Entries |
Document | Title | Date |
20100300422 | DEVICE FOR THE SUPPORT, DRIVE AND/OR TRANSMISSION OF MOTION TO A DIAMOND WIRE ON MACHINES FOR CUTTING STONES - A device for the support and/or drive of diamond wire of machines for cutting natural or agglomerate stones includes at least one pulley, wheel or drum for support and/or drive, provided with at least one groove for holding at least one diamond wire for cutting; soft material placed between the diamond wire and the winding groove of the said wire; wherein the soft material is wrapped around the pulley, wheel or drum but not fixed and is interposed in the winding of the diamond wire on it, along the winding arch, and is closed in a ring, similarly to a belt, with the winding of the said ring or belt also on a tightening wheel; furthermore, this tightening is achieved by using adjustment means for the tightening wheel to increase the wheelbase of the pulley, wheel or drum for the support and/or drive of the diamond wire in question. | 12-02-2010 |
20110041827 | System And Method For Cutting Ceramic Ware - Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at a location along the length of the log to form a cut transverse surface on the piece and grinding the cut transverse surface with a side of the blade. An apparatus for manufacturing ceramic ware is also disclosed comprising means for transversely cutting a piece from a ceramic-type log having a longitudinal axis, including a blade for cutting into the log at a location along the length of the log to form a cut transverse surface on the piece, and means for grinding the cut transverse surface with a side of the blade. | 02-24-2011 |
20110155114 | INDEPENDENTLY SUPPORTED CONCRETE SAW APPARATUS AND METHOD - A saw apparatus for sawing paving slabs has a frame mounted on a ground contacting propulsion member such that the frame may move above a slab to be cut. A saw support assembly has an engaged position and a removed position; the engaged position disposing a blade of a saw in cutting engagement with a top surface of a slab to be cut. The saw is mounted on the saw assembly and the saw assembly is mounted on the frame and the frame is mounted on the ground contact propulsion members such that no part of said frame need contact the slab during cutting. | 06-30-2011 |
20120037140 | FIXED ABRASIVE SAWING WIRE WITH A ROUGH INTERFACE BETWEEN CORE AND OUTER SHEATH - A fixed abrasive sawing wire is presented that comprises a core ( | 02-16-2012 |
20120055458 | CUTTING DEVICE WITH A LIQUID LEVEL DISPLAY - A cutting device includes an accommodation chamber having a through hole, a cover plate covering the accommodation chamber, and a cutting unit carrying a cutting element that is partially submerged in a cooling fluid in the accommodation chamber. A liquid level display is provided in fluid communication with the through hole in the accommodation chamber for indicating the level of the cooling fluid so that a user can conveniently ascertain in real time, from outside the cutting device, the current amount of the cooling fluid retained within the accommodation chamber and can add cooling fluid to the accommodation chamber as needed in real time, thus achieving improved performance in cooling and lubricating the cutting element. | 03-08-2012 |
20120060815 | Method For Shaping And Slicing Ingots Using An Aqueous Phosphate Solution - A method for slicing a workpiece into wafers in which a polyphosphate solution is applied to the workpiece during the slicing process. The method comprises the steps of positioning the workpiece, such as a silicon ingot, in the vicinity of a wire saw that can cut through the workpiece without the use of an abrasive slurry; causing an aqueous polyphosphate solution to contact the workpiece; and causing the wire saw to cut into the workpiece while the polyphosphate solution is in contact with the workpiece. After the workpiece has been cut into wafers, the polyphosphate solution is rinsed off of the wafers. Preferably, the wire saw used in this method is a diamond wire saw. | 03-15-2012 |
20120085332 | METHODS FOR CROPPING A CYLINDRICAL INGOT - Methods for cropping a cylindrical ingot and, in some particular embodiments, for cropping a multicrystalline ingot such as a multicrystalline silicon ingot. | 04-12-2012 |
20120174905 | Ground level portable saw machine - A portable saw machine includes a supporting frame, a cutting blade provided at a lower front side of the supporting frame for cutting the object at the ground level, a power device supported by the supporting frame for driving the cutting blade to rotate, and a power cutting arrangement. The power cutting arrangement includes a blade supporting frame movably extended from the supporting frame to suspendedly and adjustably support the cutting blade in a substantially horizontal orientation; and an actuating unit adapted to manually actuated to drive the blade supporting frame to adjust an elevation of the cutting blade so that when the cutting blade is driven to rotate by the power device, the cutting blade is arranged to cut the object at the ground level along the predetermined path without requiring a user to pivotally lift up the main frame. | 07-12-2012 |
20130032129 | SUPER-ABRASIVE GRAIN FIXED TYPE WIRE SAW, AND METHOD OF MANUFACTURING SUPER-ABRASIVE GRAIN FIXED TYPE WIRE SAW - The super-abrasive grain fixed type wire saw is equipped with two layers consisting of a brazing material layer ( | 02-07-2013 |
20130081606 | SAWING APPARATUS OF SINGLE CRYSTAL INGOT - Provided is a single crystal ingot sawing apparatus. The single crystal ingot sawing apparatus includes a wire saw configured to slice an ingot, a roller for configured to drive the wire saw, and a slurry bath for configured to receive slurry supplied onto the wire saw. | 04-04-2013 |
20130087132 | Systems and Methods For Connecting An Ingot To A Wire Saw - Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam. | 04-11-2013 |
20130139800 | Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130139801 | Methods For Controlling Displacement Of Bearings In A Wire Saw - Methods are disclosed for controlling the displacement of bearings in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling displacement of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130319391 | RECOVERY OF SILICON VALUE FROM KERF SILICON WASTE - The present invention is for the recovery of maximum silicon value of kerf silicon waste, produced during the manufacture of silicon wafers by wire saw, diamond saw and chemical mechanical polishing, as high purity metallurgical silicon. This recovery is achieved by a process scheme that effects an initial removal of minor extrinsic metallic impurities but not the major silicon compound impurities, and followed, preferentially, by a direct metallurgical process to form elemental silicon. The recovered silicon is for use as feedstock for polysilicon manufacturing, as high purity polysilicon for PV application, and in metallurgical alloy manufacture. | 12-05-2013 |
20130333681 | METHOD TO PRODUCE A SAWING BEAD - A method is described for producing a sawing bead for use in a sawing cord. Sawing cords are used for cutting hard and brittle materials. In the method, laser cladding is used to form an abrasive layer on a small metallic tube ( | 12-19-2013 |
20140053822 | System and Method for Concrete Slab Connection - Systems and methods of transferring loads between adjacent cast-in-place slabs, such as concrete slabs, and for accurately positioning dowels between adjacent sections of slabs are provided. A generally planar plate-type dowel is used which may be positioned within a cutaway in a preexisting slab of concrete. The dowel is shaped to generally conform to the shape of the cutaway, which is made by a saw blade. Once the dowel is positioned within the preexisting slab, a new slab is poured adjacent the preexisting slab. Rubber seals are included on the edges of the dowels to provide spacing or a gap between the dowel and the preexisting slab to allow for lateral independent movement of the adjacent slabs, and to prevent concrete from the newly poured second slab from entering into the gap. A saw unit for making a generally planar cut horizontally into an edge of a hardened concrete slab is also provided. | 02-27-2014 |
20140116409 | CONCRETE SAW - A concrete saw having a geared assembly for rotating a cutting blade is described. The saw utilizes a longitudinally oriented engine for rotating the blade. Various additional features and improvements are described including a particular belt tensioner assembly, an indicator and control system for cutting blade depth, a handle adjustment and locking system, and provisions for control of blade water are described. | 05-01-2014 |
20140165986 | APPARATUS FOR SAWING CURED SLIPFORM CAST CONCRETE PRODUCTS - An apparatus for sawing cured slipform cast concrete products, which apparatus comprises a frame with wheels, and a concrete saw connected movably to the frame, wherein the apparatus comprises a brushing unit for cleaning slipform casting bed. | 06-19-2014 |
20140190464 | Cutting Method for Stone Laminate Panels - A method of preparing a plurality of workpieces for concurrent cutting using a stone cutting machine is disclosed. Each workpiece can include a stone slab that has two parallel faces and one or more edges, a substrate that is bonded to a first face, and a substrate that is bonded to a second face of the stone slab. The stone cutting machine can have a plurality of stone cutting elements and it can be configured to concurrently create a plurality of stone cuts. The method can include: providing a plurality of workpieces; and positioning the plurality of workpieces by placing a set of shims between adjacent pairs of workpieces. The set of shims can be placed to compensate for variations in workpiece thickness and/or to position each of the workpieces with one edge of each stone slab in relative alignment with one of the stone cutting elements. | 07-10-2014 |
20150047622 | CUTTING METHOD OF HONEYCOMB FORMED BODY - A cutting method of a honeycomb formed body is provided. This is a cutting method of a honeycomb formed body in which, while a kneaded material containing a ceramic raw material is extruded to form a honeycomb formed body with a honeycomb shape having partition walls defining and forming a plurality of cells, the extruded honeycomb formed body is cut before drying by a cutting blade vibrated at a frequency of 0.3 kHz or more in a direction perpendicular to a direction in which this honeycomb formed body moves. It is preferably a cutting method of a honeycomb formed body in which the cutting blade is vibrated at a high frequency of 10 kHz or more. | 02-19-2015 |
20150096547 | CUTTING DEVICE AND A METHOD FOR CUTTING A PILE - A cutting device for cutting a pile, including a body part, for connecting the cutting device to a working machine and a gripper attached to the body part to drive the cutting device around the pile to be cut, the gripping means having at least two opposite gripping parts to obtain a grip from the pile and to release the gripper from the grips. The cutting device includes at least two sawing parts arranged to move to a sawing position and to a secure position, and the cutting device having a saw connected to the sawing parts to perform sawing operation when at least one sawing part is in the sawing position, and the cutting device includes elastic means to adapt to forces, which arises during sawing movement of the a saw. The saw is arranged to move during the sawing movement substantially horizontally to the pile being cut. | 04-09-2015 |
20150315513 | Aqueous Cutting Fluid Composition - A water-based cutting fluid that comprises water and a water-soluble polyalkylene glycol (PAG) having cloud point from 30° C. to 80° C. The cutting fluid is water-based, i.e., it comprises at least 50 percent by weight (wt %) water. The cutting fluids are well suited for use with diamond wiresaws for the cutting of silicon ingots. The fluids exhibit one or more of low hydrogen generation, no wafer cleaning issues, good lubricity, good cooling efficiency, good swarf suspension and dispersion, low foaming, are generally non-sensitive to metal ions, and are nonflammable. | 11-05-2015 |
20150343665 | INGOT CUTTING METHOD CAPABLE OF REDUCING WAFER DAMAGE PERCENTAGE - An ingot cutting method capable of reducing wafer damage percentage, comprising: forming a layer of nanostructures on at least one surface of an ingot; depositing a buffer layer on the layer of nanostructures; fixing the ingot to a mounting plate by applying a layer of epoxy between the buffer layer and the mounting plate; performing a dicing process on the ingot to get a plurality of wafers; and performing an epoxy removal process on the plurality of wafers. | 12-03-2015 |
20160016330 | Proceeding in Connection with Stone Production and a Plant for the Proceeding - The invention concerns a proceeding for the production of slab-shaped stone products ( | 01-21-2016 |
20160108548 | METHOD FOR MANUFACTURING A SILICON CYLINDER BY GROWTH ON SEEDS IN A DIRECTED SOLIDIFICATION FURNACE - A method for manufacturing a silicon cylinder by growth on seeds in a directed solidification furnace, including at least the following steps: (i) providing a crucible having a longitudinal axis (Z), in which the bottom is covered with a layer of seeds of monocrystalline silicon in a right prism shape; and (ii) proceeding with directed solidification of silicon by growth on seeds, in a direction of growth that is co-linear with the axis (Z) and with a concave solidification front, spatially or temporally; characterised in that the layer in step (i) of: one or more central seeds G | 04-21-2016 |