ENTHONE INC. Patent applications |
Patent application number | Title | Published |
20160122890 | CYANIDE-FREE ELECTROLYTE COMPOSITION AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES - The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile. | 05-05-2016 |
20160108260 | AQUEOUS STRIPPING COMPOSITION FOR METAL SURFACES - The invention relates to an aqueous stripping composition for the removal of polymeric surface sealants on metal surfaces, said stripping composition comprising an alkalizing agent, a polymer splitting agent, a swelling agent, and a cloud point booster, wherein said polymer splitting agent is at least one gluconate wherein said swelling agent is at least one compound selected from the group consisting of glycol ethers and aliphatic alcohols having 3 to 9 carbon atoms. The inventive aqueous stripping composition is capable to remove polymeric sealants like e.g. polyurethane sealants, polyethylene sealants, polyethylene waxes, polyacrylic sealants, polysilicate sealants, and the like. | 04-21-2016 |
20160076160 | LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS - A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound. | 03-17-2016 |
20160032479 | ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES - Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14. | 02-04-2016 |
20160024381 | CHROMIUM-FREE PICKLE FOR PLASTIC SURFACES - A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions. | 01-28-2016 |
20150257264 | SILVER PLATING IN ELECTRONICS MANUFACTURE - Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability. | 09-10-2015 |
20140322912 | METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS - A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound. | 10-30-2014 |
20140255600 | AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOSITION ON LASER-DIRECT STRUCTURED SUBSTRATES - The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate. | 09-11-2014 |
20140158545 | APPARATUS FOR ELECTROCHEMICAL DEPOSITION OF A METAL - The invention as described in the following relates to an apparatus for the electrochemical deposition of a metal on a substrate, which apparatus is capable of refreshing an electrolyte used for the deposition in a continuous way. Furthermore, the invention as described relates to a method of refreshing an electrolyte for the electrochemical deposition of a metal on a substrate. | 06-12-2014 |
20140154525 | AQUEOUS SOLUTION AND METHOD FOR THE FORMATION OF A PASSIVATION LAYER - The present invention generally relates to an aqueous solution for the formation of a passivation layer on a zinc layer or zinc-alloy layer. More particularly, the invention relates to the formation of a black passivation layer on a zinc layer or zinc-alloy layer, which passivation layer is substantially free of hexavalent chromium. Furthermore, the present invention relates to method for the formation of a passivation layer on a zinc layer or zinc-alloy layer, as well as a passivation layer on a zinc layer or zinc-alloy layer itself. The solution used contains trivalent chromium ions, nitrate ions, an organic acid and a dithioglycolate. | 06-05-2014 |
20140138253 | COMPOSITION AND METHOD FOR THE DEPOSITION OF CONDUCTIVE POLYMERS ON DIELECTRIC SUBSTRATES - The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. | 05-22-2014 |
20140120722 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS - A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature. | 05-01-2014 |
20140102909 | COPPER ELECTRODEPOSITION IN MICROELECTRONICS - A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a quaternized pyridinium salt compound for leveling. | 04-17-2014 |
20140030425 | ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS - Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound. | 01-30-2014 |
20130316082 | METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES - The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent. | 11-28-2013 |
20130241060 | METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS - A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound. | 09-19-2013 |
20130199935 | COPPER FILLING OF THROUGH SILICON VIAS - A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature. The deposition composition comprises (a) a source of copper ions; (b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof; (c) an organic disulfide compound; (d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and (d) chloride ions. | 08-08-2013 |
20130180768 | SILVER PLATING IN ELECTRONICS MANUFACTURE - Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability. | 07-18-2013 |
20130130056 | CORROSION-PROTECTIVE WAX COMPOSITION CONTAINING POLYANILINE IN A DOPED FORM AND A LIQUID PARAFFIN - The present invention relates to a corrosion-protective composition containing a wax, an unsubstituted or substituted polyaniline in a doped form and a liquid paraffin, and articles comprising the composition applied on a substrate. It also relates to a process for manufacturing the composition, wherein i) a first dispersion of a polyaniline in a doped form is prepared; and ii) the first dispersion of the polyaniline is combined with a wax component to sufficiently disperse the polyaniline therein, and to the use of the composition as a single layer coating for the protection against corrosion of a substrate in need thereof. | 05-23-2013 |
20130078367 | ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS - An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition. | 03-28-2013 |
20120298519 | ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER - An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; | 11-29-2012 |
20120285834 | COMPOSITE COATINGS FOR WHISKER REDUCTION - There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles. | 11-15-2012 |
20120276409 | SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS - A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant. | 11-01-2012 |
20120175022 | ANTI-TARNISH COATINGS - A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces. | 07-12-2012 |
20120168075 | ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLECULAR SYSTEM - An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof. | 07-05-2012 |
20120156387 | BETA-AMINO ACID COMPRISING ELECTROLYTE AND METHOD FOR THE DEPOSITION OF A METAL LAYER - The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5, and in which instead a β-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of β-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general. | 06-21-2012 |
20120043218 | COPPER ELECTRODEPOSITION IN MICROELECTRONICS - A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling. | 02-23-2012 |
20110279991 | SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTURE - A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper. | 11-17-2011 |
20110272284 | METHOD FOR THE POST-TREATMENT OF METAL LAYERS - A process for treating the surface of a metal substrate comprising a constituent metal selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals. An anodic potential is applied to the metal surface in an electrolytic circuit comprising the metal surface, a cathode, and an electrolytic solution that is in contact with the metal surface and in electrically conductive communication with the cathode. The electrolytic solution may contain an electrolyte comprising anions of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. The anion may comprise a polymer having a pendent moiety selected from the group consisting of phosphate, phosphonate, phosphite, phosphinate, sulfate, sulfonate, carboxylate and combinations thereof. The potential applied to the circuit is such that the substrate is anodically oxidized and reacts with the anion to form a composition that imparts an enhanced property to the metal surface. Preferably, the pH of the electrolytic solution is less than about 6.0, the potential applied is between about 0.5 and about 20 volts, and the current density is between about 0.01 and 2 amps/dm | 11-10-2011 |
20110233065 | ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYER - This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements. | 09-29-2011 |
20110198226 | METHOD FOR DEPOSITION OF HARD CHROME LAYERS - The present invention concerns a method for galvanic deposition of a hard chrome layer on a substrate surface at high rates of deposition. According to the invention, the substrate surface being coated makes contact at reduced pressure relative to the ambient pressure with a chromium-containing electrolyte suitable for galvanic deposition and a relative motion between substrate surface and electrolyte is produced during the depositing of the chrome layer on the substrate surface. | 08-18-2011 |
20110192638 | SILVER IMMERSION PLATED PRINTED CIRCUIT BOARD - A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper. | 08-11-2011 |
20110180415 | CYANIDE FREE ELECTROLYTE COMPOSITION FOR THE GALVANIC DEPOSITION OF A COPPER LAYER - A cyanide-free electrolyte composition for the galvanic deposition of a copper layer on substrate surfaces and a method for the deposition of such layers. The electrolyte composition comprises at least copper(II) ions, a hydantoin and/or hydantoin derivative, a di- and/or tricarboxylic acid or salts thereof, and a metalate of an element of the group consisting of molybdenum, tungsten and vanadium and/or a cerium compound. | 07-28-2011 |
20110140035 | CHROMIUM-FREE PICKLE FOR PLASTIC SURFACES - A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions. | 06-16-2011 |
20110097597 | IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE - A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick. | 04-28-2011 |
20100319572 | CORROSION PROTECTION OF BRONZES - A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol. | 12-23-2010 |
20100294669 | ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES - A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface. | 11-25-2010 |
20100291303 | ANTI-TARNISH COATINGS - A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces. | 11-18-2010 |
20100285660 | COPPER DEPOSITION FOR FILLING FEATURES IN MANUFACTURE OF MICROELECTRONIC DEVICES - A method for plating copper onto a semiconductor integrated circuit device substrate by forming an initial metal deposit in the feature which has a profile comprising metal on the bottom of the feature and a segment of the sidewalls having essentially no metal thereon, electrolessly depositing copper onto the initial metal deposit to fill the feature with copper. A method for plating copper onto a semiconductor integrated circuit device substrate by forming a deposit comprising a copper wettable metal in the feature, forming a copper-based deposit on the top-field surface, and depositing copper onto the deposit comprising the copper wettable metal to fill the feature with copper. | 11-11-2010 |
20100151263 | METALLIC SURFACE ENHANCEMENT - A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C. | 06-17-2010 |
20100126872 | ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS - A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature. | 05-27-2010 |
20100116677 | GALVANIC BATH AND PROCESS FOR DEPOSITING ZINC-BASED LAYERS - The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement. | 05-13-2010 |
20100075496 | SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION - A method is disclosed for metallizing a substrate comprising an interconnect feature in the manufacture of a microelectronic device, wherein the interconnect feature comprises a bottom, a sidewall, and a top opening having a diameter, D. The method comprises the following steps: depositing a barrier layer on the bottom and the sidewall of the interconnect feature, the barrier layer comprising a metal selected from the group consisting of ruthenium, tungsten, tantalum, titanium, iridium, rhodium, and combinations thereof; contacting the substrate comprising the interconnect feature comprising the bottom and sidewall having the barrier layer thereon with an aqueous composition comprising a reducing agent and a surfactant; and depositing copper metal onto the bottom and the sidewall of the interconnect feature having the barrier layer thereon. | 03-25-2010 |
20100044239 | CYANIDE-FREE ELECTROLYTE COMPOSITION, AND METHOD FOR THE DEPOSITION OF SILVER OR SILVER ALLOY LAYERS ON SUBSTRATES - The invention relates to a cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate as well as a method for depositing such layers with the help of said cyanide-free electrolyte composition. The electrolyte composition according to the invention comprises at least one silver ion source, a sulfonic acid and/or a sulfonic acid derivative, a wetting agent and a hydantoin. The silver or silver alloy layers deposited from such an electrolyte composition by means of the method according to the invention are dull and ductile. | 02-25-2010 |
20100012500 | DEPOSITION OF CONDUCTIVE POLYMER AND METALLIZATION OF NON-CONDUCTIVE SUBSTRATES - A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.1 g/L to form an electrically conductive polymer on the surface of the dielectric substrate, and electrolytically depositing copper over said electrically conductive polymer. | 01-21-2010 |
20090324804 | METHOD AND DEVICE FOR COATING SUBSTRATE SURFACES - The invention relates to a method for coating substrate surfaces with a metal or oxide layer in a coating bath. Said bath has at least one component the concentration of which changes during the coating process and which therefore has to be replenished or removed in order to maintain the quality of the bath. The method according to the invention is characterized in that the component is replenished and/or removed depending on the strength of the composition of the bath. | 12-31-2009 |
20090155468 | METROLOGY IN ELECTROLESS COBALT PLATING - Electrolessly depositing a cobalt-based alloy on a metal surface of a substrate in a process which involves monitoring for Co | 06-18-2009 |
20090145765 | COMPOSITE COATINGS FOR WHISKER REDUCTION - There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles. | 06-11-2009 |
20090145764 | COMPOSITE COATINGS FOR WHISKER REDUCTION - There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles. | 06-11-2009 |
20090121192 | SELF ASSEMBLED MOLECULES ON IMMERSION SILVER COATINGS - A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant. | 05-14-2009 |
20090035940 | COPPER METALLIZATION OF THROUGH SILICON VIA - A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions. | 02-05-2009 |
20080314283 | CORROSION PROTECTION OF BRONZES - A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol. | 12-25-2008 |
20080302668 | ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER - An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises
| 12-11-2008 |
20080261025 | METALLIC SURFACE ENHANCEMENT - A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about | 10-23-2008 |
20080254205 | SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYS - A method and composition for electrolessly depositing a layer of a metal alloy onto a surface of a metal substrate in manufacture of microelectronic devices. The composition comprises a source of metal deposition ions, a borane-based reducing agent, and a two-component stabilizer, wherein the first stabilizer component is a source of hypophosphite and the second stabilizer component is a molybdenum (VI) compound. | 10-16-2008 |
20080236619 | COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTURE - Cleaning compositions and methods in connection with cobalt-based capping of interconnects in integrated circuit semiconductor devices. | 10-02-2008 |