Entries |
Document | Title | Date |
20080236787 | METHOD TO COOL BAKE PLATES IN A TRACK LITHOGRAPHY TOOL - A method of reducing a temperature of a bake plate within a semiconductor processing tool includes (a) providing a substrate and (b) transferring the substrate to a position adjacent the bake plate. The bake plate is characterized by an initial bake plate temperature greater than a set point temperature. The method also includes (c) reducing the temperature of the bake plate by a first predetermined amount and (d) transferring the substrate from the position adjacent the bake plate to a position adjacent a chill plate. The chill plate is characterized by a chill plate temperature less than the set point temperature. The method further includes (e) transferring the substrate from the position adjacent the chill plate to the position adjacent the bake plate, (f) reducing the temperature of the bake plate by a second predetermined amount, (g) monitoring the temperature of the bake plate, and (h) repeating steps (d) through (g) until the bake plate temperature is within a predetermined tolerance of the set point temperature. | 10-02-2008 |
20080277093 | Device and Method for Cooling Tool Holders Comprising Shrink Fit Chucks - The invention relates to a method and a device ( | 11-13-2008 |
20110120670 | Combination portable computer cooling support and carrying case - The present invention achieves technical advantages as a combination portable computer carry case and cooling support with an deployable/expandable and retractable receptacle, such as a pocket. The device is configured to receive a portable computer for carrying in a first orientation, and also configured to support the portable computer at an angle upon a work surface in an ergonomic position in a second orientation. The pocket can hold portable computers of varying sizes, and is aesthetically appealing as it won't sag when used. The pocket conveniently collapses to provide a coplanar support surface when used as a support stand. | 05-26-2011 |
20110186264 | Beverage Bottle and Can Chilling Device - A device attachable to a beverage container such as a bottle or can that serves to increase the rate at which a beverage contained within the bottle or can is chilled from room temperature to a cooler temperature suitable for consumption. The device is a semi-rigid disc having a serrated edge that facilitates gripping of the device. One side of the disc includes two structures designed to receive and retain the top portion of alternately either a beverage bottle or a beverage can. A circular depression receives and retains a bottle top structure while a concentric circular wall receives and retains the disc on the top of a beverage can. Once the disc is placed on top of the beverage bottle or can, the assembly may be immersed in an ice bath and rotated, or spun, using the serrated edge of the disc as a means for imparting the spinning motion. In addition, a finger recess or aperture may be positioned on a top surface of the disc to further facilitate the manner of imparting a spinning motion to the disc. Surfaces on the disc, especially an upper surface, may be used for the placement of advertising or promotional indicia. | 08-04-2011 |
20110186265 | ATTACHMENT ARRANGEMENT FOR A HEAT SINK - An attachment arrangement for a heat sink includes, but is not limited to, an attachment surface defined on the heat sink. A thermally conductive adhesive is disposed on the attachment surface. A substrate is attached to the attachment surface via the thermally conductive adhesive. The thermally conductive adhesive defines a discontinuity that is disposed in a delamination path of the thermally conductive adhesive. | 08-04-2011 |
20110203770 | EQUIPMENT CASE - An equipment case is provided. The case comprises a sealed housing unit configured to receive an item of equipment. Cooling means, associated with the housing unit, are provided for maintaining an operational thermal environment within the equipment case. | 08-25-2011 |
20120000625 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device, configured for dissipating heat of an electronic component, includes a first heat sink and a second heat sink detachably mounted to a lateral side of the first heat sink. The first heat sink is attached to the electronic component. The second heat sink has a smaller size than the first heat sink. | 01-05-2012 |
20120168121 | INTERNAL POCKET FASTENER SYSTEM FOR CERAMIC MATRIX COMPOSITE HEAT EXCHANGER - A fastener system provides an internal pocket within a CMC HEX panel into which a fastener stud is inserted through an internal pocket opening and loaded to secure the CMC HEX panel to a support structure. | 07-05-2012 |
20120241130 | HEAT-DISSIPATING BASE FOR ELECTRONIC PRODUCT - A heat-dissipating base for an electronic product includes a pair of supporting bodies and a concealed linkage assembly. The supporting bodies have a first accommodating trough provided with a first rail and a second accommodating trough provided with a second rail. The concealed linkage assembly is received in the first accommodating trough and the second accommodating trough. The concealed linkage assembly comprises a first connecting rod and a second connecting rod pivotally connected to each other. Both ends of the first connecting rod are pivotally connected to the pair of supporting bodies in the first accommodating trough and the second accommodating trough respectively. Both ends of the second connecting rod are slidingly connected to the first rail and the second rail respectively. By this structure, the present invention can be applied to various electronic products of different sizes, and it can be folded for easy storage and carry. | 09-27-2012 |
20120267068 | THERMAL MODULE AND MANUFACTURING METHOD THEREOF - A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced. | 10-25-2012 |
20130068422 | System and method for recycling energy from ice remnants - A system for recycling energy from ice remnants. The system includes a container. The container includes a receptacle configured to receive ice remnants. An ice capturing and melting device below the receptacle is configured to capture and melt ice in the ice remnants while allowing fluid in the ice remnants to pass therethrough thereby forming a cooled recycled liquid at a bottom of the container. A discharge port located proximate the bottom of the container is configured to direct the cooled recycled liquid to at least one heat source of a facility and cool the heat source. | 03-21-2013 |
20130199753 | METHODS, SYSTEMS, AND DEVICES FOR THERMAL ENHANCEMENT - Methods, systems, and devices are provided for thermal enhancement. Thermal enhancement may include absorbing heat from one or more devices. In some cases, this may improve the efficiency of the one or more devices. In general, a phase transition may be induced in a storage material. The storage material may be combined with a freeze point suppressant in order to reduce its melt point. The mixture may be used to boost the performance of device, such as an electrical generator, a heat engine, a refrigerator, and/or a freezer. The freeze point suppressant and storage material may be separated. By delaying the periods between each stage by prescribed amounts, the methods, systems, and devices may be able to shift the availability of electricity to the user and/or otherwise boost a device at different times in some cases. | 08-08-2013 |
20130340973 | HEAT DISSIPATION DEVICE WITH FASTENER - A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. The engaging portion abuts the bottom side of the base at a periphery of the mounting hole. The head portion abuts the top side of the base at the periphery of the mounting hole. | 12-26-2013 |
20140048230 | HEAT EXCHANGER FOR A BATTERY UNIT - The invention relates to a heat exchanger for a battery unit, comprising coolant-conducting tubes ( | 02-20-2014 |
20140110085 | HEAT EXCHANGER AND METHOD FOR MANUFACTURING SUCH - Heat exchanger comprising at least a heat exchanger space, a burner space and a water conducting channel, wherein the heat exchanger comprises a body having at least one slot and at least one cassette insertable into said at least one slot, said cassette comprising at least part of a water conducting channel. | 04-24-2014 |
20140150992 | THREADED COOLING APPARATUS WITH INTEGRATED COOLING CHANNELS AND HEAT EXCHANGER - A threaded cooling apparatus includes a head having a heat exchanger and a shaft having a threaded section configured to mechanically fasten the head to a structure. The heat exchanger is configured to exchange heat with a coolant flowing through the head. The shaft also includes first and second cooling channels. The first cooling channel is configured to deliver the coolant to the heat exchanger, and the second cooling channel is configured to exhaust the coolant from the heat exchanger. The apparatus may also include a first seal between the head and the structure that is configured to reduce or prevent coolant loss. The apparatus may further include a second seal that is configured to reduce or prevent coolant flow between the first and second cooling channels that bypasses the heat exchanger. | 06-05-2014 |
20140338860 | Combination Vessel Holder for Heat Block Incubation - A device for use with a heat source, a multi-well sample plate, and a plurality of samples includes a substantially solid block of thermally conductive material having a first side and a second side generally opposite the first side; a first array of apertures on the first side of the block that aligns with wells of a first portion of the sample plate; and a second array of apertures on the second side of the block; wherein, in a first mode, the first array of apertures retains and engages with the sample plate to conduct heat from the heat source to the plate, and in a second mode, the second array of apertures retains and engages with the samples to conduct heat from the heat source to the samples. Two blocks may be combined together to accommodate a standard 96 well plate. | 11-20-2014 |
20150013939 | COLD CHASSIS FOR ELECTRONIC MODULES AND METHOD OF MAKING SAME - A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member. | 01-15-2015 |
20150027664 | RETAINER AND THERMAL DISPLACEMENT APPARATUS FOR ELECTRONIC COMPONENTS, METHODS OF PRODUCTION AND APPLICATIONS THEREOF - Retainers are described that comprise at least one center body component comprising a plurality of center body troughs, and at least one compatible component comprising a plurality of compatible troughs, wherein at least part of the plurality of the compatible troughs couple with at least part of the plurality of center body troughs. In addition, thermal displacement devices are described that incorporate at least one retainers and at least one additional component, wherein the at least one retainer is coupled at least in part to the at least one additional component through a contact area or a substrate, surface or combination thereof, wherein the at least one retainer is coupled with the substrate, surface or combination thereof through a contact area. | 01-29-2015 |
20150144301 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a fixing portion, wherein the heat dissipating portion extends from the fixing portion, and the fixing portion has a first recess structure. The base and the heat dissipating fin are combined with each other by a punching process, such that the fixing portion is fixed in the accommodating recess in a tight-fitting manner and a first side wall of the accommodating recess is embedded in the first recess structure. | 05-28-2015 |
20160169593 | APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SUBSTRATE | 06-16-2016 |
20160187076 | HEAT TRANSFER PLATE - A heat transfer plate comprising a number of rows of alternating ridges and grooves, where a transition between each ridge and the adjacent groove in the same row is formed by a portion of the heat transfer plate that is inclined relative the central plane, and a central opening that is configured to receive a fluid separation device, such that a first part of the central opening may act as a fluid inlet and a second part of the central opening may act as a fluid outlet, wherein the plate comprises plate portions that extend between the rows of ridges and grooves such that the rows are separated from each other. | 06-30-2016 |