Endovascular Technolodies, Inc.
Endovascular Technolodies, Inc. Patent applications | ||
Patent application number | Title | Published |
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20130123902 | MODULAR GRAFT COMPONENT JUNCTIONS - The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile. | 05-16-2013 |