Henkel Corporation Patent applications |
Patent application number | Title | Published |
20150238997 | DISPENSE FOR APPLYING AN ADHESIVE TO A REMOTE SURFACE - A dispense for dispensing an adhesive onto a remote surface, such as a case mouth and primer ammunition. The dispense includes a reservoir containing an adhesive; a positive displacement pump; and a nozzle having a tapered tip. The positive displacement pump delivers a predetermined amount of the adhesive, preferably an anaerobic adhesive, from the reservoir to the nozzle at predetermined intervals. The nozzle discharges the predetermined amount of adhesive through the air and at least 1/16-inch onto the remote surface. | 08-27-2015 |
20140275448 | METHODS AND APPARATUS FOR CONTROLLED SINGLE ELECTRON TRANSFER LIVING RADICAL POLYMERIZATION - This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface. | 09-18-2014 |
20140273694 | PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION - A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided. | 09-18-2014 |
20140272219 | ADHESIVE COMPOSTIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF - The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications. | 09-18-2014 |
20140272214 | ADHESIVE COMPOSTIONS WITH WIDE SERVICE TEMPERATURE WINDOW AND USE THEREOF - The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than −35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application. | 09-18-2014 |
20140268579 | ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY INSULATING COMPOSITION - Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition. | 09-18-2014 |
20140264822 | THERMOSETTING RESIN COMPOSITIONS WITH LOW COEFFICIENT OF THERMAL EXPANSION - Thermosetting resin compositions with low coefficient of thermal expansion are provided herein. | 09-18-2014 |
20140264165 | OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF - Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices. | 09-18-2014 |
20140262022 | ANAEROBIC CURABLE COMPOSITIONS - The invention provides anaerobic curable compositions, and methods of their production and use. These compositions provide excellent adhesion especially on oily surfaces. | 09-18-2014 |
20140262014 | PREPREG CURING PROCESS FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION - A prepreg curing process for preparing composites having superior surface finish and high fiber consolidation is provided. | 09-18-2014 |
20140238603 | HOT MELT ADHESIVE COMPRISING CYANOACRYLATE CURING COMPOUNDS - A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives. | 08-28-2014 |
20140235127 | ELASTIC ATTACHMENT ADHESIVE AND USE THEREOF - The present invention relates to elastic attachment adhesives that comprise non-metallocene catalyzed polymers. The elastic attachment adhesives have stable creep performance under prolonged aging parameters, making these adhesives particularly well suited for elastic applications. | 08-21-2014 |
20140232041 | INTERNAL MOLD RELEASE AGENTS FOR POLYURETHANE MATERIALS - An internal mold release agent (IMRA) which effectively releases a cured polyurethane (PU) material from a metal, in particular steel, mold. The IMRA is a surface active agent containing phosphorus or a combination (blend or reaction product) of the agent with other chemicals. In one embodiment the agent is a phosphate ester. In one embodiment the agent is polyoxyethylene alkyl phosphate ester. A polyurethane formulation comprising the IMRA has high formulation stability, clean release, low release strength, and high product transparency. | 08-21-2014 |
20140216649 | THIOL-ENE CURED OIL-RESISTANT POLYACRYLATE SEALANTS FOR IN-PLACE GASKETING APPLICATIONS - The present invention relates to thiol-ene curing compositions, which cure upon exposure to ultraviolet (UV) light and/or heat. The compositions include components having alkenyl (or “ene”) functionality and components having thiol functionality, which undergo thiol-ene curing. The compositions also include a cure system. More specifically, in some embodiments, the curable compositions include a vinyl polymer bearing alkenyl or thiol terminal functional group(s) and a cross-linking agent having the opposing functionality, i.e., thiol cross-linking agents with alkenyl-terminated vinyl polymers and vinyl cross-linking agents with thiol-terminated vinyl polymers. Also provided are methods of making and using the compositions, such as for sealants for in-place gasketing applications. | 08-07-2014 |
20140193652 | PHOTOCURABLE ELASTOMER COMPOSITIONS - The present invention relates to photocurable elastomer compositions and methods of preparation and use of such compositions for cure-in-place applications such as gaskets. The curable compositions generally include an elastomer component, a monofunctional and/or multifunctional reactant and a photoinitiator that in various aspects may be a visible and/or UV curing initiator. The various components may be present in different amounts, depending on the combination of components and composition desired. | 07-10-2014 |
20140141185 | HOT MELT ASSIST WATERBORNE ADHESIVES AND USE THEREOF - A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process. | 05-22-2014 |
20140127445 | MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES - The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C. | 05-08-2014 |
20140107283 | CONTROLLED RADICAL POLYMERIZATION OF (METH)ACRYLATE MONOMERS - Living radical polymerization processes, reaction products of such processes, and compositions containing such reaction products are provided. More particularly, a living radical polymerization of (meth)acrylic acid monomers employing having a defined order of introduction of the reactants and/or a specific set of reaction conditions, is provided. | 04-17-2014 |
20140087177 | WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF - The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates. | 03-27-2014 |
20140079897 | Adhesive Compositions and Use Thereof - The invention provides hot melt adhesive with wide service temperature ranges, methods of using the adhesive to bond substrates together, to close/seal cases and cartons and the like, and to articles of manufacture comprising the adhesive. The hot melt adhesive comprises a metallocene catalyzed polyethylene copolymer, less than 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer, greater than 22 wt % of a wax, a tackifier and optionally, additives. | 03-20-2014 |
20140030509 | SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION - A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ≦250° C. without the application of pressure. | 01-30-2014 |
20140027056 | REACTIVE HOT MELT ADHESIVE - The present invention relates to silane reactive hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives. | 01-30-2014 |
20140024781 | MOISTURE-CURABLE HOT MELT ADHESIVE - Disclosed is a moisture-curable hot melt adhesive which has a high initial adhesive strength and is also excellent in adhesion to a slightly adhesive material. This adhesive comprises an urethane prepolymer having an isocyanate group at its end, and (A) an acrylic polymer, wherein the acrylic polymer has a polymer (A1) containing a moiety derived from a (meth)acrylic acid derivative (a1) having an alkyl group with 6 or more carbon atoms. In some embodiments the acrylic polymer (A) has an alicyclic structure. | 01-23-2014 |
20140011904 | RADIATION CURABLE TEMPORARY LAMINATING ADHESIVE FOR USE IN HIGH TEMPERATURE APPLICATIONS - A radiation curable temporary laminating adhesive composition for use in temperature applications at 150° C. or greater, and typically at 200° C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent. | 01-09-2014 |
20140008822 | LIQUID COMPRESSION MOLDING ENCAPSULANTS - Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials. | 01-09-2014 |
20140004366 | ACCELERATOR/OXIDANT/PROTON SOURCE COMBINATIONS FOR TWO PART CURABLE COMPOSITIONS | 01-02-2014 |
20130317193 | PROCESS FOR PREPARING FLOWABLE AMORPHOUS POLY-ALPHA OLEFIN ADHESIVE PELLETS - The present invention relates to a process for producing free-flowing, agglomeration resistant amorphous poly-alpha-olefin based adhesive pellets. The process includes (a) extruding the adhesive through an orifice of a die plate immersed in a cooling fluid; (b) cutting the adhesive into a plurality of pellets in the cooling fluid; (c) solidifying the pellets at a temperature range of about 25° C. to about 40° C. for at least 30 minutes; and (d) separating the pellets from the recrystallization fluid and drying the pellets. The pellets harden at least three folds faster than conventionally formed pellets. | 11-28-2013 |
20130309427 | INTEGRAL HOT MELT ADHESIVE PACKAGING FILMS AND USE THEREOF - Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms. | 11-21-2013 |
20130306916 | Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film - A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater. | 11-21-2013 |
20130287980 | CURABLE ELASTOMER COMPOSITIONS WITH LOW TEMPERATURE SEALING CAPABILITY - Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more additives. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer. | 10-31-2013 |
20130210239 | PRE-CUT WAFER APPLIED UNDERFILL FILM - A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer. | 08-15-2013 |
20130207005 | COMPOSITE FILM FOR BOARD LEVEL EMI SHIELDING - An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer. | 08-15-2013 |
20130203900 | Adhesive Composition and Use Thereof - The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications. | 08-08-2013 |
20130202902 | STRETCH FILM LAMINATION ADHESIVE - The invention provides stretch film laminant adhesives, methods of using the adhesives to bond substrates together, and to articles of manufacture comprising the adhesives. It has been discovered that a stretch film lamination adhesive, which comprises a metallocene catalyzed polyolefin copolymer with a density greater or equal to 0.870 g/cm | 08-08-2013 |
20130202787 | LOW TEMPERATURE HOT MELT ADHESIVES FOR DISPOSABLE ARTICLES WITH HIGH CREEP RESISTANCE - The present invention is directed to adhesives suitable for application using a hot melt process at a relatively low temperature in the range of about 110° C. to about 130° C. Such adhesives exhibit desirable viscoelastic properties and are suitable for bonding an elastic attachment in the manufacture of disposable articles, such as disposable diapers. | 08-08-2013 |
20130197158 | SELF-ALIGNED GRAPHENE POLYMER NANOCOMPOSITES - Highly-oriented graphene polymer nanocomposites are produced from an aqueous dispersion of graphene oxide in polyurethane latex followed by chemical reduction to form graphene sheets. | 08-01-2013 |
20130197130 | B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES - An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler. | 08-01-2013 |
20130196472 | PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE - A method for preparing a semiconductor with preapplied underfill comprises (a) providing a thinned silicon semiconductor wafer having a plurality of metallic bumps on its active face and, optionally, through-silica-vias vertically through the silicon semiconductor wafer; (b) providing an underfill material on a dicing support tape, in which the underfill material is precut to the shape of the semiconductor wafer; (c) aligning the underfill material on the dicing support tape with the semiconductor wafer and laminating the underfill material to the semiconductor wafer. | 08-01-2013 |
20130189532 | ADHESIVE COMPOSITIONS - Moisture curable poly(acrylate) compositions having more environmentally acceptable catalysts and/or faster skin over time. The compositions demonstrate resistance to hydrocarbon fluids, such as transmission fluids, oils and fuels and are useful as gasketing materials. | 07-25-2013 |
20130187102 | SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS - A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition. | 07-25-2013 |
20130184384 | ADHESIVE COMPOSITIONS AND USE THEREOF - The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. The adhesives find particular use as case, carton, and tray forming, and as sealing adhesives, including heat sealing applications, for example in the packaging of cereals, cracker and beer products. | 07-18-2013 |
20130178585 | PHOTOCURABLE DICING DIE BONDING TAPE - A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure. | 07-11-2013 |
20130171651 | METHODS FOR MEASURING DEGREE OF CURE OR SOLDIFICATION OF A COMPOSITION - The present invention is directed to methods of measuring the degree of cure or solidification of a composition. Desirably, such methods are quantitative and ascertain the degree of cure or solidification in a non-destructive manner such that they are adaptable for on-line, real-time monitoring. | 07-04-2013 |
20130165600 | ONE COMPONENT EPOXY RESIN COMPOSITION - Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin. | 06-27-2013 |
20130160945 | ADHESIVE HAVING INSULATIVE PROPERTIES - An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plurality of expandable microspheres. Products having improved insulation capabilities and methods of making the products having improved insulation capabilities are also provided. The present adhesive and products including the adhesive is environmentally friendly. | 06-27-2013 |
20130158176 | LOW APPLICATION TEMPEARATURE AMORPHOUS POLY-a-OLEFIN ADHESIVE - It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles. | 06-20-2013 |
20130146223 | HARDENER FOR EPOXY RESINS - The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one α,β-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins. | 06-13-2013 |
20130136858 | ADHESIVE RECYCLING DURING SPIN COATING - A spin coating apparatus for applying adhesive to a substrate includes: a rotatable chuck configured to receive and hold a substrate thereon; a nozzle positioned above the rotatable chuck and configured to dispense the adhesive onto a surface of the substrate; a containment pan surrounding the rotatable chuck and configured to contain excess adhesive; a collection container in fluid communication with the containment pan; and a removal device positioned within the containment pan configured to direct the excess adhesive into the collection container. | 05-30-2013 |
20130102698 | DUAL CURE ADHESIVES - This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60° C. and 100° C. | 04-25-2013 |
20130101856 | WAFER BACKSIDE COATING CONTAINING REACTIVE SULFUR COMPOUND - A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations. | 04-25-2013 |
20130099396 | WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE - A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation. | 04-25-2013 |
20130098676 | CHEMICAL VAPOR RESISTANT EPOXY COMPOSITION - A two part, curable, epoxy composition useful for potting or sealing electrical devices for use in hazardous locations. Cured reaction products of the epoxy composition meet most or all UL 674 requirements and are useful to seal apertures in electrical equipment. Equipment sealed with the disclosed compositions can meet the UL 674 requirement. | 04-25-2013 |
20130079475 | ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS - Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly. | 03-28-2013 |
20130078473 | CONTROLLED CURE ALIPHATIC LAMINATING ADHESIVE USING NON-MIGRATING BLOCKING AGENTS FOR ORGANOMETALLIC CATALYSTS - A two component polyurethane adhesive composition having one or more polyols as a first component and one or more isocyanates as a second component. The composition also comprises a catalyst and a hydroxyalkyl-8-hydroxy quinoline blocking agent to delay the initial part of the curing reaction. The blocking agent links to the adhesive matrix during cure. The composition provides long open time, improved wet out of the substrates to be bonded, a rapid cure rate and bonding of the blocking agent to the cured adhesive matrix. The adhesive is useful to bond layers of a flexible food pouch sheet. Also a flexible food pouch made using the adhesive. | 03-28-2013 |
20130071202 | ANAEROBIC ADHESIVE AND SEALANT COMPOSITIONS IN FILM FORM, FILM SPOOL ASSEMBLIES CONTAINING SUCH COMPOSITIONS IN FILM FORM AND PREAPPLIED VERSIONS THEREOF ON MATABLE PARTS - Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided. | 03-21-2013 |
20130062818 | INJECTION MOLDING PROCESS AND COMPOSITIONS WITH IMPROVED SEALING CHARACTERISTICS FOR MOLD-IN-PLACE GASKETS - The present disclosure relates to liquid injection molding of a curable gasket composition to form mold-in-place gaskets. The curable gasket composition is prepared from at least an actinic radiation curable acrylic component and (meth)acrylate-functionalized silica. | 03-14-2013 |
20130035013 | CURABLE COMPOSITIONS, PROCESSES FOR USING SUCH COMPOSITIONS TO PREPARE COMPOSITES AND PROCESSES FOR PREPARING COMPOSITES HAVING SUPERIOR SURFACE FINISH AND HIGH FIBER CONSOLIDATION - Curable compositions, such as oxazine-based ones, are useful in applications within the aerospace industry, such as for example as a thermosetting resin composition for use as a matrix resin in processes, such as resin transfer molding, vacuum assisted transfer molding, resin film infusion, prepregging and towpregging, where the composites or laminates so prepared have superior surface finish and high fiber consolidation. | 02-07-2013 |
20130025784 | METHODS FOR MAKING AQUEOUS POLYURETHANE DISPERSIONS OF AROMATIC POLYISOCYANATE MIXTURES AND COMPOSITIONS - Aqueous polyurethane dispersions made from aromatic polyisocyanates and mixtures of aromatic polyisocyanates and compositions thereof are provided. Advantageously, the methods disclosed herein provide aqueous polyurethane dispersions which are produced more economically with no added organic solvent in the aqueous polyurethane dispersions. Such polyurethane dispersions are environmentally friendly and are useful as adhesives, sealants and coatings for laminating or bonding substrates such as paper, wood, metals, plastics and other synthetic materials. | 01-31-2013 |
20130023603 | EPOXY RESIN COMPOSITION WITH REDUCED TOXICITY - The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins,
| 01-24-2013 |
20130020025 | SILANE MOISTURE CURABLE HOT MELTS - The present invention relates to moisture-curable silane-reactive hot melt compositions having an acrylate-urethane copolymer moiety. Desirably, the silane groups contain alkoxy functionality to enable and enhance moisture curing. Such compositions provide enhanced green strength without sacrificing other desirable properties. | 01-24-2013 |
20130018122 | MACRO-PHOTOINITIATORS AND CURABLE COMPOSITIONS THEREOF - Macro-photoinitiators having defined polymer chain structure are provided. The macro-photoinitiators are terminated with residues of thiol and/or hydroxyl functional photoinitiators. The macro-photoinitiators may be prepared by controlled radical polymerization methods, such as atom transfer radical polymerization and single electron transfer polymerization methods. Also provided are curable (e.g., photocurable) compositions that include the macro-photoinitiators of the present invention. | 01-17-2013 |
20130012653 | Silicone-Acrylic Copolymer - A novel silicone-acrylic copolymer which comprises a covalently bonded silicone polymer with an acrylic polymer through the —Si—O—Si— linkage is described. The silicone-acrylic copolymer is a reaction product of (a) a silicone polymer, (bi) a mixture of acrylic monomers wherein at least one acrylic monomer comprises a silane (meth)acrylic monomer and/or a siloxane (meth)acrylic macromer with a radical initiator to form an acrylic prepolymer or (bii) an acrylic polymer which comprises a silane or a siloxane functional group; and (c) a scrambling catalyst, wherein the ratio of the silicone polymer (a) and the mixture of acrylic monomers (bi) or polymer (bii) is from 50:1 to 1:50. The silicone-acrylic copolymer is useful as an adhesive, sealant, coating, and the like. | 01-10-2013 |
20130011999 | COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED WAFERS - A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step. | 01-10-2013 |
20120322926 | MOISTURE CURE HOT MELT ADHESIVES - The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanate content. | 12-20-2012 |
20120292339 | DISPENSING GUN FOR A COLLAPSIBLE ADHESIVE-FILLED CONTAINER - A portable gun provides for the dispensing of flowable adhesives. The gun accommodates a flowable adhesive contained in a collapsible container which adhesive is dispensed through an extending dispensing nozzle. | 11-22-2012 |
20120285999 | DUAL CARTRIDGE PNEUMATIC DISPENSER INTEGRATED WITH DISPOSABLE ANTI-DRIP VALVE FOR PRECISION DISPENSING - The present invention relates to an anti-drip valve for precision dispensing fluid from a cartridge. The anti-drip valve includes a y-shaped anti-drip valve body and a poppet extending therethrough. The body and poppet create a seal within the anti-drip valve and control the flow of fluid from the valve to a dispense tip. | 11-15-2012 |
20120283370 | MOISTURE-CURABLE HOT MELT ADHESIVE - The present invention provides a method for producing a moisture-curable hot melt adhesive. This moisture-curable hot melt adhesive is environmentally friendly, is compatible with the components therein, has high initial adhesion strength, has long open time and has high heat resistance after moisture curing. The moisture-curable hot melt adhesive comprises a (A) urethane prepolymer having an isocyanate group at the terminus, comprising, a (A) urethane-modified rosin, and a (B) copolymer of ethylene and a (meth)acrylic acid derivative, wherein the urethane prepolymer is obtained by the reaction of polyol with an isocyanate compound. | 11-08-2012 |
20120279892 | BULK PACKAGED MATERIAL AND METHODS OF PACKAGING AND DISPENSING MATERIAL - The invention provides packaging and shipping containers used to store and transport a wide variety of materials at substantially lower cost and with less waste. | 11-08-2012 |
20120231286 | ANAEROBICALLY CURABLE COMPOSITIONS - The present invention relates to anaerobically curable compositions containing a benzoxazine component and which demonstrates resistance to elevated temperature conditions and/or accelerated cure speed. | 09-13-2012 |
20120186099 | CONNECTION SYSTEMS FOR REFRIGERATION FILTER DRYER UNITS AND METHODS FOR THEIR MANUFACTURE - A high pressure connection and method for making a high pressure connection between an existing filter dryer unit and a refrigeration system using a radically curable composition. The radically curable composition can be an anaerobically curable composition. | 07-26-2012 |
20120180950 | PRIMER COMPOSITIONS TO TOUGHEN ADHESIVE BONDS - A primer composition including a toughening agent can be applied to a surface to be bonded using a separate curable adhesive composition. The primer composition toughens cured reaction products of the adhesive composition. In some embodiments the primer composition can also enhance reactivity of the curable adhesive composition. | 07-19-2012 |
20120157641 | CURE ACCELERATORS FOR ANAEROBIC CURABLE COMPOSITIONS - The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. | 06-21-2012 |
20120129994 | CURE ACCELERATORS FOR ANAEROBIC CURABLE COMPOSITIONS - The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators are constructed as urethane/urea/thiourethane (meth)acrylate resins from diols and include a unit embraced within structure | 05-24-2012 |
20120128991 | ROBUST ADHESIVES FOR LAMINATING FLEXIBLE PACKAGING MATERIAL - A robust, two component adhesive for laminating flexible packaging material comprising a mixture of Component A and Component B. Component A comprises an isocyanate-functionalized compound. Component B comprises a mixture of a high functionality polyol containing at least four hydroxyl groups per molecule with at least two primary OH groups on the molecule and two secondary OH groups on the molecule and a trifunctional polyol containing three OH groups on the molecule. Component B can contain a difunctional polyol containing two OH groups on the molecule. The adhesive is robust and retains desirable properties when used at varying A:B mix ratios better than conventional laminating adhesives used at the same mix ratios. | 05-24-2012 |
20120114898 | ANAEROBIC ADHESIVE AND SEALANT COMPOSITIONS IN FILM FORM, FILM SPOOL ASSEMBLIES CONTAINING SUCH COMPOSITIONS IN FILM FORM AND PREAPPLIED VERSIONS THEREOF ON MATABLE PARTS - Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts are provided. | 05-10-2012 |
20120111498 | CURABLE SILICONE COMPOSITIONS CONTAINING REACTIVE NON-SILOXANE-CONTAINING RESINS - The present invention relates to two-part moisture curing compositions useful for adhesive, sealing, potting and other applications. In particular, the present invention relates to two-part room temperature vulcanizing (RTV) compositions which include in one of the parts a moisture curing organic polymer which is substantially free or does not contain siloxane bonds in its backbone. | 05-10-2012 |
20120082840 | THERMALLY REVERSIBLE HOT MELT ADHESIVE COMPOSITION CONTAINING MULTIFUNCTIONAL DIENE AND DIENOPHILE COMPOUNDS - The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods. | 04-05-2012 |
20120067249 | MOISTURE CURABLE POLYDISULFIDES - Provided are polydisulfides that are useful in moisture curable sealants. The polydisulfides have an S—S link in the backbone and are end-capped with at least one alkoxysilane functional group. Also provided are methods of making the polydisulfides, including methods that do not require the presence of a catalyst. | 03-22-2012 |
20120042990 | ORGANIC ACID- OR LATENT ORGANIC ACID-FUNCTIONALIZED POLYMER-COATED METAL POWDERS FOR SOLDER PASTES - The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes. | 02-23-2012 |
20120027935 | EXTREMELY HIGH TEMPERATURE WEARING COMPOUND - A wearing compound slurry comprising an inorganic binder, ceramic particles, ceramic powder, diluent and optionally filler and discontinuous fibers. The slurry is applied to a wearable surface and exposed to heat to remove diluent and cure the wearing compound into a hard layer. The cured wearing compound layer remains intact after exposure to extremely high temperatures. | 02-02-2012 |
20120018088 | METHOD FOR CONNECTING ELECTRODES AND BONDING COMPOSITION USED THEREFOR - There is disclosed a method for adhering a first connecting portion comprising a first electrode formed on a transparent substrate and a second connecting portion comprising a second electrode formed on a flexible substrate, whereby electrically connecting the first electrode and the second electrode, the method comprising the steps of: applying a bonding composition on at least one of the first connecting portion and the second connecting portion; aligning the first electrode and the second electrode, and irradiating with light while the first connecting portion and the second connecting portion are pressed so as to contact each other; and allowing the resulting assembly to stand at ambient temperature after the light irradiation; wherein the bonding composition comprises no electrically-conductive particle, but comprises: (a) a curable resin component; (b) a photo cure initiation component; and (c) an anaerobic curing initiation component; and wherein the anaerobic curing is not completed when the photo-irradiation is terminated. | 01-26-2012 |
20110290418 | HYDROGEN PEROXIDE COMPLEXES AND THEIR USE IN THE CURE SYSTEM OF ANAEROBIC ADHESIVES - Provided is a complex of hydrogen peroxide and at least one compound represented by Formula I: | 12-01-2011 |
20110275767 | MOISTURE-CURABLE HOT MELT ADHESIVE - A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound. The adhesive is particularly useful for building materials, electronics materials, the automotive field, and the like. | 11-10-2011 |
20110272095 | FAST,CURING TWO PART ANAEROBIC ADHESIVE COMPOSITION - The present invention concerns improved polymerizable anaerobic compositions which contain (meth)acrylic ester monomers, peroxy polymerization initiators, saccharin a saccharin derivative or a related sulfimide derivative and an activator containing a ferrocene moiety. | 11-10-2011 |
20110265913 | THERMALLY DECOMPOSABLE POLYMER COATED METAL POWDERS - The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer. | 11-03-2011 |
20110230585 | PHOTO-CURABLE RESIN COMPOSITION FOR ULTRAVIOLET LIGHT-LED IRRADIATION - A photo-curable resin composition for the UV-LED light source, which is rapidly cured and particularly has excellent surface curing property, is disclosed. The resin composition contains (a) polybutadiene (meth)acrylate; (b) a polythiol compound; and (c) a photo radical initiator and is photo-curable by an irradiation with an ultraviolet light-LED. Accordingly, production efficiency can be significantly increased in the production of liquid crystal displays and electrical and electronic components. | 09-22-2011 |
20110209424 | SELF ADHERING WINDOW FLASHING TAPE WITH MULTI-DIRECTIONAL DRAINAGE PLANE - The disclosure provides a self adhesive, flexible tape for flashing exterior wall openings. The tape is a composite comprising a barrier layer having an exterior surface and an interior surface and an adhesive layer overlying the interior surface. The barrier layer exterior surface is patterned to provide a gravity drainage path in both the tape machine direction (MD) and tape cross machine direction (CD). | 09-01-2011 |
20110178197 | Nonflammable hollow polymeric microspheres - Hollow polymeric microspheres may be rendered nonflammable by coating with one or more flame retardants, while maintaining a composite density of not greater than 0.05 g/cm3. | 07-21-2011 |
20110177341 | SHEAR- AND/OR PRESSURE-RESISTANT MICROSPHERES - The resistance of hollow microspheres towards shear and pressure may be enhanced by forming a non-tacky, solid, non-particulate outer coating comprised of a non-thermoset film-forming material on the outer surfaces of such microspheres. | 07-21-2011 |
20110176886 | DRY-TO-THE-TOUCH-MOISTURE-CURABLE COMPOSITIONS AND PRODUCTS MADE THEREFROM - A dry-to-the-touch moisture curing composition useful as a sealant and adhesive which includes a reactive modified methylene diisocyanate polymer component having isocyanate functionality of about 8% to about 18% by weight of the polymer. | 07-21-2011 |
20110170939 | CYANOACRYLATE COMPOSITIONS IN NON-FLOWABLE FORMS - The present invention relates to cyanoacrylate compositions in non-flowable and gel forms. More particularly, the present invention relates to non-flowable cyanoacrylate compositions which can be packaged in a convenient pocket-sized applicator dispenser for use in spreading the cyanoacrylate compositions onto substrates. | 07-14-2011 |
20110139959 | Method Of Preparing A Mold Sealer, Mold Sealer Assembly And Compositions Thereof - Mold sealer compositions are provided that are effective for molding thermoplastic parts from metal mold surfaces, which when applied as a coating cures to a finish having a high durability permitting multiple releases. | 06-16-2011 |
20110133366 | INJECTION MOLDING PROCESS, APPARATUS AND MATERIAL FOR FORMING CURED-IN-PLACE GASKETS - The present disclosure relates to liquid injection molding of gaskets. More particularly, the present disclosure relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding and to equipment useful with this process. | 06-09-2011 |
20110133344 | CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES - This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. | 06-09-2011 |
20110133330 | LOW TEMPERATURE CURING COMPOSITIONS - The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry. | 06-09-2011 |
20110123817 | MOISTURE CURABLE POLYAMIDES AND METHODS FOR USING THE SAME - The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process. | 05-26-2011 |
20110115132 | MOLD ASSEMBLY AND ATTENUATED LIGHT PROCESS FOR FABRICATING MOLDED PARTS - The present invention relates to a mold-in-place gasket forming assembly that includes a flange, a mold and an electromagnetic radiation filter for improved cycling. The present invention further relates to a mold-in-place gasketing process. | 05-19-2011 |
20110068512 | COMPOSITIONS WITH IMPROVED SEALING CHARACTERISTICS FOR MOLD-IN-PLACE GASKETS - The present invention relates to compositions with improved sealing characteristics for mold-in-place gaskets, and a process for forming a mold-in-place gasket by liquid injection molding. More particularly, the present invention relates to a mold-in-place gasket composition incorporating (meth)acrylate-functionalized silica, plasticizers, or both, with improved modulus and sealing properties, and a process for forming such mold-in-place gasket. | 03-24-2011 |
20110060157 | APPARATUS AND METHODS FOR CONTROLLED RADICAL POLYMERIZATION - A method of conducting controlled radical polymerization, including: (a) providing a mixture of at least one monomer; at least one monomer solvent; at least one compound metal coordinating capable; and at least one initiator; (b) directing the mixture at a rate over a solid catalyst surface contained in an external chamber to the vessel, the catalyst including a metal or metal compound capable of at least two oxidation states; (c) monitoring the reaction vessel temperature; (d) adjusting the flow rate when the temperature is outside a selected temperature range; and (e) allowing the polymerization to proceed to desired conversion level. | 03-10-2011 |
20110056779 | HIGH PERFORMANCE ADHESIVES AND METHODS FOR THEIR USE - The present invention is directed to benzoxazine-containing adhesives having high adhesive strength at high temperature. These materials are especially useful in automotive applications, in particular, as adhesives for brake components. Methods of their use are also described. | 03-10-2011 |
20110014479 | LIQUID POLYURETHANE PREPOLYMERS USEFUL IN SOLVENT-FREE ADHESIVES - Substrates, particularly low surface energy substrates, can be bonded using certain solvent-free liquid polyurethane adhesives. The adhesive cures through reaction with moisture and/or an active hydrogen-containing curing agent to form a tough, strong, thermoset polymer having excellent chemical and heat resistance. The adhesive is based on a polyurethane prepolymer obtained by reacting a stoichiometric excess of at least one polyfunctional isocyanate having a functionality of less than 2.2 with at least one polyether polyol and at least one polyester polyol containing isophthalic acid moieties but relatively few if any phthalic acid or terephthalic acid moieties. | 01-20-2011 |
20100331462 | ULTRAFAST HEAT/ROOM TEMPERATURE ADHESIVE COMPOSITION FOR BONDING APPLICATIONS - The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures. | 12-30-2010 |
20100313996 | HAND HELD PERISTALTIC PUMP FOR DISPENSING FLUID FROM A RIGID CONTAINER - A fluid dispensing apparatus includes an operable peristaltic pump. The pump supports a rigid container which includes an aggressive fluid which is to be dispensed from the container. A vent tube and a dispensing tube extends from the container through the pump. Operation of the pump causes fluid to be pumped out from the container through the dispensing tube while air is pumped into the container through the vent tube. This equalizes pressure in the container and allows fluid to be dispensed from a rigid container. | 12-16-2010 |
20100298180 | ANTI-SEIZE COMPOSITION WITH NANO-SIZED LUBRICATING SOLID PARTICLES - An anti-seize composition includes lubricating solids and at least one of a material selected from a grease and an oil. The lubricating solids include at least 15 weight percent of nano-sized lubricating solid particles. The nano-sized lubricating solid particles each have at least one dimension, on average, of less than 500 nm. | 11-25-2010 |
20100282411 | POLYAMIDES - Solvent-resistant polyamides having an exceptionally desirable combination of properties, including good cold flexibility, excellent impact resistance and high heat resistance are obtained by reacting a) an acid component comprising at least one C | 11-11-2010 |
20100261395 | CURABLE COMPOSITIONS FOR ADVANCED PROCESSES, AND PRODUCTS MADE THEREFROM - Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin in advanced processes, such as resin transfer molding, vacuum assisted transfer molding and resin film infusion, and their use in such advanced processes form the basis of the present invention. | 10-14-2010 |
20100252019 | Compositions and processes for Assembling Appliances - A method of assembling an appliance using a curable silicone composition optionally containing spacer beads of an appropriate size to permit adhesively joining the appliance parts in a desirably spaced-apart arrangement. | 10-07-2010 |
20100230565 | SURFACE ATTACHMENT DEVICE - Disclosed is a surface attachment device that can be bonded to a surface. The surface attachment device may store, mix and dispense adhesive to form a bond with a surface. Also disclosed are accessories for use with the surface attachment device and a method of attaching accessories to a surface using the surface attachment device. | 09-16-2010 |
20100212824 | Photocurable Elastomer Compositions - The present invention relates to photocurable elastomer compositions and methods of preparation and use of such compositions for cure-in-place applications such as gaskets. The curable compositions generally include an elastomer component, a monofunctional and/or multifunctional reactant and a photoinitiator that in various aspects may be a visible and/or UV curing initiator. The various components may be present in different amounts, depending on the combination of components and composition desired. | 08-26-2010 |
20100210787 | CURABLE BENZOXAZINE MACROMONOMERS, THEIR PREPARATION AND CURED PRODUCTS - The invention relates to a curable benzoxazine macromonomer containing at least 3 benzoxazine rings and at least one aliphatic, heteroaliphatic, araliphatic, hetereoaraliphatic, aromatic or heteroaromatic fragment, the fragment comprising a shortest atom chain containing at least 40 consecutive atoms between two benzoxazine nitrogen atoms or between two benzoxazine oxygen atoms, and said atom chain must not include any oxazine ring atoms (“soft fragment”). The invention further relates to cured products made thereof and a method or producing the same. | 08-19-2010 |
20100209713 | LIQUID MOISTURE CURABLE POLYURETHANE ADHESIVES FOR LAMINATION AND ASSEMBLY - This invention relates to polyurethane prepolymer containing adhesives that are liquid at room temperature and that do not phase separate under typical storage and use conditions and that can be cured by exposure to moisture or active hydrogen-containing curing agents. The polyurethane prepolymer adhesives exhibit surprisingly good adhesion to plastics such as fiberglass reinforced plastics (“FRP”). | 08-19-2010 |
20100204400 | CURABLE COMPOSITIONS CONTAINING ISOCYANATE-BASED TOUGHENERS - The present invention relates to curable compositions comprising (a) N-arylated benzoxazines, and (b) a prepolymer produced from a diisocyanate having two isocyanate groups with different reactivity. The compositions are particularly suitable in the production of adhesives and sealants, prepregs and towpreg. | 08-12-2010 |
20100204385 | CURABLE BENZOXAZINE-BASED COMPOSITIONS, THEIR PREPARATION AND CURED PRODUCTS THEREOF - The invention relates to a curable composition comprising: at least one benzoxazine and at least one toughening additive which can be bound to the at least one benzoxazine in the curing process, characterized in that the toughening additive is distributed in the cured composition in form of discrete domains, and that at least 50% of the discrete domains related to the total amount of discrete domains have a maximum length in any direction of space in the range of 10 nm to 500 nm as determined by transmission electron microscopy (TEM). | 08-12-2010 |
20100179078 | LUBRICIOUS ANAEROBIC CURABLE COMPOSITIONS - The present invention relates to lubricious anaerobic curable compositions. | 07-15-2010 |
20100173069 | TWO-COMPONENT HIGH GLOSS SEMI-PERMANENT WATER BASED RELEASE AGENT FOR POLYESTER SUBSTRATES - The present invention relates to mold release agents. More particularly, it relates to a two-component, high gloss, semi permanent water-based mold release agent. | 07-08-2010 |
20100151253 | Primer Compositions for Adhesive Bonding Systems - The present invention relates to primer compositions for adhesive bonding systems. The primer compositions may be in the form of sprayable aqueous dispersions, which are shelf stable at ambient temperatures for up to three months under ambient temperature conditions, and demonstrate a cure profile of 45 to 120 minutes within the temperature range of 220° F. to 350° F. within 60 minutes of application. Significantly, the inventive primer compositions are substantially free of chromate. | 06-17-2010 |
20100140542 | BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITIONS MADE THEREWITH - A composition of matter in liquid form at a temperature of 50° C. or less comprising a monofunctional benzoxazine compound embraced by the structure | 06-10-2010 |
20100139843 | LOW MODULUS, HUMIDITY RESISTANT SILICONE RTV COMPOSITIONS AND METHOD OF PREPARING SAME - The present invention provides one-component silicone compositions, particularly useful as sealants, having low modulus and high elongation, as well as good resistance to high temperatures and humidity, and methods for preparing these sealants. In particular, the present invention provides compositions including a chain-extended curable polyorganosiloxane, a high molecular weight silicone gum and a cure system. The compositions may be used, for example, in sealing the stitching of automotive airbags. | 06-10-2010 |
20100130655 | CURABLE EPOXY RESIN-BASED ADHESIVE COMPOSITIONS - This invention relates to compositions useful as adhesives and more particularly to epoxy-based adhesive compositions with improved impact resistance. | 05-27-2010 |
20100112363 | WATERBORNE ADHESIVE COMPOSITIONS FOR USE IN BONDING TO FIRE RETARDANT TREATED WOOD AND WOOD COMPOSITES - The invention relates to waterbome adhesive compositions that make them suited for use in bonding to fire retardant treated wood and wood composites. The waterborne adhesive comprises resin emulsion stabilized by dextrin and/or surfactant. The invention is also directed to a method for bonding fire retardant treated wood or wood composite substrate to a similarly treated or to a dissimilar substrate. The invention is further directed to articles manufactured using the adhesive composition of the invention. The manufactured fire retardant articles are well suited for use in public places where large number of people assemble, e.g. offices, schools, hospitals, and the like. | 05-06-2010 |
20100105795 | Liquid Stable Thiol-Acrylate/Vinyl Ether Compositions - The present invention relates to liquid stable thiol-acrylate and thiol-vinyl ether compositions. More particularly, in accordance with some embodiments, the compositions may include a (meth)acrylate, a thiol component, an organic acid stabilizer, and a curing initiator. In other embodiments, the compositions may include a curable component selected from a (meth)acrylate, vinyl ether and/or alkenyl ether, a reactive diluent having vinyl ether and acrylate functionality, a thiol component and a stabilizer selected from an organic acid, a hemiacetal ester derivative of an organic acid and/or a phenol acetal. | 04-29-2010 |
20100101724 | ACRYLIC ADHESIVES - The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions. | 04-29-2010 |
20100086796 | THERMALLY RESISTANT ANAEROBICALLY CURABLE COMPOSITIONS - The present invention relates to anaerobically curable compositions demonstrating resistance to elevated temperature conditions. | 04-08-2010 |
20100084091 | ROOM TEMPERATURE CURING ADHESIVE COMPOSITION HAVING HIGH TEMPERATURE PROPERTIES - Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. These compositions exhibit enhanced high temperature properties, including hot strength, heat/humidity strength, and heat aging strength, without compromising initial tensile strength and fixture speeds and still possessing a room temperature cure. | 04-08-2010 |
20100065210 | FLOWABLE NON-SAGGING ADHESIVE COMPOSITIONS - This invention provides an acrylic epoxy adhesive as a two part composition, wherein each part is of suitable viscosity for use in pumping apparatus, but after mixing, the composition increases in viscosity, so that it will not sag, drip, or migrate after application to a surface during the open time. This effect is achieved with a reactive acid component that gels on mixing with the epoxy portion of the composition. Also provided is a method of preparing the adhesive composition, and method of using the composition to form laminated materials. | 03-18-2010 |
20100061823 | DRY-TO-THE-TOUCH ANAEROBICALLY CURABLE COMPOSITIONS AND PRODUCTS MADE THEREFROM - Dry-to-the-touch compositions containing a polymeric matrix and a anaerobically curable component present within the polymeric matrix are disclosed. In a particularly desirable form, the compositions are moisture curable. The compositions are non-flowable, at high temperatures, and have an improved solvent resistance once cured. | 03-11-2010 |
20100018653 | ADHESIVE TAPE DISPENSER AND APPLICATOR - A one handed reusable tape dispenser and applicator comprises side walls, a top wall and a separate bottom wall which may be opened to allow loading of a roll of tape through an open front. Further, the tape dispenser is provided with tabs, a button and a pressing bar which present a leading length of tape in an arched condition across its width extending forwardly from the dispenser ready to be applied to a substrate; and an enlarged pressing surface allowing a user to easily dispense tape onto substrates such as wrapping paper. | 01-28-2010 |
20100006224 | LOW RATIO RTV COMPOSITIONS AND METHODS FOR MAKING SAME - A two-part moisture-curing composition having as a first part water and an hydroxy-terminated diorganosiloxane; and a second part which includes a reactive silicone, at least one end-capping silane which includes one or more enoxy groups, at least one end-capping catalyst and at least one moisture cure catalyst. Enhanced and controlled cure speed is obtained by these compositions. | 01-14-2010 |
20100006208 | ANAEROBICALLY CURABLE COMPOSITIONS - Dry-to-the-touch compositions containing a curable polymeric matrix and a curable anaerobic composition present within the polymeric matrix are disclosed. In a particularly desirable form, the compositions are moisture curable. The compositions are non-flowable at high temperatures and have an improved solvent resistance once cured. | 01-14-2010 |
20090308534 | NEXT GENERATION, HIGHLY TOUGHENED TWO PART STRUCTURAL EPOXY ADHESIVE COMPOSITIONS - This invention relates to two part, epoxy-based adhesive compositions with improved toughness suitable for structural applications. | 12-17-2009 |
20090298970 | (METH)ACRYLATES COMPOSITIONS CONTAINING DISPERSIONS OF CORE SHELL RUBBERS IN (METH)ACRYLATES - The present invention provides a (meth)acrylate composition comprising a (meth)acrylate component; and a core shell rubber component having a particle size in the range of 3 nm to 1,000 nm dispersed in a curable (meth)acrylate matrix. | 12-03-2009 |
20090298969 | CYANOACRYLATE COMPOSITIONS CONTAINING DISPERSIONS OF CORE SHELL RUBBERS IN (METH)ACRYLATES - The present invention provides a cyanoacrylate composition comprising a cyanoacrylate component; and a core shell rubber component having a particle size in the range of 3 nm to 1,000 nm dispersed in a curable (meth)acrylate matrix. | 12-03-2009 |
20090286089 | ACRYLIC-BASED ADHESIVES FOR POLYVINYLIDENE SURFACES - A process for improving adhesion to a surface that is at least partially coated with a fluorocarbon-containing coating, as well as a method for bonding surfaces that are at least partially coated with a fluorocarbon-containing coating, are disclosed. Moreover, compositions that may be used in the aforementioned process and method are disclosed. Additionally, articles and assemblies that include surfaces that are coated with a fluorocarbon-containing coating are disclosed. | 11-19-2009 |
20090281335 | Cure Accelerators for Anaerobic Curable Compositions - The present invention provides compound(s) selected from the group of compounds represented by structural Formula (I): | 11-12-2009 |
20090278084 | Cure accelerators for anaerobic curable compositions - The present invention provides compounds represented by structural Formula (III): | 11-12-2009 |
20090277356 | Cure Accelerators for Anaerobic Curable Compositions - The present invention provides products of isocyanate functional material(s) and compound(s) selected from the group of compounds represented by structural Formula (I): | 11-12-2009 |
20090270615 | METHOD OF PREPARING BENZOXAZINES - This invention relates to a novel synthesis for the preparation of benzoxazine components from phenolic components, aldehyde components, and amine components in a solvent other than toluene. | 10-29-2009 |
20090263669 | COMPONENTS COMPRISING POLYISOBUTYLENE COMPOSITIONS - This document provides components comprising a predetermined sealing surface and a curable composition thereon. The cured reaction product of the curable composition forms a seal having improved resistance to vapor permeation when exposed to hydrocarbon fluids and especially to hydrocarbon fluids comprising low molecular weight components, oxygenated compounds, polar compounds or blends containing polar and non-polar compounds such as alcohol and alcohol containing fuels. | 10-22-2009 |
20090209159 | TOUGHENED BINDER COMPOSITIONS FOR USE IN ADVANCED PROCESSES - Toughened binder compositions are useful with performs that will be infused with a matrix resin in advanced processes, such as resin transfer molding, vacuum assisted transfer molding and resin film infusion, to form composites and their use in such advanced processes form the basis of the present invention. | 08-20-2009 |
20090188269 | HIGH PRESSURE CONNECTION SYSTEMS AND METHODS FOR THEIR MANUFACTURE - A high pressure connection and method for making a high pressure connection. The method includes applying a primer composition to one distal joint portion, applying an anaerobically curable composition to the other distal joint portion; sliding one distal joint portion into the other distal joint portion and curing the anaerobic composition to maintain the second distal joint portion within the first distal joint portion thereby forming the high pressure connection. The method does not use plastic deformation of the first or second distal joint portions after the step of sliding. The method is advantageously useful for making high pressure connections in gas compression or refrigeration systems. | 07-30-2009 |
20090166559 | Curable Silicone Compositions Incorporating A Fluorescent Detection System - The present invention relates to curable silicone compositions which include a fluorescent agent for detection purposes and which have a cure system which enables the silicone compositions to possess improved depth of cure. The silicone compositions are photocurable, and may also be moisture or heat curable. | 07-02-2009 |
20090143554 | POLYSILOXANES GRAFTED WITH RADICALLY CURABLE AND/OR MOISTURE CURABLE GROUPS - This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes. | 06-04-2009 |
20090124783 | DEFORMABLE SOFT MOLDING COMPOSITIONS - A curable composition and method for producing a tear resistant, yet soft and deformable in-the-ear product yielding the user greater comfort and durability. The curable composition incorporated into a hearing aid apparatus provides a deformable, yet tear resistant housing, which may be mated to a soft tip component. The hearing aid housing provides better comfort, durability and acoustic performance for a variety of ear canal shapes. The curable composition that provides these properties includes at least one urethane acrylate oligomer, at least one reactive diluent and a cure system. The composition when cured desirably produces a tear strength of at least about 75 pli and a hardness of about Shore A 60 to about 75. | 05-14-2009 |
20090114678 | RETRACTABLE SEALANT DISPENSING APPARATUS FOR SQUEEZE TUBE - A dispensing apparatus provides for the dispensing of product from a collapsible tube. The apparatus includes a body for supporting the tube. The body has a forward end for accommodating a dispensing end of the tube and rearward end for accommodating a closed end of the tube. An elongate actuatable plunger is supported by the body. The plunger includes an elongate rod and a base attached to the rod. Actuating means is provided for effecting movement of the plunger in a first direction along the body for engagement with the collapsible tube wall thereby deforming the tube wall and dispensing the contents of the tube from the dispensing end. The actuating means also provides for retractable movement of the plunger in the second direction opposite the first direction. The base is positioned on the rod for dispensing engagement with the tube upon movement of the plunger in the first direction and movable out of dispensing engagement with the tube upon in a second direction. | 05-07-2009 |
20090057697 | LED ASSEMBLY WITH LED-REFLECTOR INTERCONNECT - The present invention provides a high output LED assembly including a heat sink ( | 03-05-2009 |
20090042047 | POLYAMIDES - The reaction of diner acids, C | 02-12-2009 |
20090032057 | ACID INHIBITOR COMPOSITIONS FOR METAL CLEANING AND/OR PICKLING - An acid inhibitor concentrate is provided which contains water, at least one polyamino-aldehyde resin such as a quaternized polyethylenepolyamine-glyoxal resin, and at least one compound selected from the group consisting of acetylenic alcohols, ethoxylated fatty amines, ethoxylated fatty amine salts, and aldehyde-releasing compounds (such as hexamethylenetetramine). Such concentrates form useful metal cleaning and pickling solutions when combined with aqueous acid, wherein such solutions, when contacted with a metal surface, are effective in removing scale, smut and other deposits from the metal surface but exhibit a reduced tendency for the aqueous acid to attack or etch the metal itself. | 02-05-2009 |
20090030150 | Mold Release Agents Employing Polyvinyl Alcohol - The present invention relates to a composition designed to be a release agent applied to the surface of a molding apparatus and method of using the composition in molding operations. The composition includes a siloxane composition, hydrophilic matting particles, a cross linking agent, a binding agent having hydrophobic and hydrophilic characteristics. The composition may optionally include a carrier. The composition is designed to be applied to the surface of a mold, allowing for repeated use without the need for re-applying the composition between uses. | 01-29-2009 |
20090030106 | Photosensitive Compounds, Photopolymerizable Compositions Including the Same, and Methods of Making and Using the Same - The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making and using the same. | 01-29-2009 |
20090025874 | Novel Adducts Useful As Cure Components For Anaerobic Curable Compositions - The present invention relates to novel polymer-bound adducts useful as cure components for anaerobic curable compositions. The compositions are particularly useful as adhesives and sealants. | 01-29-2009 |
20090022894 | Thermally Resistant Anaerobically Curable Compositions - The present invention relates to anaerobically curable compositions demonstrating resistance to elevated temperature conditions. | 01-22-2009 |
20090018239 | UNDERFILL ADHESIVES - In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes. | 01-15-2009 |
20090012202 | Acrylated Urethanes, Processes for Making the Same and Curable Compositions Including the Same - The present invention is directed to acrylated urethanes including the reaction product of: (1)(a) at least one urethane having at least two isocyanate groups and at least one acrylate group; and (b) at least one alcohol compound having at least two hydroxyl groups; or (2) (a) at least one isocyanate functional urethane which is the reaction product of at least one alcohol compound selected from the group consisting of amino alcohols, thioether alcohols, phosphino alcohols and mixtures thereof and at least one polyisocyanate; and (b) at least one hydroxy-functional material having at least one acrylate group; curable compositions including the same and processes for making the same. | 01-08-2009 |
20090004551 | Sealant Integrated Fuel Cell Components and Methods and Systems for Producing the Same - A fuel cell, having improved sealing against leakage, includes a sealant disposed over the peripheral portions a membrane electrode assembly such that the cured sealant penetrates a gas diffusion layer of the membrane electrode assembly. The sealant is applied through liquid injection molding techniques to form cured sealant composition at the peripheral portions of the membrane electrode assembly. The sealant may be thermally cured at low temperatures, for example 130° C. or less, or may be cured at room temperature through the application of actinic radiation. | 01-01-2009 |
20090004541 | Uv-Curable Fuel Cell Sealants and Fuel Cells Formed Therefrom - A fuel cell, having improved sealing against leakage, includes a fuel cell component having a cured sealant, wherein the cured sealant includes a telechelic-functional polyisobutylene, an organhydrogenosilane crosslinker, a platinum catalyst and a photoinitiator. The fuel cell component may be a cathode flow field plate, an anode flow field plate, a resin frame, a gas diffusion layer, an anode catalyst layer, a cathode catalyst layer, a membrane electrolyte, a membrane-electrode-assembly frame, and combinations thereof. A method for forming such a fuel cell includes the steps of providing a fuel cell component including a substrate; providing a mold having a cavity; positioning the mold so that the cavity is in fluid communication with the substrate; applying a curable liquid sealant composition into the cavity, wherein the curable sealant composition includes a telechelic-functional polyisobutylene, an organhydrogenosilane crosslinker, a platinum catalyst and a photoinitiator; and curing the composition with actinic radiation. | 01-01-2009 |
20090000732 | Bonded Fuel Cell Assembly, Methods, Systems and Sealant Compositions for Producing the Same - A fuel cell, having improved sealing against leakage, includes a sealant disposed over the peripheral portions a membrane electrode assembly such that the cured sealant penetrates a gas diffusion layer of the membrane electrode assembly. The sealant is applied through liquid injection molding techniques to form cured sealant composition at the peripheral portions of the membrane electrode assembly. The sealant may be thermally cured at low temperatures, for example 130° C. or less, or may be cured at room temperature through the application of actinic radiation. The sealant may be a one-part or a two-part sealant. The sealant includes a polymerizable material, such as a polymerizable monomer, oligomer, telechelic polymer, functional polymer and combinations thereof functionalized with a group selected from epoxy, allyl, vinyl, (meth)acrylate, imide, amide, urethane and combinations thereof. Useful fuel cell components to be bonded include a cathode flow field plate, an anode flow field plate, a resin frame, a gas diffusion layer, an anode catalyst layer, a cathode catalyst layer, a membrane electrolyte, a membrane-electrode-assembly frame, and combinations thereof. | 01-01-2009 |
20080314519 | Toughened Cyanoacrylate Compositions - This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, a rubber toughening component, which is substantially clear and colorless and which is substantially free of release agents and anti-oxidants known to impair the fixture speeds and shelf life stability of cyanoacrylate compositions to which they are added. As a result, the inventive rubber cyanoacrylate adhesive compositions demonstrate improved properties, such as fixture speed, strength and shelf life under accelerated aging conditions. | 12-25-2008 |
20080306216 | ADHESIVE AND COATING COMPOSITIONS - The instant invention concerns a composition that is useful as an adhesive in laminating applications. The composition comprises a segmented copolyesterether and a metallocene-catalyzed polyethylene-co-alpha-olefin plastomer, wherein the alpha-olefin comonomer can be a C | 12-11-2008 |
20080306208 | Rapid Surface Curing Silicone Compositions - The present invention relates to a method of preparing fast curing silicone RTV compositions by reacting an amino endcapped silicone with an isocyanato functionalized silane, and to compositions formed thereby. In particular, the present invention provides compositions which include silicones endcapped with silanes which contain α-ureas. Illustrative of the inventive compositions are those which include a polymer of Formula (I): | 12-11-2008 |
20080296159 | RADIATION-OR THERMALLY-CURABLE OXETANE BARRIER SEALANTS - This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer. | 12-04-2008 |
20080285247 | Low Exothermic Thermosetting Resin Compositions Useful As Underfill Sealants and Having Reworkability - This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55° C. for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. | 11-20-2008 |
20080272328 | RADIATION-OR THERMALLY-CURABLE OXETANE BARRIER SEALANTS - This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator. | 11-06-2008 |
20080268161 | Radiation Cure Silicone Compositions - The present invention relates to compositions which include compounds that are end-capped with silanes containing radiation cure groups. In addition, the invention relates to a method for preparing such compounds. In particular, the radiation cure groups are attached to the silane via a methylene linkage. Illustrative of the inventive compositions are those which include a compound of Formula (I): | 10-30-2008 |
20080245294 | RACK - The subject invention is directed to a rack for supporting at least one article during a vacuum impregnation process with the article having treated and untreated surfaces. The rack includes a metallic body defining at least one nest for accommodating the article, the nest being configured to support the article under vacuum impregnation conditions. Also, non-metallic bearing surfaces are disposed on portions of the nest. The bearing surfaces are configured to contiguously contact the treated surfaces of the article during the vacuum impregnation process with contiguous contact between the treated surfaces of the article and the metallic body being avoided. Advantageously, with the subject invention, a metallic rack may be utilized which avoids damage to the treated surfaces of an article undergoing vacuum impregnation. | 10-09-2008 |
20080214840 | Reworkable thermosetting resin composition - This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions. | 09-04-2008 |
20080207818 | Fast Curing Mold Release Compositions and Methods of Preparing Same - A mold release composition comprising at least one siloxane polymer having functional terminal groups; at least one siloxane polymer having at least one functional pendent group; and a crosslinking agent. The mold release agent is ready to mold composite parts in less than 30 minutes under room temperature curing conditions. | 08-28-2008 |