Class / Patent application number | Description | Number of patent applications / Date published |
257729000 | Portion of housing of specific materials | 21 |
20080303140 | Semiconductor device - To provide a semiconductor device which can increase reliability with respect to external force, especially pressing force, while the circuit size or the capacity of memory is maintained. A pair of structure bodies each having a stack of fibrous bodies of an organic compound or an inorganic compound, which includes a plurality of layers, especially three or more layers, is impregnated with an organic resin, and an element layer provided between the pair of structure bodies are included. The element layer and the structure body can be fixed to each other by heating and pressure bonding. Further, a layer for fixing the element layer and the structure body may be provided. Alternatively, the structure body fixed to an element layer can be formed in such a way that after a plurality of fibrous bodies is stacked over the element layer, the fibrous bodies are impregnated with an organic resin. | 12-11-2008 |
20090001564 | PACKAGE SUBSTRATE DYNAMIC PRESSURE STRUCTURE - Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed. | 01-01-2009 |
20090001565 | MEMS DEVICE FORMED INSIDE HERMETIC CHAMBER HAVING GETTER FILM - A MEMS device including a getter film formed inside a hermetic chamber provides stable performance of the MEMS device by electrically stabilizing the getter film. | 01-01-2009 |
20090121347 | Semiconductor Device and Semiconductor Device Assembly - Disclosed are a semiconductor device wherein warping of a semiconductor chip due to a sudden temperature change can be prevented without increasing the thickness, and a semiconductor device assembly. The semiconductor device comprises a semiconductor chip, a front side resin layer formed on the front surface of the semiconductor chip by using a first resin material, and a back side resin layer formed on the back surface of the semiconductor chip by using a second resin material having a higher thermal expansion coefficient than the first resin material. The back side resin layer is formed thinner than the front side resin layer. | 05-14-2009 |
20090184417 | POLYOL PHOTOSENSITIZERS, CARRIER GAS UV LASER ABLATION SENSITIZERS, AND OTHER ADDITIVES AND METHODS FOR MAKING AND USING SAME - Disclosed are photosensitizers that include a polyol moiety covalently bonded to a fused aromatic moiety. Also disclosed is a method for improving UV laser ablation performance of a coating, such as a cationic UV curable coating, by incorporating an oxalyl-containing additive into the cationic UV curable or other coating. Oxalyl-containing sensitizers having the formula Q-O—C(O)—C(O)—O—R | 07-23-2009 |
20090189277 | PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW STRESS, HIGH TEMPERATURE FILMS - Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: | 07-30-2009 |
20090189278 | ULTRASONIC MEASURING METHOD, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR PACKAGE - The waveform signals of ultrasonic waves reflected by a plurality of interfaces in a measurement object are received, the waveform signal of a reflected wave on a reference interface inside the measurement object is detected based on the amplitudes of the received waveform signals, and evaluation is made on the bonded condition of an interface to be measured based on the waveform signal of the reflected wave on the reference interface. | 07-30-2009 |
20090267225 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a semiconductor integrated circuit sandwiched between a pair of a first impact resistance layer and a second impact resistance layer, an impact diffusion layer is provided between the semiconductor integrated circuit and the second impact resistance layer. By provision of the impact resistance layer against the external stress and the impact diffusion layer for diffusing the impact, force applied to the semiconductor integrated circuit per unit area is reduced, so that the semiconductor integrated circuit is protected. The impact diffusion layer preferably has a low modulus of elasticity and high breaking modulus. | 10-29-2009 |
20090321925 | INJECTION MOLDED METAL IC PACKAGE STIFFENER AND PACKAGE-TO-PACKAGE INTERCONNECT FRAME - In some embodiments, an injection molded metal IC package stiffener and package-to-package interconnect frame is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device, and wherein the stiffener includes a plurality of vias that each couple a contact on a bottom surface of the stiffener with a respective contact on a top surface of the stiffener. Other embodiments are also disclosed and claimed. | 12-31-2009 |
20100025846 | METAL CAP WITH RINGED PROJECTION TO BE WELDED TO STEM AND RINGED GROOVE PROVIDED IMMEDIATELY INSIDE OF RINGED PROJECTION AND OPTICAL DEVICE HAVING THE SAME - An optical device with a CAN package is disclosed, where the cap is resistance-welded to the stem without causing failures due to fragments by the welding flying within the package. The cap of the invention has a flange portion to be welded to the stem. The flange portion provides a ringed groove in addition to the ringed projection for the welding. The fragment due to the welding may be captured in the ringed groove and is prevented from flying within the package. The ringed groove and the ringed projection are simultaneously formed in the stamping to form the body portion of the cap. | 02-04-2010 |
20100155935 | Protective coating for semiconductor substrates - Methods for coating a protective material on a semiconductor substrate to protect a back surface thereof from defects are provided, by depositing a diamond-like coating (DLC) material thereon at a low temperature, e.g. between about 150° C. to about 350° C. | 06-24-2010 |
20100171214 | MARKING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PROVIDED WITH MARKINGS - A marking method is provided for putting markings on the surface of a packaged semiconductor device. The semiconductor device includes a semiconductor chip and a resin package for covering the semiconductor chip. The method includes the steps of forming a groove in the obverse surface of the resin package, and filling the groove with a resin that is visually distinguishable from the resin package. | 07-08-2010 |
20110018127 | Multilayer UV-Curable Adhesive Film - This invention is an adhesive film comprising (a) a top layer that is substantially UV curable and that has a glass transition temperature of 50° C. or less; and (b) a bottom layer that is substantially not UV-curable. Additional embodiments include a bundled wafer lamination film, a semiconductor wafer with a multilayer adhesive film attached, a process for attaching a semiconductor die to a substrate, and a method of preventing individually diced dies from sticking to one another. | 01-27-2011 |
20110198746 | MEMS DEVICES - A method of manufacturing a MEMS device comprises forming a MEMS device element ( | 08-18-2011 |
20110304040 | SAMPLE LIQUID SUPPLY CONTAINER, SAMPLE LIQUID SUPPLY CONTAINER SET, AND MICROCHIP SET - A sample liquid supply container is disclosed. The sample liquid supply container includes a first region which is depressurized therein and is hermetically sealed, a second region which is able to receive a liquid therein, a first penetration portion, in which an interior of the first region is punctured by a hollow needle from outside, and a second penetration portion, in which an interior of the second region is punctured by the hollow needle inserted into the first penetration portion and reaches inside the first region. | 12-15-2011 |
20120104593 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device according to the invention includes: a substrate; an MEMS structure formed above the substrate; and a covering structure defining a cavity in which the MEMS structure is arranged, wherein the covering structure has a first covering layer covering from above the cavity and having a through-hole in communication with the cavity and a second covering layer formed above the first covering layer and closing the through-hole, the first covering layer has a first region located above at least the MEMS structure and a second region located around the first region, the first covering layer is thinner in the first region than in the second region, and a distance between the substrate and the first covering layer in the first region is longer than a distance between the substrate and the first covering layer in the second region. | 05-03-2012 |
20130062752 | RING STRUCTURE FOR CHIP PACKAGING - A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner. | 03-14-2013 |
20130187263 | SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a cutting region is removed, to form a stress concentrated region on an edge of a chip of the wafer. The wafer and the substrate are then cut, and a stress is forced to be concentrated on the edge of the chip of the wafer. As a result, the edge of the chip is warpaged. Therefore, the stress is prevented from extending to the inside of the chip. A semiconductor stacked package is also provided. | 07-25-2013 |
20140252591 | REINFORCEMENT STRUCTURE AND METHOD FOR CONTROLLING WARPAGE OF CHIP MOUNTED ON SUBSTRATE - A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die. | 09-11-2014 |
20160093545 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate and electrically connected to the package substrate; a first protective layer covering the semiconductor chip and having flexibility controlled by at least one of a material type, a thickness, a material composition ratio and viscosity of the first protective layer; and a second protective layer arranged on the first protective layer and having flexibility controlled by at least one of a material type and a thickness of the second protective layer, wherein the first protective layer comprises a first binder resin, a first hardener, and a first hardening catalyst. According to the semiconductor package of the inventive concept, protective layers protecting the semiconductor chip have flexibility, and thus, the semiconductor package may be bent. | 03-31-2016 |
20190148669 | PACKAGE STRUCTURE, PACKAGING METHOD AND ELECTRONIC DEVICE | 05-16-2019 |