Aavid Thermalloy, LLC Patent applications |
Patent application number | Title | Published |
20160076819 | THERMOSIPHON WITH BENT TUBE SECTION - A thermosiphon device including one or more multi-port tubes that form both an evaporator section and a condenser section for the device. The one or more tubes may be flat tubes with multiple, parallel flow channels, and may be bent to form a bend between the evaporator and condenser sections of the tube(s). One or more flow channels of the tube at the bend may provide a vapor flow path or a liquid flow path between the evaporator and condenser sections. | 03-17-2016 |
20160061532 | EVAPORATOR AND CONDENSER SECTION STRUCTURE FOR THERMOSIPHON - A thermosiphon device includes a closed loop evaporator section having one or more evaporation channels that are fed by a liquid return path, and a condenser section with one or more condensing channels. The condenser section may include a vapor supply path that is adjacent one or more condensing channels, e.g., located between two sets of condensing channels. Evaporator and/or condenser sections may be made from a single, flat bent tube, which may be bent about an axis parallel to the plane of the flat tube to form a turnaround and/or twisted about an axis along a length of the tube at the tube ends. A single tube may form both evaporator and condenser sections of a thermosiphon device, and an axially extending wall inside the tube in the evaporator section may separate an evaporator section from a liquid return section. | 03-03-2016 |
20150316046 | PLANAR COIL AND SUPPORT FOR ACTUATOR OF FLUID MOVER - A fluid mover includes a chamber with one or more outlet openings, first and/or second fluidic diaphragm(s) having a portion movable in the chamber to cause fluid to move at the outlet opening, and a coil assembly magnetically coupled to the fluidic diaphragm to move the movable portion of the fluidic diaphragm(s) in response to a current in the coil. The coil assembly includes a coil with an opening, and a plug may be positioned in the opening and/or a support may be positioned around a periphery of the coil. The plug and/or the support may have a magnetic permeability greater than one and be arranged so magnetic field lines created by the coil pass through the plug and/or support. The coil, plug and/or support may define a flat surface, e.g., such that a uniform gap is present between the diaphragm(s) and the coil, plug and/or support. | 11-05-2015 |
20150078934 | SPLIT FLUIDIC DIAPHRAGM - A diaphragm for a fluid mover, such as a synthetic jet device includes separate, concentric substrate sections. The substrate sections may be joined together by a resilient material at a junction between the sections, and the sections may include intermeshed cantilever tabs. The substrate sections may be joined to resist pressure-induced ballooning or similar deformation, yet allow for relatively large axial deformation. | 03-19-2015 |
20140352940 | FASTENER ASSEMBLY AND METHOD FOR HEAT SINK MOUNTING - Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board. | 12-04-2014 |
20140345829 | Thermal Transfer Device with Reduced Vertical Profile - A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states. | 11-27-2014 |
20140268571 | SYSTEM AND METHOD FOR COOLING HEAT GENERATING COMPONENTS - An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat. | 09-18-2014 |
20140020867 | THERMAL TRANSFER DEVICE WITH SPIRAL FLUID PATHWAYS - A thermal transfer device comprising a thermal transfer surface and a passageway for conducting a thermal transfer fluid from an inlet to an outlet while passing in thermal contact with the thermal transfer surface. The passageway has at least two spiral passages and a connection channel connecting the at least two spiral passages to permit flow of the heat transfer fluid from a first spiral passage to a second spiral passage; thereby forming a path for the flow of the thermal fluid from the inlet, through the passageway, along the first spiral passage to the connection channel, then along the connection channel to the second spiral passage, and then to the outlet. | 01-23-2014 |
20120186779 | Heat Sink Mount and Assembly - An assembly for a heat sink having a contact plate with opposing first and second faces, a plurality of fins extending from the first face of the contact plate, and a plurality of gaps between the fins. A retaining device has a first pair of opposing sides and a second pair of opposing sides, the first and second pairs of opposing sides surrounding an opening, the first pair of opposing sides having primary framing members, at least some of the primary framing members having a first end at a respective side and a distal free end, with at least one engagement member positioned proximate the distal free ends. The primary framing members define a receiving space for the heat sink. A metal spring is configured in a closed shape cross-section for engagement with the retaining device. The metal spring has a pair of elongated sides, a pair of truncated sides and heat sink engagement regions. The heat sink engagement regions are positioned against the contact plate when the metal spring is engaged with the retaining device, to urge the contact plate towards the engagement members. The assembly is particularly well suited for use with ball grid array packages to interface electronic components in such packages with the heat sink. | 07-26-2012 |
20100044015 | Heat Sink - A fluid-cooled heat sink ( | 02-25-2010 |
20090260782 | Heat sink base plate with heat pipe - A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface. | 10-22-2009 |