Class / Patent application number | Description | Number of patent applications / Date published |
420577000 | BISMUTH BASE | 8 |
20090129971 | LEAD-FREE SOFT SOLDER - The invention relates to a soft solder which includes the alloying constituents bismuth and two of the three metals silver, copper and nickel, wherein bismuth forms between 20% by weight and 99.8% by weight of the alloy, silver forms between 0.1% by weight and 50% by weight of the alloy, copper forms between 0.1% by weight and 30% by weight of the alloy and nickel forms between 0.1% by weight and 30% by weight of the alloy. | 05-21-2009 |
20130078138 | Bi-Al-Zn-BASED Pb-FREE SOLDER ALLOY - There is provided a Pb-free solder alloy whose residual stress during solidification is small and which achieves high joint strength and high reliability, can suppress a reaction between Ni and Bi or diffusion of Ni when used to join Ni-containing electronic parts or substrates, and can withstand a high reflow temperature. | 03-28-2013 |
20130094991 | Pb-FREE SOLDER ALLOY - Disclosed herein is a high-temperature Pb-free solder alloy having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. | 04-18-2013 |
20130121874 | Bi-Sn Based High-Temperature Solder Alloy - A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P. | 05-16-2013 |
20130216427 | LIQUID METAL ION SOURCE AND SECONDARY ION MASS SPECTROMETRIC METHOD AND USE THEREOF - A liquid metal ion source for use in an ion mass spectrometric analysis method contains, on the one hand, a first metal with an atomic weight ≧190 U and, on the other hand, another metal with an atomic weight ≦90 U. One of the two types of ions are filtered out alternately from the primary ion beam and directed onto the target as a mass-pure primary ion beam. | 08-22-2013 |
20140119981 | CONSTRUCTING BISMUTH ANTIMONY THIN FILMS WITH ANISOTROPIC SINGLE-DIRAC CONES | 05-01-2014 |
20150333027 | Method of Forming Solder Bump, and Solder Bump - A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy. | 11-19-2015 |
20190144975 | ALLOYS AND PROCESSES FOR MAKING AND USING SAME | 05-16-2019 |