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01st week of 2018 patent applcation highlights part 59
Patent application number
Title
Published
20180005816
SEMICONDUCTOR LAMINATE
2018-01-04
20180005817
APPARATUS AND METHOD FOR TREATING SUBSTRATE
2018-01-04
20180005818
CONTAMINANT REMOVAL IN ULTRA-THIN SEMICONDUCTOR DEVICE FABRICATION
2018-01-04
20180005819
SUBSTRATE PROCESSING METHOD FOR DEPOSITING A BARRIER LAYER TO PREVENT PHOTORESIST POISONING
2018-01-04
20180005820
COMPOSITION AND METHOD FOR FORMING A DIELECTRIC LAYER
2018-01-04
20180005821
COMBINED REACTIVE GAS SPECIES FOR HIGH-MOBILITY CHANNEL PASSIVATION
2018-01-04
20180005822
GLASS-BASED ARTICLE WITH ENGINEERED STRESS DISTRIBUTION AND METHOD OF MAKING SAME
2018-01-04
20180005823
CYCLICAL DEPOSITION OF GERMANIUM
2018-01-04
20180005824
A FIELD EFFECT TRANSISTOR USING TRANSITION METAL DICHALCOGENIDE AND A METHOD FOR FORMING THE SAME
2018-01-04
20180005825
NANO-HETEROSTRUCTURE
2018-01-04
20180005826
FORMING A SILICON BASED LAYER IN A TRENCH TO PREVENT CORNER ROUNDING
2018-01-04
20180005827
MULTI-DEPOSITION PROCESS FOR HIGH QUALITY GALLIUM NITRIDE DEVICE MANUFACTURING
2018-01-04
20180005828
MANUFACTURING METHOD OF SiC SUBSTRATE
2018-01-04
20180005829
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2018-01-04
20180005830
FORMING ELECTRODE TRENCHES BY USING A DIRECTED ION BEAM AND SEMICONDUCTOR DEVICE WITH TRENCH ELECTRODE STRUCTURES
2018-01-04
20180005831
Method of Reducing an Impurity Concentration in a Semiconductor Body
2018-01-04
20180005832
Semiconductor Device, Method and Tool of Manufacture
2018-01-04
20180005833
HIGH ASPECT RATIO GATES
2018-01-04
20180005834
HIGH ASPECT RATIO GATES
2018-01-04
20180005835
MEMORY DEVICE
2018-01-04
20180005836
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
2018-01-04
20180005837
METHOD OF DETECTING A CONDITION
2018-01-04
20180005838
SEGMENTED EDGE PROTECTION SHIELD
2018-01-04
20180005839
ENVIRONMENTALLY GREEN PROCESS AND COMPOSITION FOR COBALT WET ETCH
2018-01-04
20180005840
Surface Treatment in a Chemical Mechanical Process
2018-01-04
20180005841
TECHNOLOGIES FOR SELECTIVELY ETCHING OXIDE AND NITRIDE MATERIALS AND PRODUCTS FORMED USING THE SAME
2018-01-04
20180005842
CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION
2018-01-04
20180005843
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2018-01-04
20180005844
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
2018-01-04
20180005845
PACKING METHOD FOR SEMICONDUCTOR DEVICE
2018-01-04
20180005846
SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
2018-01-04
20180005847
CARRIER SUBSTRATES FOR SEMICONDUCTOR PROCESSING
2018-01-04
20180005848
LIGHT-IRRADIATION HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS
2018-01-04
20180005849
SUBSTRATE TREATING APPARATUS
2018-01-04
20180005850
SELECTIVE ETCH USING MATERIAL MODIFICATION AND RF PULSING
2018-01-04
20180005851
CHAMBER FILLER KIT FOR DIELECTRIC ETCH CHAMBER
2018-01-04
20180005852
ION TO NEUTRAL CONTROL FOR WAFER PROCESSING WITH DUAL PLASMA SOURCE REACTOR
2018-01-04
20180005853
MULTIPLE WAFER SINGLE BATH ETCHER
2018-01-04
20180005854
CHEMICAL LIQUID TREATMENT APPARATUS AND CHEMICAL LIQUID TREATMENT METHOD
2018-01-04
20180005855
MULTI-AXIS FLATTENING TOOL AND METHOD
2018-01-04
20180005856
QUARTZ UPPER AND LOWER DOMES
2018-01-04
20180005857
SYSTEM AND METHOD FOR SUBSTRATE SUPPORT FEED-FORWARD TEMPERATURE CONTROL BASED ON RF POWER
2018-01-04
20180005858
CONVEYING DEVICE, CONVEYING METHOD AND EVAPORATION APPARATUS
2018-01-04
20180005859
METHOD FOR REDUCING TEMPERATURE TRANSITION IN AN ELECTROSTATIC CHUCK
2018-01-04
20180005860
ELECTROSTATIC CHUCK
2018-01-04
20180005861
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF OPERATING THE SAME
2018-01-04
20180005862
PROTECTIVE SHEETING FOR USE IN PROCESSING A SEMICONDUCTOR-SIZED WAFER AND SEMICONDUCTOR-SIZED WAFER PROCESSING METHOD
2018-01-04
20180005863
MINIMAL CONTACT END-EFFECTORS FOR HANDLING MICROELECTRONIC DEVICES
2018-01-04
20180005864
USE OF VACUUM CHUCKS TO HOLD A WAFER OR WAFER SUB-STACK
2018-01-04
20180005865
END EFFECTOR ASSEMBLY FOR CLEAN/DIRTY SUBSTRATE HANDLING
2018-01-04
20180005866
SUBSTRATE TRANSPORT APPARATUS
2018-01-04
20180005867
ESC CERAMIC SIDEWALL MODIFICATION FOR PARTICLE AND METALS PERFORMANCE ENHANCEMENTS
2018-01-04
20180005868
SELF-ALIGNED AIRGAPS WITH CONDUCTIVE LINES AND VIAS
2018-01-04
20180005869
METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
2018-01-04
20180005870
Integrated Bi-Layer STI Deposition
2018-01-04
20180005871
ELECTRICAL INSULATION DEVICE
2018-01-04
20180005872
PREPARATION OF SILICON-GERMANIUM-ON-INSULATOR STRUCTURES
2018-01-04
20180005873
DEVICE LAYER TRANSFER WITH A PRESERVED HANDLE WAFER SECTION
2018-01-04
20180005874
VIA CLEANING TO REDUCE RESISTANCE
2018-01-04
20180005875
SELF-ALIGNED PATTERN FORMATION FOR A SEMICONDUCTOR DEVICE
2018-01-04
20180005876
Etch Stop Layer for Semiconductor Devices
2018-01-04
20180005877
SEMICONDUCTOR DEVICES, FINFET DEVICES AND METHODS OF FORMING THE SAME
2018-01-04
20180005878
SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-01-04
20180005879
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
2018-01-04
20180005880
BARRIER LAYERS IN TRENCHES AND VIAS
2018-01-04
20180005881
METHODS OF ENHANCING POLYMER ADHESION TO COPPER
2018-01-04
20180005882
LOW-K DIELECTRIC INTERCONNECT SYSTEMS
2018-01-04
20180005883
LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRUCTURE
2018-01-04
20180005884
AGGRESSIVE TIP-TO-TIP SCALING USING SUBTRACTIVE INTEGRATION
2018-01-04
20180005885
SELF ALIGNED CONDUCTIVE LINES WITH RELAXED OVERLAY
2018-01-04
20180005886
CONTACT STRUCTURE AND ASSOCIATED METHOD FOR FLASH MEMORY
2018-01-04
20180005887
THROUGH-SILICON VIA WITH INJECTION MOLDED FILL
2018-01-04
20180005888
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
2018-01-04
20180005889
METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVICES AND ELECTRONIC DEVICE
2018-01-04
20180005890
SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
2018-01-04
20180005891
INTEGRATED METAL GATE CMOS DEVICES
2018-01-04
20180005892
STRAINED AND UNSTRAINED SEMICONDUCTOR DEVICE FEATURES FORMED ON THE SAME SUBSTRATE
2018-01-04
20180005893
METHODS FOR FORMING MASK LAYERS USING A FLOWABLE CARBON-CONTAINING SILICON DIOXIDE MATERIAL
2018-01-04
20180005894
SEMICONDUCTOR STRUCTURE HAVING CONTACT HOLES BETWEEN SIDEWALL SPACERS
2018-01-04
20180005895
VERTICAL TRANSISTOR WITH VARIABLE GATE LENGTH
2018-01-04
20180005896
VERTICAL FET DEVICES WITH MULTIPLE CHANNEL LENGTHS
2018-01-04
20180005897
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
2018-01-04
20180005898
FORMING FINS UTILIZING ALTERNATING PATTERN OF SPACERS
2018-01-04
20180005899
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED DIMENSIONAL VARIATIONS
2018-01-04
20180005900
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED DIMENSIONAL VARIATIONS
2018-01-04
20180005901
SEMICONDUCTOR CONTACT
2018-01-04
20180005902
MERGED GATE FOR VERTICAL TRANSISTORS
2018-01-04
20180005903
SEMICONDUCTOR DEVICE INCLUDING DUAL TRENCH EPITAXIAL DUAL-LINER CONTACTS
2018-01-04
20180005904
VERTICAL CMOS DEVICES WITH COMMON GATE STACKS
2018-01-04
20180005905
METHOD FOR THE PRODUCTION OF AN OPTOELECTRONIC MODULE INCLUDING A SUPPORT COMPRISING A METAL SUBSTRATE, A DIELECTRIC COATING AND A CONDUCTIVE LAYER
2018-01-04
20180005906
DEVICE MANUFACTURING METHOD AND DEVICE MANUFACTURING APPARATUS
2018-01-04
20180005907
WAFER TRANSFER DEVICE
2018-01-04
20180005908
SEMICONDUCTOR DEVICE
2018-01-04
20180005909
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHODS FOR MANUFACTURING SUCH DEVICES
2018-01-04
20180005910
Repackaged integrated circuit assembly method
2018-01-04
20180005911
PLACEMENT BASE FOR SEMICONDUCTOR DEVICE AND VEHICLE EQUIPMENT
2018-01-04
20180005912
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-01-04
20180005913
Package Device
2018-01-04
20180005914
CIRCUIT BOARD AND ELECTRONIC DEVICE
2018-01-04
20180005915
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
2018-01-04