Entries |
Document | Title | Date |
20080239011 | INK JET RECORDING HEAD AND LIQUID JETTING METHOD - A liquid recording head includes thermal energy generating means, having a flat plate configuration, for generating a bubble by thermal energy; a pressure chamber in which said thermal energy generating means is provided; a flow path for introducing liquid into said pressure chamber; a supply port in fluid communication with said flow path; and an ejection outlet provided at a position opposing said thermal energy generating means in fluid communication with said pressure chamber, wherein said thermal energy generating means includes a first major surface facing said ejection outlet and a second major surface opposite said first major surface, and wherein a distance between said first major surface and ceiling surface of said pressure chamber in which said ejection outlet is formed is shorter than a distance between said second major surface and a bottom surface of said pressure chamber. | 10-02-2008 |
20080266363 | PRINTER SYSTEM HAVING PLANAR BUBBLE NUCLEATING HEATER ELEMENTS - A printer system is provided having a printhead including nozzles with bubble forming chambers, a heater element(s) disposed in each chamber configured for thermal contact with a bubble forming liquid, and drive circuitry corresponding to the nozzles for controlling operation of the heater elements via electrodes, such that the heater element forms a gas bubble in the liquid that causes drop ejection from the nozzle. Parts of the drive circuitry is disposed on opposing sides of the chambers. The heater element has a bubble nucleation section of smaller cross section than the rest of the heater element where the bubble nucleation section and the rest of the heater element are co-planar and remain co-planar when the heater element is heated. An actuation energy of less than 500 nanojoules is required to be applied to each heater element to heat it sufficiently to form the bubble. | 10-30-2008 |
20090040278 | PRINTHEAD HAVING LOW ENERGY HEATER ELEMENTS - A printhead is provided having a plurality of nozzles and a plurality of heater elements each for heating an ejectable liquid to cause ejection of a drop of the ejectable liquid from a respective one of the nozzles. Each heater element is configured such that the energy required to be applied thereto to cause ejection of the drop is less than the energy required to heat a volume of the ejectable liquid equal to the volume of the drop to a temperature less than 40 degrees Celsius above ambient temperature. | 02-12-2009 |
20090046129 | STEERING FLUID JETS - A printer includes a printhead and a source of fluid. The printhead includes a nozzle. The fluid is under pressure sufficient to eject a column of the fluid through the nozzle. The fluid has a temperature. An asymmetric thermal modulator is associated with the nozzle and includes a structure that transiently lowers the temperature of a first portion of the fluid as the fluid is ejected through the nozzle and a structure that transiently raises the temperature of a second portion of the fluid as the fluid is ejected through the nozzle. | 02-19-2009 |
20090058949 | LIQUID EJECTION HEAD, INKJET PRINTING APPARATUS AND LIQUID EJECTING METHOD - Provided are a printing head and an inkjet printing apparatus, which eject liquid droplets without leaving behind any bubble in each nozzle, thus having an enhanced durability. An ejection port of the printing head includes a first ejection port part communicating with the atmosphere and a second ejection port part having a cross-section orthogonal to an ejection direction being larger than a cross-section of the first ejection port part orthogonal to the ejection direction, and being formed between the energy effect chamber and the first ejection port part. In addition, the second ejection port part is formed to be eccentric to an electrothermal transducing element in an ink supply direction in which ink is supplied from an ink supplying port to the bubbling chamber. | 03-05-2009 |
20090058950 | THERMAL INK JET PRINTHEAD WITH HEATER ELEMENT POSITIONED FOR MINIMIZED INK DROP MOMENTUM - An ink jet printhead comprises a plurality of nozzles each having a nozzle aperture; a bubble forming chamber corresponding to each of the nozzles respectively; an ejectable liquid inlet for establishing fluid communication between the nozzle aperture and an ejectable liquid supply, the ejectable liquid inlet and the nozzle aperture being aligned such that they have a common central axis; and a heater element disposed in each of the bubble forming chambers. Each heater element has two bubble nucleation regions suspended within the bubble forming chamber in a plane parallel to that of the nozzle aperture. The two bubble nucleation regions are laterally offset from the central axis, such that the lateral offset of one of the bubble nucleation regions is equal and opposite to the lateral offset of the other bubble nucleation region. The bubble nucleation regions are spaced from each other such that bubbles nucleated at each will grow until they unite to form the gas bubble that causes the ejection of a drop of ejectable liquid. The heater element is positioned such that a distance between a point of collapse of the gas bubble and the nozzle aperture is less than 50 microns. | 03-05-2009 |
20090091603 | Inkjet Printhead With Arcuate Actuator Path - Provided is an inkjet printhead having a plurality of ink ejection arrangements. Each arrangement includes a silicon wafer having an ink channel etched therethrough, with ink operatively supplied to a first surface of the wafer via said channel to an ink ejection chamber located along the surface of the wafer. Each arrangement also includes an external actuator arranged on the wafer, and a paddle inside the chamber and attached to the actuator which is activated so as to compress a portion of the ink within the chamber against a sidewall of said chamber to eject ink from the chamber. The chamber defines an arcuate profile shaped to guide the paddle on an arcuate path. | 04-09-2009 |
20090122116 | FLUID EJECTION DEVICE WITH RESISTIVE ELEMENT CLOSE TO DRIVE CIRCUITS - A fluid ejection device that has a firing chamber from which heated fluid is ejected, a heating element that heats fluid in the firing chamber and drive circuitry for the heating element. At least part of the drive circuitry is positioned within 60 microns of the heating element. | 05-14-2009 |
20090147056 | INKJET PRINT HEAD - The landing precision of ink drops is improved to improve the image quality and increase the printing speed. An inkjet print head ejects ink supplied from an ink supply port from a plurality of ejection ports respectively connecting to ink paths having different flow resistances by using energy generated by a plurality of electrothermal transducer elements respectively corresponding to the plurality of the ejection ports, wherein each of the plurality of the ejection ports connected to the ink paths having a low ink flow resistance is arranged so that the center of each of the plurality of the ejection ports is positioned farther away from the ink supply port to the center of the corresponding electrothermal transducer element than each of the plurality of the ejection ports connected to the ink paths having a high ink flow resistance. | 06-11-2009 |
20090147057 | LIQUID EJECTION HEAD AND PRINTING APPARATUS - A liquid ejection head is provided that is adapted, when the ejection of comparatively small ink droplets by one print head is required, to not only increase a printing speed and a printing resolution but also to prevent the occurrence of cavitation. The liquid ejection head includes: nozzles, for which heaters are formed to generate thermal energy used to eject ink; and bubble generation chambers, for which ejection ports are formed for ejecting ink upon the application of thermal energy provided by the heaters. Further, a partition wall is formed in each bubble generation chamber at a position opposite the ejection port. | 06-11-2009 |
20090160909 | INKJET PRINTER NOZZLE ARRANGEMENT HAVING THERMAL ACTUATOR WITH INNER AND OUTER PORTION OF INVERSE PROFILE - A nozzle arrangement for an inkjet printhead. The nozzle arrangement comprising a wafer substrate assembly defining an ink inlet channel; a static ink ejection structure extending from the substrate assembly and bounding the ink inlet channel; a pair of thermal bend actuators extending from the wafer substrate assembly on opposite sides of the static ink ejection structure, each actuator having an outer passive portion and an inner active portion, the inner active portion having a profile inverse of the outer passive portion; an active ink ejection structure comprising a roof defining an ink ejection port, and at least one sidewall which depends from the roof and surrounds the static ink ejection structure; and a pair of coupling structures coupling respective thermal bend actuators to the active ink ejection structure, the thermal bend actuators adapted to bend to move the active ink ejection structure relative to the static ink ejection structure, whereby ink contained within the ink ejection structure is ejected through the ink ejection port. | 06-25-2009 |
20090195615 | Printhead Integrated Circuit Having Suspended Heater Elements - A printhead integrated circuit comprising a substrate having a plurality of nozzle assemblies. A nozzle plate has a plurality of nozzles openings defined therein and each nozzle opening corresponds to a respective nozzle assembly. Each nozzle assembly havs a respective nozzle chamber and a heater element positioned in the nozzle chamber. Each heater element is suspended in the nozzle chamber and parallel with a plane of the nozzle plate. The integrated circuit includes drive circuitry for controlling actuation of the heater elements. Each heater element includes solid material having a thickness of at least 0.25 microns and a mass of less than 10 nanograms. | 08-06-2009 |
20090195616 | Printhead Assembly With Ink Leakage Containment Walls For Nozzle Groups - A printhead assembly comprising a substrate defining a plurality of ink inlets; a plurality of nozzle assemblies positioned on the substrate, each nozzle assembly defining a nozzle chamber in fluid communication with a respective ink inlet and a nozzle opening from which ink is ejected; and a plurality of endless containment walls extending from the substrate. Each endless containment wall surrounds a group of nozzle assemblies and defines a containment chamber to contain leakage ink from the group of nozzle assemblies therewithin. | 08-06-2009 |
20090195617 | INKJET PRINTHEAD INTEGRATED CIRCUIT WITH SUSPENDED HEATER ELEMENT SPACED FROM CHAMBER WALLS - An inkjet printhead that has a plurality of nozzles and a bubble forming chamber corresponding to each nozzle. The bubble forming chamber of each nozzle has at least one side wall and at least one heater element suspended within each of the bubble forming chambers respectively. Each heater element is configured to heat a bubble forming liquid in the printhead to a temperature above its boiling point to form a gas bubble therein. The generation of the bubble causes the ejection of a drop of an ejectable liquid (such as ink) through an ejection aperture in each nozzle, to effect printing. The heater element is spaced from the side wall of the bubble forming chamber by between 0.1 microns and 20 microns. The nucleation and growth of a gas bubble causes the pressure pulse that ejects ink from the nozzle aperture. By laterally enclosing the bubble with at least one of the side walls of the chamber, most of the pressure is dissipated by ejecting ink through the nozzle. | 08-06-2009 |
20090195618 | Nozzle Arrangement With Ejection Apertures Having Externally Projecting Peripheral Rim - A nozzle arrangement ejects ink through apertures that each have an externally projecting peripheral rim. The nozzle arrangement has a substrate assembly defining an ink inlet passage and including heater element drive circuitry, a nozzle chamber structure formed on the substrate assembly, the nozzle chamber structure defining nozzle chambers in fluid communication with the ink inlet passage and apertures through which ink in each of the nozzle chambers can be ejected, and heater elements positioned between the drive circuitry and the apertures. The heater elements are connected to the drive circuitry and are individually supplied with current to eject ink from one of the apertures respectively. | 08-06-2009 |
20090244193 | INKJET PRINTHEAD AND PRINTHEAD NOZZLE ARRANGEMENT - A printhead for an inkjet printer comprises a wafer assembly defining a plurality of spaced apart groups of ink supply channels and a plurality of groups of ink ejection nozzle arrangements. Each ink ejection nozzle arrangement comprises a nozzle chamber structure mounted to the wafer assembly. Each ink ejection nozzle arrangement further comprises an anchor extending from the wafer assembly in a location external to the nozzle chamber; and an elongate thermal actuator mechanism extending from the anchor and into the nozzle chamber. The thermal actuator mechanism comprises an elongate arm which terminates in a free end within the nozzle chamber, and a pair of layers of conductive material located on either side of the elongate arm. One of the layers is connected to a current supply for causing a differential thermal expansion in the elongate thermal actuator mechanism. A pit is defined adjacent each nozzle chamber structure for catching ink. The ink ejection nozzle arrangements of each group are arranged in a pair of rows, with the elongate thermal actuator mechanism of ink ejection nozzle arrangements of a first row extending away from those of ink ejection nozzle arrangements of a second row. | 10-01-2009 |
20090244194 | Micro-Electromechanical Integrated Circuit Device With Laminated Actuators - A micro-electromechanical integrated circuit device comprises a substrate; drive circuitry positioned on the substrate; and a plurality of elongate actuators. Each actuator comprises a fixed end portion fast with the substrate, a free end portion that is spaced from the substrate, and a heating circuit that is connected to the drive circuitry to heat the actuator. A portion of the actuator is formed of a material having a coefficient of thermal expansion such that the material is capable of performing work by thermal expansion. The heating circuit is positioned to generate differential thermal expansion and contraction when heated and cooled to cause reciprocal displacement of the free end portion of the actuator. Each actuator is a laminated structure having a first metal layer and a dielectric layer, the first metal layer being interposed between the dielectric layer and the substrate and defining the heating circuit. The drive circuitry is operable to generate drive pulses of first and second widths, the pulses of the first width being sufficient to cause substantial displacement of the free end of the actuator, and the pulses of the second width being insufficient to cause substantial displacement of the free end of the actuator. | 10-01-2009 |
20090244195 | NOZZLE ARRANGEMENT HAVING ANNULUS SHAPED HEATER ELEMENTS - A nozzle arrangement is provided for ejecting ink. The nozzle arrangement includes a substrate assembly defining an ink inlet passage. A nozzle chamber structure extends from the substrate assembly to define a nozzle chamber in fluid communication with the ink inlet passage. The nozzle chamber structure defines an aperture through which ink in the nozzle chamber can be ejected. A pair of parallel heater elements extends from the nozzle chamber structure and into the nozzle chamber, and can be supplied with current so that ink in the nozzle chamber is ejected out through the aperture. Each heater element is shaped to define at least one broken annulus, in turn, comprising said at least one arcuate portion. | 10-01-2009 |
20090244196 | Ink Jet Printhead with Inner and Outer Heating Loops - An ink jet printhead comprising: a substrate; a plurality of chambers supported by the substrate for receiving therewithin bubble forming liquid; a nozzle aperture formed in a surface of each chamber; a beam suspended within each chamber, the beam comprising at least one respective heater element. The at least one respective heater element heats at least part of the bubble forming liquid to a temperature above its boiling point to form a gas bubble therein, thereby causing ejection of a drop of the bubble forming liquid through the nozzle aperture corresponding to the heater element. | 10-01-2009 |
20090256891 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction. | 10-15-2009 |
20090273646 | THERMAL BEND ACTUATOR COMPRISING BENT ACTIVE BEAM HAVING RESISTIVE HEATING BARS - A thermal bend actuator comprising: (a) a pair of electrical contacts positioned at one end of the actuator; (b) an active beam connected to the electrical contacts and extending longitudinally away from the contacts, the active beam defining a bent current flow path between the contacts; and (c) a passive beam fused to the active beam. When a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator. The active beam comprises a resistive heating bar having a relatively smaller cross-sectional area than any other part of the current flow path. Heating of the active beam is concentrated in the heating bar. | 11-05-2009 |
20090289996 | Nozzle Arrangement With Pivotal Wall Coupled To Thermal Expansion Actuator - A nozzle arrangement for an inkjet printhead includes a substrate assembly defining an ink inlet channel; a nozzle chamber in fluid communication with the ink inlet channel, the nozzle chamber including an ink ejection port defined through a roof of the nozzle chamber, and a pivotal wall formed as part of one sidewall of the nozzle chamber; a paddle attached to the pivotal wall in a cantilevered manner, and extending into the nozzle chamber; a pair of anchors extending from the substrate assembly, a first anchor of the pair connected to a positive electrical contact and a second anchor of the pair connected to a negative electrical contact; and a thermal expansion actuator forming a bridge between the pair of anchors and the pivotal wall, the thermal expansion actuator having two arms each respectively attached to each of the pair of anchors, the thermal expansion actuator further having a bridge portion bridging the two arm. The thermal expansion actuator is configure to expand upon application of a current supplied through the pair of anchors. | 11-26-2009 |
20090295875 | INK EJECTION NOZZLE EMPLOYING VOLUME VARYING INK EJECTING MEANS - A nozzle arrangement for ejecting ink includes a substrate defining an ink supply passage; a first endless wall extending from the substrate and bounding the ink supply passage; an elongate actuator operatively anchored at a fixed end to the substrate and at a location external to the confines of the first endless wall, the actuator configured to reciprocally bend towards and away from the substrate on receipt of an electrical current; and a cover terminating a free end of the actuator, the cover defining a second endless wall suspended from the cover within the confines of the first endless wall to define an ink chamber with the first endless wall, the cover further defining an ink ejection port through which ink in the ink chamber is ejected. The reciprocal bending of the actuator towards and away from the substrate varies a volume of the ink chamber and effects ejection of ink from the ink chamber through the ink ejection port. The first and second endless walls define a gap therebetween, a width of the gap being conducive to the formation of a fluidic seal effected via surface tension of the ink. | 12-03-2009 |
20100002058 | PRINTHEAD INTEGRATED CIRCUIT WITH LOW VOLTAGE THERMAL ACTUATORS - There is disclosed a printhead integrated circuit (IC) which comprises a plurality of nozzles and one or more heater elements | 01-07-2010 |
20100002059 | Inkjet Thermal Actuator With Parallel Current Paths - An inkjet printhead comprising: an array of ink chambers, each having a nozzle and a thermal actuator for generating vapour bubbles to eject ink through the nozzle; wherein, the thermal actuator has a pair of contacts and at least two parallel current paths between the contacts, each of the current paths having a plurality of heater elements for nucleating a vapour bubble. | 01-07-2010 |
20100033539 | Printhead With Individual Nozzle Firing Frequency At Least Once Per Decap Time - An inkjet printhead has nozzles and respective heater elements. A print engine controller actuates the heater elements to eject ink through the corresponding nozzle. During use, the print engine controller actuates each of the heater elements at least once every decap time. The decap time is a predetermined time period in which the viscosity of the ejectable liquid at the nozzle increases to a threshold, at which ejection fails and the nozzle clogs. | 02-11-2010 |
20100045748 | INK-JET RECORDING HEAD - An ink-jet recording head includes a discharge-port portion including a first discharge-port portion continuing from a discharge port, and a second discharge-port portion communicating the first discharge-port portion with a bubble generation chamber. The second discharge-port portion has an end surface that includes a border portion bordering the first discharge-port portion and is parallel to a main surface of an element substrate. The cross-sectional area of the second discharge-port portion, anywhere from an opening surface facing the bubble generation chamber to an end surface facing the first discharge-port portion, that is parallel to the main surface of the element substrate, is larger than the area of the border portion. The cross-section of the opening surface of the second discharge-port portion has a length in a direction perpendicular to an arrangement direction of the discharge ports that is greater than its length in a direction parallel to the arrangement direction. | 02-25-2010 |
20100045749 | Thermal Bend Actuator Comprising Bilayered Passive Beam - A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam is comprised of first and second layers, and the second layer is sandwiched between the first layer and the active beam. The second layer is relatively more thermally insulating than the first layer. | 02-25-2010 |
20100079550 | EFFICIENT INKJET NOZZLE ASSEMBLY - An inkjet nozzle assembly comprising a nozzle chamber for containing ink, the chamber having a nozzle opening and an ink inlet; a pair of electrical contacts positioned at one end of the assembly and connected to drive circuitry; and a thermal bend actuator for ejecting ink through the nozzle opening, the actuator comprising: an active beam connected to the electrical contacts and extending longitudinally away from the contacts, the active beam defining a bent current flow path between the contacts; and a passive beam fused to the active beam, such that when a current is passed through the active beam, the active beam heats and expands relative to the passive beam resulting in bending of the actuator, wherein the actuator has a working face for generating a positive pressure pulse in the ink during the bending of the actuator, the working face having an area of less than 800 square microns. | 04-01-2010 |
20100123758 | MICRO-FLUID EJECTION DEVICE WITH ON-CHIP SELF-MANAGED THERMAL CONTROL SYSTEM - A micro-fluid ejection device, such as an inkjet printhead, includes a substrate, a heater chip on the substrate, a structure on the substrate for supplying ink to the heater chip and a nozzle plate on the heater chip. The heater chip has a plurality of electrically-activatable spaced apart heater elements that can be repetitively subjected to momentary electrical activation and deactivation so as to cause cyclical heating and cooling of ink in the heater chip resulting in repetitive ejection of drops of ink by the nozzle plate on the heater chip. The device also includes a thermal control system in the heater chip being self-managed by operation of a control loop defined by the thermal control system internally of the heater chip and substrate for sensing and limiting the variation of the temperature of the substrate during cyclical operation of the heater elements of the heater chip. | 05-20-2010 |
20100134567 | INKJET PRINTHEAD WITH HEATER ELEMENTS HAVING PARALLEL CURRENT PATHS - An inkjet printhead having an array of ink chambers is disclosed. Each ink chamber has a nozzle and a heater element for generating vapour bubbles to eject ink through the nozzle. The heater element has multiple current paths connected in parallel. Each current path has at least one portion with a reduced cross-section relative to the remainder of the current path. A cross bracing structure is also provided for connecting intermediate portions of the current paths. | 06-03-2010 |
20100149276 | NOZZLE CHAMBERS HAVING SUSPENDED HEATER ELEMENTS - An inkjet printhead is disclosed. The printhead includes a substrate, nozzle chambers formed on the substrate, and at least one heater element suspended in each nozzle chamber. | 06-17-2010 |
20100149277 | Ink Ejection Device With Circular Chamber And Concentric Heater Element - An ink drop ejection device with a bubble forming chamber for holding an ejectable liquid, a nozzle in fluid communication with the bubble forming chamber, and at least one heater element in the bubble forming chamber for thermal contact with the bubble forming liquid. Heating the heater element to a temperature above the boiling point of the bubble forming liquid forms a gas bubble to eject a drop of the ejectable liquid through the nozzle. The bubble forming chamber has a circular cross section and the heater element has arcuate sections that are concentric with the circular cross section. | 06-17-2010 |
20100149278 | Printhead Having Low Energy Heating Circuitry - A printhead is provided having a plurality of nozzles and heating circuitry for heating an ejectable liquid to cause ejection of the ejectable liquid from the nozzles. The heating circuitry is configured such that the energy required to be applied thereto to cause the ejection causes heating of the ejectable liquid of less than 40 degrees Celsius above ambient temperature. | 06-17-2010 |
20100149279 | INKJET NOZZLE ASSEMBLY HAVING HEATER ELEMENT BONDED TO CHAMBER WALL VIA DIELECTRIC LAYER - An inkjet nozzle assembly has a chamber with a nozzle opening for ejecting a liquid, a heater element disposed in the chamber, and a dielectric layer sandwiched between the heater element and a wall of the chamber. The dielectric layer has a thermal product of less than 1495 Jm | 06-17-2010 |
20100182380 | PRINTHEAD WITH LOW DRAG NOZZLES APERTURES - An inkjet printhead that has a nozzle layer defining an array of nozzle apertures, each nozzle aperture having an associated heater element positioned for heating the ejectable liquid above its boiling point to form a vapor bubble to eject a drop of the ejectable liquid through the nozzle aperture. The nozzle aperture is less than 5 microns thick in the drop ejection direction. | 07-22-2010 |
20100214365 | PRINTHEAD INTEGRATED CIRCUIT WITH CONTROLLED DROP MISDIRECTION - A printhead integrated circuit that has an array of ink chambers, each having a nozzle and an actuator for ejecting ink through the nozzle. The nozzle has a nozzle rim defining a nozzle aperture and a localized irregularity on the nozzle rim extending toward the centre of the nozzle aperture. | 08-26-2010 |
20100214366 | PRINTHEAD WITH DOUBLE OMEGA-SHAPED HEATER ELEMENTS - An ink jet printhead has a plurality of nozzles and a bubble forming chamber corresponding to each of the nozzles respectively. The bubble forming chambers are adapted to contain a bubble forming liquid and a heater element is disposed in each of the bubble forming chambers respectively. The heater elements are configured for thermal contact with the bubble forming liquid and, a pair of electrodes for each of the heater elements are positioned adjacent each other such that the heater element provides a single current path between the electrodes of each pair. Each of the heater elements has a double omega shape in which a smaller, inner omega shape is concentric with, and encircled by, a larger, outer omega shape. | 08-26-2010 |
20100225708 | MEMS Devices and Methods of Fabrication Thereof - MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature. | 09-09-2010 |
20100231653 | PRINTHEAD NOZZLES HAVING LOW MASS HEATER ELEMENTS - Provided is a printhead having a plurality of nozzles formed on a wafer substrate. Each nozzle has a fluid chamber for holding printing fluid, the fluid chamber having an ejection port, a fluid inlet defined in the wafer substrate for supplying the fluid chamber with printing fluid, and a heater element suspended in the fluid chamber. The heater element has a mass of less than 10 nanograms. Upon application of electrical energy to the heater element, a vapour bubble is formed in the printing fluid, thereby ejecting the fluid via the ejection port. | 09-16-2010 |
20100231654 | Ink Chamber with Droplet Step Anchor - Provided is an inkjet printhead having an array of ink chambers formed on a planar support surface of a wafer substrate. Each ink chamber in the array has a nozzle, a thermal actuator for ejecting ink through the nozzle and a droplet stem anchor. The thermal actuator has two sections with higher resistance than the remainder of the thermal actuator. The droplet stem anchor is positioned between the two sections with higher resistance of the thermal actuator. | 09-16-2010 |
20100245483 | UNIT CELL FOR THERMAL INKJET PRINTHEAD - A unit cell for a thermal inkjet printhead includes a substrate portion that defines an ink supply passage; drive circuitry and interconnect layers positioned on the substrate portion; a nozzle plate defining a nozzle; side walls depending from the nozzle plate and positioned on the substrate portion to define an ink chamber; and a heater element connected to the drive circuitry and positioned intermediate the nozzle plate and the substrate portion, the heater element being suspended in the ink chamber in alignment with the nozzle and being shaped to be symmetrical about two planes that intersect along an axis extending through a centre of the nozzle. The drive circuitry is partially on one side of the ink chamber with a remainder of the drive circuitry on an opposite side. | 09-30-2010 |
20100245484 | THERMAL INKJET PRINTHEAD HAVING ANNULUS SHAPED HEATER ELEMENTS - A thermal inkjet printhead has an array of nozzle arrangements provided for ejecting ink. Each nozzle arrangement includes a substrate assembly defining an ink inlet passage. A nozzle chamber structure extends from the substrate assembly to define a nozzle chamber in fluid communication with the ink inlet passage. The nozzle chamber structure defines an aperture through which ink in the nozzle chamber can be ejected. A pair of parallel heater elements extends from the nozzle chamber structure and into the nozzle chamber, and can be supplied with current so that ink in the nozzle chamber is ejected out through the aperture. Each heater element is shaped to define at least one broken annulus, in turn, comprising said at least one arcuate portion. | 09-30-2010 |
20100253748 | DROPLET GENERATOR - A droplet generator ( | 10-07-2010 |
20100271437 | MOVABLE INK EJECTION STRUCTURE WITH ENDLESS WALLS - A nozzle arrangement for an ink jet printhead. The nozzle arrangement includes a wafer substrate arrangement defining an ink inlet channel and a first wall surrounding the ink inlet channel; a movable ink ejection structure defining an ink ejection port and a second wall surrounding the first wall so that the wafer substrate arrangement and ink ejection structure together define a nozzle chamber in fluid communication with the ink inlet channel and the ink ejection port; and a plurality of thermal bend actuators movably coupling the ink ejection structure to the wafer substrate arrangement. Each actuator includes an arm for moving the ink ejection structure responsive to an applied electrical signal, whereby a volume of the nozzle chamber is varied. Each wall is endless. | 10-28-2010 |
20100271438 | LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME - The present invention provides, in order to hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion etc. without adversely affecting discharge performance, wherein a liquid discharge head includes, first sealing resin coated on a portion between the liquid supply port and the pad on the support surface so as to surround a tip end portion at the liquid supply port of the support member and second sealing resin for sealing a gap between the support member and the liquid discharge substrate, and a peripheral part of the liquid supply port. | 10-28-2010 |
20100271439 | PRINTHEAD INTEGRATED CIRCUIT WITH THERMALLY SENSING HEATER ELEMENTS - A printhead integrated circuit including a MEMS layer having a plurality of nozzle assemblies and a CMOS layer having control circuitry. Each nozzle assembly includes a heater element for ejecting ink and sensing a temperature of the nozzle assembly. The control circuitry modifies operation of the heater elements in response to a sensed temperature exceeding a predetermined threshold. | 10-28-2010 |
20100309261 | EJECTION NOZZLE ASSEMBLY - An ejection nozzle assembly is provided having a substrate defining a fluid supply passage, drive circuitry on the substrate, a chamber on the drive circuitry and in fluid communication with the fluid supply passage and an ejection port, an ejection member disposed between the fluid supply passage and the ejection port, and a heater element electrically coupled to the drive circuitry and the ejection member for causing ejection of fluid from the ejection port. | 12-09-2010 |
20110025785 | HEATING ELEMENT - Embodiments of a heating element of a fluid ejection device are disclosed. | 02-03-2011 |
20110050806 | CRACK-RESISTANT THERMAL BEND ACTUATOR - A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide. The second layer is sandwiched between the first layer and the active beam to provide thermal insulation for the first layer. | 03-03-2011 |
20110109700 | INK EJECTION MECHANISM WITH THERMAL ACTUATOR COIL - A micro-electromechanical ejection mechanism is disclosed for ejecting an ink droplet. The mechanism has a wafer substrate and an ink chamber formed on the wafer substrate. The ink chamber has an ink ejection nozzle formed in a roof thereof and an ink inlet port formed in a floor thereof. A paddle device is arranged inside the ink chamber between the inlet port and the ejection nozzle A bi-layer thermal actuator coil is also included with a first end thereof fast with the substrate and a second end connected to the paddle device. Heating of the thermal actuator coil displaces the paddle device, causing ejection of an ink droplet through the ink ejection nozzle. | 05-12-2011 |
20110122203 | THERMAL BEND ACTUATOR WITH CONDUCTION PAD AT BEND REGION - A thermal bend actuator includes: a first active cantilever beam for connection to drive circuitry, the first beam having a bent planar beam element; a second passive cantilever beam fused to the first beam; a conduction pad sandwiched between the first and second beams; and first and second adjacent electrode contacts positioned at one side of the actuator. A first end of the beam element is connected to the first contact and a second end of the beam element is connected to the second contact. The conduction pad is positioned at a bend region of the planar beam element so as to facilitate electrical conduction around the bend region | 05-26-2011 |
20110134193 | NOZZLE ARRANGEMENT WITH AN ACTUATOR HAVING IRIS VANES - A nozzle arrangement for an inkjet printhead includes a substrate defining an ink inlet; a plurality of posts extending from the substrate; a roof portion defining an ejection port, the roof portion supported by the plurality of posts; a plurality of vanes extending from the substrate and arranged to form a wall of a chamber around the ink inlet; and a plurality of thermal bend actuators respectively positioned at a base of each vane, each thermal bend actuator having a fixed end in the vicinity of one of the plurality of posts and a displaceable end opposite the fixed end. The plurality of thermal bend actuator are adapted to bend said vanes inwards with respect to the chamber in an iris-type manner to reduce a volume of the chamber, whereby ink is ejected from the chamber via the ejection port. | 06-09-2011 |
20110205303 | FLUID EJECTOR STRUCTURE - In one embodiment, a fluid ejector structure includes: a chamber; a bridge spanning at least part of the chamber; a channel through which fluid may enter the chamber; a fluid ejector element on the bridge; and an outlet through which fluid may be ejected from the chamber at the urging of the fluid ejector element. The outlet is disposed opposite the fluid ejector element across a depth of the chamber and the chamber, ejector element and outlet are configured with respect to one another such that substantially all of the fluid in the chamber is ejected through the outlet upon actuation of the ejector element. | 08-25-2011 |
20110205304 | Thermal Bend Actuator With Resistive Heating Bar - A thermal bend actuator including: a pair of electrical contacts positioned at one end of the actuator; an active beam connected to the electrical contacts and extending longitudinally away from the contacts, the active beam defining a bent current flow path between the contacts; and a passive beam fused to the active beam. When a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator. The active beam includes a resistive heating bar having a relatively smaller cross-sectional area than any other part of the current flow path. Heating of the active beam is concentrated in the heating bar. | 08-25-2011 |
20110234703 | LIQUID DISCHARGE HEAD - A liquid discharge head includes a substrate including a plurality of nozzle arrays formed by arranging nozzles having heat generating elements generating thermal energy for discharging a liquid, and a plurality of common liquid chambers formed along the plurality of nozzle arrays and supplies the liquid to the plurality of nozzle arrays, the substrate being divided into a plurality of substrate portions by the plurality of common liquid chambers. The substrate includes a first substrate portion having a first nozzle array among the plurality of nozzle arrays and a second substrate portion having a second nozzle array different from the first nozzle array and a thermal capacity larger than that of the first substrate portion, and a heating area of the first heat generating element provided in the first nozzle array is smaller than that of the second heat generating element provided in the second nozzle array. | 09-29-2011 |
20110292131 | FLUID EJECTION DEVICE - A fluid ejection device includes a chamber, and first and second electrodes configured to generate an electric field within the chamber. A related method includes, in a firing chamber, separating whole ink into colloidal particles and ink vehicle such that the firing fluid within the chamber comprises primarily ink vehicle. | 12-01-2011 |
20120019601 | MICRO-ELECTROMECHANICAL NOZZLE ARRANGEMENT WITH PYRAMIDAL INK CHAMBER FOR AN INKJET PRINTHEAD - This invention relates to a micro-electromechanical nozzle arrangement for an inkjet printhead. The arrangement includes a substrate defining an inverted pyramidal ink chamber with a vertex thereof terminating at an ink supply channel through the substrate. The substrate includes a layer of drive circuitry. The arrangement also includes a roof structure connected to the drive circuitry layer and covering the ink chamber, the roof structure defining a fluid ejection nozzle rim above said chamber. Also included is a plurality of actuators radially spaced about, and displaceable with respect to, the nozzle rim, each actuator having a serpentine heater element configured to thermally expand upon receiving current from the drive circuitry thereby moving said actuators into the chamber and operatively increasing a fluid pressure inside the chamber to eject a drop of ink via the ejection nozzle. | 01-26-2012 |
20120044300 | MICRO-ELECTROMECHANICAL NOZZLE ARRANGEMENT WITH DISPLACEABLE INK EJECTION PORT - A micro-electromechanical nozzle arrangement that has a substrate defining an ink inlet channel, an ink chamber having an active roof structure defining an ink ejection port, drive circuitry between the substrate and the ink chamber, a pair of thermal actuators connected to the drive circuitry and connected to the active roof structure for displacement of the ink ejection port towards the substrate, and a pair of coupling structures for respectively coupling the thermal actuators to the active roof structure. The pair of coupling structures are each configured to convert arcuate displacement at a connection to the thermal actuator into linear displacement at a connection to the active roof structure. | 02-23-2012 |
20120062656 | THERMAL BEND ACTUATOR HAVING BILAYERED PASSIVE BEAM - A thermal bend actuator includes: an active beam for connection to drive circuitry; and a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator. The passive beam has first and second layers with the second layer sandwiched between the first layer and the active beam. The first layer is thicker than the second layer. | 03-15-2012 |
20120086756 | NOZZLE ARRANGEMENT WITH AN ACTUATOR HAVING IRIS VANES - A nozzle arrangement for an inkjet printhead includes a substrate; a plurality of posts extending from the substrate; a roof portion defining an ejection port, the roof portion supported by the plurality of posts; a plurality of vanes extending from the substrate and arranged to define a chamber with the substrate and the roof portion; and a plurality of thermal bend actuators respectively positioned at a base of each vane, each thermal bend actuator including a rigid arm and an expandable arm attached to an end of the rigid arm. Each expandable arm contains therewithin a heater element. The plurality of thermal bend actuator are adapted to bend the vanes inwards with respect to the chamber in response to an electrical signal applied to each heater element, the plurality of thermal bend actuators bending the vanes in an iris-type manner to reduce a volume of the chamber. | 04-12-2012 |
20120092421 | Printhead For Generating Ink Drops With Reduced Tails - A printhead ( | 04-19-2012 |
20120105552 | INKJET NOZZLE ASSEMBLY HAVING DISPLACEABLE ROOF DEFINING EJECTION PORT - An inkjet nozzle assembly includes: a nozzle chamber having a floor and a roof spaced apart from the floor, the roof having a displaceable portion defining an ejection port; and an actuator for displacing the displaceable portion of the roof towards the floor. Displacement of the displaceable portion of the roof alters a volume of the nozzle chamber such that when the volume is altered, fluid is ejected from the ejection port. | 05-03-2012 |
20120133710 | Heater Chips with Silicon Die Bonded on Silicon Substrate, Including Offset Wire Bonding - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die. | 05-31-2012 |
20120147096 | INKJET HEAD - An inkjet head includes: an ink ejecting section including an ink chamber to which ink is supplied, a driving element provided in the ink chamber, a nozzle opened to the ink chamber, and a wire connected to the driving element, the ink ejecting section being configured to eject the ink in the ink chamber from the nozzle using the driving element; an ink passage section attached to the ink ejecting section and including a supply passage, which is connected to the ink chamber and through which the ink supplied to the ink chamber passes, and a discharge passage, which is connected to the ink chamber and through which the ink discharged from the ink chamber passes; and an IC electrically connected to the driving element via the wire and thermally connected to the ink passage section. | 06-14-2012 |
20120194618 | INK JET RECORDING HEAD AND METHOD OF PRODUCING THE SAME - Provided is an ink jet recording head, including: an ink ejection portion, in which heat is applied to ink supplied inside thereof, thereby providing the ink with a pressure for ejecting the ink outside; a substrate having a first surface on which the ink ejection portion is provided and a second surface on an opposite side to the first surface, the second surface having at least one recess; and a heat radiation member for releasing heat outside, the heat being transmitted from the ink ejection portion to the substrate, the heat radiation member having a protrusion with a shape corresponding to a shape of the recess, the protrusion being embedded in the recess so that the protrusion is provided in direct contact with the recess. | 08-02-2012 |
20120200640 | LOW-PROFILE MEMS THERMAL PRINTHEAD DIE HAVING BACKSIDE ELECTRICAL CONNECTIONS - A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug. | 08-09-2012 |
20130033548 | Print Head - Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors. | 02-07-2013 |
20130083130 | PLANAR HEATER STRUCTURES FOR EJECTION DEVICES - Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures. | 04-04-2013 |
20130162724 | PROTECTING A FLUID EJECTION DEVICE RESISTOR - In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate. | 06-27-2013 |
20130208052 | INKJET PRINTHEAD HAVING SUSPENDED HEATER ELEMENT AND INK INLET LATERALLY OFFSET FROM NOZZLE APERTURE - An inkjet printhead includes a plurality of nozzle chambers disposed on a substrate. Each nozzle chamber includes: a floor having an ink inlet defined therein; a roof having a nozzle aperture defined therein; sidewalls extending between the floor and the roof; and a heater element suspended in the nozzle chamber, the heater element being connected to corresponding electrodes so as to heat fluid within the nozzle chamber thereby forming a gas bubble in the fluid which causes ejection of fluid through the nozzle aperture. The ink inlet is laterally offset from the nozzle aperture and a plane of the heater is parallel with a plane of the roof. | 08-15-2013 |
20130208053 | LIQUID DISCHARGING RECORDING HEAD - A liquid discharging recording head includes an element substrate including a plurality of discharge ports configured to discharge liquid and a plurality of energy generating elements configured to generate energy for discharging the liquid, a support member configured to support the element substrate, a first member configured to support an end of the element substrate in an array direction in which the discharge ports are arrayed, the first member having a thermal conductivity lower than a thermal conductivity of the support member, and a second member configured to support an end of the element substrate in an intersecting direction intersecting the array direction, the second member having a thermal conductivity lower than the thermal conductivity of the support member and a thermal resistance lower than a thermal resistance of the first member. | 08-15-2013 |
20130250004 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE, INCLUDING OFFSET WIRE BONDING - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die. | 09-26-2013 |
20130293638 | Fluid Ejection Device Having Firing Chamber With Mesa - A fluid ejection device includes a firing chamber having an ejection orifice opposite a chamber floor, a heating element and a mesa projecting from the chamber floor, the mesa is spaced from the heating element to define a passive zone between the mesa and heating element. | 11-07-2013 |
20130314473 | THICK FILM PRINT HEAD STRUCTURE AND CONTROL CIRCUIT - A thick-film thermal printhead (FIG. | 11-28-2013 |
20130314474 | SUBSTRATE FOR LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE HEAD - The reduction in reliably of a liquid discharge head due to the dissolution of a protective layer is suppressed. A substrate for a liquid discharge head includes a base substrate, a heat-generating resistive layer placed on the base substrate, a pair of lines placed on the base substrate, and a protective layer covering the heat-generating resistive layer and the lines. The protective layer contains a material represented by the formula Si | 11-28-2013 |
20140022313 | LIQUID DISPENSER INCLUDING ASYMMETRIC NOZZLE ACTUATOR CONFIGURATION - A liquid dispenser includes first and second liquid chambers. The first chamber includes a nozzle having a center axis. The second chamber is in fluid communication with liquid supply and return channels. A flexible membrane separates and fluidically seals the first and second chamber. A heater, associated with the second chamber, includes a center point and is selectively actuated to create a pressure pulse in a liquid that causes the flexible membrane to move from a first position to a second position to eject liquid through the nozzle of the first chamber. The center point of the heater is located off of the center axis of the nozzle. In one embodiment, a liquid supply provides a liquid that flows continuously from the supply through the liquid supply channel through the second chamber through the liquid return channel and back to the supply during a drop dispensing operation. | 01-23-2014 |
20140028758 | LIQUID EJECTION HEAD - A liquid ejection head includes a plurality of recording element substrates that each include an energy generating element generating energy utilized for ejecting a liquid and that each have a supply port through which the liquid is supplied to the energy generating element, a plurality of support members that each have a flow passage communicating with a corresponding one of the supply ports and that each support a corresponding one of the plurality of recording element substrates, a base substrate that supports the plurality of support members, and a heat insulating member disposed between the flow passages and the base substrate. In the liquid ejection head, a thermal conductivity of the support members is equal to or greater than a thermal conductivity of the recording element substrates, and a thermal conductivity of the heat insulating member is less than a thermal conductivity of the base substrate. | 01-30-2014 |
20140036003 | EJECTOR WITH IMPROVED JETTING LATENCY FOR MOLECULAR WEIGHT POLYMERS - A liquid ejection system includes a liquid ejector having a structure defining a chamber, the chamber including a first surface and a second surface, the first surface including a nozzle orifice; a resistive heater located on the second surface of the chamber opposite the nozzle orifice; a first liquid feed channel and a second liquid feed channel being in fluid communication with the chamber; and a segmented liquid inlet, a first segment of the liquid inlet being in fluid communication with the first liquid feed channel, and a second segment of the liquid inlet being in fluid communication with the second liquid feed channel; and a liquid supply comprising a liquid including a polymer at a loading of at least 2 percent by weight, wherein the polymer has a molecular weight of at least 20,000, and wherein the liquid supply is fluidically connected to the segmented liquid inlet. | 02-06-2014 |
20140184702 | SUBSTRATE FOR INKJET PRINT HEAD, INKJET PRINT HEAD, METHOD FOR MANUFACTURING INKJET PRINT HEAD, AND INKJET PRINTING APPARATUS - A substrate for an inkjet print head comprises: a base; a plurality of heating resistors for heating ink, the heating resistors being disposed on the base and producing heat in a case where the heating resistors are energized; a first protection layer disposed on the heating resistors and having insulation properties; and a second protection layer disposed on the first protection layer and having conductivity. The second protection layer includes individual sections disposed to individually cover the plurality of heating resistors, a common section connecting the individual sections, and connection sections interposed between the individual sections and the common section and connecting the individual sections and the common section. The connection sections are disposed at positions to be in contact with ink, and include a material which changes to an insulating film by an electrochemical reaction with the ink. | 07-03-2014 |
20150070440 | THERMO-PNEUMATIC ACTUATOR FABRICATED USING SILICON-ON-INSULATOR (SOI) - An ink jet printhead including a thermo-pneumatic actuator array for ejecting ink from an array of nozzles. The actuator array may include the use of a silicon-on-insulator (SOI) semiconductor wafer including a device layer, a handle layer, and a dielectric layer that physically separates the device layer from the handle layer to simplify printhead formation. During an exemplary process, the SOI wafer is attached to a heater wafer and a nozzle plate is attached to the dielectric layer such that, during use of the printhead, the device layer functions as an actuator membrane. Deflection of the device layer during use of the printhead creates a pressure within an ink chamber which causes ejection of ink from one of the nozzles of the array of nozzles. | 03-12-2015 |
20150290935 | RECORDING-ELEMENT SUBSTRATE AND LIQUID EJECTION APPARATUS - A recording-element substrate includes an ejection port configured to eject liquid; a heating resistance element configured to generate thermal energy for ejecting the liquid from the ejection port; and a drive circuit configured to drive the heating resistance element. The heating resistance element includes a heating resistor layer and three pairs of electrodes provided for the heating resistor layer. The drive circuit forms a heating area that generates thermal energy in the heating resistor layer by selectively using two or more of the electrodes. | 10-15-2015 |
20150298457 | PRINTHEAD SUBSTRATE AND PRINTING APPARATUS - A printhead substrate, comprising an electrothermal transducer configured to heat a printing material, a first DMOS transistor configured to drive the electrothermal transducer, a MOS structure forming an anti-fuse element, a second DMOS transistor configured to write information in the anti-fuse element by causing an insulation breakdown of an insulating film of the MOS structure, and a driving unit consisted of at least one MOS transistor and configured to drive the second DMOS transistor. | 10-22-2015 |
20150367641 | MICROFLUIDIC DIE WITH MULTIPLE HEATERS IN A CHAMBER - The present disclosure is directed to a microfluidic die that includes a first larger heater and a second smaller heater is a single chamber. The first heater is configured to form a primary bubble that ejects fluid from a nozzle associated with the chamber. The second heater is configured to form a secondary bubble to prevent blow back caused when the primary bubble bursts and ejects fluid from the nozzle. The first and second heater may be coupled to a single input trace and a single ground trace. | 12-24-2015 |
20160009088 | INK JET RECORDING HEAD SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND INK JET RECORDING HEAD | 01-14-2016 |
20160114580 | FLUID EJECTION DEVICE - A fluid ejection device is described. In an example, a device includes a substrate having a chamber formed thereon to contain a fluid. A metal layer includes a resistor under the chamber having a surface thermally coupled to the chamber. At least one layer is deposited on the metal layer. A polysilicon layer is under the metal layer comprising a polysilicon structure under the resistor to change topography of the resistor such that the surface is uneven. | 04-28-2016 |
20160152027 | LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME | 06-02-2016 |
20160200102 | AGITATING MEMBER FOR INK CARTRIDGE | 07-14-2016 |
20220134749 | WAFER STRUCTURE - A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes plural ink-drop generators produced by the semiconductor process and formed on the chip substrate. The ink-drop generators are arranged in a longitudinal direction to form plural longitudinal axis array groups having a pitch maintained between two adjacent ink-drop generators in the longitudinal direction, and arranged in a horizontal direction to form plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches maintained between two adjacent ink-drop generators in the horizontal direction. | 05-05-2022 |