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01st week of 2020 patent applcation highlights part 63
Patent application number
Title
Published
20200006221
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS IN MOLDED COLUMNS
2020-01-02
20200006222
SEMICONDUCTOR DEVICE
2020-01-02
20200006223
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2020-01-02
20200006224
Interconnect Structures and Methods of Forming the Same
2020-01-02
20200006225
Semiconductor Device and Method of Manufacture
2020-01-02
20200006226
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics
2020-01-02
20200006227
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics
2020-01-02
20200006228
Integrated Circuit Interconnect Structures with Air Gaps
2020-01-02
20200006229
LOCAL INTERCONNECT FOR GROUP IV SOURCE/DRAIN REGIONS
2020-01-02
20200006230
Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
2020-01-02
20200006231
SEMICONDUCTOR MEMORY DEVICE
2020-01-02
20200006232
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS
2020-01-02
20200006233
PIN ASSEMBLIES FOR PLATED VIAS
2020-01-02
20200006234
SEMICONDUCTOR PACKAGE WITH DUAL SIDES OF METAL ROUTING
2020-01-02
20200006235
MICROELECTRONIC ASSEMBLIES HAVING INTERPOSERS
2020-01-02
20200006236
EMBEDDED VERY HIGH DENSITY (VHD) LAYER
2020-01-02
20200006237
SEMICONDUCTOR DEVICE
2020-01-02
20200006238
SEMICONDUCTOR MODULE
2020-01-02
20200006239
FULLY INTEGRATED VOLTAGE REGULATOR CIRCUITRY WITHIN A SUBSTRATE
2020-01-02
20200006240
Method of Forming RDLS and Structure Formed Thereof
2020-01-02
20200006241
Semiconductor Device and Method of Manufacture
2020-01-02
20200006242
SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER
2020-01-02
20200006243
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
2020-01-02
20200006244
METHOD OF PROVIDING PARTIAL ELECTRICAL SHIELDING
2020-01-02
20200006245
DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-FIELD-SHIELDING STRUCTURE
2020-01-02
20200006246
STIFFENER-INTEGRATED INTERCONNECT BYPASSES FOR CHIP-PACKAGE APPARATUS AND METHODS OF ASSEMBLING SAME
2020-01-02
20200006247
STIFFENER SHIELD FOR DEVICE INTEGRATION
2020-01-02
20200006248
Electric Magnetic Shielding Structure in Packages
2020-01-02
20200006249
EMI Shielding Structure in InFO Package
2020-01-02
20200006250
PACKAGE STIFFENING MAGNETIC CORE
2020-01-02
20200006251
Supporting InFO Packages to Reduce Warpage
2020-01-02
20200006252
Dummy Dies for Reducing Warpage in Packages
2020-01-02
20200006253
STIFFENER BUILD-UP LAYER PACKAGE
2020-01-02
20200006254
Mixing Organic Materials into Hybrid Packages
2020-01-02
20200006255
SEMICONDUCTOR MODULE
2020-01-02
20200006256
PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION
2020-01-02
20200006257
IMPLEMENTING TRANSIENT ELECTRONIC CIRCUITS FOR SECURITY APPLICATIONS
2020-01-02
20200006258
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DIELECTRICS
2020-01-02
20200006259
Semiconductor Device and Method
2020-01-02
20200006260
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
2020-01-02
20200006261
INDUCTOR AND TRANSMISSION LINE WITH AIR GAP
2020-01-02
20200006262
SYSTEMS AND METHODS USING AN RF CIRCUIT ON ISOLATING MATERIAL
2020-01-02
20200006263
DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER
2020-01-02
20200006264
Method of Forming Contact Holes in a Fan Out Package
2020-01-02
20200006265
SEMICONDUCTOR DEVICE
2020-01-02
20200006266
Semiconductor Interconnect Structure and Method
2020-01-02
20200006267
Molded Semiconductor Package
2020-01-02
20200006268
MANUFACTURING PROCESS FOR SEPARATING LOGIC AND MEMORY ARRAY
2020-01-02
20200006269
SEMICONDUCTOR DEVICES
2020-01-02
20200006270
SEMICONDUCTOR MEMORY DEVICE
2020-01-02
20200006271
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE
2020-01-02
20200006272
THROUGH-SILICON VIA PILLARS FOR CONNECTING DICE AND METHODS OF ASSEMBLING SAME
2020-01-02
20200006273
MICROELECTRONIC DEVICE INTERCONNECT STRUCTURE
2020-01-02
20200006274
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
2020-01-02
20200006275
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
2020-01-02
20200006276
Structure and Method of Forming a Joint Assembly
2020-01-02
20200006277
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
2020-01-02
20200006278
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
2020-01-02
20200006279
METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP
2020-01-02
20200006280
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
2020-01-02
20200006281
METHOD OF BONDING TERMINAL OF SEMICONDUCTOR CHIP USING SOLDER BUMP AND SEMICONDUCTOR PACKAGE USING THE SAME
2020-01-02
20200006282
SEMICONDUCTOR-DEVICE MANUFACTURING METHOD ANDMANUFACTURING APPARATUS
2020-01-02
20200006283
METHODS FOR IMPROVED DIE BONDING
2020-01-02
20200006284
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
2020-01-02
20200006285
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
2020-01-02
20200006286
PACKAGING PROCESS AND MANUFACTURING METHOD
2020-01-02
20200006287
PACKAGE STRUCTURE HAVING SUBSTRATE THERMAL VENT STRUCTURES FOR INDUCTOR COOLING
2020-01-02
20200006288
Forming Metal Bonds with Recesses
2020-01-02
20200006289
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCATED CORNERS
2020-01-02
20200006290
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2020-01-02
20200006291
SEMICONDUCTOR DEVICES HAVING THROUGH-STACK INTERCONNECTS FOR FACILITATING CONNECTIVITY TESTING
2020-01-02
20200006292
INTEGRATED MULT-DIE PARTITIONED VOLTAGE REGULATOR
2020-01-02
20200006293
CHIP SCALE THIN 3D DIE STACKED PACKAGE
2020-01-02
20200006294
Integrated Circuit Package and Method of Forming Same
2020-01-02
20200006295
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
2020-01-02
20200006296
METHOD OF MANUFACTURING LIGHT EMITTING MODULE
2020-01-02
20200006297
LIGHT-EMITTING DEVICE
2020-01-02
20200006298
LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE
2020-01-02
20200006299
THREE-DIMENSIONAL MEMORY DEVICES WITH STACKED DEVICE CHIPS USING INTERPOSERS
2020-01-02
20200006300
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF
2020-01-02
20200006301
Semiconductor Device and Power Conversion Apparatus
2020-01-02
20200006302
MULTILEVEL DIE COMPLEX WITH INTEGRATED DISCRETE PASSIVE COMPONENTS
2020-01-02
20200006303
SEMICONDUCTOR DEVICE
2020-01-02
20200006304
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD
2020-01-02
20200006305
INTEGRATED HETEROGENOUS POWER MANAGEMENT CIRCUITRIES
2020-01-02
20200006306
CONFIGURABLE RANDOM-ACCESS MEMORY (RAM) ARRAY INCLUDING THROUGH-SILICON VIA (TSV) BYPASSING PHYSICAL LAYER
2020-01-02
20200006307
Fan-Out Package with Cavity Substrate
2020-01-02
20200006308
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
2020-01-02
20200006309
Buffer Design for Package Integration
2020-01-02
20200006310
Integrated circuit system and packaging method therefor
2020-01-02
20200006311
Stress Reduction Apparatus and Method
2020-01-02
20200006312
LTHC as Charging Barrier in InFO Package Formation
2020-01-02
20200006313
Semiconductor Device Packages, Packaging Methods, and Packaged Semiconductor Devices
2020-01-02
20200006314
SHIELDING IN A UNIT CAPACITOR ARRAY
2020-01-02
20200006315
SUBSTRATE STRUCTURE AND MANUFACTURING PROCESS
2020-01-02
20200006316
INTEGRATED CIRCUIT LAYOUT METHOD, DEVICE, AND SYSTEM
2020-01-02
20200006317
INTEGRATED CIRCUIT WITH SINGLE LEVEL ROUTING
2020-01-02
20200006318
MULTIPLE FIN HEIGHT INTEGRATED CIRCUIT
2020-01-02
20200006319
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
2020-01-02
20200006320
ELECTRONIC CIRCUIT WITH ELECTROSTATIC DISCHARGE PROTECTION
2020-01-02