SOMONT GMBH Patent applications |
Patent application number | Title | Published |
20130025673 | SOLAR CELLS AND METHOD FOR PRODUCING SAME - Solar cells, where at least one conductor is mechanically and electrically connected to the solar cell and/or further conductors by conductive cladding. The conductive cladding is preferably deposited electrolytically or galvanically from solution or is produced by plasma-spraying. In addition, methods for connecting solar cells by means of at least one conductor and/or for connecting conductors on solar cells, wherein at least one electrically-conductive conductor is mechanically and electrically connected by depositing conductive cladding from solution onto the solar cell and/or at least one conductor. Also, a device for depositing a mechanically-connecting and electrically-conductive cladding from solution onto solar cells in electrolytic cells, comprising means for receiving at least one conductor, preferably a collector or bus-bar conductor contacting surface to be deposited in the electrolyte of the electrolytic cell, preferably at least partially providing electrical contact with a seed-layer of the solar cell, and preferably simultaneously supporting the solar cell. | 01-31-2013 |
20120241325 | DEVICE AND METHOD FOR ELECTRICALLY CONTACTING TREATMENT MATERIAL IN ELECTROPLATING SYSTEMS - The subject matter is directed to electrical contacting of band- or plate-shaped materials ( | 09-27-2012 |
20120228363 | PROCESS AND APPARATUS FOR PROVIDING A SOLAR CELL WITH A SOLDER RIBBON - Process and apparatus for providing a solar cell ( | 09-13-2012 |
20120228362 | PROCESS FOR OPERATING A STRINGER AND STRINGER APPARATUS - A process for operating a stringer ( | 09-13-2012 |
20120171786 | APPARATUS FOR MANUFACTURING SOLAR CELLS AND PROCESS FOR OPERATING SUCH APPARATUS - Apparatus ( | 07-05-2012 |
20120061244 | METHOD AND DEVICE FOR THE CONTROLLED ELECTROLYTIC TREATMENT OF THIN LAYERS - An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources ( | 03-15-2012 |