Class / Patent application number | Description | Number of patent applications / Date published |
331155000 | With optical, piezoelectric or acoustic coupling means | 35 |
20080231385 | Oscillator Based on Piezoresistive Resonators - An oscillator circuit has a first and a second piezoresistive resonator ( | 09-25-2008 |
20100079213 | Oscillation circuit and method of controlling same - Disclosed is an oscillator in which current consumption relating to oscillation is reduced. The oscillator comprises: an amplifier to an input and output of which a piezoelectric oscillator and a feedback resistor are connected in parallel, and which is constituted by a CMOS logic inverter circuit; and a control circuit, which is constituted by a CMOS logic circuit, for clamping input/output levels of the amplifier and halting oscillation before oscillation start-up, unclamping the input/output levels at beginning of oscillation start-up and supplying a pulse signal to an output terminal of the amplifier a prescribed period of time after the beginning of oscillation start-up. | 04-01-2010 |
20100253441 | VARIABLE INDUCTOR - A variable simulated inductor comprises an integrator connected to receive the voltage across the input to the circuit. The output of the inductor is connected to a control terminal of a transconductor connected across the input of the circuit. The gain of the transconductor is electronically controllable in order to control the inductance of the circuit. An oscillator using a variable simulated inductor and a piezoelectric resonator connected in parallel is also provided. | 10-07-2010 |
20100264998 | APPARATUS AND METHOD FOR CHARGE TRANSFER - The invention relates to an apparatus and a method for charge transfer, wherein a charge transfer apparatus ( | 10-21-2010 |
20110025426 | FREQUENCY SELECTION AND AMPLIFYING DEVICE - A frequency selection device comprises an oscillator, which comprises a resonator mass which is connected by a spring arrangement to a substrate, and a piezoresistive element for controlling oscillation of the resonator mass, which comprises a piezoresistive element connected to the resonator mass. A current is driven through the piezoresistive element to control oscillation of the resonator mass. An input is provided for coupling a signal from which a desired frequency range is to be selected, to the resonator mass; and a detector is used for detecting a signal amplified by the oscillator. | 02-03-2011 |
20110074515 | PIEZOELECTRIC RESONATOR, OSCILLATOR AND OSCILLATOR PACKAGE - Provided is a piezoelectric resonator having a structure in which the piezoelectric resonator chip is mounted on a silicon substrate without deteriorating a characteristic. The piezoelectric resonator includes a silicon substrate ( | 03-31-2011 |
20110090020 | Voltage Controlled SAW Oscillator with Phase Shifter - An oscillator which, in one embodiment, is a voltage controlled surface acoustic wave oscillator including at least a surface acoustic wave filter and a voltage controlled phase shifter. In one embodiment, the phase shifter includes at least one low pass circuit and two high pass circuits coupled in series to improve phase shift versus control voltage linearity. In one embodiment, the low pass circuit includes at least a pair of inductors in series and a variable resistor coupled in parallel therebetween and to ground and the high pass circuit includes at least a pair of variable resistors in series and an inductor coupled in parallel therebetween and to ground. | 04-21-2011 |
20110187470 | VIBRATING MEMBER, VIBRATING DEVICE, AND ELECTRONIC APPARATUS - A vibrating member includes a base portion, a plurality of vibrating arms which extend from one end portion of the base portion, are provided in parallel in a first direction, and extend in a second direction perpendicular to the first direction, a linking portion which is provided between the base end portions of two adjacent vibrating arms and extends from the other end portion of the base portion, and a support portion which is connected to the base portion through the linking portion. | 08-04-2011 |
20110199160 | SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE UNIT - It is possible to reduce the size of a surface acoustic wave (SAW) resonator by enhancing a Q value. In a SAW resonator in which an IDT having electrode fingers for exciting SAW is disposed on a crystal substrate, the IDT includes a first region disposed at the center of the IDT and a second region and a third region disposed on both sides of the first region. A frequency is fixed in the first region and a portion in which a frequency gradually decreases as it approaches an edge of the IDT is disposed in the second region and the third region. When the frequency of the first region is Fa, the frequency at an edge of the second region is Fb | 08-18-2011 |
20110234328 | CONSTANT-TEMPERATURE PIEZOELECTRIC OSCILLATOR AND METHOD OF MANUFACTURING THE SAME - A constant-temperature piezoelectric oscillator includes: a piezoelectric vibrator; an oscillation circuit; a frequency voltage control circuit; a temperature control section; and an arithmetic circuit, wherein the temperature control section includes a temperature-sensitive element, a heating element, and a temperature control circuit, the frequency voltage control circuit includes a voltage-controlled capacitance circuit capable of varying the capacitance value in accordance with the voltage, and a compensation voltage generation circuit, and the arithmetic circuit makes the compensation voltage generation circuit generate a voltage for compensating a frequency deviation due to a temperature difference between zero temperature coefficient temperature Tp of the piezoelectric vibrator and setting temperature Tov of the temperature control section based on a frequency-temperature characteristic compensation amount approximate formula adapted to compensate the frequency deviation, and then applies the voltage to the voltage-controlled capacitance circuit to compensate the frequency. | 09-29-2011 |
20110298554 | METHOD OF ADJUSTMENT DURING MANUFACTURE OF A CIRCUIT HAVING A CAPACITOR - A method of adjustment during manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the electrical signal between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode. | 12-08-2011 |
20120038431 | MICROMECHANICAL RESONATOR ARRAY AND METHOD FOR MANUFACTURING THEREOF - The invention relates to a microelectromechanical resonators and a method of manufacturing thereof. The resonator comprises at least two resonator elements made from semiconductor material, the resonator elements being arranged laterally with respect to each other as an array, at least one transducer element coupled to said resonator elements and capable of exciting a resonance mode to the resonator elements. According to the invention, said at least one transducer element is a piezoelectric transducer element arranged laterally with respect to the at least two resonator elements between the at least two resonator elements and adapted to excite to the resonator elements as said resonance mode a resonance mode whose resonance frequency is dependent essentially only on the c | 02-16-2012 |
20120105164 | PIEZOELECTRIC OSCILLATION CIRCUIT AND TEMPERATURE-CONSTANT PIEZOELECTRIC OSCILLATOR - A piezoelectric oscillation circuit includes: a Colpitts oscillation circuit; a first circuit unit which includes a circuit having a variable-capacity capacitor for controlling an oscillation frequency; a second circuit unit which includes a circuit having a resistance; and a piezoelectric resonator which includes a first terminal connected to the first circuit unit and the second circuit unit, and a second terminal connected to the Colpitts oscillation circuit. The Colpitts oscillation circuit connects the second terminal to a fixed potential via a dividing resistance. The second circuit unit connects the first terminal to the fixed potential via the resistance. | 05-03-2012 |
20120126907 | OSCILLATION CIRCUIT - An oscillation circuit has a first inverter connected to an external piezoelectric resonator, a first feedback resistor disposed between input/output terminals of the first inverter, first/second variable capacitive elements connected to input/output of the first inverter, a charging circuit supplying input/output terminal with a reference current to charge the capacitive element, a comparator comparing a charging voltage of input/output with a reference voltage, and a control circuit that, in a calibration operation, at a first time, causes the charging circuit to start supply the reference current to the input terminal or the output terminal, and, at a second time after the first time, generates the control signal for setting a capacitance value of the first or second variable capacitive element so that the charging voltage becomes close to the reference voltage according to a comparison result of the comparator. | 05-24-2012 |
20120126908 | PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, RADIO-CONTROLLED CLOCK, AND METHOD FOR MANUFACTURING PIEZOELECTRIC VIBRATING REED - This invention is provided a piezoelectric vibrating reed which is capable of decreasing variation in the amount of etching reside as much as possible and suppressing influence of vibration loss on the vibration characteristics as much as possible. A piezoelectric vibrating reed comprising a vibrating section extensive in parallel in a longitudinal direction and a base to which the vibrating section is connected at this proximal end. The base comprises at least a first section and a second section defined from the side of the proximal end of the base long the longitudinal direction. The first section is wider in a transverse direction than the second section. | 05-24-2012 |
20120200365 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A photoresist film forming process is performed by the use of a forming apparatus that has a sprayer which generates an air flow toward metal film on a wafer to spray the photoresist material, and a plurality of spacers which is disposed between a work stage and the wafer. | 08-09-2012 |
20120229223 | VIBRATING ELEMENT, VIBRATOR, OSCILLATOR, AND ELECTRONIC DEVICE - A vibrating element includes a piezoelectric substrate having an excitation section adapted to excite a thickness-shear vibration, and provided with a step section in each of side surfaces on both ends, and a peripheral section having a thickness smaller than a thickness of the excitation section, and the peripheral section has at least one projection section disposed on both principal surfaces in an area where a vibratory displacement when the excitation section excites a vibration is sufficiently attenuated. | 09-13-2012 |
20120274410 | OSCILLATOR - The present invention relates to an oscillator. The oscillator includes a resonator unit configured to resonate terahertz waves generated by an active layer using intersubband transitions of a carrier. The oscillator further includes a strain generating unit configured to generate strain of the active layer. Still furthermore, the oscillator includes a control unit configured to control the strain generating unit in accordance with the oscillation characteristic (the frequency or the output) of the terahertz waves resonated by the resonator unit. | 11-01-2012 |
20120280759 | OSCILLATOR - There are disposed a sealing member, a pair of electrode pads to electrically couple a piezoelectric resonator, a plurality of connection pads to electrically couple an integrated circuit element and the piezoelectric resonator, and wiring patterns to establish electrical continuity between the pair of electrode pads and the plurality of connection pads, and the piezoelectric resonator and the integrated circuit element are disposed side by side in plan view. An output wiring pattern establishes electrical continuity between one of the connection pads and an alternating current output terminal of an oscillation circuit, and a power source wiring pattern establishes electrical continuity between one of the connection pads and a direct current power source terminal of the oscillation circuit. The electrode pads are disposed closer to the power source wiring pattern than the output wiring pattern. | 11-08-2012 |
20130027144 | SAW DEVICE, SAW OSCILLATOR, AND ELECTRONIC APPARATUS - A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 101-31-2013 | |
20130049876 | OSCILLATOR - A second piezoelectric vibrator ( | 02-28-2013 |
20130093527 | TRANSVERSE ACOUSTIC WAVE RESONATOR, OSCILLATOR HAVING THE RESONATOR AND METHOD FOR MAKING THE RESONATOR - A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed. | 04-18-2013 |
20130093528 | METHOD FOR OPERATING CONTROL EQUIPMENT OF A RESONANCE CIRCUIT AND CONTROL EQUIPMENT - The invention relates to a method for operating control equipment ( | 04-18-2013 |
20130127554 | SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE OSCILLATOR, AND SURFACE ACOUSTIC WAVE MODULE UNIT - It is possible to reduce the size of a surface acoustic wave (SAW) resonator by enhancing a Q value. In a SAW resonator in which an IDT having electrode fingers for exciting SAW is disposed on a crystal substrate, the IDT includes a first region disposed at the center of the IDT and a second region and a third region disposed on both sides of the first region. A frequency is fixed in the first region and a portion in which a frequency gradually decreases as it approaches an edge of the IDT is disposed in the second region and the third region. When the frequency of the first region is Fa, the frequency at an edge of the second region is Fb | 05-23-2013 |
20130162362 | SURFACE MOUNT PIEZOELECTRIC OSCILLATOR - A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator. | 06-27-2013 |
20130257551 | OSCILLATOR DEVICE AND ELECTRONIC INSTRUMENT - In an electro-acoustic transducer | 10-03-2013 |
20130257552 | OSCILLATOR DEVICE AND ELECTRONIC INSTRUMENT - Each of piezoelectric vibrators | 10-03-2013 |
20130307633 | OSCILLATION DEVICE AND ELECTRONIC APPARATUS - An oscillation device (electro-acoustic transducer ( | 11-21-2013 |
20130328637 | RESONATOR ELEMENT, RESONATOR, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING RESONATOR ELEMENT - A resonator element includes a substrate including a vibrating portion that performs thickness-shear vibration and an excitation electrode provided on top and bottom main surfaces of the vibrating portion. Assuming that the average plate thickness calculated from the plate thicknesses of a plurality of regions of the vibrating portion is H and the plate thickness difference, which is a difference between the maximum and minimum values of the plate thicknesses of the plurality of regions of the vibrating portion, is ΔH, 0%<ΔH/H≦0.085% is satisfied as a relationship between H and ΔH. | 12-12-2013 |
20140002201 | MEMS RESONATOR, MANUFACTORING METHOD THEREOF, AND SIGNAL PROCESSING METHOD USING MEMS RESONATOR | 01-02-2014 |
20140118079 | RESONATOR ELEMENT, RESONATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A resonator element includes a base portion which includes one end portion and the other end portion opposing the one end portion in a plan view, and a pair of vibrating arms which extend along a first direction from the one end portion of the base portion. The base portion includes a reduced width portion in which a width is gradually decreased along a second direction intersecting the first direction toward a direction side which is separated from the base portion along the first direction, in at least one of the one end portion and the other end portion, and a fixing portion is provided between the one end portion and the other end portion of the base portion. | 05-01-2014 |
20140197898 | High Sensitivity Micro-Piezoelectric Tunable Resonator - A highly sensitive micro-piezoelectric tunable resonator element and device that uses a tapered transition region from the actuator and sensor elements to the resonator beam to permit maximum mechanical energy transfer to the beam. A dual-resonator beam embodiment with a shared tuning element is provided in an alternative embodiment. | 07-17-2014 |
20140266484 | MICROELECTROMECHANICAL RESONATORS - Embodiments relate to MEMS resonator structures and methods that enable application of a maximum available on-chip voltage. In an embodiment, a MEMS resonator comprises a connection between a ground potential and the gap electrode of the resonator. Embodiments also relate to manufacturing systems and methods that are less complex and enable production of MEMS resonators of reduced dimensions. | 09-18-2014 |
20150318461 | BULK ACOUSTIC WAVE (BAW) DEVICE HAVING ROUGHENED BOTTOM SIDE - A bulk acoustic wave (BAW) resonator includes a substrate having a top side surface and a bottom side surface. A Bragg mirror is on the top side surface of the substrate. A bottom electrode layer is on the Bragg mirror, and a piezoelectric layer is on the bottom electrode layer. A top dielectric layer is on the piezoelectric layer, and a top electrode layer is on the top dielectric layer. The bottom side surface of the substrate has a surface roughness of at least 1 μm root mean square (RMS). | 11-05-2015 |
20160164458 | HOLLOW SUPPORTS AND ANCHORS FOR MECHANICAL RESONATORS - A micromechanical resonator having one or more anchoring stems which are hollow to increase resonator Q factor. By way of example a micromechanical disk resonator embodiment is shown utilizing a resonant micromechanical disk anchored by a stem between at least one electrode used for input and output. To increase resonator Q, a hollow stem is utilized in which an outer thickness of stem material surrounds a hollow area interior of the stem, or that is fabricated with a plurality of vias and/or fabricated substructures containing hollow spaces in the stem material. Measurements have confirmed that Q values can be increased using the hollow core stems by a factor of 2.9 times in certain implementations and operating modes. | 06-09-2016 |