Yakimishu Co. Ltd. L.L.C. Patent applications |
Patent application number | Title | Published |
20140117413 | PADS AND PIN-OUTS IN THREE DIMENSIONAL INTEGRATED CIRCUITS - A three dimensional semiconductor device, comprising: a substrate including a plurality of circuits; a plurality of pads, each pad coupled to a circuit; and a memory array positioned above or below the substrate and coupled to a circuit to program the memory array. | 05-01-2014 |
20130002296 | THREE DIMENSIONAL INTEGRATED CIRCUITS - A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer. | 01-03-2013 |