Class / Patent application number | Description | Number of patent applications / Date published |
420471000 |
Aluminum containing
| 47 |
420472000 |
Phosphorus containing
| 36 |
420473000 |
Iron, manganese or nickel containing
| 21 |
420476000 |
Zinc containing
| 7 |
420474000 |
Lead containing | 3 |
20120058005 | Copper Corrosion Resistant, Machinable Brass Alloy - An alloy which reduces lead (Pb) in brass with metals with physical, mechanical, chemical and electrochemical properties that will improve the copper (Cu) corrosion resistance and machinability of low lead (Pb) brass alloys. Such metal candidates are bismuth (Bi), antimony (Sb), tellurium (Te), phosphorous (P), silicon (Si), sulfur (S) for machinability improvement; and tin (Sn) for corrosion resistance improvement. The alloy composition has an excellent machinability and a high degree of copper corrosion resistance, and is composed of: 69 to 79%, by weight, of copper (Cu); 2 to 4%, by weight, of silicon (Si); 1 to 3%, by weight, of tin (Sn); 0.01 to 1%, by weight, of lead (Pb); and the remaining %, (but less than 20%) by weight, of zinc (Zn). | 03-08-2012 |
20130084207 | BRASS ALLOY - A brass alloy comprising (a) bismuth in an amount in the range from | 04-04-2013 |
20140112821 | LEAD-FREE BRASS ALLOY FOR HOT WORKING - Provided is a lead-free brass alloy for hot working provided with good hot-working properties and mechanical characteristics. A lead-free brass alloy for hot working, comprising: 28.0 to 35.0 wt % zinc, 0.5 to 2.0 wt % silicon, 0.5 to 1.5 wt % tin, 0.5 to 1.5 wt % bismuth, 0.10 wt % or less lead, and the remainder being copper and unavoidable impurities, the zinc equivalent being in a range of 40.0 to 43.0, and the area ratio of the κ phase after hot working being 20% or less. | 04-24-2014 |
Entries |
Document | Title | Date |
20100047112 | COPPER ALLOY SHEET EXCELLENT IN STRENGTH AND FORMABILITY FOR ELECTRICAL AND ELECTRONIC COMPONENTS - Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 μm or less, the standard deviation of crystal grain size satisfies the condition: 2σ<10 μm, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter. | 02-25-2010 |
20100111753 | Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL - [Task] The adhesion resistance of Cu—Bi based or Cu—Sn—Bi based alloy is lower than that of Cu—Sn—Pb based alloy, and also since conformability of the former alloy is low. Therefore, when Bi of the former alloy adheres onto an opposite shaft, seizure of the former alloy is likely to occur as compared with the case of the latter Cu—Sn—Pb based alloy. In is alloyed in the Bi phase of the Cu—Sn—Bi—In based copper alloy. The In-alloyed Bi phase has a considerably low melting point and therefore the sliding properties deteriorate. | 05-06-2010 |
20100266444 | Pb-FREE COPPER ALLOY SLIDING MATERIAL - When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix. | 10-21-2010 |
20110020171 | PROCESS FOR PRODUCTION OF SINTERED COPPER ALLOY SLIDING MATERIAL AND SINTERED COPPER ALLOY SLIDING MATERIAL - Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. | 01-27-2011 |
20110200479 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS - A copper alloy material for electric/electronic parts, containing Co and Si as additive elements, wherein, a compound A is dispersed, which is composed of Co and Si and has an average particle diameter of 5 nm or more but less than 50 nm, and at least one compound is dispersed, which is selected from: a compound B which does not contain one or any of Co and Si and has an average particle diameter from 50 to 500 nm, a compound C which contains both of Co and Si and another element and has an average particle diameter from 50 to 500 nm, and a compound D which is composed of Co and Si and has an average particle diameter from 50 to 500 nm; a grain size of the copper alloy matrix is 3 to 35 μm; and an electrical conductivity is 50% IACS or more. | 08-18-2011 |
20110200480 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS - A copper alloy material for electric/electronic parts, containing Co in an amount of 0.7 to 2.5 mass % and Si in an amount that gives a mass ratio of Co and Si (Co/Si ratio) within the range from 3.5 to 4.0, with the balance being Cu and unavoidable impurities, wherein the grain size is 3 to 15 μm. | 08-18-2011 |
20150017058 | METAL WIRE AND ELECTRIC WIRE - To provide a metal wire and an electric wire of high mechanical strength and high ductibility that have sufficiently increased ductibility as well as sufficiently increased mechanical strength. A metal wire manufactured at least by being subjected to an extension in which a metal wire is extended in an axial direction, and having a hardness distribution in which hardness decreases toward a specific peripheral portion from a central portion in a cross-section orthogonal to axis, whereby a softened peripheral portion becomes to show a good malleability as well as a high resistance to cracking, so as to attain an improvement of mechanical strength and ductibility. | 01-15-2015 |