Entries |
Document | Title | Date |
20080210340 | REPAIR PROCESS - In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium and a second nickel base alloy material containing chromium and cobalt, applying the brazing paste to an area of the metal workpiece containing at least one crack, and subjecting the workpiece and the brazing paste to a brazing cycle by heating the brazing paste and the workpiece, preferably to a temperature in the range of from 2000 to 2200 degrees Fahrenheit. During the brazing cycle, the brazing paste flows into and fills the at least one crack and thus repairs the metal workpiece. | 09-04-2008 |
20080308189 | LEAD FREE SOLDER CONTAINING Sn, Ag AND Bi - A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance. | 12-18-2008 |
20090065097 | LEAD-FREE SOLDER OF SN-0.7WT%CU - An improved lead-free solder of Sn-0.7 wt % Cu which contains 0.001-1.5 wt % Ti and an alkaline element of Li, Na, K, Rb, Cs, etc. The alkaline element accounts for 0.0001-0.8 wt %. Compared with the traditional lead-free solder of Sn-0.7 wt % Cu, the lead-free solder of the present invention is characterized by the resulting welding spots with glossier and smoother surface, alloy solder with improved diffusivity, and solder surface with enhanced oxidation resistance. | 03-12-2009 |
20090084469 | MATERIALS HAVING INCREASED MOBILITY AFTER HEATING - Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue. | 04-02-2009 |
20090101238 | Brazing Material Containing A Flux - A wire for use in a brazing or soldering operation is provided. The wire preferably includes a body formed of a metallic material. A flux solution is provided within a channel along at least a portion of the length of the body and a surface of the flux solution is exposed. The body is preferably formed into an annular ring having an inner wall and an opposing outer wall. The flux solution preferably includes a solvent, a polymer dissolved in the solvent, and a powdered flux added to the polymer solution. | 04-23-2009 |
20090120533 | Strand-Shaped Product for Producing an Anticorrosive Layer on a Substrate - Boric acid-free fluxes based on inorganic boron compounds for brazing metallic materials in combination with silver, copper or nickel base solders are known. Starting from this, in order to provide a further flux for brazing that is free of boric acid and contributes to a good wetting of the workpieces to be joined and that is distinguished by residues of low corrosivity, it is suggested according to the invention that the boron compounds should comprise potassium pentaborate and potassium metaborate, the ratio of the weight parts of potassium pentaborate and potassium metaborate being in the range between 4 and 10. | 05-14-2009 |
20090139607 | BRAZE COMPOSITIONS AND METHODS OF USE - Braze compositions containing flux compositions and processes for using such braze compositions, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze composition contains an aqueous binder system, multiple inorganic compounds, titanium hydride, and a metallic braze alloy. The braze composition is useful when brazing superalloys that are prone to oxidation at elevated brazing temperatures. | 06-04-2009 |
20100037990 | BULK METALLIC GLASS SOLDER MATERIAL - High strength, reliable bulk metallic glass (BMG) solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes. BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric (ILD) materials due to thermal stress in materials with different coefficients of thermal expansion (CTE). | 02-18-2010 |
20100084050 | Lead-Free Solder with Improved Properties at Temperatures >150.degree.C - Lead-free solders based on an Sn—In—Ag solder alloy contain 88 to 98.5 wt. % Sn, 1 to 10 wt. % In, 0.5 to 3.5 wt. % Ag, 0 to 1 wt. % Cu, and a doping with a crystallization modifier, the crystallization modifier preferably being a maximum of 100 ppm neodymium. | 04-08-2010 |
20100218853 | SOLDERING FLUX AND METHOD FOR BONDING SEMICONDUCTOR ELEMENT - The method for bonding a semiconductor element comprises the step of applying to solder bumps | 09-02-2010 |
20110073216 | Brazing Material Containing A Flux - A wire for use in a brazing or soldering operation is provided. The wire preferably includes a body formed of a metallic material. A flux solution is provided within a channel along at least a portion of the length of the body and a surface of the flux solution is exposed. The body is preferably formed into an annular ring having an inner wall and an opposing outer wall. The flux solution preferably includes a solvent, a polymer dissolved in the solvent, and a powdered flux added to the polymer solution. | 03-31-2011 |
20110120594 | BONDING WIRE FOR SEMICONDUCTOR - It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %. | 05-26-2011 |
20120291921 | FLUX FOR SOLDER PASTE, AND SOLDER PASTE - A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C | 11-22-2012 |
20120291922 | SOLDER PASTE - A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of | 11-22-2012 |
20130037172 | Fine particulate flux - A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier. | 02-14-2013 |
20130192722 | FLUX COMPOSITIONS FOR FORMING A SOLDER BUMP AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME - The inventive concept provides flux compositions for forming a solder bump and methods of fabricating a semiconductor device using the same. The flux composition may include a resin, an activator, and a solvent. The resin may include gum rosin and rosin ester, and a mass ratio of the gum rosin versus the rosin ester may have a range of about 60:40 to about 90:10. | 08-01-2013 |
20130333806 | FLUX - To provide flux which has a property of suppression of sedimentation of the solder powder, dissolves by heating at the time of the soldering to remain no residue and does not block any wettability of the solder. | 12-19-2013 |
20140041760 | Pb-FREE SOLDER PASTE - There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. | 02-13-2014 |
20140158254 | Flux - To provide a flux that can suppress occurrence of migration surely in a soldered portion on which flux residue is formed. | 06-12-2014 |
20140299231 | METAL-BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATERIALS - A solder composite is provided. The solder composite may include: a metal-based solder matrix, a capsule dispersed in the solder matrix, and a self-healing material that is encapsulated in the capsule. The self-healing material may be configured to react with the solder matrix when in contact with the solder matrix such that at least one of an electrically conductive intermetallic compound and an electrically conductive alloy is formed. | 10-09-2014 |
20140360628 | Brazing Material Containing a Flux - A flux coating composition may include a composition paste including an elastomer solution mixed with a flux powder or a flux paste. When the composition is heated during a brazing operation, the composition yields no metal oxides and ≦50 ppm of carbon, ash, fumes, smoke, or other by-product contaminants. The flux may include a binder with an acrylic resin and a plurality of synthetic rubber compounds. | 12-11-2014 |
20150020923 | SOLDERING FLUX AND SOLDER COMPOSITION - A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux. | 01-22-2015 |
20150090366 | SOLDERING FLUX AND SOLDER PASTE COMPOSITION - A soldering flux includes a base resin, an activator, and a solvent. The activator contains an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1). | 04-02-2015 |
20150096651 | AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME - The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent. | 04-09-2015 |
20160184937 | Flux for Resin Flux Cored Solder, Flux for Flux Coated Solder, Resin Flux Cored Solder and Flux Coated Solder - A flux for a resin flux cored solder contains 30% or more by mass but 80% or less by mass rosin ester and 5% or more by mass but 15% or less by mass activator. The total content ratio of base materials including the rosin ester is preferably equal to or more than 85% by mass but equal to or less than 95% by mass. | 06-30-2016 |
20160250722 | HIGH-CONCENTRATION FLUX FOR BEING SPRAYED ON PREFORM | 09-01-2016 |