Arakawa Chemical Industries, Ltd. Patent applications |
Patent application number | Title | Published |
20150075676 | BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE - The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3). | 03-19-2015 |
20150018470 | HOT-MELT ADHESIVE COMPOSITION - The present invention provides a hot melt adhesive composition comprising (A) an ethylene copolymer obtained by copolymerizing ethylene and α-olefin using a single-site catalyst and (B) a rosin ester, in a hydrolyzate of which a dehydroabietic acid content is 30 wt % or less and an abietic acid content is 10 wt % or less, and in a methylated product of the hydrolyzate of which a content of components having a molecular weight of 320 is equal to or greater than 10 wt % of a total amount of components having a molecular weight of 314 to 320. | 01-15-2015 |
20140079947 | Base Film and Pressure-Sensitive Adhesive Sheet Provided Therewith - To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. | 03-20-2014 |
20140073806 | METHOD FOR PRODUCING EPOXY COMPOUND - To provide a method for producing an epoxy compound having fewer residual quaternary salt compound by removing the quaternary salt compound from an organic solution containing an epoxy compound and the quaternary salt compound. | 03-13-2014 |
20140065414 | Base Film and Pressure-Sensitive Adhesive Sheet Provided Therewith - The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface. | 03-06-2014 |
20140014521 | FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm. | 01-16-2014 |
20130276937 | LEAD-FREE SOLDER FLUX AND LEAD-FREE SOLDER PASTE - A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H | 10-24-2013 |
20130065990 | ROSIN-MODIFIED PHENOLIC RESIN, PROCESS FOR PRODUCTION THEREOF, VARNISH FOR PRINTING INK, AND PRINTING INK - A rosin-modified phenolic resin, which consists of a reaction product among (a) a rosin that contains a component derived from communic acid in an amount of 0.1 to 0.8 wt %, (b) a condensation product of a phenol and formaldehyde, and (c) a polyol. The rosin-modified phenol resin makes it possible to produce a printing ink which has a good balance among ink performances such as fluidity, emulsification resistance, misting resistance, drying properties, and gloss. | 03-14-2013 |
20120291922 | SOLDER PASTE - A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of | 11-22-2012 |
20120291921 | FLUX FOR SOLDER PASTE, AND SOLDER PASTE - A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C | 11-22-2012 |
20120225969 | URETHANE (METH) ACRYLATE AND PRODUCTION METHOD THEREOF, CROSS-LINKED URETHANE (METH) ACRYLATE AND PRODUCTION METHOD THEREOF, AND LIGHT CURABLE AQUEOUS EMULSION - For the purpose of providing a urethane(meth)acrylate excellent in emulsifiability in water and a production method thereof, and a light curable aqueous emulsion using the urethane(meth)acrylate having a low viscosity and excellent in the curability, provided is a urethane(meth)acrylate being represented by the following general formula (1) and having a weight average molecular weight of 1,000 to 10,000: | 09-06-2012 |
20120216840 | ELECTRONIC COMPONENT CLEANING DEVICE AND CLEANING METHOD - A plurality of spray units spray a cleaning liquid to a plurality of spray-target regions between which a site to be cleaned is interposed. The plurality of spray-target regions are linearly extending. The plurality of spray-target regions each has a spray pattern characterized in that a spray direction when viewed from a direction where the plurality of spray-target regions are linearly extending is perpendicular to a plane including the spray-target region. The spray units are disposed such that the plurality of spray-target regions are arranged in juxtaposition each other. The cleaning liquid sprayed from the spray units crashes against the plurality of spray-target regions and thereby generates cleaning liquid flows headed for the site to cleaned. | 08-30-2012 |
20120108830 | METHOD FOR MANUFACTURING AN EPOXY COMPOUND AND METHOD FOR EPOXIDIZING A CARBON-CARBON DOUBLE BOND - The present invention provides a method for producing an epoxy compound, comprising oxidizing a carbon-carbon double bond of an organic compound by hydrogen peroxide in the presence of a neutral inorganic salt and a mixed catalyst of a tungsten compound (a), at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphonic acids, and salts thereof (b) and a surfactant (c), and an epoxidizing method comprising oxidizing a carbon-carbon double bond by hydrogen peroxide in the presence of the catalyst and the neutral inorganic salt. | 05-03-2012 |
20120090646 | CLEANING AGENT FOR REMOVAL OF, REMOVAL METHOD FOR, AND CLEANING METHOD FOR WATER-SOLUBLE, LEAD-FREE SOLDER FLUX - An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water. | 04-19-2012 |
20120037405 | FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm. | 02-16-2012 |
20120010358 | ROSIN-MODIFIED PHENOL RESIN, MANUFACTURING METHOD THEREOF, AND PRINTING INK - A rosin-modified phenolic resin, comprising a product obtained by reaction of (a) a rosin material containing 0.4 to 10% of dihydroagathic acid, (b) a condensate of a phenolic compound and formaldehyde, and (c) a polyol. | 01-12-2012 |
20110244326 | ELECTRODE FOR SECONDARY BATTERY AND MANUFACTURING PROCESS FOR THE SAME - It is an assignment to be solved to provide an electrode for secondary battery, electrode in which the active material is suppressed from coming off or falling down from the electricity collector, and that has excellent cyclic performance. | 10-06-2011 |
20110094545 | CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX - An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid. | 04-28-2011 |
20110070433 | Sheet and Adhesive Sheet - A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing. | 03-24-2011 |
20100215937 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS ARTICLES DERIVED FROM THOSE - A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition. Specifically disclosed is a curable resin composition containing at least one substance selected from the group consisting of condensates (A) obtained by hydrolyzing and condensing a thiol group-containing alkoxysilane (a1) represented by the following general formula: | 08-26-2010 |
20100180917 | CLEANER COMPOSITION FOR REMOVING LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVING LEAD-FREE SOLDERING FLUX - The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water. | 07-22-2010 |
20090145329 | Tackifier and Tackifier Emulsion - The present invention provides a tackifier that is a raw material of an adherence adhesive having good adhesion performance (in particular, holding power) for all members and can be used for various adherence adhesives, and a tackifier emulsion capable of being used for various aqueous adherence adhesives. The tackifier and the tackifier emulsion including a rosin resin wherein a ratio of the content of a component with a molecular weight of at most 300 comprised in the rosin resin to the softening point of the rosin resin (the content (% by weight) of a component with a molecular weight of at most 300/softening point (K)) is at most 0.004; and the adherence adhesive composition including the tackifier; and the aqueous adherence adhesive composition including the tackifier emulsion. | 06-11-2009 |
20090042762 | CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX - The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains:
| 02-12-2009 |