Entries |
Document | Title | Date |
20080205015 | LEAD FRAME MOUNT FOR CIRCUIT COMPONENT - An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein. | 08-28-2008 |
20080225503 | ELECTRONIC SYSTEM WITH INTEGRATED CIRCUIT DEVICE AND PASSIVE COMPONENT - An electronic system with integrated circuit device and passive component is disclosed. One embodiment provides a printed circuit board, a method for fabricating an electronic system, and an electronic system, including at least one integrated circuit device and at least one passive component, wherein the passive component is arranged at least partially underneath the integrated circuit device. | 09-18-2008 |
20080232075 | Electronic Component and Manufacturing the Same - The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resister element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced. The four-chips connected resister device | 09-25-2008 |
20080239685 | CAPACITOR BUILT-IN WIRING BOARD - A wiring board is comprised of a core board, a capacitor, a conductor containing portion and a laminated wiring portion. The core board has an accommodation hole. The capacitor has a through hole therein and is accommodated in the accommodation hole. The conductor containing portion has a current supplying conductor and is disposed in the through hole so as to be surrounded by the capacitor. The laminated wiring portion includes a component mounting region in which a first connection terminal electrically connected to the current supplying conductor is provided. Further, second connection terminals are disposed so as to sandwich the first connection terminal therebetween. | 10-02-2008 |
20080253099 | COMPATIBLE CIRCUIT FOR INTEGRATED CIRCUITS AND LAYOUT METHOD FOR THE SAME - A compatible circuit for integrated circuits (ICs) includes three input terminals coupled to corresponding pins of an IC, and three function terminals corresponding to the three input terminals. Each input terminal coupled to the three function terminals via three transmission lines, each transmission line has an open segment, and each input terminal is electrically coupled to a corresponding function terminal by selectively mounting a connection component on the open segment of the corresponding transmission line according to a specification of the IC. | 10-16-2008 |
20080253100 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME - A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component | 10-16-2008 |
20080259580 | Method for mounting leaded component to substrate - A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate. | 10-23-2008 |
20090027866 | SEMICONDUCTOR DIE PACKAGE WITH INTERNAL BYPASS CAPACITORS - Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between the processor chip and a circuit board. This package has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the processor chip. A plurality of bypass capacitors are integrated into the package and are coupled between the power and ground connections for the processor chip, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device. | 01-29-2009 |
20090059545 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes a semiconductor element, a supporting substrate where the semiconductor element is mounted, and a capacitor provided on the semiconductor element and coupled to the supporting substrate via an outside connection terminal. The capacitor includes a valve metal part, an anodic oxide film formed on a surface of the valve metal part, and a conductive part formed on the anodic oxide film and made of a conductive material. | 03-05-2009 |
20090059546 | STACKABLE ELECTRONIC COMPONENT - An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side. | 03-05-2009 |
20090067145 | CIRCUIT PATTERN DESIGNING METHOD, WHEREIN AN ELECTROCONDUCTIVE COATING MATERIAL IS USED, AND A PRINTED CIRCUIT BOARD - In a method of preparing a circuit pattern on a printed circuit board, reflow wiring is performed by printing the circuit pattern on an insulative board with an electroconductive coating material and printing a cream solder in a wiring pattern portion of the circuit pattern to form a metal conductor. Other portions of the printed, electroconductive coating material are arranged to function as any one of a resistor (R), a capacitor (C), and a coil (L), by taking advantage of the resistance and electrostatic capacitance of the electroconductive coating material. | 03-12-2009 |
20090086453 | Package with passive component support assembly - A package ( | 04-02-2009 |
20090129039 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7. | 05-21-2009 |
20090135570 | METHOD FOR IMPROVING EBG STRUCTURES AND MULTI-LAYER BOARD APPLYING THE SAME - A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel. | 05-28-2009 |
20090154127 | PCB Embedded Electronic Elements Structure And Method Thereof - Structure of embedded electronic elements in a PCB (printed circuit board) and the method for embedding the structure include assembling the electronic elements (such as a capacitor, a resistor, a diode) on the PCB, and then laminating other circuit layers. A group of electrodes of the electronic elements are aligned to a group of junctions on the PCB, respectively; the electronic elements are assembled on the group of junctions on the PCB; and then a metal layer is laminated on the PCB using gel film (dielectric gel) in which the PCB includes already embedded electronic elements. | 06-18-2009 |
20090161330 | CHIP CARRIER AND FABRICATION METHOD - A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side. | 06-25-2009 |
20090175014 | ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT - An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor. | 07-09-2009 |
20090201656 | Semiconductor package, and method of manufacturing semiconductor package - A semiconductor package is obtained by separately preparing a board having, as formed on the surface thereof, an interconnect pattern containing a fine pattern having a narrow interconnect pitch adapted to connection with a high-pin-count device, and a board having, as formed on the surface thereof, an interconnect pattern containing no fine pattern but only a rough pattern having a wide interconnect pitch adapted to connection with a low-pin-count device; by mounting the devices respectively on these boards; and by stacking these boards. | 08-13-2009 |
20090207576 | SLOTTED MAGNETIC MATERIAL FOR INTEGRATED CIRCUIT INDUCTORS - An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of magnetic material within the slotted magnetic material structure, and in particular those magnetic material layers adjacent to insulator layers. | 08-20-2009 |
20090213561 | ELECTRONIC DEVICE - An electronic device includes an insulative substrate, a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer, a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate, and a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit. | 08-27-2009 |
20090237904 | Power Converter Apparatus - A power converter apparatus includes a substrate | 09-24-2009 |
20090257211 | Power Converter Apparatus - A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, capacitors, and a cover is disclosed. Pairs of groups of switching elements are mounted on the substrate. The cover is arranged over the substrate to encompass the switching elements, the positive interconnection member, the negative interconnection member, and the capacitor. The positive interconnection member and the negative interconnection member each have a terminal portion that is joined to a circuit pattern on the substrate by ultrasonic bonding. | 10-15-2009 |
20090290317 | PRINTED CIRCUIT BOARD, METHOD OF FABRICATING PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns. | 11-26-2009 |
20100061071 | DC-DC CONVERTER - A DC-DC converter comprising a soft-magnetic, multi-layer substrate provided with a laminated coil constituted by connecting pluralities of conductor lines, and a semiconductor integrated circuit device comprising a switching device and a control circuit, which are mounted on the soft-magnetic, multi-layer substrate; the semiconductor integrated circuit device comprising an input terminal, an output terminal, a first control terminal for controlling the ON/OFF of the switching device, a second control terminal for variably controlling output voltage, and pluralities of ground terminals; the soft-magnetic, multi-layer substrate comprising first external terminals formed on a first main surface, first connecting wires formed on the first main surface and/or on nearby layers, second connecting wires formed between the side surface of the multi-layer substrate and a periphery of the laminated coil, and second external terminals formed on a second main surface; and terminals of the semiconductor integrated circuit device being connected to the first external terminals on the multi-layer substrate, at least part of the first external terminals being electrically connected to the second external terminals through the first and second connecting wires, and the input or output terminal being connected to the second external terminals via the laminated coil. | 03-11-2010 |
20100073893 | MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE - Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer. | 03-25-2010 |
20100073894 | Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same - A coreless substrate includes a stiffener material ( | 03-25-2010 |
20100085719 | CHIP PACKAGE STRUCTURE WITH SHIELDING COVER - A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and the shielding cover are disposed on the substrate. The chip is electrically connected to the substrate. The shielding cover covers the chip and has leads connected to the substrate. The leads include a first lead and a second lead. The first lead connected to a portion of the substrate is located between the pair of first passive components and arranged along a first axis with the pair of first passive components. The second lead connected to a portion of the substrate is located between the pair of second passive components and arranged along a second axis with the pair of second passive components. | 04-08-2010 |
20100091473 | Electrical Component - A stable electrical component includes a carrier substrate and a chip ( | 04-15-2010 |
20100124035 | Integrating Capacitors Into Vias Of Printed Circuit Boards - A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor integrated within the via, the capacitor including two capacitor plates, an inner plate and an outer plate, the two plates composed of electrically conductive material disposed upon the inner surface of the via hole, both plates traversing layers of the laminate, the inner plate traversing more layers of the laminate than are traversed by the outer plate; and a layer of dielectric material disposed between the two plates. | 05-20-2010 |
20100124036 | SOLDERLESS ELECTRONIC COMPONENT OR CAPACITOR MOUNT ASSEMBLY - A solderless electronic component or capacitor mount assembly including a housing having a base portion and a cover portion. The cover portion and base portion being couplable to each other so as to secure a capacitor to the housing. The assembly further including at least one connector configured to couple the assembly to a printed circuit board, and at least one electrical contact configured to contact a respective at least one lead of the capacitor and provide an electrical connection for the capacitor. | 05-20-2010 |
20100172111 | CIRCUIT BOARD - A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks. | 07-08-2010 |
20100172112 | SEMICONDUCTOR MEMORY CARD WITH CONTROLLER CHIP - A semiconductor memory card includes a semiconductor memory, a controller, input/output terminals, resistive elements, first wires, and second wires. The semiconductor memory is mounted on one surface of a substrate. The controller is mounted on the other surface of the substrate and controls the semiconductor memory. The input/output terminals input and output signals to and from the semiconductor memory via the controller. The resistive elements electrically connect input/output terminals to the controller. The first wires connect one-side ends of each of the resistive elements to the controller and each of which has a wire length of 4.0 mm or less. The second wires connect the other-side ends of each of the resistive elements to the input/output terminals. | 07-08-2010 |
20100177492 | MEMORY BOARD STRUCTURE HAVING STUB RESISTOR ON MAIN BOARD - A memory system includes; a main board having memory bus with a wiring line communicating a signal from a memory controller mounted on the main board, first and second module sockets mounted on the main board and connecting the wiring line to first and second memory modules respectively inserted into the first and second module sockets, where the first memory module includes a first electrode connected to the wiring line and the second memory module includes a second electrode connected to the wiring line, and first and second stub resistors disposed on the main board and arranged as primary dual-branching stub resistors forming a T-branch connection structure between the first and second electrodes and a branching node connected to the wiring line. | 07-15-2010 |
20100182760 | CIRCUIT BOARD AND SEMICONDUCTOR DEVICE - A printed circuit board includes a source interconnect and a ground interconnect, and the circuit board has a two-dimensional geometry having a corner. Protruding portions are provided in circumferences of the source interconnect and the ground interconnect in regions except the corner in plan view, and the source interconnect and the ground interconnect are connected to a common first decoupling capacitor in each of the protruding portions. | 07-22-2010 |
20100188830 | CONDUCTIVE MODULE AND ASSEMBLY STRUCTURE HAVING SUCH CONDUCTIVE MODULE - The present invention provides a conductive module used for assembling a magnetic element and an electronic component. The conductive module includes a conductive base, an electronic component and a plurality of conductive units. The electronic component is electrically connected to the conductive base and disposed on one side of the conductive base. The conductive units have respective hollow portions. The conductive units are spaced from each other and fixed on the conductive base such that the hollow portions of the conductive units are aligned with each other to define a channel. | 07-29-2010 |
20100246151 | ELECTRONIC COMPONENT MODULE - In a DC-DC converter module, a first through-hole conductor provided in a substrate as a first lead for electrically connecting a terminal as a voltage output terminal of an IC and a first terminal of an inductor component to each other and a second through-hole conductor provided in the substrate as a second lead for electrically connecting a terminal as a switching terminal of the IC and a second terminal of the inductor component to each other oppose each other in a direction intersecting a direction in which the first and second terminals oppose each other in the inductor component (i.e., the longitudinal direction of the substrate and inductor component). | 09-30-2010 |
20100254108 | DISPLAY DEVICE AND METHOD OF DRIVING THE SAME - A display device includes a display panel on which an image is displayed, and a driving board. The driving board includes a substrate, a first multi-layer ceramic condenser disposed on the substrate and to which a first current is supplied, and a second multi-layer ceramic condenser disposed substantially parallel with the first multi-layer ceramic condenser and to which a second current is supplied. The first current and the second current are supplied to the first multi-layer ceramic condenser and the second multi-layer ceramic condenser, respectively, in opposite directions. | 10-07-2010 |
20100265682 | Semiconductor Chip Package with Undermount Passive Devices - Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board. | 10-21-2010 |
20100321909 | Ultra-wideband assembly system and method - An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board. | 12-23-2010 |
20100321910 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first signal layer, a first reference layer, a second reference layer, and a second signal layer. An integrated circuit mounted on the first signal layer includes a power supply terminal connected to a first power supply via. The second signal layer includes a filter and a power supply wire. The filter includes a power terminal connected to the first power supply via, and a ground terminal connected to the second reference layer. The first power supply via is connected to the first reference layer through the power supply wire and a second power supply via. A void defined in the second reference layer is at least partially vertically overlapping with the power supply wire, and enables the first reference layer to function as a reference plane for the power supply wire, to increase impedance of the power supply wire. | 12-23-2010 |
20100321911 | CAPACITOR AND ELECTRONIC SUBSTRATE INCLUDING THE SAME - A capacitor including a substrate; a conductive layer provided on the substrate and containing conductive particles; a valve metal sheet having a dielectric part formed throughout an entire surface of the conductive layer; a protection layer covering the valve metal sheet; a first electrode terminal electrically connected to the conductive layer and partially exposed from an external surface of the protection layer; and a second electrode terminal electrically connected to a surface of the valve metal sheet which is opposite to a surface of the valve metal sheet on which the dielectric part is provided, and the second electrode terminal partially exposed from the external surface of the protection layer; wherein the dielectric part is made of an oxide of a metallic material of the valve metal sheet, the dielectric part is formed with a corrugated surface on the conductive layer, and the conductive particles of the conductive layer are in contact with the corrugated surface of the dielectric part. | 12-23-2010 |
20110032685 | INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME - An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device. | 02-10-2011 |
20110069463 | Method of Using Conductive Elastomer for Electrical Contacts in an Assembly - A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device. | 03-24-2011 |
20110085311 | Apparatus and Method for Vertically-Structured Passive Components - A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications. | 04-14-2011 |
20110090660 | PRINTED CIRCUIT BOARD - A printed circuit board includes a board body, a number of filtering capacitors, and a chip. The board body includes a chip mount area. The chip mount area includes a first area and a second area. The first and second areas each include a number of pads. The second area is surrounded by the first area. The pads of the second area are electrically connected to pins of the number of filtering capacitors. The pads of the first area are electrically connected to pins of the chip. The number of filtering capacitors is sandwiched between the chip and the second area. | 04-21-2011 |
20110090661 | CIRCUIT BOARD WITH CAPACITOR HAVING A MULTILAYER BODY AND DISPLAY DEVICE USING SAME - An exemplary circuit board includes a plate body and a multilayer capacitor installed on a surface of the plate body. The multilayer capacitor includes a multilayer body and two outer electrodes located at the two opposite ends of the multilayer body. The multilayer body includes a plurality of ceramic layers and a plurality of internal electrodes alternately arranged. The two outer electrodes are connected to the plate body, and a stacking direction of the multilayer body is substantially parallel to the surface of the plate body. | 04-21-2011 |
20110090662 | METHOD AND APPARATUS FOR IMPROVING POWER NOISE OF BALL GRID ARRAY PACKAGE - An apparatus and method of improving power noise of a Ball Grid Array (BGA) package are provided. The method includes securing a space for a passive element mounting pad, on which a passive element can be mounted, adjacent to a power pad on a Printed Circuit Board (PCB) corresponding to a power pin of the BGA package, mounting the passive element on the passive element mounting pad, and mounting the BGA package at a position on the PCB, wherein the position on the PCB overlaps the passive element and further wherein the BGA package is mounted above the passive element. | 04-21-2011 |
20110096521 | ELECTRONIC PASSIVE DEVICE - A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element. | 04-28-2011 |
20110103030 | Packages and Methods for Mitigating Plating Stub Effects - Packages and methods for mitigating plating stub effects. The semiconductor package includes an interposer substrate having a first side, a second side, a peripheral edge connecting the first side with the second side, a signal line on the first side, and an electrode pad on the first side. A semiconductor element is mounted on the first side of the interposer substrate. The semiconductor element is connected with the electrode pad by the signal line. A terminating resistor is mounted on the interposer substrate. A plating stub, which is located on the interposer substrate, has a first end portion that terminates near the peripheral edge of the interposer substrate and a second end portion that is electrically connected to the electrode. The first end portion is electrically connected through the terminating resistor to an electrical ground. | 05-05-2011 |
20110110060 | ELECTRONIC COMPONENT MOUNTING STRUCTURE - An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component | 05-12-2011 |
20110141712 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves. | 06-16-2011 |
20110164392 | POWER INTEGRITY CIRCUITS WITH EMI BENEFITS - A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals. | 07-07-2011 |
20110199745 | MOUNTABLE ELECTRONIC CIRCUIT MODULE - A mountable electronic circuit module which produces appropriate characteristics without a complicated structure can be a DC-DC converter including a baseboard made of a magnetic material. A helical electrode is provided in the baseboard so as to function as a smoothing inductor device. Capacitor devices in addition to a DC-DC converter IC are mounted on a main surface of the baseboard. A circuit electrode arranged to connect the circuit devices is provided to enable the circuit devices to function as the DC-DC converter. The DC-DC converter is mounted on a motherboard through external connection electrodes of the capacitor devices. | 08-18-2011 |
20110205720 | INTEGRATED CHIP PACKAGE STRUCTURE USING ORGANIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry. | 08-25-2011 |
20110211320 | Multilayer Wiring Substrate and Method of Manufacturing the Same - A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface. | 09-01-2011 |
20110211321 | MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer circuit board ( | 09-01-2011 |
20110222255 | ELECTRONIC CIRCUIT - An electronic circuit is obtained that has reduced EMI levels. The circuit includes an integrated circuit, which is a source of noise, a bypass capacitor, and a circuit substrate on which they are mounted. An electronic circuit one electrode terminal of the bypass capacitor and one connecting electrode of the integrated circuit are connected through a first wire interconnect formed in the circuit substrate, and, additionally, another electrode terminal of the bypass capacitor and another connecting electrode of the integrated circuit are connected through a second wire interconnect, and the gap between the first wire interconnect and the second wire interconnect is made smaller than either the gap between the one connecting electrode and the other connecting electrode on the integrated circuit or the gap between the one electrode terminal and the other electrode terminal of the bypass capacitor. | 09-15-2011 |
20110235295 | Semiconductor Device - A passive RF tag has an advantage of being compact and lightweight. However, the driving power is limited. In order to increase the maximum communication distance and the number of objects simultaneously identified, power consumption should be efficient and reduced. The semiconductor device includes an antenna circuit, a modulation circuit electrically connected to the antenna circuit, a filter circuit electrically connected to the modulation circuit, and a logic circuit electrically connected to the filter circuit, in which the modulation circuit includes a first resistor and a transistor, the filter circuit includes a capacitor, one terminal of the first resistor is electrically connected to one of a source and a drain of the transistor, the other terminal of the first resistor is electrically connected to the antenna circuit, and a gate of the transistor is electrically connected to one terminal of the capacitor and the logic circuit. | 09-29-2011 |
20110242781 | Module and Electronic Device - According to one embodiment, a module includes a circuit substrate having a circuit pattern which is formed of a first conductor and which includes a signal circuit, a bonding member formed of a second conductor different from the first conductor, a passive element and an active element bonded to the circuit pattern with the bonding member to implement the circuit substrate, and a detection circuit provided separately from the signal circuit on the circuit substrate. The detection circuit includes a detector having the first conductor and the second conductor which are provided on the circuit substrate and which are electrically connected to each other, a power source configured to supply current to the detector, and a measuring instrument interposed between one of the first and the second conductors in the detector and the power source and configured to measure electrical characteristics between the first and the second conductors. | 10-06-2011 |
20110279991 | SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTURE - A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper. | 11-17-2011 |
20110292626 | LOWER-FACE ELECTRODE TYPE SOLID ELECTROLYTIC MULTILAYER CAPACITOR AND MOUNTING MEMBER HAVING THE SAME - In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting. | 12-01-2011 |
20110292627 | STACKED INDUCTIVE DEVICE ASSEMBLIES AND METHODS - Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a longitudinal coaxial arrangement) such that the back of one core element associated with a first inductor provides a magnetic flux path for a second inductor. Form-less (bonded) windings are also optionally used to simplify the manufacture of the device, reduce its cost, and allow it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. | 12-01-2011 |
20110304997 | PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD - A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties. | 12-15-2011 |
20110310579 | Inductive Structure and Method of Forming the Inductive Structure with an Attached Core Structure - An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with the pick and place operation after the coil has been formed. In addition, the pick and place operation can also be used to attach one or more integrated circuits to the wafer to form an integrated inductive device. | 12-22-2011 |
20110317387 | Integrated Voltage Regulator with Embedded Passive Device(s) for a Stacked IC - A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a voltage regulator is integrated in the first semiconductor IC and coupled to passive components (for example a capacitor or an inductor) embedded in a packaging substrate on which the stacked IC is mounted. The passive components may be multiple through vias in the packaging substrate providing inductance to the active portion of the voltage regulator. The inductance provided to the active portion of the voltage regulator is increased by coupling the through via in the packaging substrate to through vias in a printed circuit board that the packaging substrate is mounted on. | 12-29-2011 |
20120002388 | PULSE SIGNAL GENERATION DEVICE - To provide a microwave/milliwave band high-frequency pulse signal generating device that enables realization of structural simplification, high performance, compact integration, easy design, low power consumption, and low cost. A radiation type oscillator substrate S | 01-05-2012 |
20120014079 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element. | 01-19-2012 |
20120020042 | NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES - One or more decoupling capacitors are coupled to a low inductance mount that is connected to the bottom layer of a printed circuit board (PCB) on which a semiconductor module is mounted. The low inductance mount includes a magnetic planar structure with vias that are coupled to the one or more decoupling capacitors and to like vias positioned on the PCB. | 01-26-2012 |
20120020043 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer, a power layer, and a ground layer. The signal layer includes an analog audio input/output (I/O) port and an audio chip. The audio chip includes a main body, a first group of signal pins connected to the analog audio I/O port and a second group of signal pins connected to a control chip. The power layer and the ground layer each is divided into two unconnected parts, an audio part and a digital part, by a dividing groove. The two audio parts act as a whole reference plane for traces between the analog audio I/O port and the first group of signal pins of the audio chip. The two digital parts act as reference planes for traces between the control chip and the second group of signal pins of the audio chip. | 01-26-2012 |
20120026707 | PRINTED CIRCUIT BOARD - A printed circuit board includes first and second layers, a control chip, bonding pads, and several electronic elements. The bonding pads can be selectively applied to interconnect the first and second layers, and the control chip with any of the electronic elements in a simple layout. | 02-02-2012 |
20120075820 | Ultra-Wideband Assembly System and Method - An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board. | 03-29-2012 |
20120081869 | PRINTED CIRCUIT BOARD FOR REDUCING CROSSTALK - There is provided a printed circuit board for reducing crosstalk, having a capacitive impedance component connected between signal and ground patterns, the printed circuit board including: signal patterns including a first signal pattern transferring low frequency signals and a second signal pattern transferring high frequency signals; ground patterns including a first ground pattern connected to the first signal pattern and a second ground pattern connected to the second signal pattern which are separated from each other; and a conductive shielding film connected between the first and second ground patterns and shielding electromagnetic waves generated from the printed circuit board. Accordingly, crosstalk between the low and high frequency signals may be reduced. | 04-05-2012 |
20120081870 | ELECTRONIC PASSIVE DEVICE - A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element. | 04-05-2012 |
20120099288 | ELECTRONIC COMPONENT FOR SURFACE MOUNTING - An electrical component for surface mounting, such as a DC-DC power converter includes a body portion including one or more surface mounting pins to connect the body portion to a circuit board, and first and second circuit boards including respective circuit elements mounted thereon. The first and second circuit boards are mounted on the body portion, such that sides of the first and second circuit board on which the circuits are mounted face the interior of the device and the reverse sides of the first and second circuit boards define an exterior surface of the component. In this way, no separate housing for the component is required. The size of the electrical component can therefore be kept small, and protection provided to the circuit elements by the reverse side of the circuit board. | 04-26-2012 |
20120106110 | HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SAME, AND ELECTRONIC DEVICE - A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals. | 05-03-2012 |
20120147579 | PRINTED CIRCUIT BOARD - A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors. | 06-14-2012 |
20120147580 | PRINTED CIRCUIT BOARD - A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas. | 06-14-2012 |
20120155042 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED GROUND OR POWER DISTRIBUTION - A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element. | 06-21-2012 |
20120155043 | PRINTED CIRCUIT BOARD - A printed wiring board is formed by laminating a power supply layer, a ground layer, a first signal wiring layer, and a second signal wiring layer with insulating layers respectively interposed therebetween. An IC and an IC are electrically connected to each other by signal wiring via a signal via hole. In the printed circuit board, a power supply through-hole electrically connected to the power supply layer and a ground through-hole electrically connected to the ground layer are formed. On the outer layers of the printed wiring board, capacitors are mounted, each of which has one end electrically connected to the power supply through-hole and the other end electrically connected to the ground through-hole. | 06-21-2012 |
20120162946 | ELECTRONIC DEVICE - An electronic device including a PCB, a first electronic component, and at least one second electronic component arranged on the PCB. A circuit layer is formed on the PCB. The first electronic component has at least two pins. The pins of the first electronic component are electrically connected to the circuit layer. The first electronic component engages with the PCB to define a chamber. The at least one second electronic component is received in the chamber and electrically connected to the circuit layer. | 06-28-2012 |
20120212919 | INDUCTOR COMPONENT AND PRINTED WIRING BOARD INCORPORATING INDUCTOR COMPONENT AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT - A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode. | 08-23-2012 |
20120262895 | LOW-COST TRANSFORMER ASSEMBLY - A transformer assembly is disclosed. An example circuit board assembly includes a circuit board. A drum core inductor is also included and has a drum core, a first winding, and first and second terminals extending from a first end of the drum core inductor. A wire of the first winding is wound around an axis of the drum core. The first winding has first and second ends coupled to the first and second terminals of the drum core inductor, respectively. A bobbin has first and second terminals extending from a first end of the bobbin. A wire of a second winding is wound around an axis of the bobbin. The second winding has first and second ends coupled to the first and second terminals of the bobbin, respectively. The first ends of the drum core inductor and the bobbin are attached to a circuit board such that the drum core inductor is positioned on the circuit board inside an opening of the bobbin defined along the axis of the bobbin. The drum core inductor and the bobbin are detached from one another. | 10-18-2012 |
20120281379 | ELECTRONIC COMPONENT - In an electronic component in which a semiconductor chip (semiconductor element) and a passive component are integrated on a multilayer wiring board and the semiconductor chip and the passive component constitute a feedback circuit, an input end and an output end of the semiconductor chip (semiconductor element) are electrically separated from each other. The electronic component includes the multilayer wiring board, the semiconductor chip disposed on the main surface of or inside the multilayer wiring board, and the passive component having a first terminal and a second terminal connected to the input end and the output end of the semiconductor chip respectively, and is configured such that a conductive member constituting the multilayer wiring board is located at a position where a distance from at least one of the first terminal and the second terminal is smaller than a distance between the first terminal and the second terminal. | 11-08-2012 |
20120307469 | MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE - A multilayer wiring board includes: a functional area which includes a thin film capacitor having a dielectric layer between an upper electrode and a lower electrode; and a peripheral area other than the functional area, wherein a mooring portion in which the dielectric layer and a conductive layer are laminated is provided in at least a portion of the peripheral area, and a roughness of a surface of the conductive layer which contacts the dielectric layer is greater than a roughness of a surface of the upper electrode or the lower electrode which contacts the dielectric layer. | 12-06-2012 |
20120314392 | CAPACITOR ARRAY SUBSTRATE - A capacitor array substrate includes a substrate, first traces, second traces, capacitors, connecting lines, and signal lines. The substrate has a first, a second, and a third side. The first side is connected with the second and the third side. The first traces are disposed on the substrate in parallel and are not vertical or parallel to the first side. The second traces are disposed on the substrate in parallel. The capacitors are disposed on the substrate at intersections of the first and the second traces and are connected to the first and the second traces. The connecting lines are disposed on the second and the third side of the substrate. Each connecting line is connected to a first and a second trace. The signal lines are disposed on the substrate. Each signal line is connected to a first or a second trace and transmits signals from the first side. | 12-13-2012 |
20120327624 | MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICs) HAVING CONDUCTOR-BACKED COPLANAR WAVEGUIDES AND METHOD OF DESIGNING SUCH MMICs - A MMIC having: a substrate; a plurality of active and passive electrical elements disposed on a top surface of the substrate; a plurality of coplanar waveguide transmission line sections disposed on the top surface of the substrate for electrically interconnecting the active and passive electrical elements; an electrical conductor disposed on a bottom surface of the substrate under the coplanar waveguide section. Edges of ground plane conductors of the coplanar waveguide (CPW) sections have slots therein in regions thereof connected to the active and passive devices. The design of such circuit includes mathematical models of the CPW with the pair of local ground planes and the strip conductor thereof have relatively narrow connectable ports. | 12-27-2012 |
20120327625 | ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT - An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment. | 12-27-2012 |
20130003334 | CHIP COMPONENT, SUBSTRATE AND ELECTRONIC APPARATUS - A chip component is provided with a block including a dielectric, input and output terminals, which are the first and second terminals that are provided on the surface of the block, an adjustment terminal that is a third terminal that includes an internal electrode extended into the block and that is provided on the surface of the block, and at least two inter-terminal circuits that are provided in the block and that are connected between at least two sets of two terminals of the first, second, and third terminals. | 01-03-2013 |
20130107486 | Apparatus and Associated Methods | 05-02-2013 |
20130120949 | METHOD OF MANUFACTURING PASSIVE COMPONENT MODULE - A method of manufacturing a passive component module, comprising the steps of: providing a carrier with alignment marks; bonding passive components to the carrier based on the alignment marks, wherein each passive component has interconnection pads; forming a molding material over the carrier for molding the passive components; separating the molding material with the passive components from the carrier; exposing all interconnection pads of each passive component; and building electrical interconnections between the passive components so that the passive component module is obtained. | 05-16-2013 |
20130120950 | BAND-PASS FILTER MODULE AND MODULE SUBSTRATE - A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss. | 05-16-2013 |
20130135835 | PRINTED CIRCUIT BOARD CAPABLE OF DECREASING ELECTROMAGNETIC INTERFERENCE - A printed circuit board includes an antenna, an EMI source, and inductor. The EMI source is connected to the printed circuit board by a pin. The inductor is connected between the pin and a ground of the printed circuit board. The connected inductor increases the resonant frequency of the EMI source to make the resonant frequency of EMI source away from the antenna. Thereby the EMI generated by the EMI source is decreased and the radiation efficiency of the antenna increases. | 05-30-2013 |
20130141886 | ELECTRONIC PACKAGE STRUCTURE - An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element. | 06-06-2013 |
20130182401 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. | 07-18-2013 |
20130194766 | SIGNAL FILTERING MOUNTING SCTRUCTURE - A signal filter mounting structure includes a circuit board having two spaced lines of metal contacts, a box mounted on the circuit board between the two spaced lines of metal contacts and having two lines of upright bars arranged at opposing front and back sides thereof and a wire management groove defined between each two adjacent upright bars, and signal filters accommodated in the box in reversed directions, each signal filter including a magnetic coil and a plurality of conductor wires wound on the magnetic coil with the end portions thereof respectively extending out of the box through the wire management grooves and respectively soldered to the metal contacts of the circuit board. | 08-01-2013 |
20130194767 | MULTI-INDUCTOR USABLE WITH SLIM FLAT IMAGE DISPLAY APPARATUS - A multi-inductor usable with a slim flat image display apparatus which includes an outer core with a number of through holes formed therein in a horizontal direction; a corresponding number of inner cores provided in respective through holes; a number of windings wound around a respective inner core; a number of electrode leads which project from a bottom surface of the outer core perpendicular to central axes of the through holes. The plurality of electrode are electrically connected with opposite ends of each of the windings. The multi-inductor further includes a sealing member that fixes each of the inner cores to a respective through hole of the outer core. | 08-01-2013 |
20130201645 | MULTI-FUNCTION INDUCTOR AND MANUFACTURE THEREOF - An inductor assembly comprising a first magnetic core and an electrically conductive material configured to wind around at least a portion of the first magnetic core. The electrical conductive material has one or more support structures that extend beyond an outside boundary of the first magnetic core. | 08-08-2013 |
20130258627 | INTERPOSER-BASED DAMPING RESISTOR - Various resistor circuits and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a resistor onboard an interposer. The resistor is adapted to dampen a capacitive network. The capacitive network has at least one capacitor positioned external to the interposer. | 10-03-2013 |
20130271938 | FORMATION OF DRAM CAPACITOR AMONG METAL INTERCONNECT - Techniques are disclosed for integrating capacitors among the metal interconnect for embedded DRAM applications. In some embodiments, the technique uses a wet etch to completely remove the interconnect metal (e.g., copper) that is exposed prior to the capacitor formation. This interconnect metal removal precludes that metal from contaminating the hi-k dielectric of the capacitor. Another benefit is increased height (surface area) of the capacitor, which allows for increased charge storage. In one example embodiment, an integrated circuit device is provided that includes a substrate having at least a portion of a DRAM bit cell circuitry, an interconnect layer on the substrate and including one or more metal-containing interconnect features, and a capacitor at least partly in the interconnect layer and occupying space from which a metal-containing interconnect feature was removed. The integrated circuit device can be, for example, a processor or a communications device. | 10-17-2013 |
20130279137 | ENERGY STORAGE STRUCTURE, METHOD OF MANUFACTURING A SUPPORT STRUCTURE FOR SAME, AND MICROELECTRONIC ASSEMBLY AND SYSTEM CONTAINING SAME - An energy storage structure includes an energy storage device containing at least one porous structure ( | 10-24-2013 |
20130329389 | CHIP-COMPONENT STRUCTURE - A chip-component structure includes an interposer on which a multilayer capacitor is mounted. The interposer includes component connecting electrodes, external connection electrodes, side electrodes, and in-hole electrodes. The component connecting electrodes and the external connection electrodes are electrically connected by the side electrodes and the in-hole electrodes. Outer electrodes of the capacitor are joined to the component connecting electrodes. | 12-12-2013 |
20140049929 | PRINTED CIRCUIT BOARD - A filter circuit | 02-20-2014 |
20140063765 | TRANSMISSION SYSTEM AND METHOD FOR CONSTRUCTING BACKPLANE SYSTEM - A through-hole stub AC termination circuit including a resistor and a capacitor, is connected to an open end of a stub of a through-hole provided in a circuit board. | 03-06-2014 |
20140085851 | SMALL FORM FACTOR STACKED ELECTRICAL PASSIVE DEVICES THAT REDUCE THE DISTANCE TO THE GROUND PLANE - The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit. | 03-27-2014 |
20140085852 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers and alternately exposed through both end surfaces of the ceramic body in a length direction of the ceramic body; a first acoustic noise absorption layer formed on one surface of the ceramic body in a stacking direction of the dielectric layers and having a thickness of 3 μm to 500 μm; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes; and a printed circuit board having the first and second external electrodes mounted thereon while facing the first acoustic noise absorption layer. | 03-27-2014 |
20140092574 | INTEGRATED VOLTAGE REGULATORS WITH MAGNETICALLY ENHANCED INDUCTORS - Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate. In further embodiments, integrated circuitry on a same substrate as the magnetically enhanced inductor, or on another substrate stacked thereon, completes the VR and/or is powered by the VR circuitry. | 04-03-2014 |
20140092575 | ZERO-LENGTH OR NEAR-ZERO-LENGTH LEAD FOR ELECTRICAL COMPONENT - An inductor assembly includes an inductor body including an inductor core and a mounting bracket that includes a first leg, a second leg, and a third leg. A portion of the mounting bracket passes through the inductor body, at least one of the first leg and the second leg of the mounting bracket is arranged to be mounted on a substrate, and the third leg of the mounting bracket is arranged to be mounted on an electrical component mounted on the substrate. | 04-03-2014 |
20140104801 | MULTILAYER SUBSTRATE - A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line. | 04-17-2014 |
20140140028 | Magnetic Coupling and Cancellation Arrangement - An inductor arrangement comprises a first inductor formed on a substrate, a second inductor formed on the substrate, a first loop formed on the substrate adjacent to the first inductor and a phasing network connected to the first loop which is arranged to receive an input signal representative of a flow of magnetic flux through the second inductor and to apply a first current to the first loop for generating a flow of magnetic flux for reducing magnetic coupling between the second inductor and the first inductor. A second loop can be formed on the substrate adjacent to the second inductor which is arranged to generate a second current in response to a flow of magnetic flux through the second loop, with the second current being the signal representative of a flow of magnetic flux through the second inductor. | 05-22-2014 |
20140153209 | COIL COMPONENT AND DISPLAY DEVICE INCLUDING THE SAME - There are provided a coil component capable of decreasing leakage inductance and a display device including the same. The coil component includes a cylindrical body part having a plurality of coils wound and stacked on an outer peripheral surface thereof; and one or more spacing parts formed on the outer peripheral surface of the body part to uniformly distribute the coils directly wound on the body part. | 06-05-2014 |
20140185260 | NANOSTRUCTURED ELECTROLYTIC ENERGY STORAGE DEVICES - In one embodiment, a structure for an energy storage device may include a first nanostructured substrate having a conductive layer and a dielectric layer formed on the conductive layer. A second nanostructured substrate includes another conductive layer. A separator separates the first and second nanostructured substrates and allows ions of an electrolyte to pass through the separator. The structure may be a nanostructured electrolytic capacitor with the first nanostructured substrate forming a positive electrode and the second nanostructured substrate forming a negative electrode of the capacitor. | 07-03-2014 |
20140240945 | Multi-Die Package with Separate Inter-Die Interconnects - A first electrode at a first side of a first semiconductor die is connected to a first conductive region of a substrate. A first electrode at a first side of a second semiconductor die is connected to a second conductive region of the substrate. Each die has a second electrode at an opposing second side of the respective die. A first metal layer extends from a periphery region of the substrate to over the first die. The first metal layer has a generally rectangular cross-sectional area and connects one of the conductive regions in the periphery region of the substrate to the second electrode of the first die. A second metal layer separate from the first metal layer extends over the first and second dies. The second metal layer has a generally rectangular cross-sectional area and connects the second electrodes of the first and second dies. | 08-28-2014 |
20140247575 | ELECTRONIC STRUCTURE AND ELECTRONIC PACKAGE COMPONENT FOR INCREASING THE BONDING STRENGTH BETWEEN INSIDE AND OUTSIDE ELECTRODES - An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion. | 09-04-2014 |
20140268614 | COUPLED VIAS FOR CHANNEL CROSS-TALK REDUCTION - Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent vertical transitions is achieved with overlapping metal surfaces within the vertical transitions. In embodiments, one or more of the overlapping metal surfaces are vias, via pads, or metal stub features extending off a vertical transition. In embodiments, signal paths with overlapped vertical transitions are utilized to achieve crosstalk reduction of more than one victim-aggressor pair and/or to achieve crosstalk reduction of more than two aggressors. In embodiments, capacitively coupled vertical transitions are implemented in a package substrate, an interposer, or a printed circuit board. | 09-18-2014 |
20140268615 | TWO-STAGE POWER DELIVERY ARCHITECTURE - A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator. | 09-18-2014 |
20140268616 | CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPACITOR - In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and within the device. | 09-18-2014 |
20140268617 | SUPERCAPACITOR STRUCTURES - Supercapacitor structures are provided which include, for example: one or more layers of supercapacitors; and one or more contact tabs. The one or more contact tabs electrically contact and extend outward from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, and the one or more contact tabs include a multi-contact tab. The multi-contact tab is configured and sized with multiple contact locations which are disposed external to the supercapacitor structure. Various supercapacitor structures are provided, including one supercapacitor structure with a shared C-shaped current collector, and another supercapacitor structure with stacked supercapacitors. One or more additional multi-contact tabs may also extend from the supercapacitor structure(s) and distribute the same or a different capacitor voltage than the multi-contact tab. | 09-18-2014 |
20140301057 | POWER CONVERTERS WITH INTEGRATED CAPACITORS - An apparatus having a power converter circuit having a first active layer having a first set of active devices disposed on a face thereof, a first passive layer having first set of passive devices disposed on a face thereof, and interconnection to enable the active devices disposed on the face of the first active layer to be interconnected with the non-active devices disposed on the face of the first passive layer, wherein the face on which the first set of active devices on the first active layer is disposed faces the face on which the first set of passive devices on the first passive layer is disposed. | 10-09-2014 |
20140313684 | Non-Planar Printed Circuit Board with Embedded Electronic Components - A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure. | 10-23-2014 |
20140313685 | Electromagnetic Meta-Materials - Apparatus including meta-materials and methods for making the apparatus are described. Circuit components, such as split ring resonators and/or spiral loops, may be formed on substrates to form the meta-materials. The meta-materials may be used in various types of apparatus. The methods of making the apparatus may include forming two and/or three-dimensional structures comprising the meta-materials. | 10-23-2014 |
20140321090 | DEVICE FOR ASSEMBLING CAPACITORS FOR AN ELECTRONIC CONVERTER - The device ( | 10-30-2014 |
20140362551 | PRINTED CIRCUIT BOARD INCLUDING INDUCTOR - A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element. | 12-11-2014 |
20150036308 | Magnetic Core Inductor Integrated with Multilevel Wiring Network - An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented. | 02-05-2015 |
20150055311 | ELECTRONIC COMPONENT WITH COIL, METHOD FOR MANUFACTURING THE SAME AND POWER SUPPLY MODULE - An electronic component includes a circuit board that includes a ground terminal connected to a ground potential, a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil, a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, and a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package. A part of the ground connection electrode is exposed outside the mixture. | 02-26-2015 |
20150062852 | SEMICONDUCTOR PACKAGES HAVING PASSIVE COMPONENTS AND METHODS FOR FABRICATING THE SAME - Semiconductor packages having through electrodes and methods for fabricating the same are provided. The method for fabricating a semiconductor package may comprise providing a package substrate including a core having a top surface and a bottom surface and a plurality of surface mount pads on the top surface of the core, providing a passive component on the package substrate between the surface mount pads, and forming an electrical connection that fills spaces between the surface mount pads and the passive component provided therebetween and electrically connects the passive component to the package substrate. | 03-05-2015 |
20150062853 | TOUCH SCREEN HAVING INTEGRATED NFC ANTENNA - A touch screen ( | 03-05-2015 |
20150070864 | Electronic Device With Printed Circuit Board Noise Reduction Using Elastomeric Damming and Damping Structures - An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill. | 03-12-2015 |
20150085459 | CONNECTOR, ANTENNA AND ELECTRONIC DEVICE - A connector including a first connector body and a mode-converting unit is provided. The first connector body includes a dielectric base, a shell and a pin set. The shell and the dielectric base are fixed to each other. The pin set is disposed on the dielectric base. The mode-converting unit includes a substrate and a mode-converting structure. The substrate is fixed to the first connector body and has a circuit. The shell constitutes a waveguide tube and is electromagnetically coupled to the circuit through the mode-converting structure. A signal is transmitted from the shell to the circuit through the mode-converting structure, or transmitted from the circuit to the shell through the mode-converting structure and emitted outward, such that the connector can be regarded as an antenna. The signal is a millimeter-wave signal. | 03-26-2015 |
20150109750 | HEAT DISSIPATING HIGH POWER SYSTEMS - An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components. | 04-23-2015 |
20150116972 | DC-DC Converter Assembly with an Output Inductor Accommodating a Power Stage Attached to a Circuit Board - A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and disposed over the power stage die on the first side of the board. The output inductor includes a magnetic core and an electrical conductor having first and second terminals attached to the first side of the board. The output inductor accommodates the power stage die under the magnetic core so that the power stage die is interposed between the magnetic core and the board. A corresponding method of manufacturing the DC-DC converter assembly and method of manufacturing the output inductor are also disclosed. | 04-30-2015 |
20150116973 | ELECTRONIC PACKAGE STRUCTURE - The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound. | 04-30-2015 |
20150131252 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON - A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body, a plurality of first and second internal electrodes formed to be alternately exposed to both side surfaces of the ceramic body, having a dielectric layer therebetween, and first and second external electrodes connected to the first and second internal electrodes, respectively; and an interposer board including an insulation board coupled to the mounting surface of the multilayer ceramic capacitor and first and second connection terminals formed on the insulation board and connected to the first and second external electrodes, respectively. | 05-14-2015 |
20150131253 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON - A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions of a mounting surface of the ceramic body, and first and second internal electrodes alternately stacked, having the dielectric layer therebetween, exposed through at least one side surface of the ceramic body, and connected to the first and second external electrodes, respectively; and an interposer substrate including an insulation substrate bonded to the mounting surface of the multilayer ceramic capacitor, and first and second connection terminals formed on the insulation substrate and connected to the first and second external electrodes, respectively. | 05-14-2015 |
20150138744 | PRINTED CIRCUIT BOARD - A printed circuit board includes a baseboard, first and second conductive wires, a fuse, a 5V connector, a USB connector, and a CPU. The 5V connector is electrically connected to a first end of the fuse through the first conductive wire, and electrically connected to a voltage pin of the CPU voltage regulating chip through the second conductive wire. A voltage pin of the USB connector is connected to a second end of the fuse. The 5V connector outputs a 5V system voltage to the USB connector through the first conductive wire and the fuse, thus providing a voltage to a USB device, and also outputs the 5V system voltage to the CPU voltage regulating chip through the second conductive wire, thus signaling the CPU voltage regulating chip to convert the 5V system voltage and provide the converted voltage to a CPU. | 05-21-2015 |
20150296606 | CHIP AND CIRCUIT STRUCTURE - The present invention provides a chip structure and a circuit structure, chip structure is disposed on a printed circuit board provided with an element layer and a copper grounding layer, and comprises: a chip body disposed on the element layer and having a plurality of power pins; a power line disposed on the element layer for supplying electric power to the chip body; a plurality of power input lines, each of which has a body disposed on the copper grounding layer and two ends disposed on the element layer and connected with the body through corresponding through holes of the printed circuit board; and a plurality of bypass capacitors having one end connected with the power pins of the chip body through the element layer and the other end of the bypass capacitors connected with the power line through the power input line. The present invention further provides a chip structure. The power line of the chip structure and the circuit structure of the present invention is disposed on the element layer, so that the heat dissipation effect of the copper grounding layer is better, and the yield of the chip and corresponding circuit structure is improved. | 10-15-2015 |
20150313019 | A POWER MODULE - A power module ( | 10-29-2015 |
20150359098 | Circuit Board Having Interposer Embedded Therein, Electronic Module Using Same, and Method for Manufacturing Same - The present invention relates to a circuit board having an interposer embedded therein, including: an interposer, the top side and back side of which are electrically connected by a first through-electrode; and a molding member having the interposer embedded therein and the top side and back side of the interposer exposed. According to the present invention, the molding member of an insulator and the interposer of a semiconductor can be appropriately selected and coupled according to the required fine pitch of a through-hole, and the interposer is molded on substantially the same level as a semiconductor chip, and thus no additional process for embedding the interposer needs to be added. | 12-10-2015 |
20150366065 | DEVICE HAVING A CIRCUIT BOARD AND AN ELECTRONIC CIRCUIT WITH AN ELECTROLYTIC CAPACITOR ARRANGED ON THE CIRCUIT BOARD - A device has a circuit board and an electronic circuit arranged on the circuit board. The electronic circuit includes an electrolytic capacitor. The electrolytic capacitor is brought to the operating temperature in the case of low temperatures by intrinsic heating as a result of its operation in a detuned circuit. | 12-17-2015 |
20150380393 | SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating substrate including an insulating plate and a circuit plate disposed on a main surface of the insulating plate; a semiconductor chip having a front surface provided with an electrode and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate and including a metal layer; a conductive post having one end electrically and mechanically connected to the electrode and another end electrically and mechanically connected to the metal layer; a passive element fixed to the printed circuit board; and a plurality of positioning posts fixed to the printed circuit board to position the passive element. | 12-31-2015 |
20160064148 | VARIABLE CAPACITANCE DEVICE AND ANTENNA DEVICE - A variable capacitance device includes: a supporting substrate having a plurality of variable capacitance elements formed thereon, the plurality of variable capacitance elements being connected in series, wherein each of the plurality of variable capacitance elements has a separate lower electrode, or at least some of the plurality of variable capacitance elements share a lower electrode, thereby forming a plural set of the lower electrodes that serves as the lower electrodes of the respective variable capacitance elements, wherein the variable capacitance device further includes an insulating moisture-resistant film and a conductive adhesive film, and wherein the conductive adhesive film and the insulating moisture-resistant film have a gap in a plan view between at least some of regions where the plural set of the lower electrodes are respectively formed so as to avoid electrical leakage between said at least some of regions through the conductive adhesive film. | 03-03-2016 |
20160073500 | Decoupling Capacitive Arrangement to Manage Power Integrity - Various implementations disclosed herein include arrangements that reduce parasitic inductance associated with a discrete decoupling capacitor by using a three-terminal capacitor and a staggered array of power supply and ground connections. In some implementations, a capacitive decoupling arrangement includes a substrate, an array of electrical vias of first and second types, and a capacitive arrangement on one side of the substrate coupled to the array of electrical vias. The array of electrical vias includes a first type of vias and a second type of vias. The capacitive arrangement is coupled between two respective vias of the first type of vias and two respective vias of the second type of vias on the first planar surface of the substrate. The capacitive arrangement includes a plurality of capacitive elements electrically arranged in parallel between the two respective vias of the first type of vias and the two respective vias of the second type of vias. | 03-10-2016 |
20160088735 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There is provided a composite electronic component and a board having the same, and the composite electronic component may include: an interposer board, and first and second electronic components mounted on upper and lower surfaces of the interposer board, respectively, and first and second electronic components are electrically connected to each other by an electrical connection part provided on the interposer board. | 03-24-2016 |
20160105958 | MULTI-LAYER SUBSTRATE, ELECTRONIC DEVICE USING MULTI-LAYER SUBSTRATE, MANUFACTURING METHOD FOR MULTILAYER SUBSTRATE, SUBSTRATE, AND ELECTRONIC DEVICE USING SUBSTRATE - In a multi-layer substrate, a glass cloth of a build-up layer is deformed toward a land below the land. A thickness of a resin layer of the build-up layer from the glass cloth to a surface adjacent to the land is set to be smaller than a dimension from the glass cloth to a front surface of a core layer. With the above configuration, a progress or an enlargement of a crack can be suppressed from a stage in which the crack is smaller. Therefore, the progress and the enlargement of the crack can be delayed. As a result, even if the crack is generated, an insulating property between the land and an inner layer wire is ensured, and the land and the inner layer wire can be restricted from being short-circuited. | 04-14-2016 |
20160133532 | PRINTED CIRCUIT BOARD - A printed wiring board includes a power supply conductor pattern arranged on one conductor layer, one ground conductor pattern arranged on the one conductor layer, and another ground conductor pattern arranged on the another conductor layer so as to be opposed to the power supply conductor pattern. The power supply conductor pattern includes a power supply pad on which a terminal of a capacitor is to be bonded. The one ground conductor pattern includes a ground pad on which another terminal of the capacitor is to be bonded. A slit is formed in the another ground conductor pattern so as to pass through a projection portion defined by projecting the power supply pad onto the another ground conductor pattern and divide a projection portion defined by projecting the power supply conductor pattern onto the another ground conductor pattern. | 05-12-2016 |
20160155572 | PLANAR CAPACITOR TERMINALS | 06-02-2016 |
20160157336 | PRINTED CIRCUIT BOARD | 06-02-2016 |
20160165729 | ELECTRONIC CIRCUIT ASSEMBLY SUBSTRATE AND DEVICE THEREOF - A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate. | 06-09-2016 |
20160174384 | PRINTED ELECTRONIC COMPONENTS ON UNIVERSALLY PATTERNED SUBSTRATE FOR INTEGRATED PRINTED ELECTRONICS | 06-16-2016 |
20160189869 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component includes: a power stabilization unit including a capacitor and an inductor connected to each other in series and configured to rectify input voltage to generate output voltage; and a switch unit including a first switch connected to the capacitor in parallel and a second switch connected to the inductor in parallel. | 06-30-2016 |
20190150284 | SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE | 05-16-2019 |