Class / Patent application number | Description | Number of patent applications / Date published |
228264000 | PROCESS OF DISASSEMBLING BONDED SURFACES, PER SE (E.G., DESOLDERING) | 18 |
20090065557 | SELECTIVE REWORK APPARATUS FOR SURFACE MOUNT COMPONENTS - An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow. | 03-12-2009 |
20090127321 | ELECTRONIC ASSEMBLY REMANUFACTURING SYSTEM AND METHOD - A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment. | 05-21-2009 |
20100001048 | SOLDERING METHOD, ELECTRONIC PART, AND PART-EXCHANGING METHOD - A soldering method for soldering an electronic part on a substrate by reflow soldering is disclosed that includes the steps of applying a solder paste on the substrate; mounting the electronic part on the substrate by using the solder paste; disposing a heat capacity enhancing member on the electronic part, the heat capacity enhancing member including a gel-like material able to enhance the heat capacity of the electronic part; and soldering the electronic part onto the substrate by reflow soldering with the heat capacity enhancing member being applied thereon. | 01-07-2010 |
20100044417 | DECONSTRUCTABLE ASSEMBLY AND METHOD - An assembly ( | 02-25-2010 |
20100127050 | METHODS AND APPARATUS FOR EFFICIENTLY GENERATING PROFILES FOR CIRCUIT BOARD WORK/REWORK - Methods and articles for receiving times and temperatures for stages of a profile including solder heating stages to rework a populated printed circuit board (PCB), the rework including removing a first integrated circuit (IC) from the PCB, focusing heat on the first integrated circuit using an oven element during rework of the PCB, collecting actual temperature information from a plurality of temperature sensing elements to detect actual temperature information associated with the first integrated circuit, and generating a suggested modification for an operator to modify the time and/or the temperature of at least one of the stages in the profile in response to a fail status indicating that the collected actual temperature information did not meet temperatures for a variable. | 05-27-2010 |
20100213248 | MICRO COMPONENT REMOVING METHOD - A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive ( | 08-26-2010 |
20110024484 | VAPOR PHASE REWORK STATION AND METHOD - A vapor phase rework station and methods for reworking a circuit board to remove and replace components soldered thereto. A nozzle is disposed over the target component and vapor is communicated from a vapor source to the interior volume of the nozzle. As the vapor heats the solder holding the target component to the circuit board, the vapor condenses within the interior volume. The condensed vapor is suctioned from the interior volume of the nozzle. A component gripping tool grips the target component and withdraws it from the circuit board. The reverse operation is performed to reflow the solder to attach a new component to the circuit board in the area from which the target component was previously removed. | 02-03-2011 |
20110079634 | HEAT CONDUCTING APPARATUS AND SOLDER MELTING METHOD THEREFOR - A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board. | 04-07-2011 |
20110079635 | REMOVAL OF BRAZED METAL SHEETS - A process including local heating of a brazing point in order to remove an integrally brazed component from a structural part is provided. The brazing point joins a metal sheet in the interior of a cavity to a structural part. The process makes the removal of the metal sheet from the cavity much easier compared to the existing mechanical removal. A plasma source or an induction source may be used for heating the filler metal. | 04-07-2011 |
20110240718 | UNIVERSAL RADIO FREQUENCY SHIELD REMOVAL - Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented. | 10-06-2011 |
20110240719 | METHOD OF REMOVING PART HAVING ELECTRODE ON THE BOTTOM - In the initial state, a part having a bottom electrode such as a BGA is attached to a substrate. A heat transfer material such as low melting point solder is allowed to fill a gap between the substrate and the part having the bottom electrode, and the heat transfer material and the BGA serving as the bottom electrode are heated. The heat transfer material and the BGA are melted by the heating so that the part having the bottom electrode is removed from the substrate. | 10-06-2011 |
20110240720 | REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANSFER CAP - A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component. | 10-06-2011 |
20120118940 | UNIVERSAL RADIO FREQUENCY SHIELD REMOVAL - Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented. | 05-17-2012 |
20140138427 | COMBINED STEEL SHEET PILE, DIAPHRAGM WALL, AND METHOD OF DISASSEMBLING COMBINED STEEL SHEET PILE - A method of disassembling a combined steel sheet pile in which a steel sheet pile and an H-shaped steel are joined to each other, in which, when viewed in a cross-section perpendicular to a longitudinal direction, in a weld zone formed by a fillet weld, the weld zone is cut off to leave a portion on a side which is closer to the steel sheet pile than a throat depth surface, and thereby the combined steel sheet pile is disassembled into the steel sheet pile and the H-shaped steel. | 05-22-2014 |
20140191019 | APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT - Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. | 07-10-2014 |
20140217157 | REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA - Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. The systems and methods described herein can be used to remove solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components from PWBs. In some such embodiments, the liquid heat medium may be at least partially separated from the solder and, in some cases, recycled back to a vessel in which the liquid heat medium is stored. The PWBs may be pre-heated, in some embodiments, prior to being immersed in a liquid heat transfer medium in which the solder is removed. In certain embodiments, an additional liquid heat medium may be used to remove underfill from PWBs. In certain embodiments, the electronic components separated from the PWBs may be at least partially separated according to size, density, and/or optical characteristics. | 08-07-2014 |
20150321279 | APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT - Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. | 11-12-2015 |
20160007515 | Ball Grid Array Rework - Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. | 01-07-2016 |