Class / Patent application number | Description | Number of patent applications / Date published |
228470100 | WITH MEANS TO HANDLE WORK OR PRODUCT | 24 |
20080302857 | WIRE CLAMP FOR A WIRE BONDER - A wire clamp for a wire bonder comprises a first arm and a second arm, which is mounted on the first arm so that it is rotatable around a predetermined axis. The first arm and the second arm each have a clamping jaw on an end distal from the axis. The wire clamp also comprises a piezo bending element for opening and closing the wire clamp. One end of the piezo bending element is fastened to the second arm and an opposite end of the piezo bending element bears in a retainer fastened to the first arm. | 12-11-2008 |
20090134202 | REFLOW APPARATUS AND METHOD - Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a plurality of magazines is stored in the input stacker. The magazines stored in the input stacker are moved to the input module and are introduced into the heating unit by the moving unit. Solder balls provided on the processing objects within the heating unit are quickly processed using an induction heating method. The processing objects that have undergone a reflow process are loaded in a magazine on an output module of the unloader unit and are then stored in an output stacker. | 05-28-2009 |
20090212090 | Industrial welding system - The invention relates to an industrial welding system with a tool table, which has at least one tool holder for fixing workpieces that are to be welded. According to the invention, the tool holder is placed on a rotating frame that is mounted in a manner that enables it to rotate about a rotation axis that is parallel to a table base area of the tool table. The invention serves to weld plastic parts for the automotive industry. | 08-27-2009 |
20140084043 | AUTOMATED BRAZING SYSTEM - An automated brazing system by which an apparatus is conveyed along a path defined through a brazing zone is provided and includes first and second sets of burners disposed within the brazing zone at first and second opposing sides of the path, respectively, to heat the components of the apparatus substantially uniformly at the first and second sides and to heat the components of the apparatus substantially uniformly along the brazing zone, such that each side of each of the components is heated to a substantially similar temperature as each side of each of the other components. | 03-27-2014 |
20140367451 | Heat Processing Device - A reflow furnace ( | 12-18-2014 |
20150034699 | Reflow treating unit & substrate treating apparatus - Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module disposed between the load port and the substrate treating module. The substrate transfer module includes a transfer robot transferring the substrate among the load port, the substrate treating module, and a cleaning unit. The reflow treating unit includes a process chamber having a treating space therein, a support member disposed within the treating space, an exhaust member connected to a top surface of the process chamber to exhaust a fluid within the treating space, and an absorption prevention plate spaced apart from an upper portion of the support member, the absorption prevention plate having a flat plate shape with a predetermined thickness. | 02-05-2015 |
20150090769 | Welding Apparatus - Provided is a welding apparatus by which a worker can work in a comfortable posture, with which a space can be effectively utilized at a low cost, and which can reliably weld workpieces. Specifically, a pair of jigs are circumferentially provided on the upper surface of a circular rotating table around its outer circumference at intervals, and positions workpieces such that orientations of the workpieces are changeable. A welding robot is provided in a workpiece welded region. A control board outputs an operation signal to the rotating table such that the jigs respectively move into a workpiece set region and the workpiece welded region, and outputs an operation signal to the respective jigs such that the jig in the workpiece set region is inclined toward a side closer to the worker and the jig in the workpiece welded region is inclined according to welded parts of the workpieces. | 04-02-2015 |
228490100 | Including means to orient work or position work portion relative to another work portion | 8 |
20110259940 | STUD WELDING APPARATUS - A stud welding apparatus comprises a feeder to receive a plurality of studs and feed the stud one by one with the stud being fed in advance of a weld portion thereof from an outlet of the feeder; and a welding gun to receive the stud as fed from the feeder through a feeding pipe to hold the stud and to weld the stud to a workpiece. The outlet of the feeder is provided with a shuttle loader wherein a hollow shuttle is loaded to a rod body of the stud to extend the length of a short stud, so that the shuttle loaded stud is lengthened as a whole to prevent the shuttle loaded stud from tumbling in the feeding pipe and/or a stud path in the welding gun. | 10-27-2011 |
20120168489 | APPARATUS FOR TRANSPORTING SUBSTRATES FOR BONDING - A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path. | 07-05-2012 |
20150069110 | SEMICONDUCTOR MANUFACTURING APPARATUS - A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip. | 03-12-2015 |
20150129643 | WELDING SPINNERS, AND RELATED METHODS AND DEVICES - A welding spinner has a base; a wheel with a mounting face for an implement to be welded; and a cam arm laterally connecting the wheel to the base and mounted to rotate between the base and the wheel to adjust the height of the wheel relative to the base. A method of using the welding spinner includes rotating the cam arm relative to the base to adjust the height of the wheel relative to the base. A counterweight device and a removable chuck are disclosed and may be used with a welding spinner. | 05-14-2015 |
20160167181 | METHOD AND APPARATUS FOR FORMING A HARD DISK DRIVE BASE PLATE WITH AN EXTENDED HEIGHT | 06-16-2016 |
228490300 | Pipe joint aligner | 3 |
20080257938 | CONTINUOUS WELDING MACHINE FOR WELDING A PIPE BLANK - A continuous welding machine ( | 10-23-2008 |
20090114702 | DEVICE FOR CENTERING AND CLAMPING TUBULAR PARTS - The invention concerns a device for centering and clamping tubular parts such as conduits designed to form pipeline pipes of the type consisting of an elongated cylinder ( | 05-07-2009 |
20180021891 | NEAR-WELD PURGE GAS DELIVERY SYSTEM | 01-25-2018 |
228490500 | Work portion comprises electrical component | 9 |
20080314964 | WIRE BONDING APPARATUS AND PROCESS - A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. | 12-25-2008 |
20110121055 | BONDING APPARATUS - There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip. | 05-26-2011 |
20120061451 | QUICK-LOADING SOLDERING APPARATUS - A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered. | 03-15-2012 |
20120292375 | METHOD OF JOINING A CHIP ON A SUBSTRATE - A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics. | 11-22-2012 |
20120318850 | CHIP BONDING APPARATUS - A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier. | 12-20-2012 |
20130134209 | CARRIER FOR CIRCUIT BOARD - A circuit board carrier comprises an upper and a lower covers that construct a space for accommodating a circuit board. The upper cover has a recess, and an inner portion of the recess has two positioning elements symmetrically arranged. The positioning elements are movable in a push-and-pull motion. An inner wall of the recess has position limiting elements arranged at four corners thereof. The limiting elements are located between the inner wall of the recess and the positioning elements for confining the motion of the limiting elements and eliminating an effect of product tolerance on manufacturing the board. The carrier implements Y-axis and Z-axis confinement, avoids vibration occurred when the board passes an oven, and avoids a sliding error occurred due to human operations, by springs and pressing bulks fastened to bottom surfaces of the positioning elements and down pressing spring structure disposed below the upper cover. | 05-30-2013 |
20150034700 | Reflow treating unit & substrate treating apparatus - Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module. | 02-05-2015 |
20160099164 | STRUCTURE FOR JOINING CERAMIC PLATE TO METAL CYLINDRICAL MEMBER - A member for semiconductor manufacturing device includes a susceptor | 04-07-2016 |
20160143155 | Reflow Treating Unit and Substrate Treating Apparatus - Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module. | 05-19-2016 |