Class / Patent application number | Description | Number of patent applications / Date published |
398164000 | Including optical circuit board | 19 |
20080199187 | FIBER OPTIC CABLE ASSEMBLY FOR OPTICAL TRANSCEIVER - Disclosed is an optical floating sub-assembly, comprising a thermally conductive non rigid substance between the heat sink carrier and external casing, to minimize mechanical stress on the optical assembly. Also disclosed is a printed circuit board as an electrical interface, comprising two modules capable of converting an electrical signal to an optical signal, transmitting the optical signal and then converting the optical signal back to an electrical signal. Also disclosed is an optical assembly, comprising a heat sink with mechanical features for optical alignment. | 08-21-2008 |
20080232818 | INTERFACE BOARD AND OPTICAL TRANSMISSION EQUIPMENT - A circuit capable of processing signals of different signal types is provided for identifying the signal type by the signal type setting from an administrator or by the implementation of the optical module, thereby selecting a signal processor to be used. An OTN frame standardized by ITU is used in a fixed manner independent of the signal type to be accommodated, while a corresponding SDH/SONET frame standardized by ITU is used for signal accommodation. | 09-25-2008 |
20080267636 | Data transmission unit for high bit-rate signals, especially high bit-rate optical data signals greater than 1 gbit/s - The invention relates to a data transmission unit for high bit-rate optical data signals, in particular, high bit-rate optical data signals with a backplane ( | 10-30-2008 |
20090022500 | METHOD AND SYSTEM FOR OPTOELECTRONICS TRANSCEIVERS INTEGRATED ON A CMOS CHIP - Methods and systems for optoelectronics transceivers integrated on a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers on a top surface of a CMOS chip, which may include a guard ring. Photodetectors may be integrated in the CMOS chip. A CW optical signal may be received from a laser source via grating couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the top surface of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser. | 01-22-2009 |
20090034985 | Optical interconnect - An optical interconnect includes a first circuit board having an optical source and an optical receiver; and a second circuit board having data source and an optical modulator optically coupled with the optical source and optical receiver, wherein the optical modulator is configured to encode data from the data source into an optical signal from the optical source. The optical receiver is configured to receive the optical signal from the optical modulator. A method of optical communication includes generating on a first circuit board an optical signal directed at a second circuit board; modulating the optical signal with data at the second circuit board; reflecting the optical signal to the first circuit board; and demodulating the optical signal to receive the data at the first circuit board. | 02-05-2009 |
20090067851 | MULTI-CHIP SYSTEMS WITH OPTICAL BYPASS - Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path. | 03-12-2009 |
20090129786 | COUPLING OF OPTICAL INTERCONNECT WITH ELECTRICAL DEVICE - One embodiment of the present invention includes a flexible interconnect assembly that can convert between optical and electrical signals and that is configured to be easily secured to an electrical device, such as a printed circuit board or integrated circuit chip. The flexible interconnect assembly includes a flexible substrate and one or more optical waveguides that are mounted on the flexible interconnect and suitable for transmitting optical signals. One or more conversion devices for converting between electrical and optical signals are arranged on the flexible substrate. The flexible interconnect assembly optionally includes an attachment fixture that enables the flexible substrate to be reversibly coupled to an attachment apparatus. Particular embodiments of the present invention involve methods, devices and systems for using a flexible interconnect assembly with one or more electronic substrates configured with an attachment apparatus. | 05-21-2009 |
20090142072 | OPTICAL INTERFACE BETWEEN TWO SECTIONS OF AN INTEGRATED CHIP - An integrated electronic chip including: a first section formed on a first substrate; a second section formed on a second substrate; and a chip package. The first section including a first electronic circuit electrically coupled to a first optical transmitter and a first optical receiver. The second section including a second electronic circuit electrically coupled to a second optical transmitter and a second optical receiver. The chip package configured to hold the first and second sections such that: the first substrate is separated from the second substrate by a gap having a predetermined width; first optical signals emitted by the first optical transmitter are received by the second optical receiver; and second optical signals emitted by the second optical transmitter are received by the first optical receiver. The first circuit is electrically isolated from the second circuit by the gap. | 06-04-2009 |
20090175630 | Optical interconnection system for transmitting and receiving a three-level signal and method of operating the same - Provided is an optical interconnection system that transmits and receives a three-level signal. The optical interconnection system includes a first and a second optical interconnection device that transmits and receives a two-level signal, and a synthesizer that outputs a three-level signal by synthesizing signals from the first and second optical interconnection devices. The optical interconnection system may transmit and receive a three-level signal while using an optical interconnection device that interconnects a two-level signal. | 07-09-2009 |
20090232514 | Optical Interconnect Solution - A low-cost, high-speed optical interconnect replacement for current electrical interconnects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. A bare optical fiber is then used to transmit the signal from an optical encoding source to an optical receiver, providing a high-speed method of replacement for traditional electrical interconnects. | 09-17-2009 |
20100290789 | TRANSMISSION SYSTEM FOR IMAGE DISPLAY DEVICE AND ELECTRONIC EQUIPMENT - A transmission system for an image display device has a first circuit board and a second circuit board, a flexible member for connecting the first circuit board and the second circuit board, an image display driver IC mounted on the first circuit board or the flexible member, an image processing IC mounted on the second circuit board, and an optical transmission path. At least part of signals to be transmitted between the image display driver IC and the image processing IC is transmitted as an optical signal. | 11-18-2010 |
20110116807 | EXPRESS INTERFACE APPARATUS USING OPTICAL CONNECTION - An express interface apparatus using an optical connection is provided. The apparatus connects between a central processing unit (CPU) in a computer system and an external device supporting optical signal transfer using a peripheral component interconnect express (PCIE) supporting high-speed signal processing. The apparatus includes an optical connection module for connecting the external device so that an optical signal is input/output; an optical-to-electrical conversion module for converting the optical signal from the optical connection module into an electrical signal or converting an electrical signal into an optical signal; a signal processing module connected to the optical-to-electrical conversion module for performing signal processing to divide or merge the electrical signal; and a PCIE control module for controlling a processed signal from the signal processing module to deliver the signal to the CPU via a PCIE slot and controlling high-speed data transmitted and received between the CPU and the external device, such that a signal can be transmitted and received without a distortion or bottleneck phenomenon in high-speed data transfer. | 05-19-2011 |
20110135316 | ELECTRICAL-OPTICAL MEDIA CONVERSION SYSTEM - A media conversion system for converting electrical video signals to optical video signals and vice versa. The media conversion system includes one or more pluggable media conversion modules. Each pluggable media conversion module converts between one or more optical video signals and one or more electrical video signals. Each pluggable media conversion module typically includes an electrical video signal conditioning circuit that includes one or more of a cable driver, an equalizer and a reclocker. The media conversion system also includes a printed circuit board for receiving the one or more pluggable media conversion modules. The printed circuit board includes one or more signal paths for transporting the one or more electrical video signals between the one or more pluggable media conversion modules and one or more electrical cable connectors. Each of the one or more signal paths is completely passive. | 06-09-2011 |
20110211844 | OPTICAL SIGNAL PROCESSING CIRCUIT - An optical gate switch circuit includes: an asymmetric Mach-Zehnder interferometer having an optical path that outputs control light and probe light to a second optical directional coupler via a first optical directional coupler and an optical phase modulation element, and another optical path that connects a third optical directional coupler to which the probe light is input, to the second optical directional coupler via a variable optical attenuator and an optical phase shifter; and a bandpass filter connected to the second optical directional coupler. | 09-01-2011 |
20120063787 | CONNECTOR AND OPTICAL TRANSMISSION APPARATUS - An optical transmission apparatus includes first and second circuit boards, and a connector. The first circuit board includes an optical transmission processing circuit, a first transmission line electrically coupled to the optical transmission processing circuit, a first pad on one surface of the first circuit board electrically coupled to the first transmission line, and a second pad on the other surface of the first circuit board electrically coupled to the first pad. The second circuit board includes a second transmission line of a layer of a multilayered structure, and a third pad on one surface of the second circuit board electrically coupled to the second transmission line and the second pad. The connector has an electrode disposed in two dimensions at a position to couple with the first pad in the case of the second circuit board is electrically coupled with the first circuit board. | 03-15-2012 |
20130094865 | METHOD AND SYSTEM FOR OPTOELECTRONICS TRANSCEIVERS INTEGRATED ON A CMOS CHIP - Methods and systems for optoelectronics transceivers integrated on a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers on a top surface of a CMOS chip, which may include a guard ring. Photodetectors may be integrated in the CMOS chip. A CW optical signal may be received from a laser source via grating couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the top surface of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser. | 04-18-2013 |
20140099129 | NETWORKS AND METHODS FOR RELIABLE TRANSFER OF INFORMATION BETWEEN INDUSTRIAL SYSTEMS - A communication network and method for transfer of information are disclosed. The communication network includes plurality of industrial systems. Each system includes I/O board including I/O modules, at least one of an optical emitter and an optical receiver, and a processing module. The processing module and the I/O board generate an optical signal corresponding to information and a Cyclic Redundancy Check (CRC) information. The network includes a first optical bus and a second optical bus coupled with the I/O boards for transferring the optical signal and complement of the optical signal between the systems. | 04-10-2014 |
20160006518 | OPTICAL INTERCONNECTION DEVICE - Signal transmission crosstalk between substrates is suppressed even when light emitting elements or light receiving elements are densely arranged. Provided is an optical interconnection device | 01-07-2016 |
20160204874 | INTEGRATED CONTROL MODULE FOR COMMUNICATION SYSTEM ON A CHIP FOR SILICON PHOTONICS | 07-14-2016 |