01st week of 2011 patent applcation highlights part 13 |
Patent application number | Title | Published |
20110001203 | MAGNETIC MEMORY ELEMENT UTILIZING SPIN TRANSFER SWITCHING - A magnetic memory element includes a pinned layer, a tunneling barrier layer, a free layer and a stabilizing layer. The tunneling barrier layer is disposed on the pinned layer. The free layer is disposed on the tunneling barrier layer. The stabilizing layer is disposed on the free layer. | 2011-01-06 |
20110001204 | TRANSIMPEDANCE AMPLIFIER HAVING A SHARED INPUT - Consistent the present disclosure, a receive circuit is provided that includes a balanced detector portion and a transimpedance amplifier (TIA). The anode of one photodiode is connected to the cathode of the other by a bonding pad, which supplies the sum of the currents generated in each photodiode to an input of the TIA. Thus, the TIA may, for example, have a single input, as opposed to multiple inputs, thereby reducing the number of connections so that the photodiodes and the TIA may be integrated onto a smaller die. In addition, since there are few connections, fewer TIAs are required and differential stages are unnecessary. Power consumption is thus reduced, and, since the photodiode current is fed through one input to the TIA, fewer feedback resistors are required, thereby reducing thermal noise. In addition, since the anode of one photodiode is connected to the cathode of the other, the dark current generated in each flows in opposite directions, and is therefore effectively cancelled out. Since one input is provided, impedance matching with other inputs is unnecessary, nor is additional DC biasing circuitry needed. As described in greater detail below, an example of the present disclosure includes a bonding pad, which connects the two photodiodes and provides the input current to the TIA. | 2011-01-06 |
20110001205 | Image sensor and semiconductor device including the same - Example embodiments relate to a three-dimensional image sensor including a color pixel array on a substrate, a distance pixel array on the substrate, an RGB filter on the color pixel array and configured to allow visible light having a first wavelength to pass, a near infrared light filter on the distance pixel array and configured to allow near infrared light having a second wavelength to pass, and a stack type single band filter on the RGB filter and the near infrared light filter and configured to allow light having a third wavelength between the first wavelength and the second wavelength to pass. According to example embodiments, a semiconductor device may include a color pixel array on a substrate; a distance pixel array on the substrate; a light-inducing member on the color pixel array and the distance pixel array; a RGB filter on the light-inducing member and configured to allow visible light to pass; a near infrared light filter on the light-inducing member and configured to allow near infrared light to pass; and a plurality of lenses on the RGB filter and the near infrared light filter. | 2011-01-06 |
20110001206 | IMAGE SENSOR DEVICE AND METHOD FOR MAKING SAME - The present invention discloses an image sensor device and a method for making an image sensor device. The image sensor device comprises an optical pixel and an electronic circuit, wherein the optical pixel includes: a substrate; an image sensor area formed in the substrate; a masking layer formed above the image sensor area, wherein the masking layer is formed during a process for forming the electronic circuit; and a light passage above the masking layer for increasing light sensing ability of the image sensor area. | 2011-01-06 |
20110001207 | SOLID STATE IMAGE SENSOR AND MANUFACTURING METHOD THEREOF - A solid state image sensor includes: a first pixel and a second pixel, each including a light receiving portion; a first color filter formed in an upper part of the first pixel on a first main surface side of a semiconductor substrate; a second color filter formed in an upper part of the second pixel on the first main surface side of the semiconductor substrate; a metal interconnect layer formed on a second main surface side of the semiconductor substrate; and a substrate contact connected to the second main surface of the semiconductor substrate, and provided between the metal interconnect layer and the second main surface. The first color filter mainly transmits first light therethrough, and the second color filter mainly transmits second light therethrough. The second light has a shorter wavelength than that of the first light. The substrate contact is not provided in the first pixel. | 2011-01-06 |
20110001208 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - An insulation is provided in a portion surrounding a light receiving portion in a semiconductor element, and a sealing resin is provided around the insulation, thereby warping the insulation outward when viewed from the light receiving portion to prevent diffuse light from returning to the light receiving portion of the semiconductor element. | 2011-01-06 |
20110001209 | SEMICONDUCTOR DEVICE - In a termination structure in which a JTE layer is provided, a level or defect existing at an interface between a semiconductor layer and an insulating film, or a minute amount of adventitious impurities that infiltrate into the semiconductor interface from the insulating film or from an outside through the insulating film becomes a source or a breakdown point of a leakage current, which deteriorates a breakdown voltage. A semiconductor device includes: an n | 2011-01-06 |
20110001210 | FUSE PART IN SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A fuse part in a semiconductor device includes a conductive pattern formed over a substrate, wherein the conductive pattern includes a blowing part and a pad part, making contact with both sides of the blowing part and having a larger thickness than that of the blowing part, a protection layer formed over the substrate having the conductive pattern, and a fuse box formed in the protection layer located on an upper portion of the blowing part, wherein a portion of the protection layer maintains a certain thickness over the blowing part. | 2011-01-06 |
20110001211 | FUSE FOR IN USE OF A SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - Provided is a fuse of a semiconductor device that includes a Y type fuse and an insulation layer configured to expose the Y type fuse such that an exposed portion of the Y type fuse has a substantially ‘V’ shape. According to the present invention, metal crack is prevented from occurring in a Y type fuse under a high temperature and high humidity condition of a reliability test so that the reliability and competitiveness of semiconductor devices can be improved. | 2011-01-06 |
20110001212 | FUSE OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A fuse of a semiconductor device includes a plurality of first conductive patterns, and a plurality of second conductive patterns filling spaces between the first conductive patterns and formed of a material which has a greater specific resistance than the first conductive patterns. | 2011-01-06 |
20110001213 | FUSE PART FOR SEMICONDUCTOR DEVICE - A fuse part for a semiconductor device includes an insulation layer configured to cover a conductive pattern over a substrate, a dual fuse configured to include a first pattern and a second pattern that are positioned on the same line over the insulation layer and spaced apart from each other by a certain distance, a protective layer configured to cover the dual fuse and include a first fuse box and a second fuse box that partially expose the first pattern and the second pattern, respectively, and a plurality of plugs configured to penetrate the insulation layer and electrically connect the first and second patterns to the conductive pattern. Herein, the plugs are positioned beneath the first and second fuse boxes. | 2011-01-06 |
20110001214 | SEMICONDUCTOR DEVICE WITH CAPACITOR AND/OR INDUCTOR AND METHOD OF MAKING - An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor. | 2011-01-06 |
20110001215 | MULTI-COMPONENT ELECTRONIC PACKAGE - An electronic multi-component package is assembled by placing multiple electronic components within multiple openings of a package substrate, then depositing and curing adhesive filler in gaps between the components and the inner peripheries of the openings. Circuit features, including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces of the package substrate. Preformed conductive vias through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components may be attached to conductive lands on at least one side of the package. The circuit features also include contact pads for external package connections, such as in a ball-grid-array or equivalent structure. | 2011-01-06 |
20110001216 | Semiconductor device and manufacturing method thereof - A manufacturing method of a semiconductor device includes: forming a wiring in a first interlayer insulating layer in a first region; etching an surface portion of the first interlayer insulating layer in a second region; | 2011-01-06 |
20110001217 | ULTRA HIGH DENSITY CAPACITY COMPRISING PILLAR-SHAPED CAPACITORS FORMED ON BOTH SIDES OF A SUBSTRATE - The present invention describes an ultra High-Density Capacitor design, integrated in a semiconductor substrate, preferably a Si substrate, by using both wafer sides. The capacitors are pillar-shaped and comprise electrodes ( | 2011-01-06 |
20110001218 | SEMICONDUCTOR INTEGRATED CIRCUIT AND SYSTEM LSI INCLUDING THE SAME - A semiconductor integrated circuit having a diode element includes a diffusion layer which constitutes the anode and two diffusion layers which are provided on the left and right sides of the anode and which constitute the cathode, such that the anode and the cathode constitute the diode. A well contact is provided to surround both the diffusion layers of the anode and cathode. Distance tS between a longer side of the well contact and the diffusion layers of the cathode is shorter, while distance tL between a shorter side of the well contact and the diffusion layers of the anode and cathode is longer (tL>tS). Accordingly, the resistance value between the diffusion layer of the anode and the shorter side of the well contact is larger, so that the current from the diffusion layer of the anode is unlikely to flow toward the shorter side of the well contact. Thus, convergence of the current at the contact holes of the diffusion layer of the anode is reduced, so that the reliability of the diode element improves. | 2011-01-06 |
20110001219 | SILICON SINGLE CRYSTAL WAFER, METHOD FOR PRODUCING SILICON SINGLE CRYSTAL OR METHOD FOR PRODUCING SILICON SINGLE CRYSTAL WAFER, AND SEMICONDUCTOR DEVICE - The present invention is a silicon single crystal wafer grown by the Czochralski method, the silicon single crystal wafer in which an wafer entire plane is an N region located outside OSFs which are generated in the form of a ring when thermal oxidation treatment is performed and contains no defect region detected by the RIE process. As a result, a silicon single crystal wafer which belongs to none of a vacancy-rich V region, an OSF region, a Dn region in an Nv region, the Dn region in which a defect detected by the Cu deposition process is generated, and an interstitial silicon-rich I region and can improve the TDDB characteristic which is the time dependent breakdown characteristic of an oxide film more reliably than a known silicon single crystal wafer is provided, and the silicon single crystal wafer is provided under stable production conditions. | 2011-01-06 |
20110001220 | LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP - A laser processing method is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a high precision in particular. | 2011-01-06 |
20110001221 | DIELECTRIC LAYER - A dielectric layer is provided. The dielectric layer includes a photo-sensitive polymer or a non-photo-sensitive polymer and an amorphous metal oxide disposed in the photo-sensitive polymer or a non-photo-sensitive polymer. | 2011-01-06 |
20110001222 | ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING SAME - An electronic device comprises an electronic element package and a mounting substrate on which the electronic element package is mounted. The electronic element package has an LGA electrode. The mounting substrate has a through-hole having a conductor which covers an inner wall. The LGA electrode has an area larger than an opening area of the through-hole on a side facing the LGA electrode. The electronic element package is mounted on the mounting substrate so that at least a part of the opening of the through-hole overlaps with the LGA electrode. The LGA electrode and the conductor of the through-hole are electrically connected to a conductive material provided inside the through-hole. In the LGA electrode, at least a part of the region that does not overlap with the opening of the through-hole is joined to the mounting substrate by an adhesive. | 2011-01-06 |
20110001223 | LEADFRAME, LEADFRAME TYPE PACKAGE AND LEAD LANE - A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and the pair of first differential signal leads is arranged the pair of second differential signal leads, a first power lead arranged between the pair of first and second differential signal leads, a second power lead arranged between the pair of second and third differential signal leads, and a third power lead between which and the second power lead is the pair of third differential signal leads. A voltage provided by the first power lead is less than a voltage provided by the second power lead, and the voltage provided by the second power lead is substantially equal to a voltage provided by the third power lead. | 2011-01-06 |
20110001224 | LEAD FRAME ROUTED CHIP PADS FOR SEMICONDUCTOR PACKAGES - A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first molding compound within those channels; patterning a second side of the substrate to form an array of chip attach sites and routing circuits electrically interconnecting the array of lands and the array of chip attach sites; directly electrically interconnecting input/output pads on a semiconductor device to the chip attach sites; and encapsulating the semiconductor device, the array of chip attach sites and the routing circuits with a second molding compound. This process is particularly suited for the manufacture of chip scale packages and very thin packages. | 2011-01-06 |
20110001225 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method includes: mounting a plurality of semiconductor elements on a substrate having wirings; connecting electrically electrodes of the semiconductor elements and the wirings; sealing the semiconductor elements with a resin, which is carried out by bringing a thermal conductor having a concavity and the substrate to be in contact with each other so that the semiconductor elements are positioned within the concavity and by filling the concavity with the resin; and separating respective semiconductor elements | 2011-01-06 |
20110001226 | LEAD FRAME, AND ELECTRONIC PART USING THE SAME - A lead frame includes a die pad on which at least one IC chip is mounted, a plurality of leads that electrically connect the IC chip and at least one external element, and a plurality of projections that are formed in at least one edge of the die pad. The projections are used as at least one bonding point that connect with at least one free terminal of the IC chip or as references of positioning when the IC chip is arranged on the die pad. | 2011-01-06 |
20110001227 | Semiconductor Chip Secured to Leadframe by Friction - A semiconductor device ( | 2011-01-06 |
20110001228 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A wire short-circuit defect during molding is prevented. A semiconductor device has a tab, a plurality of leads arranged around the tab, a semiconductor chip mounted over the tab, a plurality of wires electrically connecting the electrode pads of the semiconductor chip with the leads, and a molded body in which the semiconductor chip is resin molded. By further stepwise shortening the chip-side tip end portions of the leads as the first edge or side of the principal surface of the semiconductor chip goes away from the middle portion toward the both end portions thereof, and shortening the tip end portions of those of first leads corresponding to the middle portion of the first edge or side of the principal surface which are adjacent to second leads located closer to the both end portions of the first edge or side, the distances between second wires connected to the second leads and the tip end portions of the first leads adjacent to the second leads can be increased. As a result, it is possible to prevent the wire short-circuit defect even when wire sweep occurs due to the flow resistance of a mold resin. | 2011-01-06 |
20110001229 | PACKAGE STRUCTURE AND PACKAGE PROCESS - A package structure including a circuit substrate, at least a chip, leads and an encapsulant is provided. The circuit substrate has a first surface, a second surface opposite to the first surface, and contacts disposed on the first surface. The chip is disposed on the second surface of the circuit substrate and electrically connected to the circuit substrate. The said leads are disposed on the periphery of the second surface and surround the chip. Each lead has an inner lead portion and an outer lead portion and is electrically connected to the circuit substrate via the inner lead portion. The encapsulant encapsulates the circuit substrate, the chip and the inner lead portion and exposes the first surface of the circuit substrate and the outer lead portion, wherein the upper surface of the encapsulant and the first surface of the circuit substrate are coplanar with each other. | 2011-01-06 |
20110001230 | Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging - Adequate heat dissipation is essential for semiconductor devices. When a device exceeds a specified junction temperature, the device can be damaged, not perform correctly, or can have a reduced operating life. Semiconductor packages must dissipate heat from the chip to the external environment (i.e. to the PCB, air, etc) to keep the semiconductor device below a certain temperature threshold. For most devices, the most efficient way to dissipate the heat is through the package external I/O connections and into the PCB that it is mounted to. For Ball Grid Array (BGA) packages, the external I/Os are solder balls. Variable pitch packages pose advantages in heat dissipation without introducing significant costs. | 2011-01-06 |
20110001231 | SEMICONDUCTOR PACKAGE HAVING NON-UNIFORM CONTACT ARRANGEMENT - A semiconductor package has a non-uniform contact arrangement in which clustered contacts (e.g., a group of ground contacts, a group of power contacts, and/or a group of heatslug contacts) are placed closer together than I/O contacts. In one embodiment, I/O contacts near a cluster have a pitch in at least one direction that is larger than other I/O contacts. A local increase in the pitch of I/O contacts may be used to increase the line width and/or spacing of traces that fan out from corresponding pads on a printed circuit board. | 2011-01-06 |
20110001232 | Flip-Chip Module and Method for the Production Thereof - The invention relates to a flip-chip module with a semiconductor chip with contact posts, wherein the contact posts are connected electrically and mechanically to a substrate. Provided between the substrate and the semiconductor chip is a spacer, which is coupled mechanically to the substrate and/or the semiconductor chip. By this means, thermal stresses in the flip-chip module are absorbed by the spacer and kept away from the semiconductor chip. | 2011-01-06 |
20110001233 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOUNTING METHOD - In a semiconductor device mounted structure in which device electrodes of a semiconductor device and board electrodes of a board are connected to each other via bump electrodes, respectively, and in which a sealing-bonding use resin is placed between the semiconductor device and the board, a void portion is placed at a position corresponding to an edge portion of the semiconductor device in the sealing-bonding use resin. Thus, stress loads generated at corner portions of the semiconductor device due to board flexures for differences in thermal expansion and thermal contraction among the individual members caused by heating and cooling steps in mounting process of the semiconductor device, as well as for mechanical loads after the mounting process, can be absorbed by the void portion and thereby reduced, so that breakdown of the semiconductor device mounted structure is prevented. | 2011-01-06 |
20110001234 | Semiconductor device and fabrication method thereof - Disclosed is a semiconductor device that comprises a first insulating film provided on a main face of a semiconductor substrate; a first pedestal provided at a first wiring layer on the first insulating layer; a second insulating film provided on the first wiring layer; and a second pedestal provided at a second wiring layer on the second insulating film, wherein, when the first and second pedestals are projected in a direction perpendicular to the main face onto a plane parallel to the main face, the second pedestal is larger than the first pedestal, and the whole of the first pedestal is disposed at an inside of the second pedestal. | 2011-01-06 |
20110001235 | STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME - A stacked semiconductor device is constructed by stacking in two levels: a lower semiconductor device having a wiring board, at least one semiconductor chip mounted on a first surface of the wiring board and having electrodes electrically connected to wiring by way of a connection means, an encapsulant composed of insulating plastic that covers the semiconductor chip and the connection means, a plurality of electrodes formed overlying the wiring of a second surface of the wiring board, and a plurality of linking interconnects each having a portion connected to the wiring of the first surface of the wiring board and another portion exposed on the surface of the encapsulant; and an upper semiconductor device in which each electrode overlies and is electrically connected to the exposed portions of each of the linking interconnects of the lower semiconductor device. The linking interconnects extend from the first surface of the wiring board to the side surfaces and upper surface of the encapsulant, and moreover, electrically connect with wiring of the wiring board that projects from the encapsulant. | 2011-01-06 |
20110001236 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device having redistribution interconnects in the WPP technology and improved reliability, wherein the redistribution interconnects have first patterns and second patterns which are electrically separated from each other within the plane of the semiconductor substrate, the first patterns electrically coupled to the multi-layer interconnects and the floating second patterns are coexistent within the plane of the semiconductor substrate, and the occupation ratio of the total of the first patterns and the second patterns within the plane of the semiconductor substrate, that is, the occupation ratio of the redistribution interconnects is 35 to 60%. | 2011-01-06 |
20110001237 | ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT - The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element. | 2011-01-06 |
20110001238 | SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring. | 2011-01-06 |
20110001239 | Semiconductor Chip Package and Method for Designing the Same - A semiconductor chip package is disclosed. The semiconductor chip package comprises a package substrate having a bottom surface. At least four adjacent ball pads are on the bottom surface, arranged in a first two-row array along a first direction and a second direction. At least four vias are drilled through the package substrate, arranged in a second two-row array, wherein each of the vias in a row of the second two-row array is offset by a first distance along the first direction and a second distance along the second direction from the connecting ball pads in a row of the first two-row array, and each of the vias in the other adjacent row of the second two-row array is offset by the first distance along an opposite direction to the first direction and the second distance along the second direction from the connecting ball pads in the other adjacent row of the first two-row array. | 2011-01-06 |
20110001240 | Chip Scale Module Package in BGA Semiconductor Package - A semiconductor package includes a ball grid array (BGA) substrate having integrated metal layer circuitry, a flip chip chip scale module package (CSMP) having a first integrated passive device (IPD), the flip chip chip scale module package attached to the BGA substrate, and an application die attached to the IPD. A method of manufacturing a semiconductor package includes providing a BGA substrate having integrated metal layer circuitry, attaching a flip chip CSMP having a first IPD to the BGA substrate, and attaching an application die to the IPD. | 2011-01-06 |
20110001241 | COMPOUND SEMICONDUCTOR DEVICE AND CONNECTORS - A semiconductor device includes a semiconductor substrate formed from compound semiconductor material and multiple conductive connecting pads. The connecting pads are symmetrically arranged on a first surface of the semiconductor substrate in an interweaving pattern. Each cleavage plane extending across the first surface of the semiconductor substrate intersects a portion of at least one connecting pad of the plurality of connecting pads. | 2011-01-06 |
20110001242 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device capable of preventing occurrence of cracking and the like, taking a large area, where wiring and the like that function as elemental devices can be arranged, within a plurality of interlayer insulation films, and reducing production cost. The semiconductor device according to the present invention has a low dielectric constant film having a dielectric constant of not less than 2.7. In the low dielectric constant film and the like, materials (e.g., a first dummy pattern, a second dummy pattern) with a larger hardness than that of the low dielectric constant film are formed at a part under a pad part. | 2011-01-06 |
20110001243 | SEMICONDUCTOR DEVICE INCLUDING DUMMY - A semiconductor device or a memory which includes the same have a line pattern, and a contact plug, the line pattern including a first linear feature to which the contact plug is connected by design, and a second linear feature having a connecting portion and a dummy portion adjacent the location at which the contact plug is electrically connected to the first linear feature. A second contact plug is electrically connected to the connecting portion of the second linear feature of the line pattern. In the case of a misalignment error or the like, the first contact plug may also be electrically connected to the second linear feature of the line pattern but at the dummy portion thereof so as to not create a short circuit in that case. The dummy portion thus allows a sufficiently large process margin to be secured for the contact plug. | 2011-01-06 |
20110001244 | Method for Producing a Power Semiconductor Module, and Power Semiconductor Module Comprising a Connection Device - A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module. | 2011-01-06 |
20110001245 | SEMICONDUCTOR DEVICE INCLUDING SEALING FILM FOR ENCAPSULATING SEMICONDUCTOR CHIP AND PROJECTION ELECTRODES AND MANUFACTURING METHOD THEREOF - Disclosed in a semiconductor device including a semiconductor chip including an electrode, a projection electrode, an sealing film for encapsulating the semiconductor chip and the projection electrode, a first wiring lines provided on one surface of the sealing film, which is electrically connected with the electrode and the projection electrode, a second wiring lines provided on the other surface of the sealing film, which is electrically connected with the projection electrode and at least one of a first via hole conductor for electrically connecting the first wiring lines and the projection electrode or a second via hole conductor for electrically connecting the second wiring lines and the projection electrode, and an area of the projection electrode in an interface where the projection electrode and the first via hole conductor contact each other is greater than an area of the first via hole conductor in the interface and an area of the projection electrode in an interface where the projection electrode and the second via hole conductor contact each other is greater than an area of the second via hole conductor in the interface. | 2011-01-06 |
20110001246 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - The reliability of a semiconductor device having an embedded wire in the lowest layer wire is improved. In a main surface of a semiconductor substrate, MISFETs are formed and over the main surface, insulating films | 2011-01-06 |
20110001247 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device manufacturing method comprises bonding a semiconductor element onto one surface of a first protective film via an adhesive layer, an electrode being formed in the semiconductor element, the first protective film being disposed on a first base material and including a first via hole, removing the first base material from the first protective film, applying first laser light to the adhesive layer through the first via hole to form a second via hole in the adhesive layer so that the electrode is exposed through the adhesive layer, and forming a metal layer in the second via hole to connect the metal layer to the electrode. | 2011-01-06 |
20110001248 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2011-01-06 |
20110001249 | Supplying Power to Integrated Circuits Using a Grid Matrix Formed of Through-Silicon Vias - An integrated circuit structure includes a chip including a substrate and a power distribution network. The power distribution network includes a plurality of power through-silicon vias (TSVs) penetrating the substrate, wherein the plurality of power TSVs forms a grid; and a plurality of metal lines in a bottom metallization layer (M | 2011-01-06 |
20110001250 | METHOD AND STRUCTURE FOR ADHESION OF INTERMETALLIC COMPOUND (IMC) ON CU PILLAR BUMP - A method and structure for good adhesion of Intermetallic Compounds (IMC) on Cu pillar bumps are provided. The method includes depositing Cu to form a Cu pillar layer, depositing a diffusion barrier layer on top of the Cu pillar layer, and depositing a Cu cap layer on top of the diffusion barrier layer, where an intermetallic compound (IMC) is formed among the diffusion barrier layer, the Cu cap layer, and a solder layer placed on top of the Cu cap layer. The IMC has good adhesion on the Cu pillar structure, the thickness of the IMC is controllable by the thickness of the Cu cap layer, and the diffusion barrier layer limits diffusion of Cu from the Cu pillar layer to the solder layer. The method can further include depositing a thin layer for wettability on top of the diffusion barrier layer prior to depositing the Cu cap layer. | 2011-01-06 |
20110001251 | ADHESIVE COMPOSITION, BONDING MEMBER USING THE ADHESIVE COMPOSITION, SUPPORT MEMBER FOR SEMICONDUCTOR MOUNTING, SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THESE - Disclosed is an adhesive composition, comprising, as essential components, a thermosetting resin component A and a high-molecular component B which are evenly compatible and miscible with each other at a temperature of 5 to 40° C. without being separated from each other, and a curing agent component C, | 2011-01-06 |
20110001252 | PROCESS FOR PRODUCING OPTICAL ARTICLE - An object of the present invention is to provide a process for producing a lens suitable in sunglasses or anti-glare spectacles which reduces blue hazard, and by which a blue signal can be confirmed visually, and an optical filter, and an optical article which can cut at least a part of visible light of 380 to 500 nm. | 2011-01-06 |
20110001253 | Rotary powder compression molding machine - A rotary powder compression molding machine according to the invention includes: a flame; a rotary shaft; a turret; a plurality of die; an upper and a lower punches; an upper and a lower rolls; a designator for designating a molding portion constituted of a set of the die and the upper and lower punches corresponding to the die; a position detector for detecting that the molding portion designated by the designator has reached a predetermined position; a separator for separating a designated molded article ejected from the molding portion designated by the designator from collection of molded articles other than the designated molded article based on a position detection signal output from the position detector; and an actuation verifier for verifying actuation of the separator based on movement of the designated molded article. | 2011-01-06 |
20110001254 | Imprint Lithography Apparatus and Method - An imprint lithography apparatus is disclosed that includes an imprint template holder arranged to hold an imprint template, and a plurality of position sensors configured to measure change of the size and/or shape of the imprint template, wherein the position sensors are mechanically isolated from the imprint template. Also disclosed is a lithography method that includes using an imprint template to imprint a pattern onto a substrate, and measuring changes of the size and/or shape of the imprint template while imprinting the pattern onto the substrate. | 2011-01-06 |
20110001255 | Vacuum Removal of Entrained Gasses In Extruded, Foamed Polyurethane - Methods for forming foamed polyurethane composite materials in an extruder including a vacuum section are described. One method includes introducing a polyol, a di- or poly-isocyanate, and an inorganic filler to a first section of an extruder and mixing the components. After mixing, the composite material is advanced to a second section of the extruder, which is maintained at a vacuum pressure. The composite material can begin foaming in the second section and then be extruded from the output end of the extruder. The vacuum pressure of the second section removes non-foaming related gasses entrained in the composite material. A further method includes directing the extruded composite material into a mold. | 2011-01-06 |
20110001256 | METHODS FOR BLOW MOLDING SOLID-STATE CELLULAR THERMOPLASTIC ARTICLES - A process for producing cellular thermoplastic articles. The process comprises the steps of treating a solid parison made from a thermoplastic material with a saturating gas at an elevated pressure for a period of time to provide a gas-saturated parison; heating the gas-saturated parison to prepare a cellular parison; placing the cellular parison in a mold; and blowing a molding gas into the cellular parison to expand the cellular parison into the shape of the mold to provide a shaped cellular article. | 2011-01-06 |
20110001257 | SINGLE SCREW EXTRUDER FOR DRYER BAR MANUFACTURE - Single screw extruder for making a dryer bar. | 2011-01-06 |
20110001258 | MOLTEN RESIN SUPPLY METHOD, MOLTEN RESIN SUPPLY DEVICE, MOLTEN RESIN COMPRESSION MOLDING METHOD, MOLTEN RESIN COMPRESSION MOLDING DEVICE, AND SYNTHETIC RESIN CONTAINER MANUFACTURING METHOD - Each of supply means | 2011-01-06 |
20110001259 | DECORATIVE GRASS HAVING AN APPEARANCE SIMULATING THE APPEARANCE OF CLOTH - Decorative grasses having an appearance or texture simulating the appearance or texture of cloth are disclosed, as are methods for making such decorative grasses from materials, wherein at least one surface of the material is modified to simulate the appearance or texture of cloth. | 2011-01-06 |
20110001260 | Device and Method for Profile Production with Rotating Dies - The invention relates to device ( | 2011-01-06 |
20110001261 | EXTRUDER AND PROCESS FOR EXTRUDING A POLYMER - The present invention relates to an extruder for a polymer, and a process for extruding a polymer using said extruder. In particular, the present invention provides an extruder comprising:
| 2011-01-06 |
20110001262 | Method for manufacturing an electronic component - A method for manufacturing an electronic component includes: inserting a microcomponent into a receptacle device, the receptacle device fixing the microcomponent in relation to a shaping tool; extrusion-coating the microcomponent using a first coating; extrusion-coating the first coating using a second coating, the first coating and the second coating forming a housing; and pulling the receptacle device out of the housing before the solidification of the second coating and/or before the complete filling of the shaping tool using the second coating. | 2011-01-06 |
20110001263 | Piston for Positioning a Food Pot Decoration in a Mold, Associated Device and Associated Method - The invention concerns a piston ( | 2011-01-06 |
20110001264 | PRODUCTION METHOD AND PRODUCTION DEVICE OF FILM HAVING FINE IRREGULAR PATTERN ON SURFACE - A method for producing a film having a fine irregular pattern intermittently includes feeding a film to be processed intermittently from upstream side to the vicinity of the surface of a die having a fine irregular pattern, transferring the pattern to the surface of the film by pressing the film against the surface of a die, stripping the processed film on which a pattern is formed from the surface of a die, and then feeding a new film to be processed to the die, wherein the processed film is stripped from the surface of a die by gripping and moving the processed film to the upstream side, and then the processed film is fed by a length of intermittent feed to the surface of a die while preventing the processed film from creasing. | 2011-01-06 |
20110001265 | PROCESS FOR SHAPING POLYMERIC ARTICLES - A process ( | 2011-01-06 |
20110001266 | RESIN MOLDING PROCESS AND RESIN-MOLDING MOLD DEVICE - A resin-molding mold device is provided for carrying out the resin molding process to mold the resin molded article, wherein when cooling after charging a molten synthetic resin into a cavity ( | 2011-01-06 |
20110001267 | MACHINE FOR INJECTING A HEAT CURABLE MATERIAL, IN PARTICULAR FOR RUBBER VULCANISATION, AND CORRESPONDING METHOD FOR ACHIEVING SAME - This machine includes means for plasticizing the material and injection means suitable for injecting the material in the fluid state into a flow channel ( | 2011-01-06 |
20110001268 | NATURAL FIBER-REINFORCED THERMOPLASTIC RESIN INJECTION MOLDING - The invention provides a natural fiber-reinforced thermoplastic resin injection molding having an excellent ability to discharge static electricity. The natural fiber-reinforced thermoplastic resin injection molding is obtained by injection-molding with using natural fiber-reinforced thermoplastic resin pellets as a molding feedstock containing natural fibers as reinforcing fibers, has a natural fiber content of from 20 to 60 wt %. The natural fibers have an average length of from 1.5 to 4.0 mm. The natural fiber-reinforced thermoplastic resin injection molding has an electrostatic voltage half-life, as determined by the half-life measurement method specified in JIS L 1094, of less than 40 seconds. | 2011-01-06 |
20110001269 | DEVICE FOR PRODUCING PIN-SHAPED END PRODUCTS BY THE INJECTION-MOLDING PROCESS - The invention relates to an injection-molding tool and to a process for producing pin-shaped blanks as end products, a two-dimensional skin cavity and blank cavities connected to said skin cavity being provided at a runner, in order to be able to form a molding, including a sprue, a skin and the blanks formed on said skin via defined predetermined breaking points. In this case, the injection-molding tool makes it possible before and at the beginning of the injecting operation to create a negative pressure in the cavities and makes it easier after the molding material has solidified to demold the molding obtained by introduced compressed air. In this case, the injection-molding tool is constructed in such a way that the demolding of the blanks is performed separately from the demolding of the skin and the sprue, the demolding also being accompanied by detachment of the blanks from the skin by the lifting movement during the opening of the injection-molding tool, and the blanks being discharged with preference without being acted upon by a manipulator, on account of the loss of form fit and under the action of gravitational force, and the injection-molding tool being made operationally ready again at the end of the cycle by a closing operation. | 2011-01-06 |
20110001270 | Gate Insert - Disclosed, amongst other things, is a gate insert of an injection mold that includes a base member. The base member defines a nozzle interface for receiving, in use, a nozzle of a melt distribution system that is heated, in use, by a heater, and a gate, the gate configured to fluidly link, in use, a melt channel of the nozzle with a molding cavity. The gate insert further includes a thermal regulator associated with the base member, the thermal regulator includes a direct energy conversion device that is capable of heating and cooling, wherein the thermal regulator is controllably operable, in use, to control the temperature of the gate. | 2011-01-06 |
20110001271 | Thermal Treatment Of An Implantable Medical Device - A method of manufacturing an implantable medical device, such as a drug eluting stent, is disclosed. The method includes subjecting an implantable medical device that includes a polymer to a thermal condition. The thermal condition can result in reduction of the rate of release of an active agent from the device subsequent to the implantation of the device and/or improve the mechanical properties of a polymeric coating on the device. | 2011-01-06 |
20110001272 | OPTICAL MOLDING APPARATUS AND OPTICAL MOLDING METHOD - An optical molding apparatus molds a three-dimensional model by stacking cured layers. Each cured layer is formed by emitting light according to cross-sectional-shape data of the three-dimensional model onto a surface of photo-curable resin. The optical molding apparatus includes a container that contains the photo-curable resin, a movable stage that is movable in a direction orthogonal to the surface of the photo-curable resin, an optical system that emits the light onto the surface of the photo-curable resin contained in the container so as to form each cured layer on the movable stage, and a discharging mechanism that performs a discharging operation for discharging new photo-curable resin onto a surface of each cured layer formed on the movable stage before stacking a subsequent cured layer. | 2011-01-06 |
20110001273 | BLADDER, AN APPARATUS AND A METHOD FOR SHAPING AND CURING A TIRE - A method, a bladder and an apparatus for shaping and curing a tire, wherein the bladder has two weakened regions corresponding to the shoulder regions of the tire when the bladder is expanded in the cavity of the tire. Upon inflation of the bladder and its expansion in the tire, the bladder contacts first the inner surface of the cavity at the bead regions and progressively the sidewalls, the shoulders and then the center of the tire. The weakened regions are designed to stretch more under a given tension than the remaining regions in order to allow a progressive contact movement of the lateral regions of the bladder with the sidewalls with very little tension and relative movement between the lateral regions of the bladder and the sidewalls of the tire. | 2011-01-06 |
20110001274 | BLOW MOLDING MACHINE AND METHOD FOR PRODUCING HOLLOW BODIES - A blow molding machine for producing hollow bodies, particularly wide-necked containers, having a blow nozzle and a blow mold for accommodating a preform. To save air during the blowing process in a simple way, a plunger is introduced into the preform during the blowing operation. | 2011-01-06 |
20110001275 | MOLDED BODY OF LAMINATED PLASTIC DERIVED FROM BIOMASS, AND MANUFACTURING METHOD THEREFORE - The present invention is directed to a biomass-derived plastic laminated molding shaped in bottle(s), which, when hermetically sealed, do not deform under load and have their high-impact property enhanced, and to a manufacturing method of the same. The biomass-derived plastic laminated molding is characterized in that a preform is molded out of plastic in laminated shape so as to have at least one of layers composed of biomass-derived plastic by 25 wt % or over and the remaining layers composed of polyolefin resins, and that the plastic preform undergoes annealing where it is exposed to blown air heated to raise temperature at a rate of 5 to 20° C./min from the room temperature up to 85 to 100° C. at which the preform is left for 3 to 10 minutes, and thereafter, the blown air is gradually cooled down at the rate of 10 to 15° C./min | 2011-01-06 |
20110001276 | Process for the preparation of film sheets - A device and a process for the preparation of sheets ( | 2011-01-06 |
20110001277 | METHOD OF MANUFACTURING HOLLOW STRUCTURAL MEMBER, SUBSTRATE FOR HOLLOW STRUCTURAL MEMBER PRODUCTION, AND APPARATUS FOR MANUFACTURING HOLLOW STRUCTURAL MEMBER - There is provided a method of manufacturing a hollow structural member suitable for precisely manufacturing a hollow structural member whose pitch space of the hollows is below 30 μm. The method of manufacturing a hollow structural member of this invention is to encapsulate, by using a gas-permeable material in part of a material that constitutes the substrate ( | 2011-01-06 |
20110001278 | METHOD FOR PRODUCING SINTERED BODY - Disclosed is a production method of a sintered body. The production method of a sintered body comprises a step of sintering, at a temperature within the range of from 900° C. to 1200° C., a mixture of a manganese-based oxide and copper oxide wherein the ratio of the molar amount of copper to one mol of manganese in the mixture is in the range of from 0.001 to 0.05. | 2011-01-06 |
20110001279 | APPARATUS FOR RECOVERING PLATINUM GROUP ELEMENTS - A method for recovering platinum group elements comprises charging into a closed electric furnace and melting, together with flux components and a reducing agent, a platinum group element-containing substance to be processed and a copper source material containing copper oxide, sinking molten metal of primarily metallic copper below a molten slag layer of primarily oxides, and enriching the platinum group elements in the molten metal sunk below, and is characterized in that molten slag whose copper content has decreased to 3.0 wt % or less is discharged from the electric furnace and that the copper source material charged into the electric furnace is a granular copper source material of a grain diameter of not less than 0.1 mm and not greater than 10 mm. | 2011-01-06 |
20110001280 | SHOCK ABSORBER AND SHOCK ABSORBING STRUCTURE FOR ABSORBING VIBRATION OF AN ARTICLE - A shock absorber for absorbing vibration of an article with respect to a stationary member, the article including a coupling element formed with a notch unit. The shock absorber includes an elastic sleeve member having an external surface to permit mounting of the coupling element there around via the notch unit, and a support post. The elastic sleeve member further has an axial hole. The support post is fixed on the stationary member, and extends through the axial hole in said elastic sleeve member. The support post has an intermediate section formed with an absorbing recess in alignment with an inner peripheral portion of the coupling element contacting the elastic sleeve member and confining the notch unit. | 2011-01-06 |
20110001281 | FLUID FILLED TYPE VIBRATION DAMPING DEVICE - A fluid-filled type vibration damping device wherein a second mounting member is secured to a vehicle body; an opening of the second mounting member is closed off to define a pressure-receiving chamber a flexible film is arranged covering an outside of a main rubber elastic body to define an equilibrium chamber; a low-frequency orifice passage and a high-frequency orifice passage connect the pressure-receiving chamber and the equilibrium chamber a first moveable member is disposed on a fluid channel through the high-frequency orifice passage; the first moveable member being supported by a first support member that is linked to the second mounting member via the main rubber elastic body; and a fluid channel through the low-frequency orifice passage is situated away from the placement location of the first moveable member. | 2011-01-06 |
20110001282 | ROTARY TABLE DEVICE PROVIDED WITH COOLING STRUCTURE AND ROTARY BEARING PROVIDED WITH COOLING STRUCTURE - A rotary table device includes a cooling structure and a rotary bearing provided with a cooling structure. A rotary table device provided with a cooling structure includes a hollow motor as a drive source, a table rotated by the hollow motor, and a rotary bearing supporting rotational motion of the table, in which the rotary bearing includes an outer ring having an inner peripheral surface to which a rolling surface is formed, an inner ring having an outer peripheral surface to which a rolling surface facing the rolling surface of the outer ring is formed, and a number of rolling members in a rolling passage formed by the rolling surface of the outer ring and the rolling surface of the inner ring, and a heat sink is formed to either one of the inner and outer rings. | 2011-01-06 |
20110001283 | QUICK RELEASE BENCH VISE SYSTEM - A quick release vise includes a first and second jaw moveable relative to the first jaw, and a threaded shaft rotatably fixed to the second jaw. A shaft receiver is fixed relative to the first jaw and includes a boss and a boss cover that is moveable relative to the boss. The boss and the boss cover have channels which cooperatively define an at least partially threaded shaft-receiving bore. The boss cover is moveable between a first position wherein the threads of the shaft engage threads within the shaft-receiving bore, and a second position wherein the threads of the shaft are disengaged from the threads within the shaft-receiving bore. | 2011-01-06 |
20110001284 | IMAGE FORMING DEVICE - A multifunction peripheral includes a main body, a jam access cover, and a manual paper feeding tray. The jam access cover can expose the interior of the main body by being rotated. The manual paper feeding tray is attached to the jam access cover so as to be rotatable with a tray rotation shaft at a position that is different from a jam access cover rotation shaft as a center. A projection is arranged on the manual paper feeding tray so as to contact with a recess on the main body side to regulate the rotation of the manual paper feeding tray when the jam access cover is opened. The manual paper feeding tray includes a distal end that is located a higher position than the jam access cover rotation shaft when the projection contacts with the recess. | 2011-01-06 |
20110001285 | STIFFNESS DETECTOR, STIFFNESS DETECTION METHOD, AND PAPER SHEET PROCESSOR INCLUDING STIFFNESS DETECTOR - A stiffness detector includes a bending portion configured to bend a paper sheet to be carried. The stiffness detector transmits acoustic waves to an incidence point on an inner surface of the paper sheet which is bent by the bending portion and is carried, thereby exciting Lamb waves. The stiffness detector receives leaky waves of the Lamb waves emitted from a detection point on the inner surface of the paper sheet. The stiffness detector specifies a maximum crest value based on the received signals, and judges whether the paper sheet is an unimpaired sheet based on the specified maximum crest value. | 2011-01-06 |
20110001286 | Roulette board and method for controlling the same - A roulette board, including a roulette wheel on which a plurality of symbols are arranged in a circumferential direction of the roulette wheel, a plurality of ball reception portions that are provided in a one-to-one correspondence with the plurality of symbols, the plurality of ball reception portions being configured to receive a ball that rolls on the roulette wheel, a banked passage that is endlessly provided along an outer circumference of the roulette wheel, and allows the ball to roll in a circumferential orbit, and a ball discharging mechanism that is provided with a ball discharging member and discharges the ball received in one of the plurality of ball reception portions from the one of the plurality of ball reception portions toward the banked passage by bringing the ball discharging member into contact with the ball. | 2011-01-06 |
20110001287 | Game Board - A game board is disclosed for playing tic-tac-toe. The game board comprises a substantially concave playing surface, having a plurality of depressions at a lower region thereof. In use, the game playing members are launched onto the playing surface and spiral down the concave surface before locating within one of the depressions. | 2011-01-06 |
20110001289 | GAME BOARD - A gaming apparatus including a top surface and four side walls connected each other and to the top, the top having a game surface such as a 64 block checkerboard pattern of a first and second color, the game surface having cutouts; eight rods running crossways under the top surface and attached to two side walls; multiple rollers accessible to a player through the cutouts in the top surface. Preferably the game surface is angled on two opposing sides of each cutout to aid in rotation of the rollers underneath the game surface. The game apparatus may be adopted to play checkers, chess, backgammon or similar games. The game apparatus may also be embedded into tables or walls. | 2011-01-06 |
20110001290 | COUNTER SORTING DEVICE - A sorting device for the sorting of gaming chips comprises a base frame (36), a collection container (1), an oblique transport disc (3) adjoining the collection container (1), the oblique transport disk (3) separating and receiving gaming chips (27), a gaming chip characteristic identification system positioned adjacent the transport disc (3), a transfer device (11) distributing the gaming chips (27) in removal units (12) according to characteristics identified in the gaming chip characteristic identification system. The sorting device has a transport for transferring the gaming chips directly from the transport disc (3) to the removal units (12), and a radially external region of the transport disc (3) contains recesses (8) into which the gaming chips are separated. The sorting device is provided with at least one ejector (14) that can be inserted at least partially from one side of the transport disc (3) into the recesses (8) to lift an edge (15) of the gaming chips (27) above a front face of the transport disc (3) lying opposite the at least one ejector (14), whereby a blade (16) located on a removal unit (12) slides under the gaming chip (27) with a lifted edge, and the gaming chip (27) with a lifted edge is placed on the blade. | 2011-01-06 |
20110001291 | Method for Playing a Card Game - A method of playing a game that includes a dealer or facilitator. The game consists of allowing players to play a game that comprises at least two sub-games, each sub-game being associated with a pot and being played either simultaneously or sequentially. Each sub-game includes the step of declaring a winning player. | 2011-01-06 |
20110001292 | MILITARY TARGET SYSTEM - A target system having a base, a stationary member inclined from the base and having a cap, a rotating tube having a cap and positioned over the stationary tube, a bearing between the caps of the stationary member and the rotating tube to permit substantially free rotation of the rotating tube, and a plurality of target sides secured to the rotating tube, with impact of a fired round onto one of the target sides initiating movement of the rotating tube relative to the stationary member. | 2011-01-06 |
20110001293 | SLIDABLE GASKET AND A BEARING HAVING THE SAME - A bearing of the present invention includes a slidable gasket, in which a surface thereof is formed with a slippery portion to reduce its frictional index. As such, the bearing can be disposed between two objects to reduce the friction, in which the bearing has extended service life and produces diminished noise. | 2011-01-06 |
20110001294 | GASKET OF AN INTERNAL COMBUSTION ENGINE AND INTERNAL COMBUSTION ENGINE - A gasket of an internal combustion engine includes a discharge line installed in an intermediate layer and having an outer end exposed from the outer peripheral edge of the gasket to be a first connection part and an inner end exposed from a inner peripheral edge around the opening to be an electrode, configured such that discharge is generated between electrodes with voltage applied between first connection parts; an antenna installed at least partly in the intermediate layer at the inner peripheral edge around the opening to radiate electromagnetic waves into a combustion chamber; and an electromagnetic wave transmission line installed in the intermediate layer, having an outer end exposed from an outer peripheral edge to be a second connection part and an inner end connected to the antenna, and guiding electromagnetic waves to the antenna. | 2011-01-06 |
20110001295 | METALLIC FLAT GASKET - The invention relates to a metallic flat gasket with at least one metallic gasket layer, which is mainly flat and shows a first and second surface, wherein a plane of the gasket runs centered between said flat areas, wherein a camber is formed within the gasket layer, which protrudes over the first surface of the gasket layer and which has a larger length than width, wherein the camber possesses a first level given by a virtual level, which runs in parallel to the plane of the gasket through the foot of the camber on the first surface of the gasket layer and a second level, given by a further virtual, which runs through the highest point of the camber and also parallel to the plane of the gasket of the gasket layer, wherein the camber possesses a slope area that ascends between the two levels. The slope area is provided with an undulating structure such that it comprises at least two waves each with a wave crest and a wave trough. | 2011-01-06 |
20110001296 | SUSPENSION DEVICE - A suspension device (S) comprises: an actuator (A) including a motion conversion mechanism (T) for converting rotational motion of a screw nut ( | 2011-01-06 |
20110001297 | Method of making an ice skate blade - A method of making an ice skate blade that comprises providing an upper member made of aluminum and a bottom member made of stainless steel. The upper member has a bottom portion comprising one of a recess and a projection and a top portion having attachment portions for allowing attachment of the upper member to a blade holder. The bottom member has a top portion comprising the other one of a recess and a projection and a bottom portion having a surface for contacting ice. The method further comprises joining the upper member and the bottom member together by registering the one of a recess and a projection of the upper member with the other one of a recess and a projection of the bottom member for making the blade. | 2011-01-06 |
20110001298 | Portable Chair Carrier on Rollers - A Portable Chair Carrier on Rollers device, called a Roll-N-Go, for use with sporting goods and outdoor accessories. Particularly this device mounts a wheel assembly to a soft carrying case. The mounting may be as an original equipment feature with the case or as an add-on feature to existing cases. It is comprised essentially of two main parts: a case that has several features and a wheel support structure to support wheels and to secure the wheels to the case. | 2011-01-06 |
20110001299 | VEHICLE HAVING AN AXLE CAPABLE OF PENDULUM MOTION - A vehicle, has a chassis, at least one front axle assigned to the chassis and carrying land wheels, a rear axle located downstream of the front axle, relative to a direction of forward travel and carrying at least two steerable wheels, wherein the rear axle is hingedly connected to the chassis such that it is movable to and fro transversely to the direction of travel, and includes at least one axle body, wherein regions of the chassis are assigned to the wheels of the rear axle in an at partially adjacent manner, a pendulum device coupling the rear axle of the chassis and enabling a displacement of the rear axle that is oriented transversely to the direction of travel, and a swivel device coupling each wheel of the rear axle to the axle body of the rear axle and enabling a displacement of each wheel that is oriented transversely to the direction of travel. | 2011-01-06 |
20110001300 | Dual leaf suspension for vehicle drive arrangement - A vehicle drive arrangement for a vehicle of the type having differential power transmission arrangement that converts the rotatory motion of the rotatory power shaft to rotatory motion of first and second drive shafts disposed substantially orthogonal the rotatory power shaft. Primary leaf springs are each coupled at their respective centers to respective drive shafts by pivotal arrangements. The first and second primary springs may include helical springs that are used in place of, or in combination with, the primary leaf springs. Secondary leaf springs may be splayed and therefore need not be arranged parallel to the primary leaf springs. Control over vehicle kinematics is enhanced by configuring the resilience of a fulcrum bumper using resilient, rheological, or active systems. An active system will control vehicle height while stationary to facilitate loading and unloading of the vehicle. | 2011-01-06 |
20110001301 | Vehicular torsion bar suspension device - A vehicular torsion bar suspension device, which comprises a front torsion bar spring and a rear torsion bar spring respectively installed at front and rear suspensions of the vehicle. The opposite ends of the front and rear torsion bar springs on the same side are connected mutually by a connection mechanism, and are connected with a vehicle frame through a positioning device. The connection mechanism is mounted between the front and rear torsion bar springs on the same side, so that a linkage relationship is established between the front and rear torsion bar springs. The device improves the vibration situation of the vehicle when driving the vehicle on an uneven ground, and prevents the vehicle frame and vehicle body skeleton from suffering torsional force. As a result, the usage life of the vehicle is prolonged. | 2011-01-06 |
20110001302 | Quick Disconnect Hitch - Embodiments described herein relate to methods and structures that can be used to quickly disconnect a trailer from a tractor. One embodiment provides a quick disconnect hitch that links a tractor and a trailer. The quick disconnect hitch comprises a tongue attached to the tractor and a body insertable into the tongue. An extension is attached to and projects away from the body. The extension is connectable with the trailer. A pair of lugs is disposed on the body. The lugs are movable between a connected position where the trailer moves responsive to movement of the tractor and a disconnected position where the trailer moves independently of the tractor. A detent is disposed on each of the pair of lugs. A pair of slots is disposed on the tongue. Each of the pair of slots is configured to accept the detent. Each detent is disposed in each of the pair of slots when the lugs are in the connected position, and each detent is dislocated from each of the pair of slots when the lugs are in the disconnected position. | 2011-01-06 |
20110001303 | TOW ASSEMBLY FOR HEAVY TRUCKS - A tow assembly for a truck for high capacity loads provides independent load paths interconnected to a tow eye for bearing a towing load. According to one embodiment, the assembly includes a mounting interface having a front face and oppositely located side faces and defining an interior space, a first outer member extending from one side face of the mounting box, a second outer member extending from an opposite side face of the mounting box, an inner member disposed and extending through the first outer member, the interface, and the second outer member, and, a tow eye mounted to the front face of the interface and structurally interconnected to the inner bar. Towing loads are transmitted to the mounting interface and distributed and shared by the inner member and first and second tube structure. | 2011-01-06 |