Entries |
Document | Title | Date |
20080202552 | Method for selectively removing coatings from metal substrates - Disclosed is a method for selectively removing a coating from a substrate. Aluminum is diffused into the coating. The coating is contacted with an aqueous composition including at least one of an acid having the formula H | 08-28-2008 |
20080202553 | HIGH TEMPERATURE AND PRESSURE OXIDATION-REDUCTION POTENTIAL MEASURING AND MONITORING DEVICE FOR HOT WATER SYSTEMS - A device for measuring oxidation-reduction potential at operating temperature and pressure in hot water systems is disclosed and claimed. The device includes a flow-through cell, an oxidation-reduction potential probe, a temperature detector, and an external pressure-balanced reference electrode assembly. Each component of the device works in conjunction with the other components and each has electrical connections that transmit signals to a controller. The controller calculates and determines adjustments to feedwater chemistry for the hot water system. | 08-28-2008 |
20080223400 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM - A substrate processing apparatus includes: a support member supporting a substrate in a process chamber; a first temperature adjusting member in thermal contact with the support member; and a second temperature adjusting member capable of thermally coming into contact with and separating from the support member, wherein the first temperature adjusting member and the second temperature adjusting member are temperature-adjusted to different temperatures respectively. | 09-18-2008 |
20080230089 | AQUEOUS WASHING SYSTEM AND METHOD - An aqueous washing system and method of operation for washing of articles such as engineering components, including curing of resin impregnated porous metal components, comprising placing the articles into a process chamber ( | 09-25-2008 |
20080230090 | REMOVAL OF NIOBIUM SECOND PHASE PARTICLE DEPOSITS FROM PICKLED ZIRCONIUM-NIOBIUM ALLOYS - The present invention relates generally to a process and chemical composition for the removal of adherent niobium-rich second-phase particles (SPPs) from pickled niobium-containing zirconium alloys which includes applying to the alloy surface a chemical composition comprising alkaline hydrogen peroxide; an alkali metal meta-silicate; and a magnesium salt. | 09-25-2008 |
20080236616 | METHOD AND APPARATUS FOR COMMISSIONING POWER PLANTS - An apparatus and method for commissioning steam turbine generator power plants to advance the cleanliness of the complete steam cycle by the conditioned discharge of steam to the plant surface condenser. | 10-02-2008 |
20080264443 | Apparatus and methods for increasing the rate of solute concentration evolution in a supercritical process chamber - The present invention pertains to a system for processing semiconductor wafers. The processing may involve the removal of material from the wafers or deposition of material on the wafers. Various aspects of the invention include specialized pressurization, process vessel, recirculation, chemical addition, depressurization, and recapture-recycle subsystems. A solvent delivery mechanism can convert a liquid-state sub-critical solution to a supercritical processing solution and introduce it into a process vessel that contains a batch of wafers. The wafers may be rotated within the supercritical processing solution. The supercritical processing solution is preferably recirculated through the process vessel by a recirculation system. When chemical additives are added to a supercritical solvent, the momentum of the chemical additives are preferably matched to the momentum of the supercritical solvent. Additives may be added at a higher initial flow rate, then ramped down a lower flow rate, e.g., a steady-state flow rate. | 10-30-2008 |
20080271752 | Cleaning method, particle removing method, cleaning apparatus, and cleaning liquid - The present invention provides a mechanism capable of removing a minute particle adhered to a fine pattern or the like without giving damages to the pattern or the like. After being installed on a device which can perform rotating operation, the high viscosity liquid is dropped on an upper surface of an object such as a photomask to be cleaned by a liquid supply part, and then the photomask is rotated to move the high viscosity liquid. During the movement of the high viscosity liquid, a particle adhered to the object such as the photomask is contained in the high viscosity liquid, and is removed. Further, the particle thus contained in the liquid is prevented from re-adhering to the object such as the photomask by controlling a zeta potential of the high viscosity liquid, and is removed from the object such as the photomask. | 11-06-2008 |
20080283089 | CLEANING APPARATUS OF SEMICONDUCTOR DEVICE - A cleaning apparatus for a semiconductor device that can include a cleaning tank and a plurality of anodic metals attached to an inner surface thereof and serving as sacrificial anodes during a cleaning sequence using a cleaning liquid. | 11-20-2008 |
20090007934 | SYSTEMS AND METHODS FOR EXPOSING SEMICONDUCTOR WORKPIECES TO VAPORS FOR THROUGH-HOLE CLEANING AND/OR OTHER PROCESSES - Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes are disclosed. A representative method includes exposing a semiconductor workpiece to a vapor, with the semiconductor workpiece having an opening extending from a first surface of the workpiece through the workpiece to a second surface facing opposite from the first surface. The opening can include a contaminant, and the method can further include drawing the vapor and the contaminant through at least a portion of the opening and away from the second surface of the semiconductor workpiece. | 01-08-2009 |
20090101165 | Apparatus for Detection of Chemical or Biological Substances and Method for Cleaning the Apparatus - The present invention relates to a device ( | 04-23-2009 |
20090101166 | APPARATUS AND METHODS FOR OPTIMIZING CLEANING OF PATTERNED SUBSTRATES - Methods and apparatus for cleaning wafer surfaces are provided, especially for cleaning surfaces of patterned wafers. The cleaning apparatus includes a cleaning head with channels on the surface facing the patterned wafers which has a predominant pattern. Cleaning material flowing the channels exerts a shear force on the surface of a patterned wafer, which is oriented in a specific direction to the cleaning head. The shear force and the specific orientation between the patterned wafer and the cleaning head improve the removal efficiency of the surface contaminants. | 04-23-2009 |
20090107520 | AMIDOXIME COMPOUNDS AS CHELATING AGENTS IN SEMICONDUCTOR PROCESSES - The present invention is a composition and cleaning method for use in semiconductor processes wherein the compositions comprises at least one amidoxime compound. | 04-30-2009 |
20090107521 | CHEMICAL SOLUTION OR PURE WATER FEEDER, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING APPARATUS, OR SUBSTRATE PROCESSING METHOD - By adding a perfluoromonomer to PVDF being a fluororesin to soften it, the oxygen permeability can be significantly reduced and a flexible fluororesin tube can be obtained. The oxygen permeability can also be reduced by providing a nylon tube as an outer layer. The tube is used between a chemical solution or ultrapure water feeder and a chemical solution or ultrapure water utilizing apparatus such as a cleaning apparatus or a wet etching apparatus. | 04-30-2009 |
20090120457 | COMPOSITIONS AND METHOD FOR REMOVING COATINGS AND PREPARATION OF SURFACES FOR USE IN METAL FINISHING, AND MANUFACTURING OF ELECTRONIC AND MICROELECTRONIC DEVICES - Improved cleaning compositions for removing particles, organic contamination, photoresist, post-ash residue, coatings, and other materials from metal and silicon surfaces including substrates present during the manufacture of integrated circuits, liquid crystal displays, and photovoltaic devices. The cleaning and surface preparation compositions comprise one or more water soluble strongly basic components, one or more water soluble organic amines, one or more water soluble oxidizing agents, balance water. Optional components can include corrosion inhibitors, surfactants and chelating agents. | 05-14-2009 |
20090120458 | HIGH NEGATIVE ZETA POTENTIAL POLYHEDRAL SILSESQUIOXANE COMPOSITION AND METHOD FOR DAMAGE FREE SEMICONDUCTOR WET CLEAN - A composition for removing particulate matter from integrated circuit substrates, including (a) one or more metal ion-free base; (b) a water-soluble metal ion-free onium salt of a polyhedral silsesquioxane; (c) an oxidizing agent; and (d) metal ion-free water, and a composition obtained by combining ingredients including (a), (b), (c) and (d). A process for removing particulate matter from a surface of an integrated circuit device, including applying to the surface the composition including (a), (b), (c) and (d) or applying to the surface the composition obtained by combining ingredients including (a), (b), (c) and (d). | 05-14-2009 |
20090120459 | APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATES - An apparatus for cleaning semiconductor substrates includes a chamber having a cleaning room and a drying room disposed over the cleaning room. The cleaning room and the drying room are separated or placed in communication with one another by a separation plate. An exhaust path is formed at a central portion of the separation plate. As de-ionized water (DI water) filling the cleaning room is drained during a dry process, the inside of the drying room is decompressed, and a drying fluid in the drying room flows from the drying room to the cleaning room along the exhaust path. | 05-14-2009 |
20090133715 | CLEANING METHOD - In a process chamber of a substrate processing apparatus, such as an RTP apparatus, a carrier is placed and configured to carry out a contaminant that has been attached to it. In this state, a cleaning gas containing N | 05-28-2009 |
20090217940 | REMOVAL OF PARTICLE CONTAMINATION ON PATTERNED SILICON/SILICON DIOXIDE USING DENSE FLUID/CHEMICAL FORMULATIONS - A cleaning composition for cleaning particulate contamination from small dimensions on microelectronic device substrates. The cleaning composition contains dense CO | 09-03-2009 |
20090217941 | SHOWER HEAD FLUSH - An apparatus for cleaning a shower head. The apparatus comprises a substantially hollow container member having a predetermined shape and formed of a predetermined material for holding a cleaning solution. Such substantially hollow container member having a bottom portion and a sidewall portion extending upwardly from such bottom portion. The sidewall portion enclosing an entire perimeter of the bottom portion. A hanging member is disposed on a predetermined portion of the sidewall portion of such container member for hanging the substantially hollow container member from a water line having a shower head on an end thereof so that an end of such shower head is enclosed in the container member holding such cleaning solution. | 09-03-2009 |
20090217942 | FOUNTAIN HEAD FLUSH - An apparatus for cleaning a drinking fountain head. The apparatus comprises a substantially hollow bottomless container member for holding a cleaning solution and having each of a predetermined height, a predetermined shape and formed of a predetermined material. There is a sealing member disposed on an inside bottom periphery of the substantially hollow bottomless container member for sealing against an upper portion of such drinking fountain for retaining such cleaning solution. | 09-03-2009 |
20090283110 | Method for Cleaning Hot Dip Galvanized Steel Sheet and Cleaning Apparatus Therefor - Cleaning of a hot dip galvanized steel sheet is conducted by bringing a strip-shaped steel sheet which was treated by surface oxidation in advance into contact with a cleaning liquid for 1 second or more, and then bringing the hot dip galvanized steel sheet into contact with pure water, while continuously transferring the hot dip galvanized steel sheet. The method allows efficiently and fully washing off the acidic solution adhered to the surfaces of the hot dip galvanized steel sheet treated by surface oxidation. The invention also provides an apparatus for cleaning the hot dip galvanized steel sheet to carry out the above cleaning method. | 11-19-2009 |
20090320876 | PROCESS AND COMPOSITION FOR REMOVING A SCALE DEPOSIT - One exemplary embodiment can be a process for removing one or more scale deposits formed on a surface. The process can include contacting the surface with a composition for a period of time sufficient to remove the scale deposits that comprise coke or metal sulfides or mixtures thereof. Generally, the composition includes an effective amount of an organic acid and/or a salt thereof, and an effective amount of an oxidizing agent. | 12-31-2009 |
20100018549 | Method of recovering heat transfer in reactor and regenerator effluent coolers - This invention relates to a method for removing fouling from a heat transfer surface, such as a heat exchanger. The method involves conducting a vapor containing a scouring material to the heat transfer surface and contacting the scouring material with the foulant, the heat transfer surface, or both. Scouring material and removed foulant can be recovered and conducted away. | 01-28-2010 |
20100018550 | CLEANING COMPOSITIONS WITH VERY LOW DIELECTRIC ETCH RATES - Aqueous cleaning compositions comprising a tertiary organic amine, an organic acid, a non-metallic fluoride salt, a corrosion inhibitor, e.g., ascorbic acid or its derivatives alone or in combination, balance water, effective to remove plasma processing residues (sidewall polymer) which include metal-organic complexes and/or inorganic salts, oxides, hydroxides or complexes which form films or residues either alone or in combination with the organic polymer resins. These compositions clean effectively at low temperatures without etching metal or dielectric layers, including low-κ dielectric materials. | 01-28-2010 |
20100024842 | GENERATOR FOR FOAM TO CLEAN SUBSTRATE - In an example embodiment, a device for generating a cleaning foam includes a female housing and a male plug. The plug includes an aperture into which a fluid flows from another component of the cleaning system. The plug includes a premix chamber which receives the fluid from the aperture and into which a gas is injected to form a foam. In an example embodiment, the chamber is a hollow cylinder and the gas is injected into the cylinder through channels which are tangential to the cylinder. The plug also includes a solid cylinder with a continuous helical indentation on the outside of the solid cylinder. When the male plug is inserted into the female housing, the continuous helical indentation and the inner surface of the housing form a helical channel through which the foam flows and is further mixed on its way back into the cleaning system. | 02-04-2010 |
20100051053 | WASHING STORAGE SOLUTION FOR GLASS ELECTRODE AND THE LIKE - This invention provides a washing storage solution ( | 03-04-2010 |
20100071720 | METHOD AND SYSTEM FOR REMOVING CONTAMINANTS FROM A SURFACE - Inside a vacuum chamber | 03-25-2010 |
20100095980 | METHOD OF CLEANING STEEL SHEET AND CONTINOUS CLEANING SYSTEM OF STEEL SHEET - The present invention provides a method of cleaning steel sheet, said method of cleaning steel sheet feeding a cleaning solution activated by ultrasonic waves of a frequency of 0.8 MHz to 3 MHz to a surface of steel sheet at an angle inclined by 1 to 80° with respect to a line perpendicular to the surface of the steel sheet in a direction opposite to the running direction, thereby enabling megasonic waves to be applied to cleaning of running steel sheet and improving the cleaning effect and cleaning speed, and a continuous cleaning system of steel sheet. | 04-22-2010 |
20100122711 | WET CLEAN METHOD FOR SEMICONDUCTOR DEVICE FABRICATION PROCESSES - A wet clean method for semiconductor device fabrication begins by providing a semiconductor device structure having a substrate and features protruding from the substrate. The features are formed from a dielectric material, such as an ultra-low-k material. The method continues by cleaning the semiconductor device structure with an aqueous solution and, following the cleaning step, displacing the aqueous solution with a first solvent. Thereafter, the features are exposed to a second solvent that contains a hydrophobic treatment agent that reacts with sidewalls of the features to form a hydrophobic layer on the sidewalls. | 05-20-2010 |
20100180913 | METHODS FOR IN-SITU CHAMBER CLEANING PROCESS FOR HIGH VOLUME MANUFACTURE OF SEMICONDUCTOR MATERIALS - The present invention is related to the field of semiconductor processing equipment and methods and provides, in particular, methods and apparatus for in-situ removal of undesired deposits in the interiors of reactor chambers, for example, on chamber walls and elsewhere. The invention provides methods according to which cleaning steps are integrated and incorporated into a high-throughput growth process. Preferably, the times when growth should be suspended and cleaning commenced and when cleaning should be terminated and growth resumed are automatically determined based on sensor inputs. The invention also provides reactor chamber systems for the efficient performance of the integrated cleaning/growth methods of this invention. | 07-22-2010 |
20100212687 | Process and System for Removing Printing in Metallic Packages - Process and system for removing printing in metallic packages used in drinks, food and other applications in general, comprising the removal of ink before the cure thereof, by means of spray with ink remover liquid and non abrasive friction. Preferably, said liquid is an alkaline aqueous solution, which is sprayed onto the package surface simultaneously with the friction thereof with a soft and non abrasive element. In a preferred embodiment, said friction results in the rotation of the package around the longitudinal axis thereof, which is mounted on a rotative support, and the soft non abrasive element in contact with the surface thereof keeps motionless. | 08-26-2010 |
20100218787 | FIC Installation and Method for Operating a FIC Installation in the Pressure Range Above Atmospheric Pressure - A method of Fluoride Ion Cleaning (FIC) of a component is provided. A FIC installation includes a reaction chamber and a reactive gas or a reactive gas mixture. A pressure of the reactive gas or the reactive gas mixture in the reaction chamber is set at least occasionally above atmospheric pressure, wherein the pressure in the reaction chamber is periodically lowered and raised. | 09-02-2010 |
20100236573 | METHOD AND APPARATUS FOR WASHING SAND - A sand washing apparatus may be used for separating organic material from a mixture comprising sand and organic material. The apparatus may comprise: a wash chamber for accepting a mixture comprising sand and organic material, the chamber including a lower portion; and an agitator comprising a screw having two or more flights extending into the lower portion. A method for recovering sand from a mixture comprising sand and organic material may comprise the steps of: introducing a mixture comprising sand and organic material into a water-filled chamber having a net flow of water in an upwardly direction; allowing organic material from the mixture to ascend in a net upwardly direction and allowing sand from the mixture to descend in a net downwardly direction; subjecting at least a portion of the descending sand to a turbulence; and recovering sand that has descended past the turbulence. | 09-23-2010 |
20100242990 | Apparatus and process for the dry removal of the scale found on the surface of the metal products - An apparatus and process for the dry removal of the scale from the surface of a metal product comprising at least one heating area that does not reduce the specific surface of the material to be treated and does not cause oxidation, at least one reducing area for performing the reaction between a specific reducing gas (normally hydrogen) and at least the scale, at least one cooling area for cooling the metal product, means for heating the metal product, means for heating the reducing gas, means for controlling the fluid dynamics of the boundary layer produced by the flow of said reducing gas over the surface of the metal product, means for removing the reaction products front the reducing gas after the reaction, means for cooling the metal product, and means for removing the reaction products from the treated surface of the metal product. | 09-30-2010 |
20100252069 | METHOD OF RECOVERING IMPREGNATING AGENT COMPOSITIONS - The present invention relates to processes for recovering impregnating compositions, the impregnated metal part being brought into contact with a salt-containing cleaning composition which comprises at least 0.7% by weight of at least one salt. | 10-07-2010 |
20100252070 | METHOD FOR CLEANING SILICON WAFER AND APPARATUS FOR CLEANING THE SILICON WAFER - After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even. | 10-07-2010 |
20110000505 | METHODS AND COMPOSITION FOR CLEANING A HEAT TRANSFER SYSTEM HAVING AN ALUMINUM COMPONENT - Disclosed herein is a method and treatment system for rapid cleaning and protecting of automotive cooling systems containing controlled atmosphere brazed aluminum heat exchangers. The method and treatment system can optionally include a conditioning (passivating) step. The treatment system can comprise three different parts: (1) cleaner or cleaning solution; (2) conditioner or conditioning solution; and (3) compatible CAB aluminum protective heat transfer fluid. | 01-06-2011 |
20110048454 | SURFACE TREATMENT METHOD OF METAL MEMBER AND CLEANING NOZZLE - A surface treatment method of a metal member according to an embodiment of the invention includes removing an oily substance on the metal member by using gas-liquid two fluids that are obtained by boiling heated and pressured water under ordinary pressure. A surface treatment device of a metal member for removing an oily substance on the metal member includes self-generation two fluids production means for producing gas-liquid two fluids by boiling heated and pressured water under ordinary pressure, and a surface treatment room carrying out a surface treatment by bringing the self-generation two fluids into contact with the metal member. | 03-03-2011 |
20110048455 | Rinsing apparatus and rinsing method for polycrystalline silicon lump - A rinsing apparatus for polycrystalline silicon lump which is obtained by cutting or breaking a rod of polycrystalline silicon, including: a wash basket having a plurality of through holes, which carries the polycrystalline silicon lump; a wash tank in which the wash basket is provided therein, in which rinse water is continuously supplied from a water supply port which is arranged at a bottom part of the wash tank; an inner cage having a plurality of openings which is smaller than the through holes of the wash basket at a bottom part thereof, provided in the wash tank, in which the wash basket is stored therein; and a swing device holding and swinging the wash basket in the inner cage, and: an overflow part which recovers the rinse water overflowed from an upper portion of the wash tank is provided at the wash tank. | 03-03-2011 |
20110079243 | SCALE CONDITIONING AGENTS AND TREATMENT METHOD - An improved scale conditioning composition and method is disclosed that results in improved dissolution and disruption of tube scale, hardened sludge and other deposits composed primarily of highly densified magnetite such as those found in heat exchange vessels, particularly steam generators. After treatment with the advanced scale conditioning composition, these magnetite rich deposits are more easily removed using known and commercially available high pressure hydro-mechanical cleaning techniques. The present invention further provides effective cleaning in a short period of time and at relatively low temperatures, while reducing the amount of waste produced and reducing the resulting corrosion of carbon and low alloy steel components within the steam generator during the cleaning process. | 04-07-2011 |
20110146705 | UV LAMP ASSEMBLY OF DEGAS CHAMBER HAVING ROTARY SHUTTERS - A UV lamp assembly having rotary shutters. Each rotary shutter has a concave wall with a reflective concave surface. The rotary shutters can be collectively rotated between an open position and an closed position. At the open position, the rotary shutters do not block UV light of UV lamps from leaving the UV lamp assembly while at the closed position the rotary shutters block UV light from leaving the UV lamp assembly. | 06-23-2011 |
20110146706 | ECONOMIC SECONDARY DESCALING - This process for the secondary descaling of running metal strips, especially made of steel, during the hot-rolling thereof, by spraying water onto the surface thereof using spray rails having nozzles supplied with pressurized water, is characterized in that the nozzles are supplied at low hydraulic pressure, not exceeding 30 bar (preferably below 10 bar, but without going below 4 bar), and in that for the purpose of providing a thermal effect of the water sprayed onto the surface to be descaled quantitatively similar to the thermal effect obtained with the usual known method of secondary descaling at high pressure, namely a cooling of the strip which reduces its surface temperature to approximately 600° C., so that the heat flux density extracted from the strip (HF) resulting from the cooling of its surface by the sprayed water is similar to that achieved with said known high-pressure practice. | 06-23-2011 |
20110155170 | USE OF A DEVICE FOR CLEANING METAL FIBERS WITH A VIEW TO RECYCLE AND RECOVER THE SAME - The field of the invention is the recovery and recycling of materials, particularly the recycling of tyres. It relates particularly to a device for cleaning metal fibres comprising at least 2 coaxial cones, one fixed and one mobile in rotation, and means of moving said mobile cone. | 06-30-2011 |
20110214688 | CLEANING SOLUTION FOR SIDEWALL POLYMER OF DAMASCENE PROCESSES - An aqueous cleaning solution and a method of use of the cleaning solution are described herein for removing sidewall polymer of a damascene process on a wafer without damaging any low-k material and interconnect material on the wafer. | 09-08-2011 |
20120000484 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - In a manufacturing method of a semiconductor device, a depression is formed in a semiconductor substrate made of silicon or silicon compound semiconductor, and foreign substances including a protection layer in the depression is removed with a cleaning solution. The cleaning solution includes a mixed solution of hydrogen peroxide water to which a chelator is added, a basic solution, and water. | 01-05-2012 |
20120042898 | COMPOSITIONS AND METHOD FOR THE REMOVAL OF PHOTORESIST FOR A WAFER REWORK APPLICATION - Compositions useful in reworking microelectronic device wafers, i.e., removing photoresist from rejected wafers, without damaging underlying layers and structures such as cap layers, interlevel dielectric layers, etch stop layers and metal interconnect material. The semi-aqueous compositions include at least one alkali and/or alkaline earth metal basic salt, at least one organic solvent, water, optionally at least one quaternary ammonium basic salt, optionally at least one metal corrosion inhibitor and optionally at least one water-soluble polymer surfactant. | 02-23-2012 |
20120152276 | WAFER CLEANING APPARATUS AND WAFER CLEANING METHOD USING THE SAME - The object of the present invention is to provide a wafer cleaning apparatus that reduces the amount of dissolved oxygen, without using hydrogen peroxide, to be able to reduce the deformation, etc. of a wafer and to reduce silicon consumption and a wafer cleaning method using the same. | 06-21-2012 |
20120160265 | Use of a catalyst in a base coating to improve the strippability of subsequent coatings - The invention is a method of stripping one or more additional coats covering a barrier primer coat that covers a surface. The barrier coat contains a catalyst, such as manganese dioxide and, or, manganese carbonate, for the decomposition of hydrogen peroxide. The top coat of the covered surface is contacted with the stripping agent at decomposition reaction conditions. | 06-28-2012 |
20120167916 | NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD - Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear treatment with the oxidizing agent, which comprises a thioamide compound and a non-aromatic thiol compound. The neutralizing/reducing agent does not generate any gas during a neutralization/reduction treatment, and therefore the occurrence of defects caused by the neutralization/reduction on the surface of a through hole or a blind via hole can be prevented. Further, the neutralizing/reducing agent hardly dissolves copper, and therefore the occurrence of haloing can be prevented, and the blistering caused by the etching between an inner layer copper and a resin with the neutralizing/reducing agent can also be prevented. | 07-05-2012 |
20120180811 | DRY CLEANING METHOD OF SUBSTRATE PROCESSING APPARATUS - A dry cleaning method of a substrate processing apparatus includes forming a metal oxide by oxidizing a metal film adhered to the inside of a processing chamber of the substrate processing apparatus; forming a complex by reacting the metal oxide with β-diketone; and sublimating the complex to be removed. A cleaning gas containing oxygen and β-diketone is supplied into the processing chamber while heating the inside of the processing chamber. A flow rate ratio of oxygen to β-diketone in the cleaning gas is set such that a formation rate of the metal oxide is lower than a formation rate of the complex. | 07-19-2012 |
20120222701 | BEVERAGE MANUFACTURE, PROCESSING, PACKAGING AND DISPENSING USING ELECTROCHEMICALLY ACTIVATED WATER - A system using electrochemically-activated water (ECAW) for manufacturing, processing, packaging, and dispensing beverages including: (a) using ECAW to neutralize incompatible residues when transitioning from the production of one beverage to another; (b) using ECAW to rehabilitate and disinfect granular activated charcoal beds used in the feed water purification system; (c) producing a carbonated ECAW product and using the carbonated ECAW for system cleaning or disinfecting; (d) using ECAW solutions in the beverage facility clean-in-place system to achieve improved microbial control while greatly reducing water usage and reducing or eliminating the use of chemical detergents and disinfectants; (e) further reducing biofilm growth in the processing system, and purifying ingredient water without the use of chlorine, by adding an ECAW anolyte to the water ingredient feed stream; and/or (f) washing the beverage product bottles or other packages with one or more ECAW solutions prior to packaging. | 09-06-2012 |
20120285482 | Method For Cleaning Wafers Using A Polycarboxylate Solution - A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution. | 11-15-2012 |
20120318293 | METHOD OF CLEANING WAFER SURFACES AFTER POLISHING ALUMINUM WIRINGS IN ULTRA LARGE SCALE INTEGRATED CIRCUITS - A method of cleaning wafer surfaces after polishing aluminum wirings by means of a polishing disc in ultra large scale integrated circuits, the method including: a) mixing and stirring deionized water, between 0.5 and 5 wt. % of a surfactant, between 0.1 and 5 wt. % of an FA/O II chelating agent, and between 0.01 and 5 wt. % of an FA/O II corrosion inhibitor, to yield a neutral aqueous cleaning solution; and b) after a chemical-mechanical polishing treatment for aluminum wirings, directly washing wafer surfaces with the neutral aqueous cleaning solution without lifting the polishing disc. | 12-20-2012 |
20130014779 | CLEANING METHOD OF SEMICONDUCTOR MANUFACTURING PROCESSAANM CHEN; Yi-WeiAACI Taichung CityAACO TWAAGP CHEN; Yi-Wei Taichung City TWAANM TSAI; Teng-ChunAACI Tainan CityAACO TWAAGP TSAI; Teng-Chun Tainan City TWAANM LAI; Kuo-ChihAACI Tainan CityAACO TWAAGP LAI; Kuo-Chih Tainan City TWAANM HUANG; Shu-MinAACI Tainan CityAACO TWAAGP HUANG; Shu-Min Tainan City TW - A cleaning method of a semiconductor manufacturing process is provided. The cleaning method is applied to a semiconductor component including a plurality of material layers formed thereon. An opening is defined in the material layers, and a side wall is exposed from the opening The side wall at least includes a first material layer and a second material layer. At first, a first cleaning process is performed till a lateral etched thickness of the first material layer is equal to a lateral etched thickness of the second material layer. Then, a byproduct formed in the first cleaning process is removed. | 01-17-2013 |
20130042887 | TOILET BOWL CLEANER AND METHOD - An aqueous cleaning composition and method for cleaning toilet bowl surfaces includes a composition having an acid, such as hydrochloric acid, and at least one antimicrobially active diamine surfactant such that the cleaning composition has a pH of less than 4 and a viscosity of at least 100 centipoise. | 02-21-2013 |
20130098391 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula | 04-25-2013 |
20130098392 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula | 04-25-2013 |
20130133691 | METHOD OF CLEANING TUNGSTEN PLUG SURFACES IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER CHEMICAL-MECHANICAL POLISHING - A method of cleaning tungsten plug surfaces in ultra large scale integrated circuits after chemical-mechanical polishing, the method including: a) preparing a cleaning solution by mixing deionized water, between 15 and 30 g/L of an active agent with respect to the deionized water, between 5 and 20 g/L of a chelating agent with respect to the deionized water, and between 1 and 60 g/L of a corrosion inhibitor with respect to the deionized water; b) after alkaline chemical-mechanical polishing, washing the tungsten plug surfaces using the cleaning solution at a flow rate of between 1000 and 4000 g/min for between 30 s and 3 min. | 05-30-2013 |
20130263888 | PROCESS FOR THE REMOVAL OF POLYMER THERMOSETS FROM A SUBSTRATE - The present invention relates to a process for the removal of polymer thermosets from the substrates without damaging the substrates. The present invention relates to a process for the removal of polymer thermoset from the substrate retaining the physical and chemical properties of the substrates. The present invention more particularly relates to the use of bio molecules for cleaving polymer thermosets and the process to perform the cleaving. | 10-10-2013 |
20140182620 | USES FOR AN ACETAL BASED COMPOSITION AND METHOD OF THINNING/CLEANING/STRIPPING - An acetal-based composition is described which includes an acetal of formula R—O—CH | 07-03-2014 |
20140352716 | DRY ETCHING METHOD, DRY ETCHING APPARATUS, METAL FILM, AND DEVICE INCLUDING THE METAL FILM - In a dry etching method for etching a metal film formed on a substrate by use of etching gas containing β-diketone, the metal film contains at least one metal material that forms a penta- or hexa-coordinated complex structure with β-diketone; the etching gas containing β-diketone contains at least one additive among H | 12-04-2014 |
20150053234 | METHOD FOR CLEANING SEMICONDUCTOR WAFER - The present invention is directed to a method for cleaning a semiconductor wafer which comprises filling a cleaning solution containing ammonia and aqueous hydrogen peroxide in a cleaning tank comprising a synthetic quartz material with an average Al concentration of 1 ppb or less, immersing the above-mentioned semiconductor wafer in the above-mentioned cleaning solution, and cleaning the above-mentioned semiconductor wafer so that a surface etching rate of the above-mentioned synthetic quartz by the above-mentioned cleaning solution becomes 0.3 nm/min or less, and according to this method, a cleaning method which can maintain the Al concentration in the ammonia and per-water cleaning solution to a low concentration and can improve surface cleanliness of the semiconductor wafer is provided. | 02-26-2015 |
20150059802 | METHODS FOR REMOVING BARRIER COATINGS, BONDCOAT AND OXIDE LAYERS FROM CERAMIC MATRIX COMPOSITES - The disclosure relates generally to methods for removing coatings and bond coats of ceramic matrix composites. More specifically, the disclosure relates to, for example, methods of removing a bond coat from a ceramic matrix composite by contacting a ceramic matrix composite with at least one hydroxide at particular temperatures and removing the bond coat from said ceramic matrix composite. | 03-05-2015 |
20150075559 | METHOD FOR PURIFYING POLYCRYSTALLINE SILICON - Polysilicon fragments are purified to remove metal contaminates by contacting the fragments with a purifying liquid at a flow rate >100 mm/sec. Effective removal without abrasion is accomplished. | 03-19-2015 |
20150114429 | AQUEOUS CLEAN SOLUTION WITH LOW COPPER ETCH RATE FOR ORGANIC RESIDUE REMOVAL IMPROVEMENT - A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one corrosion inhibitor, and at least one solvent. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device while being compatible with barrier layers. | 04-30-2015 |
20160002793 | COMPOSITIONS AND METHODS FOR INHIBITING CORROSION IN GAS TURBINE AIR COMPRESSORS - Methods and compositions are disclosed for inhibiting corrosion on metal surfaces of gas turbine air compressors. The methods comprise contacting the metal surfaces with a corrosion inhibiting composition comprising at least one filming amine. | 01-07-2016 |
20160005591 | Method and Apparatus for Enhanced Cleaning and Inspection - A cleaning and inspection system includes a cleaning chamber and retaining structure disposed within the cleaning chamber and configured to secure an article to be cleaned within the cleaning chamber. The cleaning and inspection system also includes a gas distributor disposed within the cleaning chamber and configured to distribute a turbulent flow of gas into the cleaning chamber that facilitates removal of foreign particles from a surface of the article. Further, the system includes a particle collection surface positioned to collect foreign particles removed from the surface of the article. | 01-07-2016 |
20160052023 | SYSTEM AND METHOD FOR WASHING MECHANICAL PARTS - A system for washing mechanical parts polluted with hydrocarbons is described, which includes a) a cleaning fluid; b) an enzymatic complex that catalyzes the oxidative degradation of hydrocarbons coating the mechanical parts, wherein said enzymatic complex is located within a filter cartridge; and, c) a washing sink. By using the described system, daily degradation efficiency from 250 to 500 g of transformed hydrocarbons in CO | 02-25-2016 |
20160056016 | ION BEAM PROCESSING APPARATUS, ELECTRODE ASSEMBLY, AND METHOD OF CLEANING ELECTRODE ASSEMBLY - Provided is an ion beam processing apparatus including an ion generation chamber, a processing chamber, and electrodes to form an ion beam by extracting ions generated in the ion generation chamber to the processing chamber. The electrodes includes a first electrode disposed close to the ion generation chamber and provided with an ion passage hole to allow passage of the ions, and a second electrode disposed adjacent to the first electrode and closer to the processing chamber than the first electrode is, and provided with an ion passage hole to allow passage of the ions. The apparatus also includes a power unit which applies different electric potentials to the first electrode and the second electrode, respectively, so as to accelerate the ions generated by an ion generator in the ion generation chamber. A material of the first electrode is different from a material of the second electrode. | 02-25-2016 |
20160069160 | TREATMENT OF MICROBIAL-INFLUENCED CORROSION - Surfaces of well servicing equipment are treated with both a biofilm remover, which can be a mechanical or chemical, and a biocide composition. The biocide composition is designed to be effective to prevent regrowth of bacteria over a period of time in which the equipment is expected to be out of service. Further, the biocide is compatible with the water source available on site for preparation of the biocide composition. The biofilm remover and the biocide composition can be applied or mixed together as a single treatment, if compatible. The biocide is maintained within the equipment or is displaced therefrom, such as with nitrogen and residual biocide composition is effective therein to prevent regrowth. Nitrogen can be maintained within the equipment until put back into service. | 03-10-2016 |
20160096201 | SUBSTRATE-TREATING APPARATUS AND METHOD FOR TREATING A SUBSTRATE USING THE SAME - A substrate-treating apparatus includes a liquid-providing part, a first liquid-removing knife and a returning part. The liquid-providing part provides a first liquid chemical for cleaning a substrate that includes a metal pattern and a photoresist pattern on the metal pattern, and for removing an etchant that remains on the substrate. The first liquid-removing knife sprays a second liquid chemical in a direction inclined and opposite to a returning direction of the substrate, so as to remove the first liquid chemical, the first liquid chemical including a metal precipitate. The returning part returns the substrate from the liquid-providing part toward the first liquid-removing knife in the returning direction. | 04-07-2016 |
20160101446 | Method of Cleaning Turbine Blades - In a process for cleaning contaminating silicon dioxide SiO | 04-14-2016 |
20160102275 | USE OF ACTIVATOR COMPLEXES TO ENHANCE LOWER TEMPERATURE CLEANING IN ALKALINE PEROXIDE CLEANING SYSTEMS - The present invention provides for the use of activator complexes to enhance lower temperature cleaning in alkaline peroxide cleaning systems. Compositions including at least one of an activator complex, an active oxygen source, and a source of alkalinity are applied to the surface to be cleaned at temperatures between about 5° C. and about 50° C. The methods and compositions of the present invention provide for enhanced soil removal with reduced energy, water, and chemistry consumption. | 04-14-2016 |
20160115599 | USE OF A CATALYST IN A BASE COATING TO IMPROVE THE STRIPPABILITY OF SUBSEQUENT COATINGS - The invention is a method of stripping one or more additional coats covering a barrier primer coat that covers a surface. The barrier coat contains a catalyst, such as manganese dioxide and, or, manganese carbonate, for the decomposition of hydrogen peroxide. The top coat of the covered surface is contacted with the stripping agent at decomposition reaction conditions. | 04-28-2016 |
20160254182 | Removal Composition for Selectively Removing Hard Mask and Methods Thereof | 09-01-2016 |
20160376527 | Pyrophoric Iron Sulfide Treatment Using Sodium Nitrite - Pyrophoric material such as iron sulfide is frequently found in refinery equipment. When the equipment is opened to the atmosphere for maintenance, an exothermic reaction can take place that may cause injury to personnel and catastrophic damage to equipment. A process used to treat pyrophoric material uses sodium nitrite injected into a gaseous carrier stream to oxidize iron sulfides to elemental sulfur and iron oxides. The sodium nitrite solution may be buffered to a pH of about 9 with disodium phosphate or monosodium phosphate. A chemical additive that provides a quantitative measure of reaction completion may be added to the treatment solution. | 12-29-2016 |