Entries |
Document | Title | Date |
20080220701 | Polishing Pad and Method for Making the Same - A method for making a polishing pad includes providing a non-woven fabric made of a plurality of fibers. The non-woven fabric is submerged with a polymer resin solution. The polymer resin submerged in non-woven fabric is cured to form a porous polymer having an outer face adapted for polishing a workpiece. The outer face of the porous polymer is finished to form a polishing pad with a plurality of naps on the outer face. The plurality of naps on the outer face have a density ranging from 1.0 to 2.0 g/cm3, and the plurality of naps on the outer face have a length ranging from 50 to 600 μm. | 09-11-2008 |
20080220702 | POLISHING PAD HAVING SURFACE TEXTURE - The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad. | 09-11-2008 |
20080248734 | METHOD AND APPARATUS FOR IMPROVED CHEMICAL MECHANICAL PLANARIZATION AND CMP PAD - A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the compressible under-layer and pass through corresponding holes in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but be translatable in a vertical direction with respect to the guide plate. Optionally, a membrane may be positioned between the guide plate and the slurry distribution layer. The polishing pad may also include wear sensors to assist in determinations of pad wear and end-of-life. | 10-09-2008 |
20080261498 | Abrasive belt for sanding device - An abrasive belt includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut chips from the work piece and for allowing the cut chips to be received and engaged in the eyelets of the net member. The abrading particles may be applied onto an outer portion or an inner portion of the net member. A base member may be attached or engaged in the net member for supporting the net member which may include a number of longitudinal cords and lateral cords secured together. | 10-23-2008 |
20080293344 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD - Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled with a pressure-controlled medium; and a tip region having a shape that corresponds to a shape of the notch, wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch. Numerous other aspects are provided. | 11-27-2008 |
20090053982 | FIBROUS PAD FOR CLEANING/POLISHING FLOORS - A cleaning/polishing pad for cleaning or polishing stone, terrazzo or concrete floors comprises a flexible, disk-shaped pad body having an upper mounting surface and a lower working surface, the pad body comprising natural wool fibers. A plurality of resin segments spaced apart from one another and affixed adjacent the lower working surface of the disk-shaped pad body, the resin segments including diamond particles embedded therein, wherein each of the plurality of resin segments is affixed to the pad body in such a way that the majority of the resin segment stands proud of the pad body. | 02-26-2009 |
20090053983 | CHEMICAL MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SAME - There is provided a chemical mechanical polishing pad which has a circular polishing surface and a non-polishing surface that is the back side of the polishing surface and incorporates an information recording medium that is readable or readable/writable by an electromagnetic wave in a noncontact manner and in which the position of the center of gravity of the information recording medium in the radial direction of the polishing surface is preferably within a range of 0 to 10% or 80 to 100% of the radius of the polishing surface in the direction from the center on the radius of the polishing surface toward the periphery of the polishing surface. | 02-26-2009 |
20090093200 | POLISHING PAD - The present invention provides a polishing pad whose unevenness in thickness hardly occurs and whose life can be improved. A polishing pad | 04-09-2009 |
20090117837 | CMP PAD AND METHOD FOR MANUFACTURING THE SAME - Embodiments relate to a chemical mechanical polishing (CMP) pad. According to embodiments, a CMP pad may include a pad body having a series of concave and convex patterns and a chemical reactant formed on and/or over the pad body. The CMP pad may uniformly perform a CMP process without using abrasive grains. Accordingly, scratches on a surface of a wafer may be prevented. | 05-07-2009 |
20090209185 | CHEMICAL MECHANICAL POLISHING PAD - A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface, and a plurality of grooves formed in the polishing surface. The side surface has a slope surface that is connected to the polishing surface, and a depth of the grooves is equal to or smaller than a height of the slope surface. | 08-20-2009 |
20090239456 | Chemical Mechanical Polishing Pad and Dresser - The present invention discloses a Chemical Mechanical Polishing (CMP) pad dresser used in lapping and polishing silicon wafers in either single or double sided polishing machines. | 09-24-2009 |
20090253358 | POLISHING ARTICLE WITH INTEGRATED WINDOW STRIPE - A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis. | 10-08-2009 |
20090258586 | BUFFING BALL - A buffing ball is formed by compressing a stack of generally circular buffing pads along a central axis. The individual pads have a generally wave-like outer peripheral surface having valleys and mounds. When compressed together, the mounds form small knobs that are ideal for buffing or cleaning intricate surfaces. | 10-15-2009 |
20090258587 | POLISHING PAD HAVING GROOVE STRUCTURE FOR AVOIDING THE POLISHING SURFACE STRIPPING - The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the small grinded pieces. Furthermore, the grinding layer does not have acute structure and is not easy to peel to form the small grinded pieces. Therefore, the grinding quality and grinding effect can be improved. | 10-15-2009 |
20090258588 | Chemical Mechanical Planarization Pad With Void Network - A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures. | 10-15-2009 |
20090318067 | Polishing pad and the method of forming micro-structure thereof - This invention is related to a polishing pad, and more particularly a polishing pad with flexible micro-structure. The polishing pad comprises a connecting surface and a polishing surface. The connecting surface is used to secure on a polishing device. The polishing surface with flexible micro-structure is used to grind and adequately press close to the surface of semiconductor piece. The present invention not only increases the area of polishing surface that contact with the semiconductor piece but also get over the difficulty in pressing close to different piece. It will save grinding time and have a better effect. | 12-24-2009 |
20100029185 | POLISHING PAD AND A METHOD FOR MANUFACTURING THE SAME - An object of the invention is to provide a polishing pad excellent in durability and in the adhesiveness between a polishing layer and a base material layer. The first invention relates to a polishing pad comprising a polishing layer arranged on a base material layer, wherein the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 μm, the polyurethane foam comprises an isocyanate component and an active hydrogen-containing compound as starting components, and the active hydrogen-containing compound comprises 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g. | 02-04-2010 |
20100056031 | Polishing Pad - The present invention provides a polishing pad, and is more particularly related to a polishing pad, the width of groove bottom of polishing surface of which is 0 mm. The polishing pad includes a polishing surface on which comprises a plurality of grooves, wherein each groove includes a groove opening and a groove bottom, the characteristic of which being that the width of groove bottom of polishing surface is 0 mm. Therefore, when the polishing step is performed, it is not easy for polishing particles suspended in the slurry to deposit on the groove bottom and the deposits can be prevented from scratching the concerned work piece to avoid damage of work piece. | 03-04-2010 |
20100130112 | POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHOD USING THE SAME - A polishing pad includes a guide plate, a compressible foam under layer disposed adjacent to a lower surface of the guide plate, and a plurality of polishing elements that extend in a first direction substantially normal to a plane defined by the guide plate and through the guide plate. The pad further includes an optical path along the first direction and which is defined by an aperture in the compressible foam under layer and the guide plate. The optical path includes a transparent window that extends above an upper surface of the guide plate but below tips of the polishing elements, the upper surface of the guide plate being opposite the lower surface thereof. An optional slurry distribution layer may be disposed on the upper surface of the guide plate, in which case the polishing elements extend through the slurry distribution layer and the transparent window extends beyond a top surface thereof. | 05-27-2010 |
20100159811 | High-rate groove pattern - The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows: | 06-24-2010 |
20110014858 | GROOVED CMP POLISHING PAD - The present invention provides polishing pads for use in CMP processes. In one embodiment, a pad comprises a surface defining a plurality of grooves with landing surfaces separating the grooves, the landing surfaces together defining a substantially coplanar polishing surface, each groove having a depth of at least about 10 mil and a width, W | 01-20-2011 |
20110070814 | Method for Manufacturing Polishing Pad and Polishing Pad - The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also. | 03-24-2011 |
20110104999 | ABRASIVE PAD - Disclosed is an exemplary abrasive pad having a plurality of first elongated members and a plurality of second elongated members arranged crosswise relative to the first elongated members to form a mat having a first side and an opposite second side. The second elongated members alternately pass over and under the first members in a serpentine manner, and include a longitudinal concave region and a longitudinal convex region. The abrasive pad includes an abrasive material affixed to the convex region of at least one of the plurality of second elongated members, wherein the concave region of the second elongated members are devoid of abrasive material. | 05-05-2011 |
20110159794 | ABRASIVE ARTICLE WITH OPEN STRUCTURE - An abrasive article includes a fabric comprising a front face and a back face. The front face is formed of first knitted yarns. Each yarn of the first knitted yarns includes a plurality of filaments. A plurality of threads intertwines with the first knitted yarns and extending between the front face and the back face. The plurality of threads defines a hollow space between the front face and the back face. The abrasive article also includes abrasive grains adhered to the front face of the fabric. | 06-30-2011 |
20110230126 | COMPOSITE POLISHING PAD - An abrasive article referred to as composite polishing pad (CPP) includes a plurality of fixed abrasive elements or a plurality of chemical mechanical polishing (CMP) pads attached to a plurality of pressure pads suspended to flexible structures capable to follow the wafer topography. A plurality of stems with dimpled ends act on the pressure pads to generate desired pressure acting on the wafer. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In one embodiment a plurality of pressure pads suspended to a plurality of stems by revolute joints. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In another embodiment, a plurality of pressure pads are attached to a plurality of stems suspended to a series of springs capable of substantial vertical deflection under a desired load. | 09-22-2011 |
20110244768 | POLISHING PAD AND METHOD OF USE - A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural modulus greater than 2000 psi, and a wet Shore D hardness between 25-80, inclusive. The hydrogel material may be made from one or a combination of the following moieties: urethane, alkylene oxides, esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, and/or carbonates. | 10-06-2011 |
20110281510 | Pad Window Insert - A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer. | 11-17-2011 |
20120009855 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE - Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D. | 01-12-2012 |
20120045977 | Flexible Grinding Product and Method of Producing the Same - The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay ( | 02-23-2012 |
20120094586 | POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS - Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described. | 04-19-2012 |
20120094587 | Flexible Grinding Product and Method of Producing the Same - The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay ( | 04-19-2012 |
20120171940 | Dual-Pore Structure Polishing Pad - The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. A porous polishing layer includes a dual porosity structure within a polyurethane matrix. The dual porosity structure has a primary set of pores having pore walls with a thickness of 15 to 55 μm and a storage modulus of 10 to 60 MPa measured at 25° C. In addition, pore walls contain a secondary set of pores having an average pore size of 5 to 30 μm. The porous polishing layer is either fixed to a polymeric film or sheet substrate or formed into a woven or non-woven structure to form the polishing pad. | 07-05-2012 |
20120178349 | CMP POLISHING PAD HAVING PORES FORMED THEREIN, AND METHOD FOR MANUFACTURING SAME - The present invention relates to a CMP polishing pad and to a method for manufacturing same, characterized in that a light-absorbing material for forming pores is dispersed in the pad. Pores formed in the CMP polishing pad of the present invention are formed by means of the breakdown of the light-absorbing material which absorbs a laser beam irradiated on the polishing pad, enabling the pore size to be controlled by controlling the amount of the light-absorbing material, the intensity of the laser beam, etc., and enabling pore distribution to be freely controlled through the computer numerical control (CNC) technique. Accordingly, a CMP polishing pad can be provided that exhibits the highest polishing effectiveness in accordance with the material to be polished or the type of slurry. | 07-12-2012 |
20120184194 | CMP POLISHING PAD AND METHOD FOR MANUFACTURING SAME - The present invention relates to a CMP polishing pad and to a method for manufacturing same. The CMP polishing pad is manufactured by means of a method in which a light-absorbing material is dispersed in or on the surface of the pad, and a laser beam is absorbed by the light-absorbing material to form holes, wherein the diameter of the holes is determined by the wavelength of the laser beam. The CMP polishing pad of the present invention has holes formed therein by absorbing laser light with light-absorbing material dispersed on the surface of or in the CMP polishing pad, and laser beams of various wavelengths can be effectively absorbed in accordance with the type of light-absorbing material, such that holes having a desired diameter can be formed in the CMP polishing pad, thereby enabling the low-cost manufacture of a CMP polishing pad with excellent polishing characteristics. | 07-19-2012 |
20120190281 | POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN - Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described. | 07-26-2012 |
20120252329 | FLEXIBLE ABRASIVE ARTICLE AND METHODS OF MAKING - Provided are abrasive articles having a plurality of elongated channels extending across its working surface and intersecting with each other. These channels provide hinge points that enhance flexibility of the article along two or more directions. Optionally, the abrasive article includes a flexible attachment layer, along with apertures that penetrate through the attachment layer located at the intersection points of the channels. The enhanced flexibility allows the abrasive article to easily access recessed areas of the workpiece and facilitates applying even pressure across convex and concave surfaces. The channels assist in segregating dust particles from the abrading operation, and the optional apertures can be advantageously connected to a vacuum source for evacuation of the dust particles from the channels. | 10-04-2012 |
20120282849 | POLISHING PAD WITH ALIGNMENT FEATURE - Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described. | 11-08-2012 |
20120302148 | POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON - Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described. | 11-29-2012 |
20130005228 | POLISHING PAD - A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced. | 01-03-2013 |
20130040543 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved. | 02-14-2013 |
20130059509 | METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS - Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof. | 03-07-2013 |
20130072097 | Contouring sanding pad - The contouring sanding pad works to sand irregular surfaces, including but not limited to automobile surfaces. It is made using thin flat flexible material such as stainless steel and a pressure dispersal system. The pressure dispersal system is attached superiorly to a pressure source, which can include, but is not limited to a handle; and inferiorly, to said flexible material, where pressure is evenly distributed throughout the pad, simultaneously conforming to all surface types and shapes. This technology is superior to existing sanders in that it doesn't require mental concentration or physical adjustments to sand rounded, irregular, or uneven surfaces simultaneously, maximizing productivity. The contouring sanding pad is versatile in its various forms, shapes, sizes, and adaptability. Its components can be reconfigured in terms of materials and structure. The contouring sanding pad can be used manually or attached to power tools. It automatically conforms and continually self-adjusts to surfaces. | 03-21-2013 |
20130231032 | POLISHING PAD WITH TWO-SECTION WINDOW HAVING RECESS - A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves. | 09-05-2013 |
20130237136 | POLISHING PAD COMPRISING TRANSMISSIVE REGION - The invention provides a polishing pad comprising an optically transmissive region, wherein the polishing pad comprises a polishing pad body comprising an opaque first region and an optically transmissive second region, wherein the second region has at least one recess formed therein of at least one part of the polishrag pad body, and at least one translucent window insert is integrated into the at least one recessed area. The polishing pad body and the at least one translucent window insert comprise different porous. materials. | 09-12-2013 |
20130260656 | ABRASIVE ARTICLE HAVING A NON-UNIFORM DISTRIBUTION OF OPENINGS - An abrasive article having a plurality of apertures arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, and in particular those patterns described by the Vogel equation. Also, provided is a back-up pad having a spiral or phyllotactic patterns of air flow paths, such as in the form of open channels. The back-up pad can be specifically adapted to correspond with an abrasive article having a non-uniform distribution pattern. Alternatively, the back-up pad can be used in conjunction with conventional perforated coated abrasives. The abrasive articles having a non-uniform distribution pattern of apertures and the back-up pads can be used together as an abrasive system. | 10-03-2013 |
20130260657 | Methods and Systems for Centrifugal Casting of Polymer Polish Pads and Polishing Pads Made by the Methods - A method for making a polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a polymer precursor. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer precursor has cured. The rotating of the cylinder may be continued until the polymer has cured. The method may include forming at least two distinct layers in the polishing pad by casting and curing sequentially at least two different polymer precursors. A system for manufacturing a polishing pad includes a centrifugal caster adapted to rotate. A polishing pad made by a method is provided. | 10-03-2013 |
20130295826 | POLISHING PAD FOR ENDPOINT DETECTION AND RELATED METHODS - A polishing pad has a polishing layer with a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves. | 11-07-2013 |
20130309951 | THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS - A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window. | 11-21-2013 |
20130316631 | METHOD AND APPARATUS FOR FORMING A SLURRY POLISHING PAD - Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad. | 11-28-2013 |
20140004780 | METHOD OF MANUFACTURING POLISHING PAD MOLD, POLISHING PAD MOLD MANUFACTURED BY THE METHOD, AND POLISHING PAD MANUFACTURED BY THE MOLD | 01-02-2014 |
20140038501 | TRANSPARENT WINDOW IN A POLISHING PAD - A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface. | 02-06-2014 |
20140045413 | EXCHANGEABLE ABRASIVE MEANS FOR AN ABRASION APPLIANCE HAVING A SUCTION EXTRACTION ARRANGEMENT - An exchangeable abrasive mechanism or disc for use on abrasive-mechanism carriers having suction holes includes a plurality of through openings that each have a centroid. The through openings are differentiated into three groups that differ in the radial disposition of the centroids. A first group comprises at least one, but not more than four, through openings of a first cross section. At least two of the through openings of the first group are disposed on a first circumcircle diameter that is substantially identical to one of the hole-circle diameters such that, when the abrasive mechanism is correctly disposed on an abrasive-mechanism carrier, they are in direct alignment with and can overlap, two corresponding suction holes. A second group of through openings of a second, preferably smaller, cross section, comprises at least four through openings that are disposed on a second circumcircle diameter that differs from the first circumcircle diameter. | 02-13-2014 |
20140057539 | TOOL UNIT - A tool unit includes at least one basic body and at least one information element. The at least one basic body includes at least one fastening region configured, at least partially, to couple to a tool receiver of at least one hand-held power tool. The at least one basic body also includes at least one working region configured, at least partially, to work at least one workpiece when in an operating state. The at least one information element includes, at least partially, a material relief in the basic body. | 02-27-2014 |
20140057540 | METHOD OF MANUFACTURING POLISHING PAD HAVING DETECTION WINDOW AND POLISHING PAD HAVING DETECTION WINDOW - A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window. | 02-27-2014 |
20140120811 | METHOD FOR PRODUCING AT LEAST ONE ABRASIVE UNIT - A method for producing at least one abrasive unit that has at least two abrasive bodies connected at least partially to each other via at least one perforation includes trimming at least one edge of the abrasive unit with at least one laser cutting method. The edge of the abrasive unit is at least partially formed by the laser cutting method so as to have at least one curvature. | 05-01-2014 |
20140154961 | MULTI-ABRASIVE TOOL - A multi-abrasive tool is constituted by a support on which abrasive elements are present. Such abrasive elements are arranged in a manner so as to form one or more paths along which the successive abrasive elements have grain size sequentially increasing or decreasing by an arbitrary quantity when passing from on element to the next. Such principle gives rise to abrasive tools with different conformation both for polishing machines and for grindstones. For roto-orbital and planetary polishing machines, and optionally orbital, such support is circular and the grain sequence is circumferential, or radial, or in both directions. A first tool is constituted by contiguous (or non-contiguous) circular rings, that are differently abrasive. A second tool comprises differently abrasive elements arranged along the circular peripheral edge. A third tool comprises differently abrasive elements arranged along a spiral path of 360° starting from the edge. A fourth tool comprises two 180° spiral paths with reversed roughness sequences. A fourth tool comprises pairs of differently abrasive small cylinders fixed to a plate on concentric circumferences. A fifth tool is obtained directly on the plate of the polishing machine by means of reliefs and spacers for fixing differently abrasive sectors. For linear polishing machines, the abrasive support is a belt along which differently abrasive rectangular or oblique zones follow each other. For alternative polishing machines, the abrasive support is a plate shaped like the aforesaid belt. For tools to use with grindstones, the multi-abrasive element has a cylindrical rotation symmetry, or conical with rounded tip, or spherical symmetry. | 06-05-2014 |
20140154962 | POLISHING PAD - A polishing pad includes at least a cushion layer and a polishing layer including a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle α with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle β with a plane parallel to the polishing surface, the angle α is larger than 90 degrees, the angle β is not smaller than 85 degrees, and the angle β is smaller than the angle α, a bending point depth is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3×10 | 06-05-2014 |
20140170943 | POLISHING PAD - A polishing pad comprising at least a polishing layer and a cushion layer, wherein a groove is formed on a polishing surface of the polishing pad, at least one of angles formed by the polishing surface and a side surface of the groove which continues to the polishing surface is 105-150° inclusive, and the cushion layer has a strain constant of 7.3×10 | 06-19-2014 |
20140302759 | Mesh Abrasive Cloth - The invention is a new napped mesh abrasive cloth that is made with a gray cloth that is a napped fabric. It is used in the coated abrasives industry. Its uniqueness is in the construction. It is formed by a base material, an abrasive layer and a multilayer adhesive. On the bottom surface of the material there is nap, on the top surface of base material, there is an abrasive layer that is attached by a layer of primer. Finally, the surface of the abrasive layer is then coated with a multilayer adhesive. | 10-09-2014 |
20140342646 | POLISHING PAD - A polishing pad at least includes a polishing layer, and a cushion layer, in which a plurality of holes is provided in the polishing layer, the holes passing through the polishing layer in a thickness direction, and a plurality of grooves is provided in a polishing surface of the polishing layer, a through hole ratio is from 0.13% or more to 2.1% or less, and angles made by the polishing surface and side surfaces of the groove, which continue to the polishing surface, is from 105 degrees or more to 150 degrees or less. | 11-20-2014 |
20140357169 | Soft And Conditionable Chemical Mechanical Polishing Pad Stack - A chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm | 12-04-2014 |
20140357170 | Soft and Conditionable Chemical Mechanical Window Polishing Pad - A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm | 12-04-2014 |
20150044951 | CMP PADS HAVING MATERIAL COMPOSITION THAT FACILITATES CONTROLLED CONDITIONING - Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad. | 02-12-2015 |
20150056900 | POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON - Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described. | 02-26-2015 |
20150079886 | PERMEATED GROOVING IN CMP POLISHING PADS - A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad. | 03-19-2015 |
20150093977 | METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS - Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof. | 04-02-2015 |
20150343595 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE - Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D. | 12-03-2015 |
20160001423 | METHOD TO PROVIDE AN ABRASIVE PRODUCT SURFACE AND ABRASIVE PRODUCTS THEREOF - The invention relates to obtaining an abrasive product comprising a surface with multiple abrasive zones supported by a backing layer. The abrasive zone are surrounded by interconnected channel portions comprising first channel portions with a first transverse dimension td | 01-07-2016 |
20160023321 | GROOVED CMP PADS - CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof. | 01-28-2016 |
20160023322 | POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN - Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described. | 01-28-2016 |
20160101501 | PERMEATED GROOVING IN CMP POLISHING PADS - A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad. | 04-14-2016 |
20160107290 | CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES - Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials. | 04-21-2016 |
20160107381 | POLISHING ARTICLES AND INTEGRATED SYSTEM AND METHODS FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING ARTICLES - A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device. | 04-21-2016 |
20190143487 | Rotary Brush with Vibration Isolation | 05-16-2019 |