Entries |
Document | Title | Date |
20080205002 | Composite board for heat dissipation and forming methodology - A composite board for heat dissipation, comprises two or three or more flat boards connected together through welding/bonding. There are multiple pipes formed between the flat boards for the heat dissipation liquid passing through. The heat dissipation liquid is controlled by a water pump. The electronic elements that generate heat contact the composite board directly or indirectly. A circuit is formed on at least one of the surfaces of the composite board, and the electronic elements are welded to the circuit. Thus, the heat in the case and the circuit board used in a computer, especially a notebook computer, may be dissipated more efficiently, available spaces may be increased, and the heat dissipation of airflow may be facilitated. | 08-28-2008 |
20080218970 | Thermal Management for a Ruggedized Electronics Enclosure - The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events. | 09-11-2008 |
20080225482 | SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE - A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through. | 09-18-2008 |
20080225483 | FRAME MOUNTED MODULAR HYBRID COOLING SYSTEM - A modular cooling system ( | 09-18-2008 |
20080225484 | THERMAL PILLOW - Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap. | 09-18-2008 |
20080225485 | Distributed transmit/receive integrated microwave module chip level cooling system - A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit. | 09-18-2008 |
20080225486 | HEAT-DISSIPATING DEVICE CONNECTED IN SERIES TO WATER-COOLING CIRCULATION SYSTEM - A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system. | 09-18-2008 |
20080225487 | Power Inverter - The power inverter includes: a case made of a metal; a first power module provided in the case and including a DC terminal and an AC terminal; a second power module provided in the case and including a DC terminal and an AC terminal; and a cooling formation body for decreasing heat generated from the first and second power modules. The first and second power modules are disposed in a manner such that the DC terminals face each other. | 09-18-2008 |
20080239671 | Semiconductor Element Mounting Substrate, Semiconductor Module, And Electric Vehicle - A semiconductor element mounting substrate excellent in cooling performance and simple in structure is provided. The semiconductor element mounting substrate is a substrate | 10-02-2008 |
20080259566 | EFFICIENTLY COOL DATA CENTERS AND ELECTRONIC ENCLOSURES USING LOOP HEAT PIPES - Disclosed in the present invention are ways for cooling components contained in enclosures that reject 500 or more Watts employing two phase passive heat transfer devices including Loop Heat Pipes and devices we refer to as LHPLs. The methods minimize the amount of energy employed in cooing while at the same time maximizing the quality of heat rejected to the secondary cooling loops that transmit the heat to the outside world. Where data centers provide direct access to chilled water it becomes possible to reject heat directly to cooling towers in locations as hot and humid as Atlanta Ga. eliminating 40% or more of the total energy consumed. The key advances that make this energy efficient performance employ LHPLs that have the smallest possible total thermal resistance, methods that maximize their effectiveness and ancillary devices that minimize the energy consumed in move cooling air. | 10-23-2008 |
20080259567 | CONDUCTIVE HEAT TRANSPORT COOLING SYSTEM AND METHOD FOR A MULTI-COMPONENT ELECTRONICS SYSTEM - A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough. | 10-23-2008 |
20080266798 | SYSTEM AND METHOD FOR LIQUID COOLING OF AN ELECTRONIC SYSTEM - A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion. | 10-30-2008 |
20080266799 | Methods and Apparatuses for Cold Plate Stability - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module. | 10-30-2008 |
20080273307 | LIQUID-BASED COOLING SYSTEM FOR COOLING A MULTI-COMPONENT ELECTRONICS SYSTEM - A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components. | 11-06-2008 |
20080278913 | COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED - A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled. | 11-13-2008 |
20080291628 | Semiconductor module and inverter device - A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction. | 11-27-2008 |
20080298017 | COUNTERFLOW MICROCHANNEL COOLER FOR INTEGRATED CIRCUITS - A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communicating with a second group of channels, the first group of channels and the first pair of plena isolated from the second group of channels and the second pair of plena. Each of the pairs of manifolds includes multiple branches coupled to the channels and a common plenum. Cooling fluid is injected into the channels from different sides of the base, causing fluid to flow in different directions in the two groups of channels, the channels in thermal contact with the integrated circuit. | 12-04-2008 |
20080298018 | HEAT SINK AND LASER DIODE - The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates. | 12-04-2008 |
20080304236 | Maintaining cooling system air above condensation point - A cooling system cools air that flows through an electronic system to cool heat generating components. The cooling system maintains a temperature of the air near a set point above a condensation point. | 12-11-2008 |
20080310110 | SYSTEM AND METHOD FOR MOUNTING A COOLING DEVICE AND METHOD OF FABRICATION - A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate. | 12-18-2008 |
20090009968 | Cooling device and electronic apparatus - According to one embodiment, a cooling device has a base substance formed in a plate form and having in its inside a channel through which a refrigerant circulates, and a flow mechanism that generates a stream of the refrigerant along the channel. The base substance has a first heat receiving part, a second heat receiving part and a heat radiating part. The first heat receiving part has in its inside a first heat receiving section thermally connected to the first heat generator. The second heat receiving part has in its inside a second heat receiving section thermally connected to the second heat generator. The heat radiating part has in its inside a heat radiating section located downstream of the first heat receiving section and the second heat receiving section. | 01-08-2009 |
20090027856 | BLADE COOLING SYSTEM USING WET AND DRY HEAT SINKS - An enclosure is disclosed. The enclosure comprises a chassis having a plurality of slots configured to hold a plurality of blades. At least one wet heat sink is positioned adjacent to each of the plurality of slots. An input piping system is coupled to the wet heat sinks and configured to supply cooling fluid to each of the wet heat sinks. An exhaust piping system is also coupled to the wet heat sinks and configured to remove the cooling fluid from the wet heat sinks. At least one blade is installed into one of the slots. The blade has at least one dry heat sink attached to the blade. The at least one dry heat sink is in thermal contact with the at least one wet heat sink positioned adjacent to the first slot. | 01-29-2009 |
20090040723 | HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY - A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing. | 02-12-2009 |
20090040724 | POWER INVERTER - In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module. | 02-12-2009 |
20090052134 | LIQUID-COOLED GROUNDED HEATSINK FOR DIODE RECTIFIER SYSTEM - A diode rectifier system for generator excitation includes a plurality of diode modules mounted on a heatsink and a coolant tube provided in the heatsink. The heatsink is electrically grounded. A method of cooling a diode rectifier system for generator excitation comprises providing a flow of liquid coolant in the coolant tube and electrically grounding the heatsink. | 02-26-2009 |
20090052135 | ELECTRONIC APPARATUS - A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased. | 02-26-2009 |
20090080158 | Comb-shaped power bus bar assembly structure having integrated capacitors - A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer includes a novel stack of semiconductor substrate assemblies. Some semiconductor substrate assemblies involve field programmable gate array (FPGA) dice that are directly surface mounted, as bare die, to a semiconductor substrate. Other semiconductor substrate assemblies of the stack involve bare memory integrated circuit dice that are directly surface mounted to a semiconductor substrate. Elastomeric connectors interconnect adjacent semiconductor substrates proceeding down the stack. Tines of novel comb-shaped power bus bar assembly structures extend into the stack to supply DC supply voltages. The supply voltages are supplied from bus bars, through vias in the semiconductor substrates, and to the integrated circuits on the other side of the substrates. The power bus bars also serve as capacitors and guides for liquid coolant. | 03-26-2009 |
20090109622 | THERMAL CONTROL SYSTEM FOR RACK MOUNTING - A thermal control system of a 3U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces. | 04-30-2009 |
20090129021 | GAS STATION TELEVISION - Preferred embodiments relates to a cooling system and a method for cooling an electronic display. Embodiments include a transparent liquid cooling chamber, a reservoir tank, and a pump. The components in the system are preferably housed within the electronic display housing. The cooling chamber defines a fluid compartment that is anterior to and coextensive with the electronic display surface. Circulating coolant removes heat directly from the electronic display surface by advection. In order to view the display, the coolant fluid is transparent or at least semi-transparent. The image quality of an exemplary embodiment remains essentially unchanged, even though coolant is flowing over the visible face of the electronic display surface. | 05-21-2009 |
20090141451 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus including an insulation substrate, a heat sink, and a stress reduction member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. The heat sink is thermally coupled to the second surface of the insulation substrate. The heat sink, which includes an upper case and a lower case, serves as a liquid cooling device including a cooling passage. The stress reduction member is arranged between the insulation substrate and the upper case. The stress reduction member includes stress absorption hollows. The upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case. The first portion has a thickness that is less than that of the second portion. | 06-04-2009 |
20090147479 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of the insulation substrate. A heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other. The stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink of the heat mass member. The heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters. | 06-11-2009 |
20090154101 | LIQUID-COOLED INVERTER ASSEMBLY - An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a direct current (DC) path. A plurality of inverter switches is mounted on the substrate and electrically coupled to the AC path and the DC path. | 06-18-2009 |
20090190310 | HEAT MANAGEMENT IN AN ELECTRONIC MODULE - In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating component. The housing includes a first case and a second case attached to the first case. The first and second cases cooperatively define a sealed cavity containing a fluid. The second case includes a thermal contact structure positioned proximate to the heat-generating component. | 07-30-2009 |
20090201643 | INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES - Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. | 08-13-2009 |
20090201644 | SYSTEMS AND ASSOCIATED METHODS FOR COOLING COMPUTER COMPONENTS - Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer. | 08-13-2009 |
20090207568 | METHOD AND APPARATUS FOR COOLING IN MINIATURIZED ELECTRONICS - A method and apparatus for cooling in miniaturized electronics are provided including in an electronic circuit board. The electronic circuit includes a substrate and at least one integrated channel within the substrate configured to allow fluid flow therethrough. | 08-20-2009 |
20090219692 | Rack for housing a liquid-cooled electric unit - The present invention provides a rack suitable for housing a liquid-cooled electric unit. A rack | 09-03-2009 |
20090219693 | Cooling system for high voltage systems - A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to be dissipated. The cooling system can include a cooling mechanism for dissipating the heat. The cooling mechanism can include a liquid conduit thermally coupled to the electrical component. The liquid conduit can contain a cooling solution comprising an alcohol having the formula R-OH, wherein R is a hydrocarbon having the formula C | 09-03-2009 |
20090219694 | Power Electronics Assembly - The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element. | 09-03-2009 |
20090231810 | DIRECT DIPPING COOLED POWER MODULE AND PACKAGING - A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I/O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability. | 09-17-2009 |
20090231811 | Electric Power Conversion Apparatus - An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel. | 09-17-2009 |
20090231812 | DIRECT COOLED POWER ELECTRONICS SUBSTRATE - The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor. | 09-17-2009 |
20090237883 | BOARD UNIT AND ELECTRONIC APPARATUS - A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is superimposed on an outer surface of the first heat transfer plate and that insulates heat dissipation, a second heat transfer plate that continues to the first heat transfer plate and that defines a heat conducting surface and a heat receiver that is received by the heat conducting surface of the second heat transfer plate and that defines a flow path of a coolant. | 09-24-2009 |
20090237884 | Electromagnetically-actuated micropump for liquid metal alloy - The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe. | 09-24-2009 |
20090251862 | SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE - A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the silicon carrier to the chip; liquid microchannels for cooling; a liquid coolant flowing through the microchannels; and an interconnect to one or more chips or chip stacks. | 10-08-2009 |
20090279257 | SYSTEM AND METHOD FOR A SUBSTRATE WITH INTERNAL PUMPED LIQUID METAL FOR THERMAL SPREADING AND COOLING - A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. | 11-12-2009 |
20090279258 | HINGE CONNECTOR WITH LIQUID COOLANT PATH - A hinge for moving two parts of an electronic apparatus relative to each other is disclosed. The hinge includes two coolant flow paths helically arranged between inlet and outlet connections as portions of the hinge are rotated relative to each other. Guide plates within the hinge independently rotate to suitably position the conduits of the coolant flow paths in a position of minimum twisting and stretching. The hinge can be incorporated into any electronic apparatus, for example a portable computer. | 11-12-2009 |
20090279259 | System and method for proportional cooling with liquid metal - A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board. | 11-12-2009 |
20090284921 | Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements - Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions. | 11-19-2009 |
20090284922 | HIGH-POWER THYRISTOR MODULE HAVING COOLING EFFECT - A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting frame. Each thyristor has a gate. The mounting frame includes a dielectric top plate disposed on a top side of the housing, and a plurality of electrodes mounted on the top plate so that the electrodes are exposed outwardly of the housing, and coupled respectively to the gates of the thyristors. Cooling oil is contained in the inner receiving space so that the thyristors are submerged thereby. | 11-19-2009 |
20090316359 | HEAT-TRANSFER MECHANISM INCLUDING A LIQUID-METAL THERMAL COUPLING - Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator. | 12-24-2009 |
20090316360 | COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled. | 12-24-2009 |
20090316361 | Method and apparatus for controlling the output of solar arrays - A method to control the temperature of a circulating fluid and thereby control the electrical output of a PV array is provided along with an apparatus for doing so which adds simple mechanical, data measurement and control elements to prior art systems. Given a set amount of sunlight, electrical output from a solar PV array will change if the temperature of the array changes. One can change the temperature of a PV array by circulating a fluid through a loop in thermal contact with the array. Controlling the temperature of this circulating fluid, allows one to control the electrical output from the array. | 12-24-2009 |
20100002392 | Assembled Heat Sink Structure - The present invention provides an assembled heat sink structure including a base, a plurality of heat dissipating fins mounted on the top of the base, and a capillary device located inside the base, wherein the base is formed and assembled by an upper cover with a lower cover and the mountain-shaped fin-like device for diversion or capillary is located inside the base, so that after a plurality of heat dissipating fins are assembled on the top of the base, they can be welded to form an integration. Then, a heat dissipating medium can be poured into the airtight chamber of the base, and thus, when the base is contacted with the contact surface, the heat can be absorbed by an absorbing end of the base, transmitted to a plurality of heat dissipating fins on the top of the base and then exhausted by a fan, thereby achieving heat dissipating effect. | 01-07-2010 |
20100002393 | LIQUID COOLING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM - Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem. | 01-07-2010 |
20100033932 | ELECTRONIC BOARD AND COLD PLATE FOR SAID BOARD - The invention relates to an electronic board that comprises a planar projection plate ( | 02-11-2010 |
20100039773 | Narrow Gap Spray Cooling in a Globally Cooled Enclosure - Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed. | 02-18-2010 |
20100046167 | COOLING AN INTEGRATED CIRCUIT DIE WITH COOLANT FLOW IN A MICROCHANNEL AND A THIN FILM THERMOELECTRIC COOLING DEVICE IN THE MICROCHANNEL - An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel. | 02-25-2010 |
20100061061 | POWER SOURCE APPARATUS - A power source apparatus includes a power source module which is formed of a plurality of power source elements, a case which houses the power source module and a cooling liquid, a fan which is placed in the case in a state in which the fan is immersed in the cooling liquid together with the power source module, the fan forming a laminar flow of the cooling liquid, the laminar flow having a width at least substantially the same as a length of the power source element in a length direction of the power source element. | 03-11-2010 |
20100085712 | Liquid Cooling System - A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs. | 04-08-2010 |
20100097765 | Power Conversion Apparatus and Power Module - Disclosed are a power conversion apparatus and a power module that can be downsized. Four corners of a power module are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus. Thereafter, a top and a bottom of the housing are reversed, and nuts are screwed with bolts projecting from the rear face of the cooling jacket to fasten the power module. That is, on the top surface of the cooling jacket facing the bolts are arranged an AC terminal of the power module, a DC positive electrode terminal connection portion, and a DC negative electrode terminal. Accordingly, the power module can be downsized. | 04-22-2010 |
20100103618 | APPARATUS AND METHOD FOR FACILITATING PUMPED IMMERSION-COOLING OF AN ELECTRONIC SUBSYSTEM - Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled. | 04-29-2010 |
20100142147 | Electronic Device and Heat Dissipating Module Thereof - An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors. | 06-10-2010 |
20100142148 | Liquid cooling unit and electronic apparatus - A liquid cooling unit includes a pump body. A nipple is formed in the pump body. The nipple defines an outflow passage for coolant. An elastic tube has the tip end receiving insertion of the nipple so that the elastic tube is coupled to the nipple. A fixation member defines a groove supporting the nipple inside the elastic tube over a first predetermined length from the tip end of the nipple. The groove receives the elastic tube alone ahead of the tip end of the nipple over a second predetermined length from the tip end of the nipple. | 06-10-2010 |
20100165574 | IMAGE DISPLAY APPARATUS - An image display apparatus of the present invention includes: a display device for displaying an image; a heat-receiving tube that is disposed so as to be in thermal communication with the display device and is filled with a cooling liquid; a heat-radiating tube that is provided to be continuous with the heat-receiving tube and is filled with the cooling liquid; and a transporting pump allowing the cooling liquid to circulate through the heat-receiving tube and the heat-radiating tube. When viewed from a display surface side of the display device, at least a part of the heat-radiating tube is located outside a peripheral edge of the display device and is disposed along the peripheral edge. | 07-01-2010 |
20100172099 | Metal Clad Fiber Optics for Enhanced Heat Dissipation - An integrated optical I/O and semiconductor chip with a direct liquid jet impingement cooling assembly are disclosed. Contrary to other solutions for packaging an optical I/O with a semiconductor die, this assembly makes use of a metal clad fiber, e.g. copper, which will actually enhance cooling performance rather than create a design restriction that has the potential to limit cooling capability. | 07-08-2010 |
20100208427 | SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE - A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink. | 08-19-2010 |
20100226093 | METHODS FOR MAKING MILLICHANNEL SUBSTRATE, AND COOLING DEVICE AND APPARATUS USING THE SUBSTRATE - A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented. | 09-09-2010 |
20100226094 | GRAVITY ASSISTED DIRECTED LIQUID COOLING - Dielectric liquid is used to cool heat generating electronic components disposed on a circuit board within a case. The liquid is poured or otherwise directed over the electronic components, with gravity assisting the liquid in flowing downward over the components, with the liquid thereafter being collected in a sump for eventual return back to the electronic components. One exemplary application of the described concepts is in cooling electronic components in computers, for example personal computers or server computers. | 09-09-2010 |
20100232110 | COOLING APPARATUS AND POWER CONVERTER - A cooling apparatus with high strength and good heat radiation characteristics. In the cooling apparatus, a heat exchanger is joined to an evaporator disposed on the lower side in a face to face manner; a containing unit of the heat exchanger includes a heat exchanger high temperature liquid outlet, and a two-phase fluid inlet in a joint portion with the evaporator; an outlet header of the heat exchanger includes an intermediate liquid outlet at a joint portion with the evaporator; and the evaporator includes a two-phase fluid outlet in the joint portion with the heat exchanger in opposition to the two-phase fluid inlet of the containing unit, and including an intermediate liquid inlet at the joint portion with the heat exchanger in opposition to the intermediate liquid outlet of the outlet header. | 09-16-2010 |
20100232111 | Power Converter - A power converter assembly includes a housing and at least one transistor module. The housing has a liquid cooled heat transfer surface. The at least one transistor module is mounted directly to the liquid cooled heat transfer surface and positioned at least partially within the housing. | 09-16-2010 |
20100238629 | COOLING STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND INVERTER - A cooling structure of a power semiconductor device includes a cooling water passage and a plurality of fins. The cooling water for cooling the power semiconductor device flows through the cooling water passage. The plurality of fins are provided on a path of the cooling water passage and set up with a spacing therebetween in a direction orthogonal to a flow direction of the cooling water. The plurality of fins promote heat exchange between the power semiconductor device and the cooling water. The plurality of fins have ends facing the upstream side of a cooling water flow. The end of at least one fin among the plurality of fins is arranged so as to be displaced to a more upstream side of the cooling water flow than the ends of the fins adjacent to both sides of the at least one fin. By such a configuration, there is provided a cooling structure of a power semiconductor device and an inverter with excellent cooling efficiency. | 09-23-2010 |
20100254087 | Electric module - The electric module includes a sealed enclosure ( | 10-07-2010 |
20100271779 | WATER JACKET FOR COOLING AN ELECTRONIC DEVICE ON A BOARD - A water jacket includes a channel which accommodates MCM and through which a coolant runs, and the channel has a throttle part of which a flow passage sectional area is smaller than other parts and which is at the upstream of the MCM. | 10-28-2010 |
20100277867 | Thermal Dissipation Mechanism for an Antenna - According to one embodiment, a heat dissipation system includes an elongated radar absorbing member configured with a thermal dissipation mechanism. The radar absorbing member extends proximate a junction of a microwave antenna enclosure that houses an antenna and a radome that covers an opening in the microwave antenna enclosure. The radar absorbing member absorbs electro-magnetic energy incident upon the junction. The thermal dissipation mechanism absorbs heat generated by the absorbed electro-magnetic energy. | 11-04-2010 |
20100290188 | INTEGRATED CIRCUIT STACK - The invention relates to an integrated circuit stack ( | 11-18-2010 |
20100296247 | Water-cooling type cooler and inverter having the same - A water-cooling type cooler and an inverter employing the same are disclosed. A guide pin for distributing cooling water is formed in the middle of a cooling water flow path having a bent face, to make a flow rate of cooling water at the bent portion of the cooling water flow path uniform to thus improve cooling performance of the water-cooling type cooler. In addition, because the cooling performance of the water-cooling type cooler is improved without extending the cooling pin, an increase in the weight of the water-cooling type cooler can be reduced and a fabrication cost of the water-cooling type cooler can be reduced. | 11-25-2010 |
20100296248 | DUAL-CHAMBER FLUID PUMP FOR A MULTI-FLUID ELECTRONICS COOLING SYSTEM AND METHOD - A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber. | 11-25-2010 |
20100302733 | STACKED BUSBAR ASSEMBLY WITH INTEGRATED COOLING - A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough. | 12-02-2010 |
20100315779 | WATER-COOLED COMMUNICATION CHASSIS - A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid. | 12-16-2010 |
20100315780 | ELECTRIC VEHICLE AND METHOD OF COOLING VEHICULAR DC/DC CONVERTER - The present invention relates to an electric vehicle and a method of cooling a vehicular DC/DC converter. A fuel cell vehicle, as one example of an electric vehicle, includes a DC/DC converter connected between an electricity storage device and a fuel cell, for converting a voltage generated by the electricity storage device and applying the converted voltage to a motor, and converting a regenerated voltage produced by the motor in a regenerative mode or a voltage generated by the fuel cell and applying the converted voltage to the electricity storage device, and a cooling apparatus for cooling the DC/DC converter. The cooling apparatus includes a cooling fluid passage therein for a cooling fluid that flows therethrough, the cooling fluid passage including a bend. The cooling apparatus constructed such that the cooling fluid flowing upstream of the bend cools upper arm devices, while the cooling fluid flowing downstream of the bend cools lower arm devices. | 12-16-2010 |
20100328888 | COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN - A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material. | 12-30-2010 |
20110013363 | Housing Used As Heat Collector - A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components. | 01-20-2011 |
20110026225 | Method and Apparatus for Liquid Cooling Computer Equipment - A cooling system for cooling computer component with a liquid provided at atmospheric pressure, or low pressure, that flows through channel defined in the computer component. The liquid is pumped from a reservoir to a discharge port, or weir, that is located above the computer component. The liquid flows through an in-feed manifold to diverters that direct the liquid into in-feed tanks located above a row of the computer component. The liquid flows through the channels and flow control orifices to a drain that returns the liquid to the reservoir. | 02-03-2011 |
20110043999 | APPARATUS AND ARRANGEMENT FOR HOUSING VOLTAGE CONDITIONING AND FILTERING CIRCUITRY COMPONENTS FOR AN ELECTROSTATIC PRECIPITATOR - A unitary-enclosure housing apparatus and arrangement for protecting and cooling the high voltage electronic conditioning and filtering circuitry components used for providing a high-voltage waveform to an electrostatic precipitator device includes a hermetically sealed dielectric liquid coolant filled tank/housing having one or more side-mounted hollow-panel type radiator structures for dissipating heat from the coolant. The disclosed unitary-enclosure housing apparatus and the particular arrangement of the internal electronic components results in a relatively external small footprint while containing both the transformer-rectifier (TR) set and high-voltage resistor-capacitor (R-C) filter components associated with a high-voltage electrostatic precipitator device in a single unitary package. The housing apparatus is outfitted with a removable top cover plate and access panel for providing easy access to the TR set and R-C filter components. A coolant drain spigot is also provided on the housing for simplifying the draining and replacement of coolant liquid. | 02-24-2011 |
20110044000 | TRANSPARENT HEAT-SPREADER FOR OPTOELECTRONIC APPLICATIONS - An optoelectronic cooling system is equally applicable to an LED collimator or a photovoltaic solar concentrator. A transparent fluid conveys heat from the optoelectronic chip to a hollow cover over the system aperture. The cooling system can keep a solar concentrator chip at the same temperature as found for a one-sun flat-plate solar cell. Natural convection or forced circulation can operate to convey heat from the chip to the cover. | 02-24-2011 |
20110051371 | Semiconductor Device, and Power Conversion Device Using Semiconductor Device - The present invention provides a vehicle power module and a power converter including a power semiconductor element ( | 03-03-2011 |
20110075367 | COMPLIANT CONDUCTION RAIL ASSEMBLY AND METHOD FACILITATING COOLING OF AN ELECTRONICS STRUCTURE - Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally conductively interfaced to the first rail, and a biasing mechanism biasing the second rail away from the first rail. The first and second rails and the biasing mechanism are configured for slidable insertion into a housing with the electronics structure, the housing containing a liquid-cooled cold plate(s). With insertion of the electronics structure into the housing, the second rail engages the liquid-cooled cold plate and is forced by the biasing mechanism into thermal contact with the cold plate, and is forced by the cold plate towards the first rail, which results in a compliant thermal interface between the electronics structure and the liquid-cooled cold plate of the housing. | 03-31-2011 |
20110075368 | WATER-COOLED REACTOR - A liquid-cooled electromagnetic component (reactor, transformer) including a plurality of disc-shaped coils with one or more turns and flat radiators located between them, wherein at least two disc coils are assigned to a flat radiator, and in which all the winding elements (turns of the coil) are in direct thermal contact with the surfaces of the flat radiators. This component is used in power converter installations and in midfrequency installations. | 03-31-2011 |
20110116235 | MOTOR DRIVE UNIT AND VEHICLE INCLUDING THE SAME - Disclosed is a motor drive unit. The motor drive unit includes a case, a capacitor provided in the case and generating heat, an inverter provided in the case and configured to convert Direct Current (DC) power into Alternating Current (AC) power, and a water cooling jacket provided in the case and configured to radiate heat generated by the inverter to the outside. The case includes a radiating plate to radiate the heat generated by the capacitor to the outside. | 05-19-2011 |
20110122583 | IMMERSION COOLING APPARATUS FOR A POWER SEMICONDUCTOR DEVICE - An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid coolant is circulated. The thermally conductive module has first and second oppositely disposed connector headers housing terminal pins or blades electrically coupled to the semiconductor device, and the connector headers protrude through openings in oppositely disposed sidewalls of the housing so that the portion of the thermally conductive module between the connector headers is suspended in the chamber and immersed in the circulating coolant. The thermally conductive module is sealed against the housing sidewalls around the openings, and one of the sidewalls is removable to facilitate installation of the thermally conductive module in the housing or its subsequent removal. | 05-26-2011 |
20110157827 | MINIATURIZED LIQUID COOLING APPARATUS AND ELECTRONIC DEVICE INCORPORATING THE SAME - A liquid cooling apparatus for cooling an inversely mounted electronic component, includes a casing defining a receiving room therein, a diaphragm, a partition plate forming a nozzle thereon, and a piezoelectric element attached to the diaphragm in such a manner that that a vibrating direction thereof is perpendicular to the diaphragm. The diaphragm is arranged in the receiving room and divides the receiving room into a top first chamber and a bottom second chamber isolated from each other. The partition plate is arranged in the first chamber and divides the first chamber into an upper region and a lower region. The lower region is filled with a working fluid. When the diaphragm is driven to vibrate upwardly by the piezoelectric element, the diaphragm pushes the working fluid in the lower region of the first chamber to the upper region of the first chamber via the nozzle. | 06-30-2011 |
20110157828 | Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure - According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level. | 06-30-2011 |
20110164385 | LIQUID COOLER AND METHOD OF ITS MANUFACTURE - A liquid cooler including a heat sink. A hollow body is produced by extrusion having at least one flat outer surface between a first and a second end. At least one elongated cavity passes through the body from the first to the second end. The hollow body includes a plurality of parallel fins directed into and along the at least one cavity. An insert housed in the at least one cavity connects the tops of the fins in a fluid-tight manner thereby forming liquid channels for a coolant liquid between the insert and the hollow body. A lid is attached at both ends of the hollow body for forming a liquid cooling system. | 07-07-2011 |
20110188202 | Algae Oil Based Dielectric Fluid for Electrical Components - The disclosure is directed to a dielectric fluid. The dielectric fluid includes an algae oil. The algae oil includes a natural algae antioxidant. The natural algae antioxidant is selected from β-carotene, astaxanthin, tocopherol, polyunsaturated triglycerides, and combinations thereof. | 08-04-2011 |
20110188203 | PLUG IN LED ARRAY - An LED device comprises an LED ( | 08-04-2011 |
20110205706 | RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING THE SAME - Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board ( | 08-25-2011 |
20110205707 | COMPONENT CARRIER - An extruded aluminum electrical circuit component carrier on which at least one electrical circuit component is to be mounted. A first side portion and a second side portion include areas for mounting at least one first electrical circuit component part and at least one second electrical circuit component part. An inlet to which an inlet conduit for a cooling liquid can be connected. An outlet to which an outlet conduit for the cooling liquid can be connected. At least one supply passage for the cooling liquid formed through the first side portion. At least one return passage for the cooling liquid formed through the second side portion. The at least one supply passage is connected to the at least one return passage in series. An area of a cross-section of the at least one return passage is smaller than an area of a cross-section of the at least one supply passage, whereby in use a flow velocity of the at least one return passage exceeds a flow velocity of the at least one supply passage so that an essentially uniform cooling capacity for the first and second electrical circuit component parts is achieved. | 08-25-2011 |
20110228478 | AUTOMATIC TRANSMISSION CONTROL UNIT COOLING APPARATUS - An automatic transmission control unit cooling apparatus includes a control unit having an electronic component, installed on a substrate, for controlling the automatic transmission; a holder accommodating the substrate and within a case of the automatic transmission disposed at a position that is higher than the oil surface in the automatic transmission when the transmission is installed in a vehicle and on a side face of a valve body in the transmission case. The apparatus further includes a radiator that contacts the electronic component or the substrate in order to conduct heat generated by the electronic component. At least a part of the radiator is immersed in the oil when the transmission is installed in the vehicle. | 09-22-2011 |
20110228479 | Electric Power Conversion Apparatus - An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel. | 09-22-2011 |
20110235276 | POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT - A power converter module with a liquid-cooled heat sink, a busbar arrangement having at least two busbars, at least two power semiconductor modules, which are mechanically connected to the liquid-cooled heat sink for thermal conduction and are electrically connected to connections of the power converter module by the busbar arrangement has at least one coolant line forming a single structural unit with the busbar arrangement. The coolant line prevents additional power loss in the laminated busbar. | 09-29-2011 |
20110242760 | POWER CONVERTER MODULE WITH A COOLED BUSBAR ARRANGEMENT - A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected to connections of the power converter module by the busbar arrangement. A second liquid-cooled heat sink is positively or non-positively connected to the busbar arrangement. A thermally conductive and electrically insulating layer is disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink. Additional power loss arising in the busbar is dissipated by the second liquid-cooled heat sink, which is pressed with a clamping elements on a surface of the upper busbar. | 10-06-2011 |
20110249402 | POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT - A power converter module includes at least two power semiconductor modules, which are mechanically connected to a liquid-cooled heat sink and electrically connected to terminals of the power converter module by a busbar arrangement having at least two busbars. The busbars are insulated from one another by an insulation layer. The insulation layer is composed of two insulating layers, which are materially connected with one another so as to form therebetween a cavity having a predetermined shape and an entrance side and an exit side disposed on least one side face of the insulation layer. A connector is provided on the entrance side and the exit side and fluidly connected to the liquid-cooled heat sink. The rectifier module is thus able to sustain relatively high electrical loads compared to conventional rectifier modules, whilst maintaining a permitted temperature for the insulation layer and the lamination material of the busbar. | 10-13-2011 |
20110273845 | HIGH POWER BAND PASS RF FILTER HAVING A GAS TUBE FOR SURGE SUPPRESSION - A high power band pass RF filtering device having a housing for containing a printed circuit board with filtering components for achieving strong attenuation of out-of-band signals. An input port and an output port on the housing electrically connect to a respective input node and output node on the printed circuit board. Surge protection elements are connected at the input port and at the output port for dissipating surge conditions present at the input port or the output port to the housing before the surge travels through the printed circuit board. A non-surge signal present on the input port can travel through the filtering components on the printed circuit board towards the output port. An oil or other fluid is disposed and completely contained within the housing and contacts the printed circuit board for cooling the printed circuit board or the filtering components. | 11-10-2011 |
20110286183 | WATER-COOLED COMMUNICATION CHASSIS - A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid. | 11-24-2011 |
20110304987 | DEVICE FOR COOLING INTEGRATED CIRCUITS - The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels ( | 12-15-2011 |
20110317365 | LIQUID COOLING SYSTEM AND ELECTRONIC DEVICE INCORPORATING THE SAME - A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly is connected to the liquid tank. When pressed against the clip assembly by a user, the liquid tank is fastened by the clip assembly and thus retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. An electronic device using the liquid cooling system is also provided. | 12-29-2011 |
20110317366 | FIXING STRUCTURE AND FIXING METHOD OF CIRCUIT BOARD WITH EMBEDDED ELECTRONIC PARTS TO COOLER - In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts. | 12-29-2011 |
20120020022 | PRINTED CIRCUIT BOARD COOLING ASSEMBLY - A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board | 01-26-2012 |
20120033382 | HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS - A heat sink for absorbing heat which is generated by an electronic module by using a coolant which flows in its internal portion, comprises a housing which is provided with, in its internal portion, a first surface which is located in the vicinity of the electronic module and a second surface which faces the first surface and comprises fins which extend from the first surface toward the second surface, wherein a projecting portion projecting from the second surface toward the first surface is formed at the second surface, between the top edges of the fins on the second surface side and the second surface. | 02-09-2012 |
20120057302 | COOLING APPARATUS AND ELECTRONIC EQUIPMENT - A cooling apparatus that cools first and second high density heat dissipation components provided in a housing including a fan that provide an air convection from one opening toward the other opening, the cooling apparatus having: a conduit that contacts the first heat dissipation component and that allows a coolant to pass there through; and a fin structure that contacts the conduit and that is provided on an upwind side of the second heat dissipation component. | 03-08-2012 |
20120063090 | COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An apparatus for cooling a stacked die package comprises a substrate, a first die above the substrate, a second die above the first die, and a housing containing the first and second dies. The housing seals the first and second dies from the environment. The apparatus further includes a cooling fluid in fluid communication with the first die and the second die to transfer the heat from the dies to the housing. | 03-15-2012 |
20120063091 | Cooling Apparatuses and Power Electronics Modules - A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device. | 03-15-2012 |
20120113594 | Thermoelectric Converter and System Comprising a Thermoelectric Converter - An apparatus and process are disclosed that relates to a thermoelectric converter for converting thermal energy into electric energy. The apparatus includes at least one magnetic circuit including magnetic flux; at least one electric coil coupled to the at least one magnetic circuit; a magnetic switch coupled to the at least one magnetic circuit which loads the at least one electric coil with magnetic flux of the at least one magnetic circuit depending on a temperature of the magnetic switch, wherein the magnetic switch has a ferromagnetic state below a critical temperature (Tc) and a paramagnetic state above the critical temperature (Tc). | 05-10-2012 |
20120155028 | COOLING COMPONENTS OF AN ELECTRONIC UNIT - A method of enabling the cooling of components of an electronic unit is provided. The method comprises providing a thermally conductive liquid or gel in contact with the components wherein the unit is an electronic module comprising a casing comprising metallic material and housing the components. The method further comprises including such liquid or gel in the casing to fill the entire space within the casing apart from the components so that heat from the components can be conducted via the liquid or gel to the casing. | 06-21-2012 |
20120188717 | POWER ELECTRONICS ASSEMBLY FOR A MAGNETIC RESONANCE DEVICE - A power electronics assembly for a magnetic resonance device includes a housing and at least one printed circuit board (PCB) arranged in the housing with at least one power electronics component to be cooled. The PCB has an at least one millimeter thick backside layer that may be made of copper. The power electronics assembly also includes a stabilizing cooling plate configured as part of the housing and/or the housing includes at least one coolant channel open on at least one side, so that the PCB mounted on the cooling plate comes into direct contact with coolant guided in the coolant channel in an area of the power electronics components with the backside layer. | 07-26-2012 |
20120188718 | Assembly of an Electronic Device Casing, A Heat-Dissipating Module and a Waterproofing Module, and the Waterproofing Module - An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion. | 07-26-2012 |
20120195003 | Rotating Rectifier - A rectifier comprising an electrically conductive support 32, a first plurality of rectifier components 24 carried by the support 32 and having their anodes connected to a first bus bar 26, a second plurality of rectifier components 28 carried by the support 32 and having their cathodes connected to a second bus bar 30, the cathode of each of the first rectifier components 24 being connected to the anode of an associated one of the second rectifier components 28, and first and second resistance paths 40, 42 between the first and second bus bars 26. 30 and the support 32. | 08-02-2012 |
20120206879 | COOLING DEVICE - The invention relates to a cooling device for an electric energy supply ( | 08-16-2012 |
20120224326 | MODULAR BATTERY STRUCTURE - A module system is provided that includes at least one module support and at least one module support and at least one energy storage module that is connected to the at least one module support. The module support and the energy storage module have cooling fluid connections, electric contacts, and coupling elements that are adapted to each other. | 09-06-2012 |
20120236500 | WIRING BOARD AND POWER CONVERSION DEVICE - A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe. | 09-20-2012 |
20120257353 | Carriage Chassis With A Tri-Lobed Torsion Stop - Carriage chassis for installation of a component assembly in a support structure. The support structure includes a power connector in a connector housing. The carriage chassis includes: rails adapted to receive a component assembly and a safety cover. One of the rails includes a tri-lobed torsion stop that includes a first lobe configured to contact the connector housing when no safety cover is installed, preventing a component assembly from coupling with power; a second lobe configured to receive contact from a displacement member of a safety cover, rotating the tri-lobed torsion stop; and a third lobe configured to provide contact to the displacement member when the safety cover is installed and a component assembly is coupled with power. The third lobe and the first lobe prevent removal of the safety cover when a component assembly is coupled with the power connector. | 10-11-2012 |
20120307451 | SYSTEMS AND METHODS FOR EJECTING REMOVABLE MODULES FROM ELECTRONIC DEVICES - An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of the electronic device. The ejectable component assembly may also be provided with an ejector mechanism for at least partially ejecting the removable module from the connector. The ejector mechanism may receive a user input force at an ejector user interface, translate that user input force into an ejection force, and apply that ejection force onto the removable module for ejecting the module. The ejector user interface may be provided at any suitable position of the housing that may not interfere with other functions of the device. The path along which the ejector mechanism translates the user input force into the ejection force between the ejector user interface and the removable module may be provided in any suitable way throughout the device. | 12-06-2012 |
20120320527 | BOARD ASSEMBLY, ELECTRONIC DEVICE TEST APPARATUS AND WATER JACKET - A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module | 12-20-2012 |
20130003301 | STACKED COOLER - A stacked cooler includes a plurality of refrigerant flow passages and a plurality of semiconductor modules. The refrigerant flow passages and the semiconductor modules are stacked alternately, and each of opposite surfaces in a stacking direction of each of the semiconductor modules is in contact with a corresponding one of the refrigerant flow passages, thereby cooling the semiconductor modules. The semiconductor modules generate different amounts of heat. One or a plurality of the semiconductor modules and one or a plurality of the semiconductor modules are arranged in each of arrangement spaces adjacent to the refrigerant flow passages so that a difference in amount of heat generated between the respective arrangement spaces becomes small. Consequently, cooling capability is equalized throughout the respective arrangement spaces, enabling reduction in waste due to excessive cooling. | 01-03-2013 |
20130027882 | Safety Device of Battery Temperature Control System - To provide a safety device of a battery temperature control system for an EV or an HEV capable of preventing an electric shock due to the electrical conduction across terminals of batteries in the event of a vehicle collision. | 01-31-2013 |
20130039009 | INVERTER FOR VEHICLE - An inverter for a vehicle is disclosed. The inverter for the vehicle illustratively includes: a power module provided with a power semiconductor device; a cooling module coupled to the power module and flowing a coolant therethrough; and a capacitor module mounted at the cooling module through a mounting unit and adapted to absorb a ripple current of the power module. | 02-14-2013 |
20130039010 | HEAT DISSIPATION DEVICE AND SEMICONDUCTOR DEVICE - Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device. | 02-14-2013 |
20130044431 | LIQUID COOLING OF STACKED DIE THROUGH SUBSTRATE LAMINATION - A liquid cooled package for integrated circuit dies includes flex circuit boards ( | 02-21-2013 |
20130058041 | SEMICONDUCTOR MODULE AND COOLER - A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage. | 03-07-2013 |
20130077244 | Arrangement of a power semiconductor circuit - The invention relates to a power electronic assembly ( | 03-28-2013 |
20130083484 | COMPOSITE ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING COMPOSITE ELECTRONIC COMPONENT - A composite electronic component includes electronic components, a conductor layer, and a support. Each of the electronic components includes a first terminal electrode and a second terminal electrode that are arranged on respective opposing surfaces of an element body. The conductor layer electrically connects the first terminal electrodes of the electronic components to one another. The conductor layer is arranged on the support. The second terminal electrodes of the electronic components function as mounting terminal electrodes to be connected to terminals of a circuit substrate. | 04-04-2013 |
20130094145 | THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY - A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component. | 04-18-2013 |
20130094146 | LIQUID SUBMERSION COOLED NETWORK ELECTRONICS - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 04-18-2013 |
20130107457 | COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S) | 05-02-2013 |
20130120936 | SCANNER PROTECTION CASING AND SYSTEM OF READING THE HEIGHT OF THE PELLET BED OF GRID CARS INSIDE A GRID FURNACE COMPRISING A SCANNER PROTECTED BY SAID CASING - A scanner protection casing including an external cabinet, an internal cabinet within which a scanner is positioned, a thermal insulation material between the external cabinet and the internal cabinet that reduces the thermal conductivity between the external cabinet and the internal cabinet. Further, the internal cabinet has a first side wall and a second side wall and the space between the first side wall and a second side wall is filled with a cooling fluid. | 05-16-2013 |
20130128460 | COOLING DEVICE WITH LIQUID FOR ELECTRONIC CARDS, IN PARTICULAR FOR HIGH PERFORMANCE PROCESSING UNITS - Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack. | 05-23-2013 |
20130163203 | THERMALLY-STABLE DIELECTRIC FLUID - The disclosure is directed to a thermally-stable dielectric fluid. The dielectric fluid includes (a) an oil, (b) a substituted, hindered phenolic antioxidant having at least two substituted cresol groups being covalently bonded to each other through a methylene bridge, and (c) a substituted, diphenyl amine antioxidant having at least two substituted phenyl groups being covalently bonded to each other through an amine bridge. | 06-27-2013 |
20130170141 | Method for providing power supply, and a power supply device - A device for a power supply system of a working machine, for supplying electric power to at least one actuator is disclosed. The device includes a frame part with a bottom and a cooling liquid channel system The frame part includes a recess which can be arranged in a flow connection with the cooling liquid channel system). The device may be combined with other devices to form modules for the power supply system of the working machine. | 07-04-2013 |
20130201628 | RADIATOR AND ELECTRONIC APPARATUS INCLUDING SAME - There is provided a radiator which includes a tank including first and second chambers that are separated from each other, the first and second chambers including first and second openings, respectively, a first tube including first and second ends, the first and second ends communicating with the first and second chambers, respectively, and a second tube being next to the first tube, the second tube including first and second ends communicating with the first and second chambers, respectively, wherein the first chamber includes first and second flow channels that communicate with the first opening, the first and second channels being split so as to sandwich at least part of the second chamber, and the first ends of the first and second tubes sandwich the second ends of the first and second tubes. | 08-08-2013 |
20130208421 | Cooled Electronic System - A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed. | 08-15-2013 |
20130215572 | AIRCRAFT ELECTRONICS COOLING APPARATUS FOR AN AIRCRAFT HAVING A LIQUID COOLING SYSTEM - The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronics cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling system of the aircraft. A coolant delivered by the liquid cooling system may flow through a board of the electronic device, through a heat sink on which the electronic device is arranged and/or through a housing in which the electronic device is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device. | 08-22-2013 |
20130223008 | MOLDED HEAT SINK AND METHOD OF MAKING SAME - A heat sink for use with a heat generating component includes a molded cooling block including a molded cooling passage for receiving a cooling medium. The cooling block is configured to be positioned in sufficient heat transfer relationship with respect to the heat generating component so that the cooling medium is able to receive heat from the heat generating component. Furthermore, the cooling block includes first and second sections that are connected together and that each partially define the cooling passage. | 08-29-2013 |
20130223009 | Power Converter - The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. | 08-29-2013 |
20130235526 | ELECTRICAL PART FIXING STRUCTURE FOR HYBRID VEHICLES - A battery charger ( | 09-12-2013 |
20130258592 | LIQUID COOLED ELECTRONICS ASSEMBLY SUITABLE TO USE ELECTRICALLY CONDUCTIVE COOLANT - A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized. | 10-03-2013 |
20130258593 | THERMO-MAGNETIC POWER GENERATION SYSTEM - A thermo-magnetic power generation system includes a thermo-magnetic power generation device, a first circulating device, and a second circulating device. The first circulating device and the second circulating device are connected to the thermo-magnetic power generation device. The liquid is heated by the first circulating device and cooled by the second circulating device. The heated liquid and the cooled liquid transmitted to the thermo-magnetic element are recycled by the first circulating device and the second circulating device. | 10-03-2013 |
20130271916 | Modular liquid-cooled power semiconductor module, and arrangement therewith - A power semiconductor module, and an arrangement using the module. The module has a basic parallelepipedal shape with opposed pairs of main, longitudinal and narrow sides, a cooling device which is capable of carrying a flow of a cooling fluid, having a power electronics switch and a housing. The cooling device has a cooling volume with at least one cooling face and four connection devices which are arranged in pairs on the main sides. In addition, the connection devices carry the cooling fluid and are designed as a flow inflow and a flow outflow and as a return inflow and a return outflow, respectively. The power electronics switch has load input connection devices and load output connection devices which are arranged on one or both longitudinal sides and a control connection device which is arranged on a narrow side of the module. | 10-17-2013 |
20130271917 | Liquid-cooled arrangement having modular power semiconductor modules and at least one capacitor device, and power semiconductor module therefor - An arrangement having a cooling circulation, a plurality of modular power semiconductor modules and at least one capacitor, wherein a power semiconductor module has a power electronics switch and a cooling device, which is capable of carrying a flow of a cooling fluid, for cooling the switch, the cooling device having at least one cooling face, and four connection devices for the cooling fluid. The connection devices are arranged in pairs on main sides of the power semiconductor module. The power semiconductor modules have their main sides strung together modularly by connecting corresponding connection devices on successive power semiconductor modules. To this end, at least two successive power semiconductor modules have a capacitor arranged between them which, for its part, is cooled by means of the cooling circulation of the cooling fluid as provided by the arrangement. | 10-17-2013 |
20130279113 | EDGE SEAL FOR ELECTRONICS ASSEMBLY SUITABLE FOR EXPOSURE TO ELECTRICALLY CONDUCTIVE COOLANT - A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized. | 10-24-2013 |
20130279114 | Vehicular Power Conversion Apparatus - A first power semiconductor module and a second power semiconductor module are fixed in parallel to a first channel along a flow direction of a cooling refrigerant flowing through the first channel, a third power semiconductor module is fixed to a second channel such that the first power semiconductor module and the third power semiconductor module face each other via a capacitor circuit unit, and an electric circuit element electrically connected in series or in parallel with regard to the capacitor circuit unit and a DC terminal is arranged in such a position that the second power semiconductor module and the electric circuit element face each other via the capacitor circuit unit. | 10-24-2013 |
20130301220 | MOUNTING STRUCTURE FOR POWER CONTROL UNIT | 11-14-2013 |
20130308270 | COOLING SYSTEM FOR ELECTRIC VEHICLE AND CONTROL METHOD THEREOF - Disclosed are a cooling system for an electric vehicle and a control method thereof. The electric vehicle equipped with electronic parts including an electric motor. The electric vehicle includes a motor control unit to control the electric motor, a main control unit to control the electronic parts and the motor control unit, a water pump to circulate a cooling water cooling the electronic parts, the motor control unit, and the main control unit, and a temperature sensor to detect a temperature for an operation of the water pump and output the temperature to the motor control unit. The motor control unit generates a control signal to operate or stop the water pump according to a detection result of the temperature sensor. | 11-21-2013 |
20130329365 | Electric Device Package and Method of Making an Electric Device Package - A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid. | 12-12-2013 |
20130335920 | COOLING APPARATUS - A cooling apparatus includes a case in which a refrigerant passage through which a refrigerant flows is formed inside, and an element module partially disposed within the refrigerant passage and including an element provided inside. A portion of the element module in contact with the refrigerant is formed of an insulating material. | 12-19-2013 |
20140002993 | FITTING FOR FLEXIBLE MANIFOLD SYSTEM | 01-02-2014 |
20140016270 | INTERPOSER AND SEMICONDUCTOR MODULE USING THE SAME - An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources. | 01-16-2014 |
20140029199 | COOLING APPARATUSES AND ELECTRONICS MODULES HAVING BRANCHING MICROCHANNELS - Electronics modules and cooling apparatuses having branching microchannels for liquid cooling by jet impingement and fluid flow are disclosed. In one embodiment, a cooling apparatus includes a heat receiving surface and an array of branching microchannel cells. Each branching microchannel cell includes an inlet manifold fluidly coupled to the heat receiving surface and a branching microchannel manifold fluidly coupled to the inlet manifold. The branching microchannel manifold includes a plurality of fins that orthogonally extend from the heat receiving surface such that the plurality of fins define a plurality of branching microchannels that is normal with respect to the heat receiving surface. The cooling apparatus further includes an outlet manifold fluidly coupled to the plurality of branching microchannels. The coolant fluid flows through the plurality of branching microchannels in a direction normal to the heat receiving surface. | 01-30-2014 |
20140036447 | DIELECTRIC HEAT-TRANSFER FLUID - Provided is a use of a vegetable oil high in monounsaturates as dielectric and heat-transfer fluid in a device for the generation, storage, conversion and/or distribution of electrical energy. | 02-06-2014 |
20140043764 | ELECTRONIC DEVICE COOLING WITH AUTONOMOUS FLUID ROUTING AND METHOD OF ASSEMBLY - An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel. | 02-13-2014 |
20140043765 | SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE - A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel. | 02-13-2014 |
20140063740 | COMMUNICATION MODULE-COOLING STRUCTURE AND COMMUNICATION DEVICE - A communication module-cooling structure includes a main body section to be cooled by a cooling mechanism, and a heat sink including a cooling receiving section including partition walls and slit-shaped receiving spaces defined by the partition walls. The receiving spaces of the cooling receiving section receive communication modules, and each of the communication modules includes a substrate mounted with a communication circuit component thereon and first and second sidewalls which sandwich the substrate therebetween in a thickness direction of the substrate. At least one of the first and second sidewalls of each of the communication modules is in surface contact with an inner surface of each of the receiving spaces. | 03-06-2014 |
20140071623 | COOLANT SUPPLY UNIT, COOLING UNIT, AND ELECTRONIC DEVICE - A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port. | 03-13-2014 |
20140071624 | COOLING UNIT AND ELECTRONIC EQUIPMENT - A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably. | 03-13-2014 |
20140071625 | IMMERSION COOLING SYSTEM AND METHOD - Embodiments of the present invention provide an immersion cooling system, including: an electronic device, a non-conductive working medium, and one or more gasbags. The electronic device is immersed in the non-conductive working medium; the non-conductive working medium is configured to dissipate heat for the electronic device, and a volume of the non-conductive working medium expands as a temperature rises; and a surface of the gasbag is elastic, and the gasbag is configured to reduce its volume when the gasbag is compressed by volume expansion of the non-conductive working medium, so as to buffer a pressure rise in the system, where the pressure rise is caused by the volume expansion of the non-conductive working medium. With the immersion cooling system provided in the embodiments of the present invention, installation is more flexible and cooling performance of the system is further improved. | 03-13-2014 |
20140078672 | ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE - Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module. | 03-20-2014 |
20140085821 | METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARRAY OF LIQUID SUBMERGED ELECTRONIC DEVICES - A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array. | 03-27-2014 |
20140092558 | Dielectrophoretic Restriction to Prevent Vapor Backflow - A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction. | 04-03-2014 |
20140098496 | POWER CONVERSION APPARATUS INCLUDING SEMICONDUCTOR MODULES AND COOLER - The power conversion apparatus includes semiconductor modules constituting a part of a power conversion circuit, a cooler including coolant passages, and a frame holding the semiconductor modules and the cooler. The semiconductor modules and the coolant passages are stacked on one another to form a stacked body. The cooler includes a pair of inlet/outlet tubes for introducing and discharging a coolant, the pair of the coolant inlet/outlet tubes extending from one of the coolant passages which is located at one end in a stacking direction of the stacked body to outside of the frame. Each of the pair of the coolant inlet/outlet tubes includes a proximal end portion located inside the frame and a distal end portion located outside the frame. In at least one of the pair of the inlet/outlet tubes, the proximal end portion has an outer diameter smaller than an outer diameter of the distal end portion. | 04-10-2014 |
20140126149 | SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS - Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits. | 05-08-2014 |
20140126150 | HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS - A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device. | 05-08-2014 |
20140126151 | SEPARATE CONTROL OF COOLANT FLOW THROUGH COOLANT CIRCUITS - Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits. | 05-08-2014 |
20140133100 | APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICE - There are provided an apparatus for testing a semiconductor device and a method for testing a semiconductor device. The apparatus for testing a semiconductor device includes: a temperature detection unit detecting a temperature of a semiconductor device to generate a detected temperature; a controller comparing the detected temperature with a preset control temperature to generate a comparison result, and determining whether to cool the semiconductor device according to the comparison result; and a cooling unit cooling the semiconductor device according to a control of the controller, wherein the controller resets the control temperature, when the detected temperature is outside of a range of an operational temperature of the semiconductor device. | 05-15-2014 |
20140133101 | Signal Transmission Device - A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate. | 05-15-2014 |
20140140004 | HEAT SINK FOR POWER MODULE - A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins. | 05-22-2014 |
20140140005 | POWER ELECTRONICS DEVICE - Power electronics device, such as a frequency converter, which includes liquid-cooled power units (REC | 05-22-2014 |
20140168897 | POWER ELECTRONICS DEVICE AND ITS COOLING ARRANGEMENT - Liquid-cooled power unit of a power electronics device, which power unit includes at least two power modules, the cooling surface of which power modules is provided with pin-type protrusions and which power modules are fixed to the frame part of the power unit. A liquid duct is arranged inside the frame part of the power unit, and the power modules are fixed to the points of the apertures situated in the frame part on both sides of the liquid duct in such a way that the pin-type protrusions of the power modules are situated in the liquid duct. A wedge-shaped part is disposed in the liquid duct, which wedge-shaped part includes a wedge-shaped front part for spreading the liquid flow into two essentially equal flows at the point of the power modules. | 06-19-2014 |
20140198452 | DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAPILLARIES - Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces. | 07-17-2014 |
20140198453 | MIXING MANIFOLD AND METHOD - A method and cooling system that cools a power stack in a power conversion apparatus. The liquid cooling system includes a first cooling stage that includes first cooling components, wherein the first cooling components are connected to form parallel cooling branches; a mixing manifold configured to be fluidly connected to the parallel cooling branches so that cooling liquid streams from the parallel cooling branches are mixed in the mixing manifold; and a second cooling stage that includes second cooling components, and the second cooling stage is connected in series with the first cooling stage in terms of a cooling liquid that flows through the cooling system. | 07-17-2014 |
20140204533 | HEAT SINK FOR COOLING OF POWER SEMICONDUCTOR MODULES - A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin. | 07-24-2014 |
20140233186 | COOLING DEVICE EQUIPED WITH A THERMOELECTRIC SENSOR - A cooling device of a component includes at least one channel in which a first cooling fluid flows designed to cool a hot area of the component. It further includes a thermoelectric module configured to measure a temperature difference between the hot area of the component and the channel, and a control circuit configured to modulate the flowrate of the first cooling fluid in the channel according to the temperature difference. | 08-21-2014 |
20140247555 | SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE - Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure. | 09-04-2014 |
20140254098 | MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING - A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. | 09-11-2014 |
20140268571 | SYSTEM AND METHOD FOR COOLING HEAT GENERATING COMPONENTS - An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat. | 09-18-2014 |
20140293542 | Thermal mgmt. device for high-heat flux electronics - The invention is for an apparatus and method for removal of waste heat at high-flux from electronic, photonic, and other components. The apparatus of the present invention is a self-contained unit comprising a closed flow loop flowing liquid metal coolant pumped by an integral magneto-hydrodynamic (MHD) pump. Liquid metal coolant flow is arranged to impinge onto a thin member mounting a heat load. Impinging flow of liquid metal coolant offers a high heat transfer coefficient, which translates to comparably low thermal resistance between the heat load and the liquid metal coolant. As a result, the apparatus may remove heat from the heat load at very high flux. Waste heat acquired from the heat load may be transferred at reduced flux into a flowing secondary coolant, heat pipe, structure, or a radiation panel. Temperature of the heat load may be varied by varying the MHD pump drive current. | 10-02-2014 |
20140313669 | LIQUID COOLING SYSTEM FOR MODULAR ELECTRONIC SYSTEMS - A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit. | 10-23-2014 |
20140313670 | Dielectric Fluid with Farnesene-Based Oligomer - The present disclosure is directed to a dielectric fluid comprising a farnesene-based oligomer and an antioxidant and devices containing the dielectric fluid. | 10-23-2014 |
20140321057 | ARCHITECTURE FOR POWER PLANT COMPRISING CLUSTERS OF POWER-GENERATION DEVICES - Various techniques are employed alone or in combination, to reduce the levelized cost of energy imposed by a power plant system. Solar energy concentrators in the form of inflated reflectors, focus light onto photovoltaic receivers. Multiple concentrators are grouped into a series-connected cluster that shares control circuitry and support structure. Individual concentrators are maintained at their maximum power point via balance controllers that control the flow of current that shunts this series connection. DC current from clusters is transmitted moderate distances to a centralized inverter. The inductance of transmission lines is maximized using an air-spaced twisted pair, enhancing the performance of boost-type three phase inverters. Cluster outputs are separate from individual inverters in massively interleaved arrays co-located at a central location. Step-up transformers convert inverter voltages to grid voltages, and small transformers provide isolation and voltage step-up only on receiver-to-receiver imbalance currents, typically <20% of the total current. | 10-30-2014 |
20140328021 | HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes a chassis and a heat dissipation apparatus. The chassis includes a sidewall defining a latching hole and a rear wall defining an opening adjacent to the latching hole. The heat dissipation apparatus is detachably inserted in the chassis from the opening. The heat dissipation apparatus includes a casing defining a positioning slot aligning with the latching hole of the chassis, a liquid cooling assembly received in the casing, and a resilient latching member. A first end of the latching member is mounted in the casing. A latching block protrudes out from a second end of the latching member. The latching block extends through the positioning slot, to be latched in the latching hole of the chassis. | 11-06-2014 |
20140334102 | POWER CONVERSION APPARATUS - In general, according to an embodiment, a power conversion apparatus includes a first inverter, second inverter and a cooler. The first inverter includes a plurality of semiconductor devices connected together in parallel per phase. In the second inverter, the number of parallel-connected semiconductor devices are two or more per phase, the semiconductor devices are connected together in parallel and the number of parallel-connected semiconductor devices in the second inverter is fewer than that in the first inverter per phase. The semiconductor devices in the first inverter are installed in an area of a cooling surface of the cooler positioned over a first channel. The semiconductor devices in the second inverter are installed in an area of the cooling surface positioned over the second channel. | 11-13-2014 |
20140340847 | SUBSTRATE UNIT AND ELECTRONIC DEVICE - A substrate unit includes: a substrate arranged with a first heat generating element on one surface and a second heat generating element on the other surface; a first cooler that is arranged on one surface side of the substrate and that is in contact with the first heat generating element; a second cooler that is arranged on the other surface side of the substrate and that is in contact with the second heat generating element; a supply port provided in the first cooler, the supply port supplying the coolant to the first cooler; a discharge port provided in the first cooler, the discharge port discharging the coolant in the first cooler; and transport tubes that are connected to the first cooler and the second cooler, the transport tubes allowing the coolant to be transported between the first cooler the second cooler. | 11-20-2014 |
20140347817 | JET IMPINGEMENT COOLERS AND POWER ELECTRONICS MODULES COMPRISING THE SAME - Jet impingement assemblies and power electronics devices incorporating jet impingement assemblies are described. The jet impingement assemblies include a fluid inlet, a fluid outlet, a manifold, and a heat distribution member. The manifold includes a distribution side in fluid communication with the fluid inlet, a collection side in fluid communication with the fluid outlet, a plurality of orifices extending from the distribution side to the collection side, and a return channel extending from the collection side to the distribution side. The heat distribution member is positioned proximate to the collection side of the manifold. | 11-27-2014 |
20140347818 | Power Semiconductor Module with Liquid Cooling - A power semiconductor module includes a substrate and a two-part cooling system arranged under the substrate. The cooling system has upper and lower pieces. The upper piece forms a flow channel with the substrate for a cooling liquid. The upper piece has a first inflow and an outflow, through which the cooling liquid can be introduced into the flow channel and removed. The upper piece also has at least one second inflow, which is spaced apart from the first inflow in a longitudinal direction. The lower piece has an inlet and an outlet, the outlet being connected to the outflow and the inlet being connected to the first inflow. The lower piece also has a channel branching off from the inlet, which includes at least one bypass channel, which is connected to the second inflow, so part of the cooling liquid passes through the bypass channel into the flow channel. | 11-27-2014 |
20140355212 | IMMERSION COOLED MOTOR CONTROLLER - An immersion cooled motor controller assembly is disclosed that includes a sealed housing, a fluorocarbon cooling liquid contained in the sealed housing, and an AC/AC motor controller disposed in the sealed housing and submerged in the fluorocarbon cooling liquid, wherein the AC/AC motor controller includes a power board module adapted and configured to operate at power levels greater than 30 kW. | 12-04-2014 |
20140362531 | COOLING SYSTEM FOR AN ELECTRONIC RACK - The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis. | 12-11-2014 |
20140369004 | HEAT-TRANSFER PLATE, HEAT-TRANSFER PLATE MODULE, AND SUBMARINE APPARATUS - A heat-transfer plate includes a pool portion configured to have a partially-depressed surface and to be loaded with thermally-conductive resin that is in contact with a heating component so as to transfer the heat from the heating component to the heat-transfer plate, a resin-amount check portion configured to have a plurality of depths and to be disposed at a position where the thermally-conductive resin is viewable in a state where the printed circuit board is fixed to the heat-transfer plate, a levee portion configured to be provided between the pool portion and the resin-amount check portion and to suppress flow of the thermally-conductive resin toward the resin-amount check portion, and a flow channel configured to be provided between the pool portion and the resin-amount check portion and to serve as a path through which the thermally-conductive resin flowing into the resin-amount check portion from the pool portion travels. | 12-18-2014 |
20140369005 | PASSIVE THERMAL MANAGEMENT DEVICE - A thermal management device including a first face configured to be in contact with a hot source and a second face opposite the first face configured to be in contact with a cold source, and at least one network of cells filled with a solid/liquid phase-change material located in a cavity between the first and second faces, wherein the cells include walls formed of carbon nanotubes, wherein the nanotubes extend roughly from the first to the second face, thermally connecting the first face to the second face. | 12-18-2014 |
20140376187 | PACKAGE MOUNTING STRUCTURE - A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate. | 12-25-2014 |
20150022974 | Power Conversion Apparatus and Electric Vehicle - The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area. | 01-22-2015 |
20150029665 | COOLING FLUID FLOW PASSAGE MATRIX FOR ELECTRONICS COOLING - A cooling supply package for an electronic component has a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed. | 01-29-2015 |
20150029666 | Power Conversion Apparatus - Disclosed is a downsized an integrated power-converter apparatus in which a plurality of power converter apparatuses is integrated, and to shorten a wiring connection distance in the power converter apparatus. The power-converter apparatus includes a power semiconductor module, a DC-to-DC converter, a capacitor module, a flow-path forming body for forming a flow path through which a refrigerant flows, a case, and a first DC connector for transmitting the DC current. The power semiconductor module is arranged in a position facing the DC-DC converter with the flow-path forming body interposed therebetween. The DC connector is arranged on one specified surface side of the case. The surface of the case is formed along an arrangement direction of the power semiconductor module, the flow-path forming body, and the DC-DC converter. The capacitor module is arranged between the surface of the case and the flow-path forming body, and is connected to the DC connector. | 01-29-2015 |
20150043164 | JET IMPINGEMENT COOLING APPARATUSES HAVING ENHANCED HEAT TRANSFER ASSEMBLIES - Enhanced heat transfer assemblies and jet impingement cooling apparatuses having target surfaces with surface fins and microslots are disclosed. In one embodiment, an enhanced heat transfer assembly includes a target surface, a plurality of surface fins extending from the target surface, and a plurality of microslot matrices formed on the target surface. Each microslot matrix includes individual microslots positioned adjacent to each other, and each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins. Jet impingement cooling apparatuses and power electronics modules haying an enhanced heat transfer assembly with surface fins and matrices of microslots are also disclosed. | 02-12-2015 |
20150043165 | ELEVATED TEMPERATURE COOLING WITH EFFICIENCY OPTIMIZATION CONTROL - Apparatus, systems, and method for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank. | 02-12-2015 |
20150049437 | MEDIUM VOLTAGE HYBRID AIR/LIQUID COOLED ADJUSTABLE FREQUENCY DRIVE - An adjustable frequency drive including a number of power modules and a heat management system is provided. Each of the number of power modules includes a number of inverters. Each inverter includes a number of power poles. The heat management system includes a housing assembly, a first heat management assembly, and a second heat management assembly. The housing assembly defines a power module enclosure and a liquid cooling assembly enclosure. The first heat management assembly is substantially disposed in the power module enclosure. The second heat management assembly is not substantially disposed in the power module enclosure. | 02-19-2015 |
20150055298 | SELF-COOLING ENERGY SAVER - A self-cooling energy saver includes a housing filled with insulating oil and having a plurality of conduits disposed on a first lateral side and a second lateral side thereof, a plurality of heat dissipation modules including a plurality of fins connecting corresponding conduits and heat dissipation flow path formed by adjacent fins; at least one input rod disposed on a top side of the housing and comprising a plurality of insulators; at least one output rod disposed on the top side of the housing and including a plurality of insulators; and an energy saving unit immersed in the insulating oil, electrically connected to the input rod and the output rod and comprising a plurality of reactance elements coupled to filter reactors electrically connected to a switch electrically connecting the reactance elements. | 02-26-2015 |
20150055299 | FABRICATING MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING - Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. | 02-26-2015 |
20150070844 | LIQUID-COOLING MODULE AND ELECTRONIC DEVICE USING THE SAME - A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings. | 03-12-2015 |
20150070845 | POWER SUPPLY DEVICE - In a power supply device | 03-12-2015 |
20150077936 | LIQUID COOLED ELECTRONIC MODULES AND METHODS FOR REPLACING THE SAME - Embodiments include a liquid cooled electronic device including a compartment configured to enclose an electronic module therein. The compartment includes a stationary cooling plate disposed on an interior portion of the compartment, the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate and a plurality of electrical connectors configured to connect to the electronic module. The electronic module includes a mobile cooling plate configured to intimately fit with the stationary cooling plate when the plurality of electrical connectors are connected to the electronic device module. The heat generated by the electronic module is removed by the mobile cooling plate and the stationary cooling plate. | 03-19-2015 |
20150092350 | HEAT-CONDUCTIVE CONNECTION ARRANGEMENT - A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance. | 04-02-2015 |
20150109734 | SURFACE MODIFICATION OF HOSES TO REDUCE DEPLETION OF CORROSION INHIBITOR - An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a passivating agent to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary passivating agents include, but are not limited to, aliphatic alcohols (e.g., 1-hexanol), alkoxysilanes (e.g., (3-aminopropyl)triethoxysilane), and multidentate polymers (e.g., polyvinyl alcohol (PVA)). In one embodiment, a solution of pre-hydrolyzed (3-aminopropyl)triethoxysilane and deionized water is passed through a multilayer hose to form a pre-treated multilayer hose. In some embodiments, one or more pre-treated hoses interconnect liquid-coolant cooling system components (e.g., cold plates, headers, manifolds, pumps, reservoirs, and heat exchangers) of a cooling apparatus that removes heat from one or more electronic components. | 04-23-2015 |
20150116938 | Heat Sink Device for Power Modules of Power Converter Assembly - A heat sink for power modules can be incorporated into a power module of a machine. In embodiments, an alloy is extruded to form a body with a plurality of divider webs integral thereto and defining a plurality of longitudinal passage segments inside the body. The body is machined to remove alternating end portions of the divider webs to define a fitting end turn area and a return end turn area disposed in opposing relationship with each other, thereby forming a serpentine fluid passage. A fitting end cap is welded to the body. A fluid inlet and a fluid outlet of the fitting end cap are respectively in fluid communication with a passage inlet and a passage outlet of the serpentine fluid passage. | 04-30-2015 |
20150116939 | Auto-Compensating Temperature Valve Controller for Electro-Rheological Fluid Micro-Channel Cooled Integrated Circuit - A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature. | 04-30-2015 |
20150124406 | HEAT-RECEIVING DEVICE, COOLING DEVICE, AND ELECTRONIC DEVICE - A heat-receiving device includes: a plurality of heat receivers into which a refrigerant flows; a series path that comprises a connection path connecting adjacent heat receivers among the plurality of heat receivers, that connects the plurality of heat receivers in series, and into which the refrigerant flows; a bypass path that is not connected to the plurality of heat receivers, and into which the refrigerant flows; a branch path that connects the connection path and the bypass path, and into which the refrigerant flows; and a throttle valve that is provided in the connection path on an upstream side with respect to a connection point of the connection path and the branch path, and that reduces a flow rate at which the refrigerant flows into the connection path as a temperature of the refrigerant flowing into the connection path decreases. | 05-07-2015 |
20150131228 | HEAT EXCHANGE DEVICE, ELECTRONIC SYSTEM, AND COOLING METHOD OF ELECTRONIC SYSTEM - A heat exchange device that is coupled to an electronic device that includes an electronic component that generates heat, the heat exchange device includes: a first-channel through which a first-coolant that cools the electronic component flows; a heat-exchange-unit that performs heat exchange between the first-coolant and a second-coolant; a second-channel through which the second-coolant-flows; a first-coolant-detection-unit that detects leakage of the first-coolant from the first-channel; a collection-unit that collects the first-coolant that is leaked from the first-channel; a storage-unit that is provided in the first-channel and supplies the stored first-coolant to the first channel; a recovery-unit that is provided between the collection-unit and the storage-unit; and a control-unit that causes the recovery-unit to recover the first-coolant that is collected by the collection unit, into the storage-unit when the first-coolant-detection-unit detects leakage of the first-coolant. | 05-14-2015 |
20150138729 | Solar Inverter - A solar inverter is provided having a cooling module, a DC module, an inverter module and an AC module provided side-by-side within a chassis. The DC module includes an input accessible from a first side of the chassis and a disconnection switch on a second side of the chassis, with the input being configured to be connected to a DC solar power source. The AC module includes an output accessible from the first side of the chassis and a disconnection switch provided on the second side of the chassis. The cooling module is configured to pump a liquid coolant around the solar inverter in order to cool elements of the DC module, the inverter module and/or the AC module. | 05-21-2015 |
20150138730 | HEAT RECEIVING APPARATUS, COOLING APPARATUS, AND ELECTRONIC APPARATUS - A heat receiving apparatus includes a heat receiver including: a case that is provided at its inside with a flow path through which a refrigerant flows, and that conducts heat from a heat-generating part arranged outside the case; and a valve that is capable of changing a cross sectional area of a part of the flow path in a state where the refrigerant flows through the flow path. | 05-21-2015 |
20150146376 | HEAT-RECEIVING DEVICE, COOLING DEVICE, AND ELECTRONIC DEVICE - A heat-receiving device includes: a first heat receiver into which a refrigerant flows, and that receives heat from a heat-generating part; and a second heat receiver into which the refrigerant discharged from the first heat receiver flows, and that receives heat from the heat-generating part or another heat-generating part; wherein the first heat receiver includes: a case; a flow path that includes first and second branch paths branch off from each other and are joined again, that is provided within the case, and through which the refrigerant flows; and a thermostat that is provided in the first branch path, and that reduces a flow rate of the refrigerant flowing through the first branch path as a temperature of the refrigerant flowing through the first branch path decreases. | 05-28-2015 |
20150305198 | MONOLITHIC MULTI-MODULE ELECTRONICS CHASSIS WITH MULTI-PLANAR EMBEDDED FLUID COOLING CHANNELS - A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process. | 10-22-2015 |
20150313040 | Power Converter - The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. | 10-29-2015 |
20150334874 | Coldplate with Integrated Electrical Components for Cooling Thereof - A coldplate for use in cooling electrical components may include first and second coldplate members, each having a pocket and a secondary portion. The pocket of each member is configured to receive an electrical component and sized to substantially surround the component when received in the pocket to provide physical integration of the component in the coldplate member. The first and second coldplate members are adapted to be joined together to form a manifold therebetween for receiving a fluid for use in cooling the electrical components. The secondary portion of each coldplate member is arranged substantially opposite the pocket of the other coldplate member when the coldplate members are joined together. | 11-19-2015 |
20150334875 | Coldplate with Integrated DC Link Capacitor for Cooling Thereof - A coldplate for use with an inverter of an electric vehicle includes a coldplate member. The coldplate member includes a pocket configured to receive a DC link capacitor of the inverter therein. The pocket is sized to surround the DC link capacitor when the DC link capacitor is received within the pocket to thereby provide physical integration of the DC link capacitor in the coldplate member. | 11-19-2015 |
20150357260 | DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (IC) CHIP - An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer. | 12-10-2015 |
20150359140 | SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE - Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure. | 12-10-2015 |
20150359141 | LIQUID-COOLED JACKET AND ELECTRONIC DEVICE - A liquid-cooled jacket, includes: a cooling chamber including a first inner surface that extends along a to-be-cooled surface of an exothermic component; a heat transfer portion arranged in the cooling chamber and configured to transfer heat from the first inner surface to a second inner surface of the cooling chamber formed to oppose the first inner surface; an inflow path for a refrigerant including one end having an opening at a central portion of the second inner surface; a plurality of outflow holes for the refrigerant arranged in the second inner surface; and an outflow path, formed at a back side of an edge of the second inner surface, through which the refrigerant from the respective outflow holes circulates. | 12-10-2015 |
20150382506 | POWER SEMICONDUCTOR MODULE - A power semiconductor module includes an insulated wiring board; semiconductor elements mounted on one main surface of the insulated wiring board; a heat radiation board bonded to another main surface of the insulated wiring board; a plurality of fins including a first group of fins each having one end fixed to the another main surface of the heat radiation board and another end with a free end; and a water jacket housing the plurality of fins and allowing coolant to flow among the plurality of fins. The plurality of fins further includes a second group of fins as reinforced fins each having one end fixed to the another main surface of the heat radiation board and another end bonded to the water jacket. | 12-31-2015 |
20160007503 | MOUNTING FRAMEWORK FOR ARRANGING ELECTRONIC COMPONENTS - A mounting frame for arrangement of electronic components includes a set of horizontal shelves and vertical posts of the frame with, at least, one internal channel for coolant to pass therethrough, forming coolant feed channel and coolant drain channel. The mounting frame includes at least two horizontal shelves, attached to the horizontal shelves of the frame, and at least one an electronic component installed thereon. One of the horizontal shelf includes at least one flexible hose, connected to the coolant feed channel to connect the coolant feed channel to it of at least one electronic component. The adjacent horizontal shelf includes at least one flexible hose connected with coolant drain channel, so that to link it with own coolant drain channel of, at least, one electronic component, inlet opening for feeding the coolant into coolant feed channel, and outlet opening for removal of coolant from coolant drain channel. | 01-07-2016 |
20160014916 | Power Semiconductor Module With Current Sensor | 01-14-2016 |
20160021785 | ELECTRONIC DEVICE - Embodiments of the present disclosure refers to an electronic device, comprising a first bracket that is made of a first material having a thermal conductivity greater than a first threshold and has therein at least one passage including a chamber; wherein the first bracket and the chamber define a closed space in which a cooling medium having a thermal conductivity greater than a second threshold is able to circulate; and wherein the chamber is provided with a driving body at at least one side wall of the chamber and the driving body is deformable under a perdetermined condition to change a capacity of the chamber so as to drive the cooling medium to flow. | 01-21-2016 |
20160037680 | HEAT DISSIPATION SOLUTION FOR ADVANCED CHIP PACKAGES - A solution for dissipating heat generated from high power chip packages, e.g., a fcBGA package, wbBGA package, 2.5D/3D TSV package, PoP, etc. The heat dissipation system may include a high power chip package including a high power chip. A micro-jet may be attached to the high power chip. A micro-pump may be in fluidic communication with the micro-jet. A heat exchanger may be in fluidic communication with the micro-pump. The high power chip package is assembled on the same PCB with the micro-pump and the heat exchanger. | 02-04-2016 |
20160037682 | Auto-Compensating Temperature Valve Controller for Electro-Rheological Fluid Micro-Channel Cooled Integrated Circuit - A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature. | 02-04-2016 |
20160049354 | POWER SEMICONDUCTOR MODULE AND METHOD FOR COOLING POWER SEMICONDUCTOR MODULE - The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device. | 02-18-2016 |
20160050790 | MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING - A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. | 02-18-2016 |
20160064304 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit. | 03-03-2016 |
20160064305 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes: a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion. | 03-03-2016 |
20160066472 | ELECTRONIC APPARATUS HAVING A COOLING APPARATUS - According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid. | 03-03-2016 |
20160066473 | WIRE HARNESS FIXING STRUCTURE - A wire harness fixing structure includes a cooling medium tank provided with a cooling medium relief valve; a sensor that is installed in the cooling medium tank; a connection terminal that is located beyond the cooling medium relief valve as viewed from a position where the sensor is installed; a wire harness that electrically connects the sensor to the connection terminal; and a bracket that is fastened to the cooling medium tank and that fixes the wire harness. The bracket includes a fastened portion that is fastened to the cooling medium tank, and a retention portion that has a substantially U-shaped form closed at a side facing the cooling medium relief valve and that retains the wire harness in the U-shaped form. | 03-03-2016 |
20160073556 | Electric Power Convertor - An electric power converter | 03-10-2016 |
20160079145 | ELECTRIC POWER CONVERTER AND METHOD FOR MANUFACTURING THE SAME - An electric power converter includes a laminated semiconductor unit, a beam member that supports the laminated semiconductor unit from a rear end in a laminating direction, a frame, and a plurality of pressing plates. The frame that accommodates the laminated semiconductor unit, and has an insertion opening in a rear thereof in the laminating direction into which the laminated semiconductor unit can be inserted. The plurality of pressing plates are accommodated between a front wall portion of the frame and the laminated semiconductor unit, and the pressing plates press the laminated semiconductor unit in a direction from the front toward the rear. The plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction. The beam member is fixed to the frame. | 03-17-2016 |
20160079744 | POWER CONVERSION APPARATUS - A power conversion apparatus has a configuration in which plate-like bus-bars are laminated via an insulating material to define a pair of bus-bars. A laminated bus-bar, in which the pair of bus-bars is disposed vertically so that a width direction thereof is in a vertical direction, includes a pair of voltage measuring terminals that is correspondingly branched from a part of the pair of bus-bars to extend toward a circuit board. The pair of voltage measuring terminals is arranged symmetrically with respect to the pair of bus-bars to extend upward toward the circuit board, while extending in an intersecting direction intersecting with the pair of bus-bars, to be electrically connected to the circuit board. | 03-17-2016 |
20160081178 | Liquid Cooled Metal Core Printed Circuit Board - The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems. | 03-17-2016 |
20160081233 | POWER CONVERSION APPARTATUS - A power conversion apparatus | 03-17-2016 |
20160088767 | SUBSEA UNIT WITH CONDUCTION AND CONVECTION COOLING - A subsea unit includes a housing containing a dielectric liquid, a first heat generating component and a second heat generating component. The first heat generating component is arranged in thermal connection with the housing and the second heat generating component is arranged at a distance from the housing. A method of cooling heat generating components contained in a housing of a subsea unit is also presented. | 03-24-2016 |
20160088778 | Power Converter Arrangement And Method For Producing A Power Converter Arrangement - A three-dimensional arrangement for a power converter device, e.g., an inverter or a rectifier, is provided. The switching elements, activation electronics, the load connections of the power converter device are arranged on a carrier device in such a way that defines especially short conduction paths. The components of the power converter device (e.g., all required components), such as switching elements, control electronics, and load connections, are arranged on a common carrier device. The carrier device is simultaneously used as a cooling device for the entire switching device. The power converter device may thereby achieve particularly efficient performance. | 03-24-2016 |
20160095253 | ENCLOSURE FOR LIQUID SUBMERSION COOLED ELECTRONICS - An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure. | 03-31-2016 |
20160095264 | Power Module and Power Conversion Apparatus Using Same - A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member. | 03-31-2016 |
20160105997 | LIQUID COOLING SYSTEM FOR AN ELECTRONIC COMPONENT - A liquid cooling system for an electronic component, comprising an exchanger plate having a first wall suitable to be at least partially interfaced to an electronic component to be cooled and a second wall, placed in contact with a cooling liquid, a plurality of heat sink elements, associated to said second wall and influenced by the cooling fluid so as to dissipate heat, wherein the heat sink elements are shaped according to regular patterns that extend parallel to a main extension direction and that comprise a plurality of loops, wherein each loop comprises a continuous curvilinear section that extends cantilevered from a first to a second attachment end fixed to the second wall. Advantageously, the continuous curvilinear section is shaped so that, a first and a second plane being traced perpendicular to the second wall passing respectively through said first and second ends, the continuous curvilinear section extends at least partially outside the space defined between said perpendicular planes. | 04-14-2016 |
20160106011 | ELECTRIC POWER CONVERTER - An electric power converter includes a laminated body, a capacitor, a case, and a pressing member. The laminated body is formed by laminating semiconductor modules and cooling pipes. The pressing member presses the laminated body in a laminating direction of the laminated body. The case has outer wall portions that form an outer shell, and partition wall portions formed in the case and are connected to the outer wall portions. The capacitor has capacitor elements and a sealing member. The sealing member is filled in a capacitor housing space in a state where the capacitor elements are sealed. Pressing force of the pressing member is applied to an interposing partition wall portion interposing between the laminated body and the capacitor among the partition wall portions. A thickness of the interposing partition wall portion is made thinner than any other parts of the outer wall portions. | 04-14-2016 |
20160126160 | SYSTEM FOR COOLING DUAL SIDES OF POWER SEMICONDUCTOR DEVICE - A system for cooling dual sides of power semiconductor devices includes two (2) cooling water flow passages, each of which being bent in the “ | 05-05-2016 |
20160128240 | COOLING FLOW CHANNEL MODULE FOR POWER CONVERSION DEVICE AND POWER CONVERSION DEVICE INCLUDING THE SAME - Provided are a cooling flow channel module for a power conversion device, in which a structure of a cooling flow channel for cooling a power conversion device including an inverter or an LDC is simplified to facilitate manufacturing and assembling, and a power conversion device including the same. The cooling flow channel module includes an intake flow channel, a discharge flow channel disposed to be parallel to the intake flow channel, and a cooling pipe configured to connect the intake flow channel and the discharge flow channel and cool the heating element disposed thereabove or therebelow, wherein a plurality of cooling pipes are provided and connect a side portion of the intake flow channel and a side portion of the discharge flow channel disposed to be parallel to each other. | 05-05-2016 |
20160143132 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board includes: a core portion comprising a fluid path, the fluid path being open toward an outside of the circuit board to allow a fluid outside the circuit board to pass through the fluid path; and insulation layers disposed above and below the core portion. | 05-19-2016 |
20160143184 | LIQUID-COOLED HEAT SINK ASSEMBLIES - Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure. | 05-19-2016 |
20160143185 | LIQUID-COOLED HEAT SINK ASSEMBLIES - Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure. | 05-19-2016 |
20160150678 | Silicon Cooling Plate With An Integrated PCB - Examples of a silicon cold plate with an integrated PCB are described. An apparatus may include a silicon plate, one or more electrical and thermal connections, and a heat-generating device. The silicon plate may include a first side and a second side opposite the first side, a plurality of edges between the first side and the second side, one or more internal coolant flow channels therein, one or more coolant inlet ports disposed on one or more of the edges and configured to allow a coolant to flow into the one or more internal coolant flow channels, and one or more coolant outlet ports disposed on one or more of the edges and configured to allow the coolant to flow out of the one or more internal coolant flow channels. The one or more electrical and thermal connections may be disposed on the first side of the silicon plate. The heat-generating device may be disposed on the one or more electrical and thermal connections. | 05-26-2016 |
20160183407 | BOARD ASSEMBLY INCLUDING COOLING SYSTEM AND ELECTRONIC APPARATUS | 06-23-2016 |
20160183409 | MODULAR JET IMPINGEMENT ASSEMBLIES WITH PASSIVE AND ACTIVE FLOW CONTROL FOR ELECTRONICS COOLING | 06-23-2016 |
20160191834 | TRANSMISSION SYSTEM - According to an embodiment, system includes transmitter, pump, controller, tank and thermal storage. Pump circulates water through the transmitter. Controller drives the pump, circulates the water while the transmitter is operating, and stops the circulation of the water at a time of a stop of the transmitter. Tank stores the water circulated through the transmitter, and supplies the water to the pump. Thermal storage is provided on a surface of the tank, and stores waste heat of the exothermic part of the transmitter, which was taken in the water via the tank. Thermal storage changes in phase if a temperature of the water in the tank lowers to a predetermined temperature or below, and heats the water by latent heat which occurs. | 06-30-2016 |
20160192539 | STACK UNIT - With respect to a stack unit in which a plurality of power cards and a plurality of coolers are stacked, each of the plurality of power cards housing semiconductor element, a technique for improving the fitting of a stack unit to a housing is taught. A stack unit is a unit that coolers and power cards are stacked. An outer frame binds a stack of the power cards and the coolers. The outer frame pressurizes the stack along with the stacked direction. Each of the coolers comprises a main body and a metal plate. The main body includes a flow channel of coolant and an opening provided at a position facing the power card. The metal plate has one surface closing the opening. A seal between the opening and the metal plate is secured by pressure of the outer frame. | 06-30-2016 |
20160192540 | Electric Converter with Compact Module Arrangement for Subsea Applications - An electric converter system, including a housing configured to receive a dielectric fluid, at least two electric modules, each including a first space and a second space, the first space including a connecting portion and a cooling system configured to circulate the dielectric fluid to cool the electric modules. The converter system further includes an inter module bus bar portion including a complementary connecting portion, whereby the connecting portion is configured to be connected to the complementary connecting portion of the inter module bus bar portion, whereby the inter module bus bar portion is configured to interconnect one of the at least two electric modules with the other of the at least two electric modules, said one electric module being proximate to said other electric module, and whereby the connecting portion, the first space and the second space of each electric module are arranged in series. | 06-30-2016 |
20160205809 | HEAT EXCHANGER, COOLING UNIT, AND ELECTRONIC DEVICE | 07-14-2016 |
20160254212 | ONBOARD ELECTRONIC DEVICE | 09-01-2016 |
20160381827 | PLASTIC CHASSIS FOR LIQUID COOLED ELECTRONIC COMPONENTS - A system for mounting liquid cooled electrical components includes a plastic chassis having a plurality of mounting sites. The plastic chassis defines at least one fluid circuit that extends through at least a portion of a length of the plastic chassis. The at least one fluid circuit includes an inlet configured to receive a cooling fluid from a fluid source, an outlet configured to return the cooling fluid to the fluid source, and at least one fluid channel extending between the inlet and the outlet. The system also includes a plurality of electrical components. Each of the plurality of electrical components is coupled with one of the plurality of mounting sites. Each of the plurality of mounting sites is in contact with the at least one fluid channel. | 12-29-2016 |
20160381829 | COOLING DEVICE AND WIRELESS POWER SUPPLY SYSTEM - A cooling device of the present disclosure is attached to a park station where wireless power supply is performed to a vehicle using a coil and cools a coil provided on the vehicle by spraying a coolant. | 12-29-2016 |
20180027695 | LIQUID COOLING DEVICE, LIQUID COOLING SYSTEM, AND CONTROL METHOD OF LIQUID COOLING DEVICE | 01-25-2018 |
20180027704 | POWER CONVERSION DEVICE | 01-25-2018 |
20190150312 | A Device Comprising Server Modules | 05-16-2019 |
20190150321 | DEVICE FOR COOLING ELECTRONIC COMPONENTS | 05-16-2019 |
20190150328 | POWER CONTROL DEVICE AND STRUCTURE OF MOUNTING THE SAME | 05-16-2019 |
20220141998 | LIQUID COOLING DEVICE - A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space. | 05-05-2022 |
20220142010 | VEHICLE-MOUNTED DEVICE AND VEHICLE - This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component. | 05-05-2022 |