Entries |
Document | Title | Date |
20080201944 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A multilayer printed circuit board has an IC chip | 08-28-2008 |
20080209721 | MULTIPOINT NANOPROBE AND METHOD FOR FABRICATION - A nanoprobe includes a substrate having a layer, which forms a projected portion. A plurality of conductive lines is adhered to the projected portion and the lines extend beyond an end of the projected portion by a distance to form contact points, wherein the lines are connected to material of the projected portion to provide stiffness and the contact points provide flexibility during use. | 09-04-2008 |
20080216313 | Method For Fabricating IC Board Without Ring Structure - A method for fabricating an IC board without a ring structure is provided, in which after the completion of the core board (including the core through hole), the second pattern photoresist layer is used to mask over the first depositing metal layer, and portion of the second depositing metal layer (this portion of the second depositing metal layer is to electrically couple to the conductive circuit of the core through hole). Later, the second depositing metal layer, the first depositing metal layer, the metal layer, and even to the substrate at the innermost layer which are for the portion that are not masked by the second pattern photoresist layer are removed. As a result, the substrate is exposed to form the ringless structure, but which is to couple a conductive line to the core board through hole. | 09-11-2008 |
20080271314 | ENHANCED-RELIABILITY PRINTED CIRCUIT BOARD FOR TIGHT-PITCH COMPONENTS - A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts. | 11-06-2008 |
20080282535 | METHOD OF FABRICATING AN INTEGRATED CIRCUIT - A method of fabricating an integrated circuit, including a functional layer on a substrate is disclosed. One embodiment includes providing a substrate in a process atmosphere. A first precursor and a second precursor are provided in the process atmosphere. The first precursor is removed from the process atmosphere. A third precursor is provided in the process atmosphere. | 11-20-2008 |
20080282536 | Lead Zirconate Titanate with Iron/Tungstein Doping, Method of Producing a Piezoceramic Material with the Lead Zirconate Titanate, and Use of the Piezoceramic Material - A piezoceramic composition has a nominal empirical formula of Pb | 11-20-2008 |
20080289176 | PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin. | 11-27-2008 |
20080313896 | Sensor with layered electrodes - A thin film sensor, such as a glucose sensor, is provided for transcutaneous placement at a selected site within the body of a patient. The sensor includes several sensor layers that include conductive layers and includes a proximal segment defining conductive contacts adapted for electrical connection to a suitable monitor, and a distal segment with sensor electrodes for transcutaneous placement. The sensor electrode layers are disposed generally above each other, for example with the reference electrode above the working electrode and the working electrode above the counter electrode. The electrode layers are separated by dielectric layer. | 12-25-2008 |
20090007426 | Image forming apparatus and method of manufacturing electronic circuit using the same - An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photo conductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photo conductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer. | 01-08-2009 |
20090025215 | MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation film on the first metal wiring element, with use of a screen mask having a non-ejection area slightly larger than a head of the via post, such that the interlayer insulation film has an upper surface at the level lower than the head of the via post, while generally aligning the non-ejection area with the head of the via post, a step of curing the interlayer insulation film, and a step of forming a second metal wiring element in contact with the via post on the interlayer insulation film such that the first metal wiring element and the second metal wiring element are connected through the via post. | 01-29-2009 |
20090025216 | MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN INDEX FOR A POSITION OF VIA HOLES - A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film. | 01-29-2009 |
20090031563 | Rearrangement sheet, semiconductor device and method of manufacturing thereof - There are provided a semiconductor device construction having more degrees of design freedom of the semiconductor element than prior arts, and a method of manufacturing such device easily and at low cost. For this purpose, a rearrangement sheet is employed provided with an insulating sheet and conductive metallic patterns formed on this insulating sheet. | 02-05-2009 |
20090056119 | Method of fabricating multilayer printed circuit board - Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey. | 03-05-2009 |
20090064495 | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates - Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates. | 03-12-2009 |
20090064496 | INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME - The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via. | 03-12-2009 |
20090064497 | Printed circuit board using paste bump and manufacturing method thereof - The method of manufacturing a printed circuit board using paste bumps includes perforating a core board to form at least one via hole, filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, stacking a paste bump board on at least one surface of the core board, and forming an outer layer circuit on a surface of the paste bump board. The method provides a structurally stable all-layer IVH structure due to increased strength in the BVH's of the plated core boards and the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 03-12-2009 |
20090070995 | MANUFACTURING METHOD OF DISPLAY APPARATUS - A manufacturing method of a display apparatus which comprises a plurality of display pixels including light emitting elements having a carrier transport layer includes first causing a surface of an electrode formed in a forming region of the plurality of display pixels by being enclosed by a partition wall which is provided on a substrate to have a lyophilic characteristic, making a surface of the partition wall have a repellency characteristic and second causing the surface of the electrode to have the lyophilic characteristic again by carrying out a plasma treatment in an inert gas atmosphere. | 03-19-2009 |
20090077799 | Circuit board structure with capacitor embedded therein and method for fabricating the same - The present invention relates to a circuit board structure with a capacitor embedded therein and the method for fabricating the same. The disclosed structure comprises: a core board; a buffer layer disposed on two surfaces of the core board and having a plurality of open areas; a first circuit layer disposed in the open areas; a high dielectric material film disposed over the first circuit layer and the buffer layer on at least one surface of the core board; and a second circuit layer disposed on the high dielectric material film, wherein the region where the second circuit layer corresponds to the first circuit layer functions as a capacitor, and the first circuit layer on two surfaces of the core board electrically connects to each other by at least one plated through hole. The present invention improves the problem of void generation and enhances the precision of the capacitor region. | 03-26-2009 |
20090090003 | PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin. | 04-09-2009 |
20090094824 | METHOD OF PRODUCING SUBSTRATE - The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer. | 04-16-2009 |
20090100673 | METHOD FOR MANUFACTURING WIRING BOARD - There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer. | 04-23-2009 |
20090106975 | Roughened Printed Circuit Board And Manufacturing Method Thereof - A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed. | 04-30-2009 |
20090113702 | DISK DRIVE COMPRISING A DOUBLE SIDED FLEX CIRCUIT WHEREIN A FIRST SIDE LEAD PROVIDES AN ETCHING MASK FOR A SECOND SIDE LEAD - A method of manufacturing a flex circuit is disclosed for a disk drive comprising a disk, a head actuated radially over the disk, and control circuitry. The flex circuit is for electrically coupling the head to the control circuitry and comprises a substrate. An electrical coating applied to a first side of the substrate is etched to form a first electrical lead. The first side of the substrate is irradiated with radiation such that the first electrical lead masks the radiation from passing through the substrate to prevent curing of a photoresist applied to the second side of the substrate to form an uncured photoresist and a cured photoresist on the second side of the substrate. The uncured photoresist is removed from the second side of the substrate to form a groove, and the groove is filled with electrically conductive material to form the second electrical lead. | 05-07-2009 |
20090113703 | CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX ARRANGEMENT - Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines. | 05-07-2009 |
20090119914 | Process for Forming Electrical Contacts on a Semiconductor Wafer Using a Phase Changing Ink - A process for forming electrical contacts or electrical conductors on a surface of a substrate comprising ink jet printing a phase-change electrically conducting or semi-conducting printing ink or, such a phase-change printing ink that becomes electrically conducting or semi-conducting after a post-printing treatment of the applied ink. | 05-14-2009 |
20090133253 | Method of manufacturing printed circuit board - A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer. | 05-28-2009 |
20090144971 | PROBE CARD - An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape. | 06-11-2009 |
20090165295 | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates - Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates. | 07-02-2009 |
20090183366 | METHOD FOR MANUFACTURING CIRCUIT FORMING SUBSTRATE - A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs, that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon. | 07-23-2009 |
20090205204 | PROCESS FOR THE PRODUCTION OF A CIRCUIT PORTION ON A SUBSTRATE - The invention relates to a method for producing at least one circuit part on a substrate ( | 08-20-2009 |
20090211088 | Circuit board having configurable ground link and with coplanar circuit and group traces - A transition circuit board for transitioning a cable to a connector is provided. A circuit board has an outer surface with a circuit trace, ground plane and ground link provided thereon. A cable pad and a contact pad are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane. | 08-27-2009 |
20090217520 | METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE - In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed. | 09-03-2009 |
20090217521 | DISPLAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY DEVICE HAVING THE SAME - A display substrate includes a substrate, a first capacitor electrode, a dielectric layer, a second capacitor electrode, and a transparent conductive electrode. The substrate includes an effective display region and a non-effective display region that surrounds the effective display region. The first capacitor electrode is in the non-effective display region. The dielectric layer is on the first capacitor electrode. The second capacitor electrode is on the dielectric layer corresponding to the first capacitor electrode. The transparent conductive electrode is positioned substantially in the effective display region. Therefore, the number of elements is decreased so that a size and a manufacturing cost of a display device are reduced. | 09-03-2009 |
20090241334 | Metallization forming method - A metallization forming method comprises the steps of: patterning a silver halide emulsion on a surface of at least one side of a substrate in accordance with a desired metallization pattern to form a patterned emulsion layer; exposing the patterned emulsion layer; and thereafter developing the exposed patterned emulsion layer to form a patterned conductive silver layer having the metallization pattern. | 10-01-2009 |
20090260231 | DEVICE TO CHECK AND CORRECT THE POSITION OF PLATES FOR ELECTRONICS AND RELATED METHOD - A device to check and correct the position of plates for electronics, associated with a loading station of the plates and with a printing unit of an apparatus for depositing metal or other material, in which there is a video acquisition member to acquire at least an image indicating a position occupied by the plate in the loading station. The device comprises movement and positioning means suitable for the reciprocal alignment of the printing unit and the plate, as detected in the loading station, there also being present a control, processing and governing unit. | 10-22-2009 |
20090265929 | METHOD OF MOUNTING ELECTRONIC CIRCUIT CONSTITUTING MEMBER AND RELEVANT MOUNTING APPARATUS - A mounting method comprising the steps of (A) disposing first liquid ( | 10-29-2009 |
20090271982 | Method of forming a wiring having carbon nanotube - In a method of forming a wiring having a carbon nanotube, a lower wiring is formed on a substrate, and a catalyst layer is formed on the lower wiring. An insulating interlayer is formed on the substrate to cover the catalyst layer, and an opening is formed through the insulating interlayer to expose an upper face of the catalyst layer. A carbon nanotube wiring is formed in the opening, and an upper wiring is formed on the carbon nanotube wiring and the insulating interlayer to be electrically connected to the carbon nanotube wiring. A thermal stress is generated between the carbon nanotube wiring and the upper wiring to produce a dielectric breakdown of a native oxide layer formed on a surface of the carbon nanotube wiring. A wiring having a reduced electrical resistance between the carbon nanotube wiring and the upper wiring may be obtained. | 11-05-2009 |
20090277006 | METHOD FOR FORMING AN ELECTRICAL CONNECTION - Embodiments of the present invention provide a method of forming an electrical connection on a device. In one embodiment, the electrical connection is attached to the device via an adhesive having electrically conductive particles disposed therein. In one embodiment, the adhesive is cured while applying pressure such that the conductive particles align, have a reduced particle-to-particle spacing, or come into contact with each other to provide a more directly conductive (less resistive) path between the electrical connection and the device. In one embodiment of the present invention, a method for forming an electrical lead on a partially formed solar cell during formation of the solar cell device is provided. The method comprises placing a side-buss wire onto a pattern of electrically conductive adhesive disposed on a back contact layer of a solar cell device substrate, laminating the side-buss wire and electrically conductive adhesive between the solar cell device substrate and a back glass substrate to form a composite solar cell structure, and curing the electrically conductive adhesive while applying pressure and heat to the composite solar cell structure | 11-12-2009 |
20090307902 | APPARATUS AND METHOD FOR APPLYING CONDUCTIVE PASTE ONTO ELECTRONIC COMPONENT - An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig unit, for allowing the conductive paste to be applied onto the electronic component. The conductive paste is applied onto the electronic component, while the electronic component is loaded onto or unloaded from the first jig unit. The apparatus and the method allow the conductive paste for forming electrodes to be precisely applied onto the electronic component, easily adjust the amount of the applied conductive paste, prevent the spreading of the conductive paste or the incorrect application of the conductive paste, allow jig units, for applying the conductive paste onto the electronic component, to be used for a long time without replacement or washing, cause the reduction of the maintenance costs of the apparatus, and facilitate the formation of electrodes having various shapes on the electronic component. | 12-17-2009 |
20090313819 | Methods for Manufacturing a Panel of Electronic Component Protection Devices - Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications. | 12-24-2009 |
20100000086 | METHOD OF MAKING A MOLDED INTERCONNECT DEVICE - The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body. | 01-07-2010 |
20100005653 | Circuit Apparatus and Method of Fabricating the Apparatus - The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer. | 01-14-2010 |
20100018052 | Method of manufacturing printed circuit board for optical waveguide - Disclosed herein is a method of manufacturing a printed circuit board for an optical waveguide which includes electrical and optical layers for transmitting electrical and optical signals to the printed circuit board. The method includes forming a lower clad layer on a base substrate, layering or applying a core material on the lower clad layer, machining a trench in the core material to form a core layer having a core pattern, and forming an upper clad layer on the lower clad layer and the core layer. The method enables an optical waveguide to be manufactured using a simple apparatus and process without the use of an additional photo mask. | 01-28-2010 |
20100058585 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board is disclosed. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention can include: forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing, heating and sintering the circuit pattern, and transferring the circuit pattern on an insulation layer by stacking the carrier on the insulation layer such that the circuit pattern is buried in the insulation layer. In accordance with an embodiment of the present invention, a minute, precise circuit pattern can be formed through inkjet printing, and adhesion between the circuit pattern and the insulation layer can be improved. | 03-11-2010 |
20100071207 | APPARATUS FOR ROLL-TO-ROLL MANUFACTURING SEMICONDUCTOR PARTS AND FEEDING METHOD THEREOF - Provided are an apparatus for roll-to-roll manufacturing of semiconductor parts and a method of the roll-to-roll manufacturing. The apparatus includes a material supplying unit continuously supplying a material, a processing unit processing the material supplied by the material supplying unit, a transferring unit transferring the material, a tension adjusting unit adjusting tension of the material in a direction in which the material is being transferred; and a connection operating unit, which is disposed between the material supplying unit and the processing unit, attaching a leading board to a leading portion of the material. | 03-25-2010 |
20100077609 | BURIED TRACES FOR SEALED ELECTROSTATIC MEMBRANE ACTUATORS OR SENSORS - In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace. | 04-01-2010 |
20100077610 | METHOD FOR MANUFACTURING THREE-DIMENSIONAL CIRCUIT - A method for manufacturing a three-dimensional circuit is described as follows. Firstly, a three-dimensional insulating structure having at least one uneven surface is provided. Secondly, a self-assembly film is formed on the uneven surface for completely covering the uneven surface. Next, a catalytic film is formed on the self-assembly film. Afterward, the self-assembly film and the catalytic film are patterned. Then, a three-dimensional circuit structure is formed on the catalytic film by chemical deposition. | 04-01-2010 |
20100088887 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other. | 04-15-2010 |
20100101083 | METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE WITH CONCAVE CONDUCTIVE CYLINDERS - A method of fabricating a circuit board structure with concave conductive cylinders is provided. Firstly, a conductive layer is provided and a dielectric layer is formed on a surface of the conductive layer. Next, a plurality of vias is formed in the dielectric layer, where the vias are exposed on the surface of the conductive layer. A conductive material is then filled in the vias to form a plurality of conductive cylinders on the surface of the conductive layer, so that the tips of the conductive cylinders are exposed on a surface of the dielectric layer relatively far away from the conductive layer. The exposed tips of the conductive cylinders are removed, so that the height of the conductive cylinders is lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer. | 04-29-2010 |
20100126008 | Circuit module and process for producing the same - A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder. | 05-27-2010 |
20100139090 | WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD - A wiring board comprising: a core board including a core body and a ceramic sub-core which is accommodated in a sub-core accommodation space that is a through-hole that communicates with major surfaces of the core body or a recess having an opening in a first major surface of the core body; and wiring laminates each formed by resin insulating layers and conductor layers laminated on each of major surfaces of the core board, wherein: a groove-filling portion which fills a gap between the core body and the ceramic sub-core is integral with a lowest resin insulating layer of the first-major-surface-side wiring laminate; and via conductors that are connected to respective conductor patterns formed on a first major surface of the ceramic sub-core penetrate through the lowest resin insulating layer. | 06-10-2010 |
20100146780 | METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS - A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly. | 06-17-2010 |
20100154211 | METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING INKJET PRINTHEAD SUBSTRATE - A method for manufacturing a wiring board includes a first process of preparing a substrate having a hole passing through a first surface and a second surface opposite the first surface; a second process of closing the opening of the hole in the first surface with a wiring member; a third process of supplying a powder conductive material onto the second surface to fill the hole with the conductive material; a fourth process of removing the conductive material that is not charged into the hole from the top of the second surface; and a fifth process of melting the conductive material that fills the hole by heating the conductive material and thereafter solidifying the conductive material. | 06-24-2010 |
20100170087 | Method of manufacturing a circuit board - A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces. | 07-08-2010 |
20100175249 | Method for Fabricating Thin Touch Sensor Panels - A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment. | 07-15-2010 |
20100175250 | Multilayer substrate and method of manufacturing the same - A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members. | 07-15-2010 |
20100175251 | FLEXIBLE PRINTED CIRCUIT BOARD - A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line. | 07-15-2010 |
20100186227 | Wired circuit board and production method thereof - A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer. | 07-29-2010 |
20100192372 | METHOD OF DISPOSING ELECTRONIC DEVICE ON ELECTRODE FORMED ON SUBSTRATE TO CONNECT ELECTRICALLY THE ELECTRONIC DEVICE AND THE ELECTRODE - The present invention includes: a pre-step of preparing a substrate having on its surface a hydrophilic region that is surrounded by a water-repellent region and provided with a hydrophilic electrode; a first step of applying an electroless plating solution in which a metal compound is dispersed in water to the substrate to dispose an electroless plating solution in the hydrophilic region; a second step of applying an electronic device-dispersed liquid in which an electronic device having a device electrode is dispersed in a first liquid to the substrate to move the electronic device from the first liquid to the electroless plating solution so as to bring the device electrode into contact with the hydrophilic electrode; a third step of coating a surface of the substrate with a second liquid before the water contained in the electroless plating solution volatilizes completely to cause a plating reaction between the hydrophilic electrode and the device electrode and to connect electrically the hydrophilic electrode and the device electrode; and a fourth step of removing the second liquid from the substrate. | 08-05-2010 |
20100199492 | CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP - A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures. | 08-12-2010 |
20100229384 | Flexible Electrode Array for Artificial Vision - An image is captured or otherwise converted into a signal in an artificial vision system. The signal is transmitted to the retina utilizing an implant. The implant consists of a polymer substrate made of a compliant material such as poly(dimethylsiloxane) or PDMS. The polymer substrate is conformable to the shape of the retina. Electrodes and conductive leads are embedded in the polymer substrate. The conductive leads and the electrodes transmit the signal representing the image to the cells in the retina. The signal representing the image stimulates cells in the retina. | 09-16-2010 |
20100236065 | Method of Producing Printed Circuit Board Incorporating Resistance Element - There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes | 09-23-2010 |
20100251544 | Manufacturing method of a flexible printed circuit board - In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer on a surface of the substrate and corresponding to the Y-axis circuit, forming an X-axis circuit layer on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer according to the external circuit. | 10-07-2010 |
20100257732 | Shielding Arrangement for Electronic Device - A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding. | 10-14-2010 |
20100269335 | Method of manufacturing printed circuit board having embedded resistors - A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns. | 10-28-2010 |
20100299919 | METHOD FOR MAKING A POSITIVE TEMPERATURE COEFFICIENT DEVICE - A method for making a positive temperature coefficient device includes: (a) forming a crosslinkable preform of a positive temperature coefficient polymer composition containing a polymer system and a conductive filler; (b) attaching a pair of electrodes to the preform; (c) soldering a pair of conductive leads to the electrodes using a lead-free solder paste having a melting point greater than 210° C.; and (d) crosslinking the crosslinkable preform after step (c). | 12-02-2010 |
20100299920 | METHODS FOR MANUFACTURING DEVICE MOUNTING BOARD AND CIRCUIT SUBSTRATE - To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically. | 12-02-2010 |
20100325885 | CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDUCTOR DEVICE, AND SURFACE LAMINATION STRUCTURE FOR CIRCUIT MEMBER - A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed. | 12-30-2010 |
20110005070 | DUAL-DAMASCENE BIT LINE STRUCTURES FOR MICROELECTRONIC DEVICES AND METHODS OF FABRICATING MICROELECTRONIC DEVICES - The present invention is directed toward methods of fabricating components for microelectronic devices, microelectronic devices including memory cells or other components, and computers including memory devices. For example, one embodiment is directed toward a method of fabricating a memory cell on a workpiece having a substrate, a plurality of active areas in the substrate, and a dielectric layer over the active areas. One embodiment of the method includes constructing bit line contact openings in the dielectric layer over first portions of the active areas and cell plug openings over second portions of the active areas. The method also includes depositing a first conductive material into the bit line contact openings to form bit line contacts and into the cell plug openings to form cell plugs. This embodiment continues by forming a trench through an upper portion of a plurality of the bit line contacts and portions of the dielectric layer between bit line contacts. The trench has a first sidewall and a second sidewall. In certain embodiments, the method continues by fabricating a spacer made from a dielectric material along at least the first sidewall of the trench and then fabricating a bit line in the trench. The bit line is embedded into the bit line contacts. The bit line is electrically coupled to selected bit line contacts, but is electrically insulated from the cell plugs. | 01-13-2011 |
20110061234 | Method For Fabricating Carrier Board Having No Conduction Line - A method for fabricating a carrier board having no conduction line is provided. The fabricating method includes: providing a support plate having a detachable metal layer; providing a plating current via the support plate and the detachable metal layer to plate on the detachable metal layer to in sequence configure an etching resist layer and a plating metal layer; and then gradually completing other circuit layers by a compression laminating process with the support plate providing the plating current. After the entire plating process has been completed, the support plate and the detachable metal layer are removed. | 03-17-2011 |
20110067233 | Method of fabricating printed circuit board - A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity. | 03-24-2011 |
20110067234 | METHOD FOR CONTINUOUS SINTERING ON INDEFINITE LENGTH WEBS - A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process. | 03-24-2011 |
20110078899 | MULTI-CHIP MODULE FOR BATTERY POWER CONTROL - A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure. | 04-07-2011 |
20110094098 | DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING - A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding. | 04-28-2011 |
20110099805 | Method of Fabricating Capacitive Touch-Screen Panel - Provided is a method of fabricating a capacitive touch-screen panel. The method includes preparing first and second substrates having first lateral surfaces on which first and second transparent conductive layers for forming first and second transparent electrode pattern units are disposed. Each of the first and second substrates has a screen region and an inactive region. Second lateral surfaces of the first and second substrates are bonded to each other by an interlayer adhesive. First and second metal layers for forming first and second outer electrode interconnections are disposed on exposed surfaces of the first and second transparent conductive layers, respectively. Double-side exposure and etching processes are performed to form the first transparent electrode pattern unit and the first outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the first substrate, respectively, and simultaneously, form the second transparent electrode pattern unit and the second outer electrode interconnection on the screen region and the inactive region of the first lateral surface of the second substrate, respectively. The first and second outer electrode interconnections are electrically connected to the first and second transparent electrode pattern units, respectively. The method can efficiently reduce the fabrication cost of a touch screen and greatly simplify the fabrication process of the touch-screen panel. | 05-05-2011 |
20110107596 | CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC - A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump. | 05-12-2011 |
20110131806 | ALIGNMENT MARK RECOGNITION METHOD AND PRINTED WIRING BOARD MANUFACTURING METHOD - A method for recognizing alignment marks includes preparing a substrate having multiple alignment marks including alignment marks positioned adjacent to each other, and recognizing the alignment marks on the substrate by capturing images of the alignment marks using a recognition camera. The recognizing of the alignment marks includes adjusting the position of the recognition camera when capturing images of the alignment marks positioned adjacent to each other such that each of the alignment marks positioned adjacent to each other is positioned equidistant from the center of an image-capturing region of the recognition camera. | 06-09-2011 |
20110138621 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 06-16-2011 |
20110146069 | ELECTRIC COMPONENT AND COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - A method for producing an electrical component ( | 06-23-2011 |
20110146070 | METHOD OF FABRICATING MULTI-LEVEL METALLIC PARTS BY THE LIGA-UV TECHNIQUE - The method of fabricating a multi-level, metallic microstructure includes the steps consisting in:
| 06-23-2011 |
20110154660 | CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODES AND METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR USING THE SAME - Provided are a conductive paste composition for inner electrodes and a method of manufacturing a multilayer ceramic capacitor using the same. The conductive paste composition for inner electrodes includes a metal powder having an average particle size ranging from 50 nm to 300 nm, and 4 to 10 parts by weight of a binder resin. The binder resin contains at least one resin selected from the group consisting of a high-molecular-weight polyvinylbutyral resin having a weight-average molecular weight of 250 thousands to 400 thousands, a low-molecular-weight polyvinylbutyral resin having a weight-average molecular weight of 50 thousands to 150 thousands, and a rosin ester. | 06-30-2011 |
20110154661 | Method of fabricating printed circuit board assembly - Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature. | 06-30-2011 |
20110154662 | METHOD OF MANUFACTURING ELECTRONIC CARDS - The present invention concerns a method of manufacturing complex electronic cards each including an electronic device or assembly ( | 06-30-2011 |
20110154663 | Memory Device - A memory or switching device includes a mesa and a first electrode conforming to said mesa. The device also includes a second electrode and a phase-change or switching material disposed between said first and second electrodes. The phase-change or switching material is in electrical communication with the first and second electrodes at a first contact region and a second contact region respectively. Also described is a method for making a memory or switching device. The method includes providing a first insulator and configuring the first insulator to provide a mesa. A first conductive layer is provided conforming to the mesa. A phase-change or switching material is provided over a portion of the first conductive layer, and a second conductive layer is provided over the phase-change or switching material. | 06-30-2011 |
20110154664 | STRUCTURE OF CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME - A circuit board structure and a method for fabricating the same are proposed. The structure includes an insulating protective layer having a plurality of openings in which conductive vias are formed, a patterned circuit layer formed on the surface of the insulating protective layer and electrically connected to the conductive vias in the openings of the insulating protective layer, and a dielectric layer formed on the insulating protective layer and on the surface of the patterned circuit layer, wherein a plurality of openings are formed in the dielectric layer to thereby expose parts of the patterned circuit layer. Accordingly, the present invention reduces the thickness of a circuit board, which reduces package size, improves product performance, and conforms to the developmental trend toward smaller electronic devices. | 06-30-2011 |
20110173809 | METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIELECTRIC LAYERS IN A CONTINUOUS MANNER - Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer. | 07-21-2011 |
20110185566 | METHOD FOR FORMING PATTERN AND A WIRED BOARD - A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material. | 08-04-2011 |
20110239457 | CIRCUIT MODULES AND METHOD OF MANAGING THE SAME - Circuit modules including identification codes and a method of managing them are provided. A module substrate includes signal input output terminals and outer ground terminals provided at the peripheral portions of a surface which becomes a mounting surface when the circuit module is completed. An inner-ground-terminal formation area surrounded by the signal input output terminals and the outer ground terminals includes a plurality of inner ground terminals arranged in a matrix of rows and columns. One of the edge portions is a direction identification area. The inner ground terminal is not provided in the direction identification area, and a first identification code having information about the position of the module substrate is provided in the direction identification area. | 10-06-2011 |
20110239458 | THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD - An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad. | 10-06-2011 |
20110239459 | METHOD FOR MANUFACTURING WAFER SCALE HEAT SLUG SYSTEM - A method for manufacturing a wafer scale heat slug system includes: dicing an integrated circuit from a semiconductor wafer; forming a heat slug blank equivalent in size to the semiconductor wafer; dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit; attaching the integrated circuit to a substrate; attaching the heat slug to the integrated circuit; and encapsulating the integrated circuit. | 10-06-2011 |
20110247212 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the base substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, forming vias in at least one of the first substrate or second substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than a mounting area of the first substrate such that the first substrate extends beyond an edge of the second substrate. | 10-13-2011 |
20110252639 | PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT - A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode, and a resistive element comprising a resistive material provided in the resistor-filling part wherein the resistor-filling part is substantially enclosed by the first electrode and the second electrode. | 10-20-2011 |
20110265321 | Manufacturing Method of Identifiable Print Circuit Board - A manufacturing method of identifiable print circuit board comprises a step of “disposing identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board. | 11-03-2011 |
20110265322 | Flexible Circuit Electrode Array with at least One Tack Opening - The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening. | 11-03-2011 |
20110265323 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring. | 11-03-2011 |
20110265324 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate. | 11-03-2011 |
20110277321 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured. | 11-17-2011 |
20110283533 | METHOD FOR GENERATION OF ELECTRICALLY CONDUCTING SURFACE STRUCTURES, APPARATUS THEREFOR AND USE - Disclosed is a method for generating conductive surface patterns on a substrate by coating the substrate with a predetermined pattern of electrically conductive particles or of particles of a material that can be converted by heating into an electrically conducting material, and sintering or melting the coated substrate by means of electromagnetic radiation and by applying an antenna for said electromagnetic radiation in the vicinity of the predetermined pattern. | 11-24-2011 |
20110302777 | Electronic Component Protection Device Panel - Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A layered structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications. | 12-15-2011 |
20110314669 | PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity. | 12-29-2011 |
20120000067 | Method of manufacturing printed circuit board having flow preventing dam - A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist | 01-05-2012 |
20120005893 | Method of manufacturing through electrode-attached glass substrate and method of manufacturing electronic component - A method of manufacturing a through electrode-attached glass substrate includes: forming an effective unit cell by drilling a plurality of through holes in a unit cell with a minimum area acquired by cutting out and dividing plate-shaped glass being configured as the unit cell and distributing dummy unit cells in which the through hole is not formed in an area in which the effective unit cell is formed; inserting electrode members into the through holes; welding the plate-shaped glass and the electrode members by heating the plate-shaped glass at a temperature that is higher than a softening point thereof; and grinding both sides of the plate-shaped glass together with the electrode members so as to expose a plurality of the electrode members to both sides of the plate-shaped glass and configure the plurality of the electrode members as a plurality of through electrodes that are electrically separated from each other. | 01-12-2012 |
20120030942 | Method for manufacturing multi-layer printed circuit board - Disclosed herein is a method for manufacturing a multi-layer printed circuit board. The method for manufacturing the multi-layer printed circuit board according to an exemplary embodiment of the present invention includes manufacturing a core substrate on which circuit patterns are formed by patterning copper clads on both sides thereof; laminating insulating films on top and bottom surfaces of the core substrate; and stacking the copper clads provided with bumps on the top and bottom surfaces of the core substrate, respectively, on which the insulating films are laminated. | 02-09-2012 |
20120030943 | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs - A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device | 02-09-2012 |
20120036712 | METHOD AND APPARATUS FOR PROVIDING AN ALTERNATIVE POWER SOURCE FOR A GRAPHICS CARD - A method and apparatus for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board. | 02-16-2012 |
20120066901 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion. | 03-22-2012 |
20120073131 | METHOD OF PRODUCING WIRING SUBSTRATE - A method of producing a wiring substrate includes producing a substrate body including a first primary surface on which a semiconductor chip mounting area is provided and a second primary surface opposed to the first primary surface; attaching a stiffener member on the first primary surface, the stiffener member including an opening which the semiconductor chip mounting area is exposed from; and connecting lead pins to corresponding connection pads provided on the second primary surface by way of electrically conductive members. | 03-29-2012 |
20120090172 | Method of manufacturing printed circuit boad - Disclosed herein is a method of manufacturing a printed circuit board, including: forming a first circuit wiring layer on a substrate; forming an organic metal compound layer on the surface of the first circuit wiring layer; performing a surface treatment on the surface of the organic metal compound layer; forming an insulating layer on the first circuit wiring layer including the organic metal compound layer; and forming a second circuit wiring layer on the insulating layer. | 04-19-2012 |
20120117801 | VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A variable resistance memory device has memory cells that are operated by Joule's heat and which are highly thermally efficient. Conductive patterns are formed on a substrate; sacrificial patterns exposing a portion of the top surface of each of the conductive patterns are formed on the conductive patterns, lower electrodes are formed by etching upper portions of the conductive patterns using the sacrificial patterns as an etching mask, then mold patterns are formed on the lower electrodes and cover exposed sidewall surfaces of the sacrificial patterns, and then the sacrificial patterns are replaced with variable resistance patterns. | 05-17-2012 |
20120124829 | Producing method of wired circuit board - A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer. | 05-24-2012 |
20120124830 | PROCESS FOR FABRICATING CIRCUIT BOARD - A process for fabricating a circuit board is provided. In the process, first, a circuit substrate including an insulation layer and at least a pad contacting the insulation layer is provided. Next, a barrier material layer is formed on the circuit substrate. The barrier material layer completely covers the insulation layer and the pad. Then, at least one conductive bump is formed on the barrier material layer. The conductive bump is opposite to the pad, and the material of the barrier material layer is different from the material of the conductive bump. Next, a portion of the barrier material layer is removed by using the conductive bump as a mask, so as to expose the surface of the insulation layer and to form a barrier connected between the conductive bump and the pad. | 05-24-2012 |
20120131794 | Biocompatible Bonding Method and Electronics Package Suitable for Implantation - The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. | 05-31-2012 |
20120144666 | METHOD FOR MANUFACTURING WIRING BOARD - There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer. | 06-14-2012 |
20120144667 | MULTILAYER PRINTED WIRING BOARDS WITH HOLES REQUIRING COPPER WRAP PLATE - Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries. | 06-14-2012 |
20120151763 | METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - Disclosed are a method of manufacturing multilayer ceramic electronic components and a multilayer ceramic electronic component using the same. There is provided a method of preparing a plurality of ceramic layers including a first side, a second side, a third side, and a fourth side; printing a first inner electrode pattern and a second inner electrode pattern on the ceramic layers, the first inner electrode pattern and the second inner electrode pattern being exposed to the first side or the third side and having concave portions in the second side and fourth side directions; and stacking and compressing the plurality of ceramic layers printed with the first inner electrode pattern and the second inner electrode pattern. | 06-21-2012 |
20120167385 | METHOD OF FABRICATING IMPLANTABLE PULSE GENERATOR USING WIRE CONNECTIONS TO FEEDTHROUGH STRUCTURES AND IMPLANTABLE PULSE GENERATORS - In one embodiment, a method of fabricating an implantable pulse generator, comprises: providing a lead body including a plurality of conductors; providing a feedthrough component comprising feedthrough pins; electrically coupling pulse generating circuitry through switching circuitry with the feedthrough pins; hermetically enclosing the pulse generating circuitry and switching circuitry within a housing; providing a ferrule tube connector about each feedthrough pin wherein (i) each ferrule tube connector comprises an inner diameter that is sized to make contact about a circumference of respective feedthrough pin, and (ii) each ferrule tube connector comprises at least one slot in an upper portion of the respective ferrule tube connector; placing a respective conductor of the plurality of conductors in the slot of each of the ferrule tube connectors; and performing welding operations to connect the plurality of conductors of the lead body with the ferrule tube connectors. | 07-05-2012 |
20120174392 | Method of fabricating printed circuit board - A method for manufacturing a printed circuit board includes applying a layer of an ink material onto the substrate, the ink material includes a number of conductive particles contained in a solution, and the substrate is then heated to remove the solution and to sinter or retain the conductive particles on the substrate and to form a conductive metal line on the substrate of the printed circuit board. One or more additional layers of the ink material are applied onto the conductive metal line of the substrate with an electroplating process, or by repeating applying the ink material onto the conductive metal line and heating and retaining the conductive particles on the conductive metal line of the substrate. | 07-12-2012 |
20120174393 | METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD - A method of fabricating a multilayered printed circuit board, the method including: providing a core substrate having an outer circuit, the core substrate having a thermal expansion coefficient of 10 to 20 ppm/° C. at −60 to 150° C.; stacking a stress-relieving insulation layer on either side of the core substrate, the stress-relieving insulation layer having a thermal expansion coefficient of −20 to 6 ppm/° C.; and forming a metal layer on the insulation layer and forming at least one pad by removing at least one portion of the metal layer and electrically connecting the pad with the outer circuit. | 07-12-2012 |
20120180312 | CORE VIA FOR CHIP PACKAGE AND INTERCONNECT - In integrated circuit packages, core vias are created to provide electrical connections between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods for forming a via in a packaging substrate and packaging substrates having core vias formed in the core substrate material. Methods for forma a core via in a packaging substrate in which a first hole is created through the core substrate and filled with a low permittivity filler material. A second co-axially aligned hole is then created in the low permittivity filler material wherein the second hole is smaller in diameter than the first hole. The second hole is then filled with conducting material to provide a conducting via through the core substrate material. | 07-19-2012 |
20120186080 | CREATING CONDUCTIVIZED TRACES FOR USE IN ELECTRONIC DEVICES - Methods are provided for manufacturing electronic devices such as transistors, solar arrays, optical display arrays, portions of such devices and arrays, and the like. The methods involve providing a substrate having a surface with a pattern of raised portions and recessed portions, adding a conductive material to the surface of the substrate, and manipulating the surface of the substrate to provide the conductive material only in the recessed portions. | 07-26-2012 |
20120192415 | METHOD FOR CONNECTING TWO OBJECTS ELECTRICALLY - A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily. | 08-02-2012 |
20120198693 | METHOD OF MANUFACTURING MULTI-BAND FRONT END MODULE - A method of manufacturing a multi-band front end module having an embedded passive element, the method including: preparing metal plates formed on either surface of an adhesion layer interposed therebetween; forming first circuit patterns on the plates; separating the plates by removing the adhesion layer; pressing one of the plates to one surface of an insulation layer and another of the plates to the other surface of the insulation layer; removing the plates to form the insulation layer having the first circuit patterns formed on either surface thereof; stacking dielectric layers on either surface of the insulation layer; and forming a second circuit pattern on the dielectric layers stacked on the either surface of the insulation layer. | 08-09-2012 |
20120204420 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board, which prevents electrostatic destruction generated in a mask pattern, by employing a structured exposure mask at a low cost is provided. The method can comprise the steps of forming a photosensitive resin layer on an insulating layer located underneath a predetermined conductor layer, forming a plating resist by exposing and developing the photosensitive resin layer with an exposure light while an exposure mask is disposed on a surface of the photosensitive resin layer, forming a metal plating layer that has a conductor pattern formed by applying a metal plating to an opening of the plating resist, and removing the plating resist. The exposure mask may have a plurality of graphic patterns, and each corner of the graphic patterns maybe chamfered by 50 micrometers or more so that electrostatic destruction due to electric discharge between the adjacent graphic patterns is prevented. | 08-16-2012 |
20120222298 | METHOD OF CIRCUIT LAYOUT BY PHOTOSENSITIVE ENVIRONMENT-FRIENDLY INK - A method of circuit layout by photosensitive environment-friendly ink, which is used in a printed circuit board having a copper foil layer. The method comprises: providing photosensitive environment-friendly ink; disposing a circuit layout pattern, and injecting the photosensitive environment-friendly ink on the copper foil layer according to the circuit layout pattern to form the printed circuit board having the circuit layout pattern thereon; exposing the printed circuit board under light to have the photosensitive environment-friendly ink reacted with ultraviolet light in the light; and copper cleaning and alkaline cleaning the copper foil layer to expose the circuit layout pattern corresponding to the photosensitive environment-friendly ink on the printed circuit board. The invention can be used to achieve reducing steps in the conventional printed circuit board manufacturing process, reduced usage of chemical materials, simplified transfer of manufacturing process, optimization of wirings in the circuit layout, and low cost manufacture. | 09-06-2012 |
20120222299 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased. | 09-06-2012 |
20120227259 | SINGLE LAYER TOUCH SENSOR - Embodiments described herein provide capacitance sensing devices and methods for forming such devices. The capacitance sensing devices include a substrate having a central and an outer portion. A plurality of substantially co-planar electrodes are on the central portion substrate. A first plurality of conductors are on the substrate. Each of the first plurality of conductors has a first end portion electrically connected to one of the plurality of electrodes and a second end portion on the outer portion of the substrate. An insulating material is coupled to the second end portions of the first plurality of conductors. A second plurality of conductors are coupled to the insulating material. Each of the second plurality of conductors is electrically connected to the second end portion of at least some of the first plurality of conductors and is insulated from the second end portion of the others of the first plurality of conductors. | 09-13-2012 |
20120255166 | METHOD FOR MANUFACTURING FABRIC TYPE CIRCUIT BOARD - An embodiment of the present invention relates to a method for manufacturing a fabric type circuit board and can form a fine pattern by performing the etching process on the metal layer when a circuit pattern is formed, transfer the circuit pattern to the fabric by a thermosetting adhesive film to secure strong durability against flexibility of the fabric and sufficient electric conductivity and maintain ventilation, and apply various mounting methods such as soldering, wire bonding, or the like, when electronic parts are mounted. | 10-11-2012 |
20120255167 | SINGLE LAYER TOUCH SENSOR - Embodiments for constructing capacitance sensing devices include, but are not limited to, forming a plurality of electrodes on a central portion of a substrate, the substrate comprising a central portion and an outer portion, forming a first plurality of conductors on the substrate, each of the first plurality of conductors being connected to and extending from at least one of the plurality of electrodes, and forming an insulating material on the outer portion of the substrate and at least partially over some of the first plurality of conductors. The constructing also includes forming a second plurality of conductors on the insulating material, wherein the second plurality of conductors and the insulating material are configured such that each of the second plurality of conductors is electrically connected to at least some of the first plurality of conductors and is insulated from the others of the first plurality of conductors. | 10-11-2012 |
20120260501 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB. | 10-18-2012 |
20120260502 | METHOD FOR MAKING CIRCUIT BOARD - A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure. | 10-18-2012 |
20120266463 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board, including: forming a complex solder resist layer including a solder resist having an open part for forming a metal post and a cover film contacting the solder resist on a base substrate having an outer-layer circuit including a plating lead line; forming a metal post on the open part for forming the metal post by performing electroplating; removing the plating lead line; and exposing the metal post by removing the cover film. | 10-25-2012 |
20120279060 | METHODS AND APPARATUSES FOR NON-PLANAR CHIP ASSEMBLY - Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation. | 11-08-2012 |
20120279061 | CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES - A method of fabricating a substrate via structure in a substrate/chip assembly includes steps of: disposing a center via stack for electrical interconnects in the substrate/chip assembly; and providing a plurality of stacked vias surrounding the center via stack. The plurality of stacked vias encircle the center via stack, resulting in no isolated via stacks on the structure. The plurality of stacked vias have both functional and non-functional vias. | 11-08-2012 |
20120291275 | METHOD OF FORMING METAL INTERCONNECTION LINE ON FLEXIBLE SUBSTRATE - Provided is a method of forming a metal interconnection line on a flexible substrate, wherein the method includes: coating a hard mask layer on at least one surface of the flexible substrate, followed by performing photolithography thereon to form a predetermined hard mask pattern; etching a portion of the flexible substrate by using the hard mask pattern as a mask to form a trench; plasma treating the inside of the trench by using a treatment gas for pre-treating the flexible substrate; coating a seed layer inside the trench; removing the hard mask pattern; and filling the inside of the trench coated with the seed layer with metal. A metal interconnection line formed by using the method may have a strong adhesion force with respect to the flexible substrate. | 11-22-2012 |
20120297617 | MULTI-PURPOSE ARCHITECTURE FOR CCD IMAGE SENSORS - A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate electrodes disposed over the VCCD shift registers and arranged into physically separate and distinct sections that are non-continuous across the plurality of VCCD shift registers. The CCD image sensor can be configured to operate in two or more operating modes, including a full resolution charge multiplication mode. | 11-29-2012 |
20120297618 | PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY - A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. | 11-29-2012 |
20120317805 | Printed Circuit Board Having Aluminum Traces with a Solderable Layer of Material Applied Thereto - A method is provided for producing a printed circuit board. The method includes the step of providing an insulating substrate having a layer of aluminum material applied to the substrate. A portion of the layer of aluminum material is removed for defining a circuit trace. A layer of conductive material is applied to the layer of aluminum material. | 12-20-2012 |
20130000116 | ELECTROMECHANICAL TRANSDUCER - When the initial displacement greatly varies among cells in an element, there is a need to reduce a bias voltage to be applied between electrodes. This decreases the sensitivity. An electromechanical transducer of the present invention includes an element having a plurality of cells. Each of the cells includes a first electrode and a second electrode that are provided with a cavity being disposed therebetween. A groove is provided at a position at a predetermined distance from the cavity of the cell on the outermost periphery of the element. | 01-03-2013 |
20130008024 | Electronic Component-Embedded Printed Circuit Board and Method Of Manufacturing The Same - Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material. | 01-10-2013 |
20130008025 | PRINTED CIRCUIT BOARD HAVING MICRO STRIP LINE, PRINTED CIRCUIT BOARD HAVING STRIP LINE AND METHOD OF MANUFACTURING THEREOF - A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer. | 01-10-2013 |
20130019470 | METHOD OF MANUFACTURING THREE-DIMENSIONAL CIRCUIT - A method of manufacturing 3D circuit includes the steps of providing a main body of a 3D structure; degreasing and roughening surfaces of the main body; performing a metallization process on the main body to deposit a thin metal film thereon; performing a photoresist coating process to form a photoresist protective layer on the thin metal film; performing an exposure and development process on the photoresist protective layer to form a patterned photoresist protective layer; performing an etching process to form a patterned circuit layer at areas covered by the patterned photoresist protective layer; stripping the patterned photoresist protective layer off the patterned circuit layer; and performing a chemical plating process on the patterned circuit layer to form a thickness-increased circuit layer. With the method, a 3D circuit can be formed on a 3D structure without providing additional circuit carrier to meet the requirement for miniaturized and compact electronic devices. | 01-24-2013 |
20130025119 | Printed Circuit Board With Reduced Dielectric Loss - A printed circuit board (‘PCB’) with reduced dielectric loss, including conductive traces disposed upon layers of dielectric material, the layers of dielectric material including core layers and prepreg layers, one or more of the layers of dielectric material including pockets of air that reduce an overall relative dielectric constant of the PCB. | 01-31-2013 |
20130031780 | Biosensor Electrode Mediators for Regeneration of Cofactors - The present invention is based on the discovery of NAD | 02-07-2013 |
20130047428 | METHOD OF MANUFACTURING TOUCH PANEL - Disclosed herein is a method of manufacturing a touch panel. A method of manufacturing a touch panel according to the present invention includes: patterning a transparent substrate using a stamp so that the transparent substrate has concave portions depressed therein; applying a barrier layer only to outer sides of the concave portions of the transparent substrate so that the concave portions are exposed; and forming sensing electrodes in the concave portions, the sensing electrode made of a metal. | 02-28-2013 |
20130055567 | INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERCONNECTION CARD, AND INSPECTION METHOD USING INTERCONNECTION CARD - Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin. | 03-07-2013 |
20130067741 | Neutron detector and method of making - A neutron detector comprises at least two conductive cathode sheets lying parallel to one another and coated with neutron reactive material on at least one side thereof; dielectric material separating the cathode sheets and covering less than about 80% of their surface area; and a plurality of anode wires lying generally parallel to the cathode sheets and separated from them by the dielectric, with the distance between adjacent anode wires being no more than twenty times the distance between said cathode sheets. The cathode sheets may be flat or curved; they may be separate plates or they may be successive folds or windings of a single folded or spiral-shaped metal sheet. Related methods for building the detector are disclosed. | 03-21-2013 |
20130067742 | PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD - Multi-layer printed wiring boards may be produced by:
| 03-21-2013 |
20130081267 | Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board - A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material. | 04-04-2013 |
20130081268 | METHOD FOR MANUFACTURING BASE FILM INCLUDING PRINTED CIRCUIT FILMS AND APPARATUS FOR BLANKING THE PRINTED CIRCUIT FILM - Methods for manufacturing a base film including a printed circuit film are provided. The base film includes a printed circuit film with a tap integrated circuit (“IC”). The method includes forming reference fixing-holes in the base film at both sides of the printed circuit film, respectively, the reference fixing-holes being collinear with a center line of the printed circuit film, and forming a plurality of auxiliary fixing-holes separated from the reference fixing-holes at equal intervals along a longitudinal direction of the base film. The printed circuit film includes a first side parallel to the longitudinal direction of the base film, a second side parallel to the first side, a third side perpendicular to the first and second sides, and a fourth side parallel to the third side. The center line of the printed circuit film is located at the same distance from the third side and the fourth side. | 04-04-2013 |
20130111746 | METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method of manufacturing a multilayer wiring substrate includes: a first laminate structure formation step of forming a first laminate structure on a support substrate, the first laminate structure including at least one conductor layer and at least one resin insulation layer; a core substrate formation step of laminating a core substrate on the first laminate structure such that a lower main surface of the core substrate comes in contact with the first laminate structure, the core substrate having a metal layer provided on an upper main surface thereof; and a second laminate structure formation step of forming a second laminate structure on the core substrate such that the second laminate structure covers the metal layer, the second laminate structure including at least one conductor layer and at least one resin insulation layer. | 05-09-2013 |
20130160290 | METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD - Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers. | 06-27-2013 |
20130180104 | Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same - A method of manufacturing a printed circuit board includes the initial steps of providing a first layer stack and providing a second layer stack. The first layer stack includes a first electrically-insulating layer. The first electrically-insulating layer includes a first surface and one or more electrically-conductive traces disposed on the first surface. The second layer stack includes a second electrically-insulating layer and a first electrically-conductive layer. The second electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the second electrically-insulating layer. The second layer stack further includes a cut-out area defining a void that extends therethrough. The cut-out area is configured to receive therein at least a portion of a device to be coupled to the first surface of the first electrically-insulating layer and electrically-coupled to one or more of the one or more electrically-conductive traces. | 07-18-2013 |
20130180105 | Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same - A method of manufacturing a printed circuit board includes the steps of providing a first layer stack including a first electrically-conductive layer and a first electrically-insulating layer and providing a second layer stack including a second electrically-insulating layer. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second electrically-insulating layer includes one or more electrically-conductive traces disposed on a first surface thereof. The method also includes mounting a device on the first surface of the second electrically-insulating layer such that the device is electrically-coupled to at least one of the one or more electrically-conductive traces, and providing the first layer stack with a cut-out area defining a void that extends from the second surface of the first electrically-insulating layer to the first surface of the first electrically-conductive layer. The cut-out area is configured to receive at least a portion of the device therein. | 07-18-2013 |
20130192065 | METHOD FOR MANUFACTURING A CIRCUIT - A method for manufacturing an integrated circuit includes the steps of: forming above an upper surface of a substrate ( | 08-01-2013 |
20130199034 | Methods and Apparatuses of Using Metal Needle Arrays for Specimen Lift-Out and Circuit Edit - Embodiments of the present invention provide method and apparatus of restoring probes attached to the manipulator in a control environment (e.g. vacuum chamber of an focus ion beam) without a need to open the vacuum chamber. Another embodiment of the present invention teaches construction and application of various shapes of nanoforks from a nanoneedles array inside a FIB vacuum chamber. In another embodiment, the present invention teaches edition and correction of completed and oxide-coated circuit boards by re-nano-wiring using nanoneedles of a nanoneedles array (as nanowire supply), contained in the same controlled space. In this embodiment, individual nanoneedles in a nanoneedle array are manipulated by a manipulator and placed in such a way to make electrical contact between the desired points. | 08-08-2013 |
20130219713 | METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD WITH A MULTILAYER CIRCUIT STRUCTURE - A method of manufacturing a laminate circuit board with a multilayer circuit structure which includes the steps of forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer on the circuit metal layer, forming a cover layer to cover the substrate and the nanometer plating layer, forming through holes in the cover layer to generate openings exposing part of the nanometer plating layer, and finally forming a second metal layer on the cover layer to fill up the openings is disclosed. The nanometer plating layer is used to obtain same effect of previously roughening by chemical bonding, such that no circuit width is reserved for compensation, and the density of the circuit increases such that much more dense circuit can be implemented. | 08-29-2013 |
20130227838 | METHOD OF MANUFACTURING A CIRCUIT BOARD - A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern. | 09-05-2013 |
20130232783 | CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE - Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %. | 09-12-2013 |
20130239407 | Bonding Components to Each Other Using Exothermic Reactions by Simultaneous Current Pulses - A method and apparatus for joining a first workpiece and a second workpiece. A layer of exothermic material is placed between the first workpiece and the second workpiece. A plurality of currents is applied to the layer of exothermic material in a plurality of locations and substantially at the same time such that an exothermic reaction occurs in the layer of exothermic material. | 09-19-2013 |
20130247371 | METHOD FOR MANUFACTURING A SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS - An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards. | 09-26-2013 |
20130247372 | MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE - To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the interlayer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 μm or smaller, and the multilayer wiring board itself for the electronic device has the flexibility. | 09-26-2013 |
20130269185 | WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE - A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess. | 10-17-2013 |
20130283610 | APPARATUS AND METHOD OF FABRICATING TOUCH SCREEN PANEL - Provide is an apparatus and method of fabricating a touch screen panel capable of decreasing costs. The method includes forming print solution materials corresponding to components such as sensing patterns, insulating patterns, and sensing lines on different areas on a single blanket roll and printing the materials to form the components on a transparent substrate. An apparatus of fabricating a touch screen panel includes a substrate support configured to support a substrate thereon and a blanket roll being rotable and movable and configured to rotate and move to print a plurality of material patterns on the substrate, wherein an outer surface of the blanket roll is divided into a plurality of areas separated from each other, and at least one of the plurality of material patterns is formed in each of the plurality of areas. | 10-31-2013 |
20130283611 | THERMOELECTRIC MODULE - A thermoelectric module may include a first substrate having a mounting portion and an extension portion and a second substrate facing to the mounting portion. First electrodes are disposed on the mounting portion and have a first surface layer of gold. Second electrodes are disposed on the second substrate and have a second surface layer of gold. Thermoelectric elements are electrically bonded between the first and second arrays of electrodes by solder. A bonding layer is disposed on the extension portion and has a third surface layer of gold. The first surface layer of gold is distanced by a gap from the first surface layer of gold. A metal layer underlies the gap. The metal layer has a solder-wettability that is lower than that of the first and third surface layers of gold. | 10-31-2013 |
20130291381 | INTEGRATED CIRCULATORS SHARING A CONTINUOUS CIRCUIT - The present invention is directed to a circuit assembly that includes an integrated circulator assembly. The circuit assembly has a first substrate, which contains a continuous circuit trace that includes a circulator component from the circulator assembly and at least one electrical component from the circuit assembly. A second substrate is disposed beneath the first substrate and includes a cladding on one surface. The second substrate contains an aperture that accepts a ferrite element, which is axially aligned with the circulator component of the circuit trace. A conductive material is placed across the ferrite element so that it forms a continuous ground plane with the cladding, which is common to the entire circuit trace. The circulator assembly also contains a magnet bonded to the ferrite element. The circulator assembly may also include a yoke disposed below the magnet to shield the circulator from external magnetic fields. | 11-07-2013 |
20130298397 | METHOD FOR MAKING CIRCUIT BOARD - A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure. | 11-14-2013 |
20130298398 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - The invention relates to a photosensitive resin composition comprising a binder polymer having a (meth)acrylic acid-based structural unit, with a dispersity (weight-average molecular weight/number-average molecular weight) of no greater than 1.6, a photopolymerizable compound, a photopolymerization initiator and a sensitizing dye. | 11-14-2013 |
20130298399 | Electrodynamic Arrays Having Nanomaterial Electrodes - A method of making an electrodynamic array of conductive nanomaterial electrodes calls for a liquid solution containing nanomaterials to be deposited as an array of conductive electrodes on a substrate, including rigid or flexible substrates such as fabrics, and opaque or transparent substrates. The nanomaterial electrodes may also be grown in situ. The nanomaterials may include carbon nanomaterials, other organic or inorganic nanomaterials or mixtures. | 11-14-2013 |
20130333208 | REDUCTION OF ARC-TRACKING IN CHIP ON FLEXIBLE CIRCUIT SUBSTRATES - A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces. | 12-19-2013 |
20140000108 | GEOMETRY AND DESIGN FOR CONFORMAL ELECTRONICS | 01-02-2014 |
20140033528 | METHOD OF FAST DEVICE ATTACHMENT - A method to fast print an electrical circuit on a surface of a ceramic heat-dissipation substrate and simultaneously adhere electronic devices, comprising the following steps: a. Using the method of printing, spraying, transfer-printing, or the similar to form a solderable metal adhesive layer on a surface of a heat-dissipation substrate; b. Forming a necessary electrical circuit on the surface of the heat-dissipation substrate via burning and solidifying the solderable metal adhesive layer; c. Spreading solder paste and positioning related Surface Mount Device (SMD) on the electrical circuit; d. Placing the heat-dissipation substrate into a furnace having liquidized metal inside, and partially diving the heat-dissipation substrate into the liquidized metal to heat and melt the solder paste via the thermal energy conducted from the liquidized metal, therefore the SMD is adhered on the electrical circuit; and e. Cooling down the heat-dissipation substrate via placing it into a plurality of cooling-chambers. | 02-06-2014 |
20140041216 | MAKING TRANSPARENT TOUCH-RESPONSIVE DEVICE WITH MICRO-WIRE ELECTRODES - A method of making a touch-responsive capacitive device includes providing a transparent substrate and forming anisotropically conductive first and second electrodes extending in corresponding first and second orthogonal length directions over the substrate. Anisotropically conductive first and second electrodes each with electrically connected micro-wires are formed on opposing sides of the transparent substrate. The anisotropically conductive first and second electrodes extend in corresponding first and second length directions. The first and second micro-wires are formed with substantially parallel straight micro-wires extending substantially in the corresponding first and second length directions and a plurality of angled micro-wires are formed at a non-orthogonal angle to the straight micro-wires and electrically connect the straight micro-wires so that the anisotropically conductive first and second electrodes have a greater electrical conductivity in the corresponding first and second length directions than in another anisotropically conductive electrode direction. | 02-13-2014 |
20140041217 | METHOD FOR MAKING SURFACE ENHANCED RAMAN SCATTERING DEVICE - A method for making a surface enhanced Raman scattering device in accordance with one aspect of the present invention comprises a first step of forming a nanoimprint layer on a main surface of a wafer including a plurality of portions each corresponding to a substrate; a second step of transferring, by using a mold having a pattern corresponding to a fine structural part, the pattern to the nanoimprint layer after the first step, and thereby forming the formed layer including the fine structural part for each portion corresponding to the substrate; a third step of forming a conductor layer on the fine structural part after the second step; and a fourth step of cutting the wafer into each portion corresponding to the substrate after the second step. | 02-13-2014 |
20140053399 | MASKLESS WRITING OF A WORKPIECE USING A PLURALITY OF EXPOSURES HAVING DIFFERENT FOCAL PLANES USING MULTIPLE DMDS - The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes. | 02-27-2014 |
20140059852 | MULTI-LAYER PRINTED CIRCUIT BOARD COMPRISING FILM AND METHOD FOR FABRICATING THE SAME - A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern. | 03-06-2014 |
20140096381 | MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD - A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board. | 04-10-2014 |
20140101935 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board including: preparing a carrier member including a metal layer and a transfer circuit pattern sequentially formed on one surface thereof; preparing a base substrate having an inner layer circuit; forming an insulating layer on the base substrate; disposing the carrier member so that the transfer circuit pattern faces the insulating layer; embedding the transfer circuit pattern in the insulating layer through a heating and compressing process; and removing the carrier member, wherein the metal layer has a melting point lower than that of the transfer circuit pattern. | 04-17-2014 |
20140115887 | AQUEOUS CHEMICAL LEAK DETECTION CABLE - Disclosed are aqueous chemical leak detection cables that provide protection to sensor wires by using a conductive polymer coating that is resistant to corrosion by aqueous chemicals. In addition, non-conductive, liquid pervious layers may surround one or more of the sensor wires to assist in preventing false detection of a aqueous chemical leak as a result of various non-liquid contaminants. The non-conductive, liquid pervious layer may comprise braided, non-hygroscopic, non-conductive fibers, or a continuous, non-conductive pervious coating. | 05-01-2014 |
20140123487 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - In a printed circuit board manufacturing method that manufactures at least one thin circuit and at least one large cross-section circuit on a same PCB substrate, a circuit trench is formed on a first PCB substrate having a copper clad circuit layer of a smaller thickness and exposed from the bottom of a groove on another side of the copper clad layer, and then a thick copper is filled into the circuit trench by a copper electroplating method until the thick copper is protruded from the first PCB substrate to form the large cross-section circuit along the circuit trench, and at least one prepreg is covered onto the large cross-section circuit and at a position where it is exposed from the board surface of the first PCB substrate, and the prepreg is covered onto the large cross-section circuit by a hot melt pressing method to maintain a flat smooth surface. | 05-08-2014 |
20140150257 | METHOD OF MANUFACTURING A CIRCUIT BOARD - A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern. | 06-05-2014 |
20140201992 | CIRCUIT BOARD STRUCTURE HAVING EMBEDDED ELECTRONIC ELEMENT AND FABRICATION METHOD THEREOF - A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time. | 07-24-2014 |
20140201993 | SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION - To provide a substrate for mounting element having sulfurization resistance improved by increasing planarity of the surface of a thick conductor layer. | 07-24-2014 |
20140250687 | METHOD OF FABRICATING FLEXIBLE ELECTRONIC DEVICES - The present disclosure is related to a method of fabricating display panels, especially to a method of fabricating flexible electronic devices. By means of adding an inorganic membrane with surface roughness between a bonding layer and a PI film, in order to effectively improve the dimensional stability of plastic substrate and the water/oxygen barrier property of flexible substrate during the PI film fabrication and the follow-up process, improving the yield of good products and prolonging the working life thereof. | 09-11-2014 |
20140290057 | METHOD OF MANUFACTURING A STACKED MULTILAYER STRUCTURE - Disclosed is a method of manufacturing a stacked multilayer structure, including the steps of forming a first circuit layer with bumps on a substrate, punching an aluminum plate to form recesses corresponding to the bumps, forming openings in a plastic film including a glass fiber layer corresponding to the bumps, pressing the aluminum plate, the plastic film and the substrate, removing the aluminum plate, polishing to level the resulting surface, forming a second circuit layer connected to the first circuit layer, and finally removing the substrate to form the stacked multilayer structure. Because the glass fiber layer in the plastic film is not exposed after polishing, the thickness of the dielectric layer is uniform and the reliability of the circuit layer is improved so as to increase the yield. | 10-02-2014 |
20140290058 | METHOD OF MANUFACTURING A CIRCUIT BOARD - A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer. The method includes removing sections of the conductive seed layer and sections of the conductive circuit layer during a circuit common removal process | 10-02-2014 |
20140331492 | COVER GLASS STRUCTURE AND FABRICATION METHOD THEREOF - A cover glass structure includes a glass substrate, a touch-sensing structure and a decorative layer. The glass substrate has at least one cutting section, and the cutting section is etched to form an etched structure. The touch-sensing structure is disposed on the glass substrate, and the decorative layer is disposed on the glass substrate. | 11-13-2014 |
20140338191 | METHOD OF MANUFACTURING AN INTEGRATED TOUCH SENSOR WITH DECORATIVE COLOR GRAPHICS - A method of manufacturing includes printing a first plurality of patterned ink seed layers on a first side of a substrate. A second plurality of patterned ink seed layers are printed on a second side of the substrate. The first plurality of patterned ink seed layers and the second plurality of patterned ink seed layers are electroless plated with a first conductive material. A coating is printed over the first side of the substrate. A graphic design is printed on the second side of the substrate. | 11-20-2014 |
20140338192 | METHOD FOR MANUFACTURING A METAL PRINTED CIRCUIT BOARD - Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom. | 11-20-2014 |
20140373349 | LASER DIODE PATTERNING OF TRANSPARENT CONDUCTIVE FILMS - Methods of patterning metal nanowire containing transparent conductive films using laser diodes, where the films comprise a radiation absorbing substance, such as an infrared absorbing substance or an ultraviolet absorbing substance. The use of laser diodes can decrease the time and costs associated with patterning transparent conductive films comprising nanowires, such as silver nanowires. | 12-25-2014 |
20150013155 | PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK - A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board. | 01-15-2015 |
20150040391 | SYSTEMS AND METHODS FOR MAKING AND USING ELECTRICAL STIMULATION SYSTEMS WITH IMPROVED RF COMPATIBILITY - A method of forming a control module for an electrical stimulation system, the control module including an electronic subassembly disposed in an inner space of a casing and a feedthrough housing disposed along a portion of the casing, includes: forming an RF-diverting assembly having capacitive elements electrically-coupled to a feedthrough ground; electrically-coupling the capacitive elements to conductive pathways extending along a non-conductive substrate; electrically-coupling the conductive pathways to feedthrough pins extending through the feedthrough housing from a location external to the casing to a location within the inner space of the casing; electrically-coupling the conductive pathways to the electronic subassembly such that the conductive pathways electrically-couple the feedthrough pins to the electronic subassembly; electrically-coupling the feedthrough ground to an electrically-conductive portion of the feedthrough housing; and electrically-coupling the electrically-conductive portion of the feedthrough housing to an electrically-conductive portion of an outer surface of the casing. | 02-12-2015 |
20150047187 | Method and Apparatus for Manufacturing Electronic Devices - This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature. | 02-19-2015 |
20150052747 | MANUFACTURING METHOD OF TOUCH SUBSTRATE - A manufacturing method of touch substrate includes steps of: providing a substrate, a photosensitive film of Nano-Silver particles being formed on a surface of the substrate; performing an exposure process to the film of Nano-Silver particles of the surface of the substrate; performing a development process to the film of Nano-Silver particles of the surface of the substrate to form a nontransparent sensing electrode layer and a nontransparent electrode wiring layer in the form of a mesh on the surface of the substrate; and performing a high electrical conductivity treatment and a stabilization treatment to the nontransparent sensing electrode layer on the surface of the substrate. So, the nontransparent sensing electrode layer and nontransparent electrode wiring layer can be formed on the surface of the substrate at the same time. Therefore, the manufacturing process is simplified. Moreover, the surface resistance is lowered and the wiring space is enlarged. | 02-26-2015 |
20150059172 | METHOD FOR MAKING TOUCH PANEL - A method for making a touch panel is provided. A number of first transparent conductive layers are formed on an insulative substrate. Each of the first transparent conductive layers is resistance anisotropy. A number of adhesive layers are formed on the insulative substrate with each to cover only part of one of the first transparent conductive layers. A carbon nanotube layer is formed on the number of adhesive layers. The carbon nanotube layer is patterned to obtain a number of second transparent conductive layers spaced from each other and with each corresponding to one first transparent conductive layer. A number of first electrodes, a first conductive trace, a number of second electrodes, and a second conductive trace are formed contemporaneously. | 03-05-2015 |
20150068032 | MULTI-LAYER MICRO-WIRE SUBSTRATE METHOD - A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer. | 03-12-2015 |
20150068033 | METHOD OF FABRICATING PACKAGING SUBSTRATE - A packaging substrate includes a first dielectric layer, a first circuit layer, a first metal bump, and a built-up structure. The first metal bump and the first circuit layer are embedded in and exposed from two surfaces of the first dielectric layer. The end of the first metal bump is embedded in the first circuit layer and between the first circuit layer and the first dielectric layer. In addition, a conductive seedlayer is disposed between the first circuit layer and the first metal bump. The built-up structure is disposed on the first circuit layer and the first dielectric layer. The outmost layer of the built-up structure has a plurality of conductive pads. Compared to the prior art, the present invention can effectively improve the warpage problem of the conventional packaging substrate. | 03-12-2015 |
20150082628 | USING TIME-DOMAIN REFLECTOMETRY TO IDENTIFY MANUFACTURING INFORMATION FOR A PASSIVE PRINTED CIRCUIT BOARD - A method uses time-domain reflectometry to measure a signal reflection delay in a conductive trace formed on a specific passive printed circuit board, and uses the measured signal reflection delay as an index into a table storing a predetermined association between signal reflection delay and passive printed circuit board manufacturing information, wherein the table includes a plurality of predetermined signal reflection delay values, and wherein each of the predetermined signal reflection delay values is associated with unique passive printed circuit board manufacturing information. During manufacturing of the passive printed circuit board, a hole is drilled through the passive printed circuit board so that the hole intersects with the conductive trace and divides the conductive trace into a proximal segment extending from the connector to the hole and a distal segment that is electrically isolated from the proximal segment by the hole. | 03-26-2015 |
20150096172 | GRADUATED ROUTING FOR ROUTING ELECTRODES COUPLED TO TOUCH SENSOR ELECTRODES TO THEREBY BALANCE CAPACITANCE ON THE TOUCH SENSOR ELECTRODES - A system and method for balancing the capacitive charge on touch sensor electrodes so that every two adjacent routes have the same capacitance as any other adjacent two routes, wherein routing electrodes are spaced further and further apart, or graduated, as they get longer, to thereby balance the capacitance on the touch sensor electrodes without having to add or subtract an offset from each touch sensor electrode. | 04-09-2015 |
20150128412 | MANUFACTURING ELECTROCHEMICAL SENSOR MODULES - Certain processes for manufacturing an electrochemical sensor module include etching a Silicon wafer to form precursor sensor bodies, disposing sensor fibers along rows of the precursor sensor bodies, securing a rigid layer over the sensor fibers, dividing the wafer, rigid layer, and sensor fibers into individual precursor sensor bodies, and joining each precursor sensor body to a component body to form sensor modules. | 05-14-2015 |
20150143694 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a carrier for manufacturing a printed circuit board, including: an insulating layer; a release layer buried in at least any one of top and bottom surfaces of the insulating layer and having a length shorter than that of the insulating layer; and a metal foil bonded to a surface of the insulating layer in which the release layer is buried and having a length longer than that of the release layer, thereby increasing reliability of a product in the manufacturing the substrate using the carrier. | 05-28-2015 |
20150311176 | Carrier Tape for Tab-Package and Manufacturing Method Thereof - The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product. | 10-29-2015 |
20150366072 | METHOD OF FORMING METALLIC PATTERN ON POLYMER SUBSTRATE - A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate. | 12-17-2015 |
20160057870 | MONOLITHICALLY INTEGRATED RF SYSTEM AND METHOD OF MAKING SAME - Radio frequency system ( | 02-25-2016 |
20160073507 | Method of Making a Circuit Board on a Mandrel - A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure. | 03-10-2016 |
20160095231 | MULTI-LAYER CIRCUIT BOARD HAVING CAVITY AND MANUFACTURING METHOD THEREOF - A manufacturing method of a multi-layer circuit board having a cavity is provided, including the following steps: a core board is provided, and a through hole is formed penetrating the core board; two build-up structures are bonded to two opposite sides of the core board to foam the multi-layer circuit board, and the two build-up structures cover the through hole; and a portion of one of the two build-up structures corresponding to the through hole is removed to make the through hole communicate with the outside and form the cavity. A multi-layer circuit board having a cavity, manufactured by the aforementioned method, is also provided. | 03-31-2016 |
20160100470 | METHOD AND TECHNOLOGY FOR CREATING/INSTALLING DISPLAY DEVICES - Embodiments of the disclosure describe apparatuses, systems and methods for display device creation and installation. Said embodiments execute operations for receiving data identifying dimensions of a target surface, said target surface being a surface for creating and installing a display device and for a user to view the display device. In response to receiving data identifying dimensions of the target surface, a three dimensional (3D) fabrication process is executed to form at least some components of the display device. When the pixel area of the display device is formed, the pixel control circuitry of the display device is communicatively coupled to a display driver component to install the display device onto the target surface; said display driver component receives image data and drives the pixel control circuitry based on the received image data. | 04-07-2016 |
20160109291 | METHOD FOR MAKING SURFACE ENHANCED RAMAN SCATTERING DEVICE - A method for making a surface enhanced Raman scattering device in accordance with one aspect of the present invention comprises a first step of forming a nanoimprint layer on a main surface of a wafer including a plurality of portions each corresponding to a substrate; a second step of transferring, by using a mold having a pattern corresponding to a fine structural part, the pattern to the nanoimprint layer after the first step, and thereby forming the formed layer including the fine structural part for each portion corresponding to the substrate; a third step of forming a conductor layer on the fine structural part after the second step; and a fourth step of cutting the wafer into each portion corresponding to the substrate after the second step. | 04-21-2016 |
20160113125 | RIGID FLEX BOARD MODULE AND THE MANUFACTURING METHOD THEREOF - A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board. | 04-21-2016 |
20160158537 | Methods of Manufacturing Devices for the Neurorehabilitation of a Patient - A mouthpiece for providing non-invasive neuromodulation to a patient, the mouthpiece including an elongated housing having an anterior region and a posterior region, the elongated housing having a non-planar exterior top surface and internal structural members disposed within the housing, the internal structural members elastically responding to biting forces generated by the patient, a spacer attached to the top surface of the housing for limiting contact between a patient's upper teeth and the exterior top surface of the elongated housing, and a printed circuit board mounted to a bottom portion of the elongated housing, the printed circuit board having a plurality of electrodes for delivering subcutaneous local electrical stimulation to the patient's tongue. | 06-09-2016 |
20160163908 | SYSTEMS AND METHOD FOR PRECISION AUTOMATED PLACEMENT OF BACKSHEET ON PV MODULES - A method for constructing a photovoltaic (PV) substrate. A moving frame can be lowered towards a stack of back sheets and a back sheet of the stack of back sheets may be secured to the moving frame. The back sheet can be transferred from the moving frame to a vacuum table. An adhesive can be dispensed to the back sheet using an adhesive dispenser. At least one string may be placed onto the adhesive applied to the back sheet. The vacuum table can be rotated, and the back sheet can be released from the vacuum table onto a glass sheet. | 06-09-2016 |
20160163913 | SYSTEM AND APPARATUS FOR PRECISION AUTOMATION OF TAB ATTACHMENT FOR FABRICATIONS OF SOLAR PANELS - One embodiment of the present invention provides an apparatus for attaching conductive tabs to photovoltaic structures. The apparatus includes a cassette configured to store a plurality of conductive tabs and a pick-and-place apparatus configured to obtain a conductive tab from the cassette and place the conductive tab at an edge of a photovoltaic structure. The pick-and-place apparatus further includes a tab holder configured to pick up and release the conductive tab and a substantially horizontal track coupled to the tab holder. The tab holder is further configured to move back and forth along the track. | 06-09-2016 |
20160188070 | COLOR FILTER SUBSTRATE, MANUFACTURING METHOD THEREOF, TOUCH SCREEN AND DISPLAY DEVICE - A color filter substrate, a manufacturing method thereof, a touch screen and a display device are provided, and the display screen including the color filter substrate can achieve the touch function. The color filter substrate includes: a transparent substrate and a color filter film layer disposed on the transparent substrate, the color filter film layer includes a plurality of filter elements, a plurality of first sensing electrodes and a plurality of second sensing electrodes; and the first sensing electrodes are insulated from the second sensing electrodes, in which the first sensing electrodes are insulated from the second sensing electrodes at crossed positions by portions of the color filter film layer, disposed at the crossed positions of the first sensing electrodes and the second sensing electrodes, and a touch sensing capacitor is provided. | 06-30-2016 |
20160192501 | METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DEVICE - A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting nanostructured material through a membrane such that the electrically conducting nanostructured material is deposited on the membrane; b) depositing an elastomeric polymerisable material on the electrically conducting nanostructured material and curing the elastomeric polymerisable material thereby embedding the electrically conducting nanostructured material in an elastomeric polymer thus formed; and c) separating the elastomeric polymer with the embedded electrically conducting nanostructured material from the membrane to obtain the flexible electronic device. Flexible electronic device manufactured by the method, and use of the flexible electronic device are also provided. | 06-30-2016 |
20160192504 | SINGLE MOLECULE DETECTION - Disclosed herein is a method comprising patterning a second electrode of each of a plurality of electrode pairs onto a substrate; patterning a strip of a sacrificial layer directly across the second electrode; patterning a first electrode of each of the plurality of electrode pairs directly on the strip of the sacrificial layer; forming a nanogap channel by removing the strip of the sacrificial layer; wherein the strip of the sacrificial layer is sandwiched between and in direct contact with the first electrode and the second electrode before the strip is removed, and wherein at least a portion of the first electrode directly faces at least a portion of the second electrode. The method may involve planarization (e.g., CMP). The electrode pairs may be configured such that a redox active molecule can only diffuse back and forth therebetween while it is in the portion of the nanogap channel sandwiched therebetween. | 06-30-2016 |
20160381811 | SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE - A semiconductor device may include the following elements: a first substrate; a second substrate; a dielectric layer, which may be positioned between the first substrate and the second substrate and may have a hole; a first conductive member, which may be positioned in the dielectric layer; a second conductive member, which may be positioned in the dielectric layer, may be spaced from the first conductive member, and may be positioned closer to the second substrate than the first conductive member; and a third conductive member, which may contact both the first conductive member and the second conductive member through the hole. | 12-29-2016 |