Class / Patent application number | Description | Number of patent applications / Date published |
204298410 | Vacuum arc discharge coating | 25 |
20080271998 | Device for Carbon Deposition - A method for carbon deposition using a pulsed, plasma-supported vacuum arc discharge, having an anode, a target cathode made of carbon, a pulsed energy source and at least two ignition units. The at least two ignition units are positioned in the edge area of target cathode and each have two planar metallic electrodes and a planar ceramic insulator positioned between the electrodes. The planar shape of ignition units and their positioning on target cathode enables homogeneous utilization of the entire target surface and homogeneous coating of workpieces. | 11-06-2008 |
20090057144 | Arc Evaporation Source and Vacuum Deposition System - An arc evaporation source and a vacuum deposition system capable of properly collecting an evaporated material emitted from a cathode in vacuum arc discharge are provided. An arc evaporation source ( | 03-05-2009 |
20090127110 | METHOD OF MANUFACTURING ELECTRODE FOR ELECTRICAL-DISCHARGE SURFACE TREATMENT, AND ELECTRODE FOR ELECTRICAL-DISCHARGE SURFACE TREATMENT - A method of manufacturing an electrode for electrical-discharge surface treatment includes increasing oxygen content in the powder; mixing the powder, in which the oxygen content is increased, with an organic binder and a solvent to prepare a liquid mixture; granulating the powder in the liquid mixture to form granulated powder; and forming the granulated powder to prepare a compact in which an oxygen concentration ranges from 4 weight % to 16 weight %. | 05-21-2009 |
20090242397 | SYSTEMS FOR CONTROLLING CATHODIC ARC DISCHARGE - A system for controlling cathodic arc discharge is provided. The system includes a vacuum chamber forming an anode. The system also includes a power supply connected to the vacuum chamber, wherein the power supply is configured to generate an electric field within the vacuum chamber. The system further includes a cathode disposed within the vacuum chamber. The system also includes at least one permanent magnet configured to actuate in a translational direction inwards and outwards of the cathode, wherein the magnet is further configured to apply a magnetic field in a direction perpendicular to a face of the cathode and to the electric field to bum the cathode at a predetermined radius on the face of the cathode. | 10-01-2009 |
20100018859 | Radially enlarged type plasma generating apparatus - Intended is to provide a plasma generating apparatus, which can remove such a droplet efficiently as might otherwise migrate into a plasma and which can constitute a droplet removing portion simply and inexpensively thereby to improve a, surface treating precision such as a filming with a highly pure plasma. In a plasma advancing path ( | 01-28-2010 |
20100059369 | PLASMA GENERATING APPARATUS RENDERED ELECTRICALLY NEUTRAL ON THE PERIPHERY OF PLASMA GUN - There is provided a plasma generating apparatus having a plasma gun which can remove droplets mixed with plasma efficiently without reducing the effective amount of plasma generated by vacuum arc discharge and in which a droplet removing portion can be constituted easily and inexpensively, and precision of surface treatment of films by high purity plasma can be enhanced. Periphery of a cathode ( | 03-11-2010 |
20100170787 | Filtered Cathodic Arc Deposition Method and Apparatus - An apparatus for the application of coatings in a vacuum comprising a plasma duct surrounded by a magnetic deflecting system communicating with a first plasma source and a coating chamber in which a substrate holder is arranged off of an optical axis of the plasma source, has at least one deflecting electrode mounted on one or more walls of the plasma duct. In one embodiment an isolated repelling or repelling electrode is positioned in the plasma duct downstream of the deflecting electrode where the tangential component of a deflecting magnetic field is strongest, connected to the positive pole of a current source which allows the isolated electrode current to be varied independently and increased above the level of the anode current. The deflecting electrode may serve as a getter pump to improve pumping efficiency and divert metal ions from the plasma flow. In a further embodiment a second arc source is activated to coat the substrates while a first arc source is activated, and the magnetic deflecting system for the first arc source is deactivated to confine plasma to the cathode chamber but permit electrons to flow into the coating chamber for plasma immersed treatment of the substrates. A load lock shutter may be provided between the plasma duct and the coating chamber further confine the plasma from the first arc source. | 07-08-2010 |
20100213054 | VACUUM COATING APPARATUS WITH MUTIPLE ANODES AND FILM COATING METHOD USING THE SAME - A vacuum coating apparatus is disclosed. The apparatus includes a cathode target, a plurality of anodes, a transiting device, a pulsed arc discharge device, and a pulsed laser device. The plurality of anodes is placed on the transiting device and successively passes though a working position by the transiting device. The pulsed arc discharge device is electrically connected to the cathode target and the anode at the operable position to form plasma in a vacuum chamber for film coating. The pulsed laser device is located outside of the vacuum chamber and provides a pulsed laser beam onto the surface of the cathode surface to serve as a plasma trigger. A coating method for the vacuum coating apparatus is also disclosed. | 08-26-2010 |
20100213055 | Vacuum arc vaporisation source and also a vacuum arc vaporisation chamber with a vacuum arc vaporisation source - The invention relates to a vacuum arc vaporisation source ( | 08-26-2010 |
20110068004 | PLASMA GENERATING APPARATUS AND PLASMA PROCESSING APPARATUS - Provided is a plasma generating apparatus by which droplets mixed in plasma can be efficiently removed and surface processing precision can be improved in film formation wherein high purity plasma is used. A plasma processing apparatus using such plasma generating apparatus is also provided. A droplet removing portion arranged in a plasma advancing path is composed of a straight plasma straightly advancing tube (P | 03-24-2011 |
20110089031 | Sputtering System with Normal Target and Slant Targets on the Side - A sputtering system aimed for sputtering workpieces that have non-planar surfaces, such as concaves, pillars, and steps of a case of a laptop. The sputtering system comprises a sputtering chamber including a carrier, a first sputtering source, and a second sputtering source. The first sputtering source is located over the carrier main to sputter planar portion of the workpiece. The second sputtering source is inclined at an angle so as to sputter the vertical portion of the workpiece. | 04-21-2011 |
20110180403 | Insulator Interposed Type Plasma Processing Apparatus - Electrically charged droplets and neutral droplets mixed with plasma are removed with better efficiency, and an improvement in the surface treatment precision of film formation by high purity plasma is sought. | 07-28-2011 |
20110308941 | MODIFIABLE MAGNET CONFIGURATION FOR ARC VAPORIZATION SOURCES - The present invention relates to an arc vaporization source for generating hard surface coatings on tools. The invention comprises an arc-vaporization source, comprising at least one electric solenoid and a permanent magnet arrangement that is displaceable relative to the target surface. The vaporization source can be adjusted to the different requirements of oxide, nitride, or metal coatings. The rate drop during the lifespan of a target to be vaporized can be held constant or adjusted by suitably adjusting the distance of the permanent magnets to the front side of the target. A compromise between the coating roughness and rate can be set. | 12-22-2011 |
20120037504 | Multiply Divided Anode Wall Type Plasma Generating Apparatus and Plasma Processing Apparatus - An object of the present invention is to provide a multiply divided anode wall type plasma generation apparatus, wherein a short circuit between the cathode and the anode is not caused even if deposited matter adhering and depositing on the inner wall of the anode by diffusion plasma detach and fall. Also, an object is to provide a plasma processing apparatus using the same. | 02-16-2012 |
20120152739 | METHOD FOR APPLYING A HIGH-TEMPERATURE LUBRICANT - The present invention relates to a method for applying hexagonal boron nitride to a rough surface, wherein it is intended for the boron nitride to be provided as a temperature-resistant lubricant of the surface. According to the invention, a pin composed of hexagonal boron nitride is rubbed with pressure over the rough surface, such that abraded boron nitride adheres to the surface. | 06-21-2012 |
20120205243 | POWER SUPPLY APPARATUS - Provided is a power supply apparatus which can effectively restrict the current rise at the time of occurrence of arc discharge that is directly related to the occurrence of splashes or particles, and which is also capable of preventing the discharge voltage from getting excessive at the time of finishing the arc processing. The power supply apparatus has: a DC power supply unit which applies a DC voltage to a target which comes into contact with a plasma; and an arc processing unit which can detect arc discharge generated in the electrode by positive and negative outputs from the DC power supply unit, and also which can perform arc discharge suppression processing. An output characteristics switching circuit switches the outputs such that the output to the electrode has constant-current characteristics and that the output to the electrode has constant-voltage characteristics by the time of completion of the arc suppressing processing. | 08-16-2012 |
20130126348 | TARGET FOR SPARK VAPORIZATION WITH PHYSICAL LIMITING OF THE PROPAGATION OF THE SPARK - The present invention relates to a target for an ARC source having a first body ( | 05-23-2013 |
20130146454 | METHOD FOR IMPROVED CATHODIC ARC COATING PROCESS - A method of forming targets for cathodic arc deposition of alloy bond coats for turbine engines components consists of melting a base alloy containing aluminum and other metals, adding grain boundary strengthening alloy additions, and casting the melt to form a cylindrical billet that is subsequently sectioned into puck shaped targets. The grain boundary strengthening additions minimize intergranular fracture of the targets during high current operation of the arc coating process. | 06-13-2013 |
20130327642 | ARC EVAPORATION SOURCE - An arc evaporation source ( | 12-12-2013 |
20140251803 | CATHODIC ARC MASK ASSEMBLY LOCK SYSTEM - A mask assembly for a coating system includes a second mask that mounts to a first mask and is retained thereto by a pin. A method of masking a component for a cathodic arc vapor deposition system includes retaining a first mask to a second mask with a platter mount pin. | 09-11-2014 |
20140291149 | ANODE ASSEMBLY OF A VACUUM-ARC CATHODE PLASMA SOURCE - An anode unit is connected with an arc power supply having a positive terminal. The unit includes—an anode with an inlet,—a focusing coil encircling the anode, generating a focusing magnetic field,—a deflection coil being a conductive cooled pipe within an electro-conductive shell mounted in the anode, generating a deflection field opposite to the focusing one, having a distal butt end distal to the inlet and a proximal butt end proximal thereto, and a beginning turn,—a deflection permanent magnet inside the deflection coil facing the proximal end, generating a permanent deflection field, and—an additional permanent magnet inside the deflection coil facing the distal end, generating an additional magnetic field opposite to the permanent deflection one. The positive terminal is connected to the anode through the focusing coil and to the shell through the deflection coil. The beginning turn has a thermal contact with the shell. | 10-02-2014 |
20150083586 | DEPOSITION APPARATUS - A deposition apparatus comprises a source unit having a function of generating a plasma by an arc discharge; and a filter unit configured to transport the plasma generated by the source unit toward a material to be deposited, wherein the filter unit includes a duct configured to transport the plasma, a magnetic field formation unit configured to form, in the duct, a magnetic field for transporting the plasma, and a magnetic field bending unit configured to generate a magnetic force for bending the magnetic field formed by the magnetic field formation unit. | 03-26-2015 |
20160013027 | FILM FORMING DEVICE | 01-14-2016 |
20160071702 | ARC-PLASMA FILM FORMATION DEVICE - An arc-plasma film formation device includes a film formation chamber in which a substrate to be treated is stored, a plasma chamber in which at least a part of a target is stored, the plasma chamber being configured to be connected to the film formation chamber, and a plurality of hollow coils configured to generate a continuous line of magnetic force between the target and the film formation chamber and having at least one curved section, the plurality of hollow coils being arrange in the plasma chamber and covered by an outer coat made of a non-magnetic metal. Plasma containing ions derived from the target material and generated in the plasma chamber as a result of arc discharge is transported from the target to the substrate by passing an inside of the plurality of hollow coils. | 03-10-2016 |
20160086770 | ARC EVAPORATION SOURCE - Provided is an arc evaporation source for melting and evaporating a cathode material by arc discharge for film formation on a surface of a substrate, and including a cathode formed in a substantially disc shape and a magnetic field generating apparatus, disposed at a back side of the cathode. The magnetic field generating apparatus generates a magnetic field which forms magnetic lines that form an acute angle with respect to a substrate direction at an outer circumferential surface of the cathode, magnetic lines that are substantially perpendicular to the discharge surface at an outermost circumference part of the discharge surface of the cathode, and magnetic lines that form an acute angle with respect to a center direction of the cathode at a region towards the outer circumferential surface of the discharge surface of the cathode, by at least one permanent magnet disposed at the back side of the cathode. | 03-24-2016 |