Class / Patent application number | Description | Number of patent applications / Date published |
279003000 | VACUUM | 26 |
20080203679 | Tool Holder Comprising A Suction System - This patent document relates, as its title indicates, to a tool holder with suction system of the type used in automatic machining systems with numerical control for the adaptation and securing of different machining tools, characterised in that it integrates in a single device the functionality of a conventional automatic tool holder, being capable of bearing a retractable element for improving precision in the control of the depth of machining, and a suction system for the powder and swarf generated during the process, enabling in an alternative embodiment the use of an axial knuckle joint in the sensing device that enables automatic adaptation to the irregularities of the surface to be machined with the subsequent reduction in machining error, and also enabling in another alternative embodiment the use of a plurality of slide guides in the retractable elements for improving the sliding of the sensing element. | 08-28-2008 |
20080277885 | Wiring-Free, Plumbing-Free, Cooled, Vacuum Chuck - A solar cell production system utilizes self-contained vacuum chucks that hold and cool solar cell wafers during transport on a conveyor between processing stations during a fabrication process. Each self-contained vacuum chuck includes its own local vacuum pump and a closed-loop cooling system. After each wafer is processed, it is removed from its vacuum chuck, and the vacuum chuck is returned to the start of the production line by a second conveyor belt. In one embodiment, each vacuum chuck includes an inductive power supply that is inductively coupled to an external source to drive that vacuum chuck's vacuum pump and cooling system. An optional battery is recharged by the inductive power supply, and is used to power the vacuum pump and cooling system during hand-off between adjacent processing stations. | 11-13-2008 |
20100013169 | THIN WAFER CHUCK - Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove. | 01-21-2010 |
20100194061 | Head Used For Attracting a Workpiece - A workpiece vacuum chuck head, which serves to vacuum-chuck a light, minute workpiece and to release and place the vacuum-chucked workpiece on a workpiece placement surface, includes a base section, a workpiece vacuum chuck section, and a follower mechanism section for connecting together the base section and the workpiece vacuum chuck section. These sections form an integral structure. The base section has an attachment surface for attaching the workpiece vacuum chuck head to a head drive mechanism. The workpiece vacuum chuck section has a workpiece vacuum chuck surface and a negative-pressure chamber, which opens at the workpiece vacuum chuck surface via a suction hole. The follower mechanism section has a structure that is easily elastically deformable, and is appropriately deformed in a three-dimensional space so as to cause the workpiece vacuum chuck surface to follow an inclination of the workpiece placement surface. | 08-05-2010 |
20110198817 | THIN WAFER CARRIER - An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings. | 08-18-2011 |
20110241298 | WAFER FLATTENING APPARATUS AND METHOD - An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck centre and the vacuum source applied to the grooves, the wafer is held securely to the surface. | 10-06-2011 |
20120068420 | CENTERING METHOD FOR OPTICAL ELEMENTS - A method for centering a circular optical element using a non-self-centering chuck adapted to grip the element at two grip strengths. The element is rotated in the chuck while measuring the lateral position of the element's outer rim with a probe. The positions of maximum and minimum run-out of the element as a function of its angular position are determined. Chuck rotation is stopped at an angular position with the maximum rim run-out positioned at a predetermined point. The grip of the chuck is reduced such that the element is still held in the chuck but can be moved in a lateral direction without damaging its surface. The element is moved in a direction connecting the predetermined point of maximum run-out and the axis of rotation of the chuck, in order to reduce the run-out of the element. The procedure is repeated until the desired centering is achieved. | 03-22-2012 |
20120139192 | CHUCKING DEVICE AND CHUCKING METHOD - A chucking device is disclosed. The chucking device includes plural protruding portions that support the central portion of a semiconductor substrate and that are provided on a base portion. The chucking device also includes a cylindrical peripheral portion that supports the outer peripheral portion of the semiconductor substrate, plural suction holes that chuck the semiconductor substrate, and a vacuum source that vacuum draws the plural suction holes at differing timings. A plurality of mutually independent vacuum drawable suction holes are provided in at least one portion of the protruding portions. | 06-07-2012 |
20120193878 | COLORED CERAMIC VACUUM CHUCK AND MANUFACTURING METHOD THEREOF - In the present invention, a ceramic vacuum chuck | 08-02-2012 |
20120205878 | HIGH TEMPERATURE VACUUM CHUCK ASSEMBLY - A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector. | 08-16-2012 |
20120313332 | APPARATUS OF MANUFACTURING SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES USING THE SAME - Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided. | 12-13-2012 |
20130075982 | HIGH VOLTAGE CHUCK FOR A PROBE STATION - A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface. | 03-28-2013 |
20130082448 | Controlled Surface Roughness in Vacuum Retention - An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection. | 04-04-2013 |
20130147129 | WAFER SUPPORTING STRUCTURE - A wafer supporting structure for improving the critical dimension uniformity of a wafer, including: a chuck, a plurality of pin holes, and a platform positioned under the chuck. The chick has a surface and configured to receive a wafer thereon, the plurality of pin holes form through the chuck, and the platform comprises a plurality of movable pieces which support corresponding pins, wherein the pins are configured to move in a direction perpendicularly protruding from or sinking into the surface of the chuck. The movable piece has one end supporting the bottom of the pin and the other end subjected to an pneumatic pressure, hydraulic pressure, or piezoelectricity. | 06-13-2013 |
20130168929 | SEMICONDUCTOR WAFER ISOLATED TRANSFER CHUCK - A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer. | 07-04-2013 |
20130264780 | SUBSTRATE HOLDING APPARATUS AND SUBSTRATE HOLDING METHOD - In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate. | 10-10-2013 |
20140042715 | Chuck Exhaust Openings - A chuck includes a number of gas openings positioned to provide a gas flow to a backside of a wafer secured to the chuck. The chuck also includes a number of exhaust openings positioned to exhaust the gas at a distance from a topside edge of the wafer such that adverse thermal effects on the edge are reduced to a predetermined level. | 02-13-2014 |
20140091537 | CHUCK TABLE - A chuck table holds a workpiece having a warp. The chuck table includes a suction holding member having a suction holding surface for holding the workpiece under suction, and an annular seal member provided around the outer circumference of the suction holding member for supporting a peripheral portion of the workpiece. The annular seal member is formed from an elastic member. The upper surface of the annular seal member is set higher in level than the suction holding surface according to the warp of the workpiece. In holding the workpiece on the chuck table under suction, vacuum leaking from the gap between the workpiece and the suction holding surface due to the warp of the workpiece is applied to the space defined by the workpiece and the annular seal member, thereby elastically deforming the annular seal member to flatten the upper surface of the workpiece. | 04-03-2014 |
20140159321 | HOLDING DEVICE FOR HOLDING A PATTERNED WAFER - This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F | 06-12-2014 |
20140191478 | DEVICE FOR HOLDING A PLANAR SUBSTRATE | 07-10-2014 |
20140312576 | SUBSTRATE HOLDER ASSEMBLY FOR CONTROLLED LAYER TRANSFER - A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate. | 10-23-2014 |
20140319784 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer. | 10-30-2014 |
20150069723 | VACUUM CHUCK - A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly. | 03-12-2015 |
20150306678 | CHUCKING APPARATUS FOR A WORKPIECE WITH HONEYCOMB STRUCTURE - A chucking apparatus for a workpiece with honeycomb structure includes a table that can be supplied with vacuum and a clamping plate which can be placed on the table and which accommodates the workpiece in the region of an already profiled surface determined by the face ends of the honeycombs, whose receiving surface, which corresponds to the profiled surface of the workpiece, is provided with suction openings to the table. In order to provide advantageous chucking conditions, the clamping plate has an open-cell structure. | 10-29-2015 |
20150325466 | SUBSTRATE SUPPORTING APPARATUS - A substrate supporting apparatus includes a rotatable chuck, a first mass flow controller, a second mass flow controller, a plurality of locating pins and guiding pillars, and a motor in which the rotatable chuck defines a plurality of first injecting ports and second injecting ports, the first injecting ports are connected with a first gas passage for supplying gas to the substrate and sucking the substrate by Bernoulli effect, the second injecting ports are connected with a second gas passage for supplying gas to the substrate and lifting the substrate, the first and the second mass flow controllers are respectively installed on the first and the second gas passages, the plurality of locating pins and guiding pillars are disposed at the top surface of the rotatable chuck and every guiding pillar protrudes to form a holding portion, and the motor is used for rotating the rotatable chuck. | 11-12-2015 |
20150380294 | Vacuum Chuck with Polymeric Embossments - A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate. | 12-31-2015 |