Class / Patent application number | Description | Number of patent applications / Date published |
029170100 | FOIL OR OTHER THIN SHEET-METAL MAKING OR TREATING | 16 |
20150107070 | METHOD AND APPARATUS FOR FORMING A BENT SHEET OF FOIL - Apparatus for forming a bent sheet of foil, comprising a holder for holding a roll of foil; a motor for horizontally feeding the foil from the roll; a bending station for providing the fed foil with an angled portion; a controller for controlling a desired length of foil to be fed by commanding operation of said motor; and a cutting station for cutting said fed foil at said desired length, whereby to form constant length sheets of said foil. The controller is operable to command operation of the motor to sequentially feed the foil a first distance corresponding to a selected longitudinal dimension of the angled portion and then to feed the foil a second distance corresponding to a selected longitudinal dimension of a foil sheet to be formed. | 04-23-2015 |
029170200 | Method | 15 |
20140130318 | Method for Producing a Surface of a Component, Said Surface Having Reduced Drag and Component with Reduced Drag - A method for the production of a riblet film, having at least one surface that reduces airflow resistance involves the provision of a metal film that is structured using a mechanical treatment. | 05-15-2014 |
20140173860 | STAINLESS STEEL FOIL FOR FLEXIBLE DISPLAY USE - The present invention provides stainless steel foil for flexible display use which enables fabrication of a TFT substrate for display use which is superior in shape recovery after being rolled up or bent and which is high in surface flatness and is characterized by having a thickness of 20 μm to 200 μm, a surface roughness Ra of 50 nm or less, and a shape recovery of a distortion angle of 10° or less after being wound around a 30 mm diameter cylinder. | 06-26-2014 |
20150348707 | MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME - A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively. | 12-03-2015 |
20180025847 | METHOD OF PRINTING A CONDUCTIVE INK ONTO A CATHODE SURFACE TO INCREASE SURFACE AREA AND CAPACITANCE | 01-25-2018 |
029170300 | Clad or other composite foil or thin metal making | 11 |
20120210548 | LITHIUM SECONDARY BATTERY, METHOD FOR PRODUCING POWER COLLECTION FOIL FOR SAME, AND POWER COLLECTION FOIL FOR SAME - The present invention provides a method for producing a lithium secondary battery in which peeling of an active substance can be prevented and the generation of metal powder can be prevented when a power collection foil is processed at an electrode production step. The method for producing the lithium secondary battery includes an electrode-producing step of producing a positive electrode and a negative electrode; a step of forming a group of electrodes by layering the positive electrode and the negative electrode on each other through a separator, or winding the positive electrode and the negative electrode through a separator; and a step of immersing the group of the electrodes in an electrolyte. The electrode-producing step has a boring step of forming a plurality of through-holes penetrating a power collection foil and having projected parts projected from at least a rear surface of the power collection foil and a mixed agent-forming step of forming a mixed agent layer on the power collection foil through which the through-holes have been formed. After the boring step finishes, the mixed agent-forming step is successively performed without winding the power collection foil through which the through-holes have been formed. | 08-23-2012 |
20140000077 | METHOD FOR PRODUCING METALLIC CATALYST SUPPORT | 01-02-2014 |
20140115849 | METHOD FOR FLOW CONTROL - A mechanical amplifier and method for converting a small motion amplitude to a larger motion amplitude are disclosed. The method includes using two or more beams which are connected in series at angles to each other. Undesirable movements arising in the structure are absorbed by the structure through torsion. Each beam is a mechanical motion amplifier, and by connecting these in series, the total amplification is the product of the amplification of the comprised beams. The disclosure also pertains to a device comprising two or more beams connected together at an angle of 90 degrees in one embodiment. | 05-01-2014 |
20140165346 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the invention provide a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin. | 06-19-2014 |
20140215782 | MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME - A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface. | 08-07-2014 |
20140230207 | LIFT OFF PROCESS FOR CONDUCTOR FOIL LAYER - A flex-circuit or a rigid printed circuit board is formed by depositing an adhesive pattern on a top surface of a substrate. The adhesive pattern corresponds to a copper foil pattern to be formed for interconnecting electronic components. A thin copper foil is then laminated over the substrate to adhere the foil to the adhesive pattern. The foil is then peeled off the substrate such that the foil overlying the adhesive pattern remains, and the foil that is not overlying the adhesive pattern is removed. In one embodiment, the foil is cut or weakened along the edges of the adhesive pattern to minimize tearing of the foil. The foil may be first affixed to a sheet for increased mechanical integrity, prior to the foil being laminated over the substrate, followed by kiss-cutting the foil while on the sheet to avoid tearing of the foil during the lift-off step. | 08-21-2014 |
20140237784 | METHOD OF FORMING A MICROCHANNEL COOLED COMPONENT - A method of forming a microchannel cooled component is provided. The method includes forming at least one microchannel within a surface of a relatively planar plate. The method also includes placing a relatively planar cover member over the surface having the at least one microchannel formed therein. The method further includes adhering the relatively planar cover member to the relatively planar plate. The method yet further includes curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate. | 08-28-2014 |
20140338162 | PROCESS FOR PRODUCING DCB SUBSTRATES - Process for producing DCB substrates having in each case at least one ceramic layer which is essentially made up of aluminium nitride (AlN) and is provided on at least one surface side with an intermediate layer which is essentially made up of aluminium oxide and also has at least one metallization formed by a metal layer or metal foil on the intermediate layer | 11-20-2014 |
20150351248 | METHOD FOR MANUFACTURING SUBSTRATE GAP SUPPORTER - Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal foils to expose the insulating plate so that a plurality of stripes are arranged on both sides of the insulating plate in parallel at constant intervals, wherein the stripes expose the insulating plate at constant widths; and a third step of cutting in direction in parallel with the stripes and in direction in vertical with the stripes along one edges of the stripes to complete the gap supporter. | 12-03-2015 |
20150366081 | MANUFACTURING METHOD FOR CIRCUIT STRUCTURE EMBEDDED WITH ELECTRONIC DEVICE - A manufacturing method for a circuit structure embedded with an electronic device including the following steps is provided. A first dielectric material is provided. At least one electronic device is disposed on the first dielectric material. A second dielectric material is laminated on the first dielectric material, and two conductive materials are disposed on the first dielectric material and the second dielectric material respectively, such that the electronic device is embedded between the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are respectively located between the electronic device and the corresponding conductive material, and the first dielectric material, the second dielectric material, the electronic device and the two conductive materials form a core board. An inner-layer circuit is formed on the core board, and the inner-layer circuit is connected with the electronic device. | 12-17-2015 |
20160081200 | METHOD FOR MANUFACTURING CIRCUIT BOARD BY ETCHING POLYIMIDE - A method for manufacturing circuit board includes steps of forming upper and lower copper foil layers on upper and lower surface of a PI substrate, respectively, etching the upper and lower copper foil layers to form first and second electrical circuits, attaching first and second PI coverlays to the upper and lower copper foil layers, respectively, etching the PI substrate through a PI etching process to form at least one opening exposing the lower copper foil layer, and performing a surface treatment to form a solder layer electrically connected to the electrical circuit of the lower copper foil layer for soldering electrical elements in a subsequent process. Therefore, the circuit board with double side circuit and single side assembly is obtained. The present invention do not employ the process of exposure ink, thereby simplifying the whole manufacturing procedure and greatly improving preciseness of the circuit board. | 03-17-2016 |