01st week of 2022 patent applcation highlights part 76 |
Patent application number | Title | Published |
20220007513 | DISPLAY DEVICE AND ASSEMBLY METHOD THEREOF - A display device includes: a display panel; a circuit board, one end of the circuit board being connected to the display panel, and the circuit board being at least partially disposed on a back surface of the display panel and includes a device region on a side distal from the display panel; at least one electronic device disposed in the device region; and an adhesive tape disposed on a side, distal from the display panel, of the circuit board and bonded to a back surface of at least a part of the circuit board and the back surface of at least a part of the display panel. At least a part of the at least one electronic device in the device region is disposed between the adhesive tape and the back surface of the display panel. | 2022-01-06 |
20220007514 | METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AND STIFFNESS OF CONDUCTIVE PATTERN - Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti). | 2022-01-06 |
20220007515 | FLEXIBLE PRINTED ARTICLES - One example of a flexible printed article includes a non-conductive, graphene oxide membrane base substrate; and an electronic component positioned on the non-conductive, graphene oxide membrane base substrate. An example method for generating this example of the flexible printed article includes inkjet printing a conductive ink directly on the non-conductive graphene oxide membrane base substrate. | 2022-01-06 |
20220007516 | METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS - A method of fabricating at least one electronic circuit component comprises: patterning a conductive material on a fibrous substrate by aerosol jet printing in a pattern corresponding to said at least one electronic circuit component; and sintering the conductive material by hot air sintering. The fibrous substrate may be paper, for example cellulose fibre paper. | 2022-01-06 |
20220007517 | ELECTRONIC UNIT COMPRISING ELECTRONIC COMPONENTS AND AN ARRANGEMENT FOR PROTECTING SAME FROM PRESSURE - An electronic unit may have a printed circuit board populated on a main surface of the printed circuit board with at least one electronic component coated with a coating element, where the at least one electronic component is embedded, and where there is a protective element that bears directly on the electronic component on a side facing away from the printed circuit board. | 2022-01-06 |
20220007518 | USING SOLDER STANDOFFS DURING REFLOW TO REDUCE VOIDING WITH CIRCUIT BOARDS - Aspects of the technology employ significantly reduce void formation beneath critical components on a printed circuit board (PCB). This is accomplished using advanced fabrication techniques that include employing alignment fixtures and solder standoffs to position duplexers, using nitrogen gas during the reflow process, and maintaining specific temperature and “time above liquideous” (TAL) controls. Certain types of components, such as duplexers used in communication circuit boards, can be highly susceptible to voids. Because such components are relatively large and block x-rays, it is challenging to determine whether voids have been formed beneath them. Thus, in many instances conventional fabrication techniques are insufficient to produce viable circuit boards that minimize void formation within acceptable tolerances. It may be mission critical to minimize voids, such as for PCBs used in communication modules deployed on high altitude platforms intended to operate in the stratosphere for extended periods of time. | 2022-01-06 |
20220007519 | METHOD OF MANUFACTURING MULTILAYER SUBSTRATE - In a preparatory process of a method of manufacturing a multilayer substrate, an insulating substrate is prepared, with a conductor pattern formed only on one surface of the insulating substrate. At that time, the conductor pattern is constituted of the Cu element, a Ni layer is formed on the surface of the conductor pattern that is on the side of the insulating substrate. In a first forming process, a via hole having the conductor pattern as the bottom thereof is formed in the insulating substrate. At that time, the Ni layer that is in the area of the bottom is removed. In a filling process, a conductive paste is filled in the interior of the via hole. In a second forming process, a stacked body is formed by stacking a plurality of the insulating substrates. In a third forming process, the stacked body is heated while being subjected to pressure. | 2022-01-06 |
20220007520 | PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS - The disclosure is and includes at least an apparatus, system and method printing multilayer circuits on graphics. The multilayer print may include forming an electronic human machine interface, sensor readout, or a driver circuit, by way of example, and may include successively printing at least two functional ink layers comprising at least one conductive layer and at least one dielectric layer on a substrate comprising one of a thermoform and an overmold; printing at least one non-conductive graphical ink layer in the succession of the successively printing; curing each of the successively printed layers after the printing of each of the successively printed layers, wherein the curing of the successively printed functional ink layers comprises at least an ultra-violet curing; and squeegeeing at least the at least one conductive layer with a squeegee having a low durometer. | 2022-01-06 |
20220007521 | LIGHTED CUP HOLDER FOR SEATING ARRANGEMENTS - A method and apparatus include attaching a lighted cup holder to a seating arrangement. The lighted cup holder includes a cup holder body and a light-producing light source, with the cup holder body being attached to the seating arrangement and having a cup receptacle therein, the light-producing source being disposed within the cup receptacle for illuminating the receptacle. A light-sensitive element operatively connected to the light source selectively controls production of light by the light source in such a manner that illumination of the cup holder is provided only under conditions where visibility is reduced to the point that it becomes difficult to locate the cup holder. The light-sensitive element is mounted on a master lighted cup holder and controls illumination of the master lighted cup holder and one or more slave lighted cup holders operatively connected to the master lighted cup holder. | 2022-01-06 |
20220007522 | SUPPORT STRUCTURE FOR ELECTRONIC BANNER DISPLAY - A display comprises a display surface formed from a plurality of display modules arranged in proximity, each display module comprising a plurality of light-emitting elements configured to collectively display one or more of video, graphical, or textual information, and a support array onto which the plurality of display modules is mounted to form the display surface. The support array comprises a plurality of tension members, a plurality of support members arranged in an array, each of the plurality of support members comprising a mounting face and each being supported by at least one of the plurality of tension members. Each of the tension members is suspended either from a support structure or another one of the support members, and each of the display modules is coupled to the mounting face of one or more of the support members. | 2022-01-06 |
20220007523 | MODULAR ENCLOSURE SYSTEM - A modular enclosure system for forming a weld-free enclosure. The enclosure system includes a corner piece and a plurality of rails each adapted to mate with the corner piece and secured at one or more exterior-facing frame attachment points on the corner piece to form a frame. Panels are also included and are adapted to be secured to the frame. The panel conceals the frame attachment points when secured to the frame. Another aspect is directed to a weld-free enclosure assembled using the components of the modular enclosure system described herein. | 2022-01-06 |
20220007524 | DISPLAY PANEL - The present disclosure provides a display panel. The display panel of the present disclosure includes: a front frame and a printed circuit board protective shell. The front frame includes a first front frame portion and a second front frame portion extending in a length direction of the display panel; and a third front frame portion and a fourth front frame portion extending in a width direction of the display panel; wherein the first front frame portion and the second front frame portion are disposed oppositely; and the third front frame portion and the fourth front frame portion are disposed oppositely, and connected between the first front frame portion and the second front frame portion. The printed circuit board protective shell is engaged with the first front frame portion and the second front frame portion to form an integral structure. | 2022-01-06 |
20220007525 | ADJUSTING MECHANISM FOR TILE DISPLAY SCREENS AND TILED DISPLAY DEVICE - An adjusting mechanism for tile display screens and a tiled display device are provided. The adjusting mechanism for tile display screens is configured to adjust a gap between two adjacent tile display screens, and includes first support plates, a second support plate, and adjusting fixtures. The first support plates are used to fix the tile display screens in one to one correspondence and are movably connected to the second support plate. Each adjusting fixture is operable to be connected between two adjacent first support plates and includes two adjusting members in threaded connection. A threaded connection length between the two adjusting members is adjustable so that the gap between at least two tile display screens is adjusted. | 2022-01-06 |
20220007526 | STACKABLE BATTERY ASSEMBLIES AND METHDS OF USE - Stackable battery assemblies and methods of use are disclosed herein. An example battery assembly includes an energy storage device, a housing having a locking unit, a receiver unit, and a sidewall that are interconnected to form an enclosure that retains the energy storage device. The locking unit can include a plate that is spaced apart from the sidewall of the housing by a second sidewall, the plate supporting a first electrical connector that is electrically coupled to the energy storage device via a locking member. The receiver unit can include a third sidewall that defines a cavity that is shaped to correspond with the locking unit, the third sidewall having a lock notch and a second electrical connector that is electrically coupled to the energy storage device. | 2022-01-06 |
20220007527 | APPARATUS FOR DATA CENTER - A server includes a chassis; a base panel fixedly coupled to the chassis; a movable panel coupled to the base panel; and a locking member fixedly coupled to the movable panel. The movable panel is movable relative to the base panel in a moving direction between an unlocked position where the locking member is configured to be disengaged with a locking panel of an electronic rack, and a locked position where the locking member is configured to be engaged with the locking panel of the electronic rack. | 2022-01-06 |
20220007528 | DISPLAY DEVICE - A display device including: a display module; a first support part and a second support part which are disposed under the display module and spaced apart from each other in a first direction; a first gear connected to each of both sides of the first support part which are opposite each other in a second direction crossing the first direction; and a second gear connected to each of both sides of the second support part which face each other in the second direction, where the second gear is disposed adjacent to the first gear in the first direction and engaged with the first gear. When viewed in the second direction, each of the first gear and the second gear has a shape corresponding to at least a portion of an elliptical shape. | 2022-01-06 |
20220007529 | CABLE LEAD-OUT SYSTEM - The present invention relates to a cable lead-out system, configured to route at least one cable from inside of a device to outside of the device, wherein the cable lead-out system comprises: a first pressing piece having at least one through hole for leading out the cable; a second pressing piece having at least one through hole for leading out the cable; and a seal having a base sandwiched between the first pressing piece and the second pressing piece with two opposite sides thereof, and being deformable when being pressed by the first pressing piece and the second pressing piece, having the base comprising at least one through hole for leading out the cable, and at least one protrusion that protrudes from at least one of the two sides of the base, and each of the at least one protrusion being disposed around a through hole of the base, whereby the through hole of the base passes throughout the protrusion, wherein each of the at least one protrusion completely passes through a corresponding through hole of the first pressing piece or a corresponding through hole of the second pressing piece. The cable lead-out system can protect the cable sheaths from being scratched by metal parts. | 2022-01-06 |
20220007530 | COVER PLATE AND FLEXIBLE DISPLAY DEVICE - The present invention provides a cover plate including a non-bending region and a bending region connected to the non-bending region. A hardness of a portion of the cover plate disposed in the bending region is less than a hardness of a portion of the cover plate disposed in the non-bending region. | 2022-01-06 |
20220007531 | COVERS FOR ELECTRONIC DEVICES - The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate joined with an insert molding plastic part, and a protective treatment layer on the light metal substrate and the insert molding plastic part. A transparent primer coating on the protective treatment layer, and a paint coating on the transparent primer coating. A milled edge along the insert molding plastic part, wherein the milled edge cuts through the paint coating to expose the transparent primer coating. | 2022-01-06 |
20220007532 | FLEXIBLE CIRCUIT SWITCHING AND PROTECTION DEVICE - A flexible electrical system distribution, switching, and protection solution having two or more autonomous electrical switching devices and optionally adding circuit protection and manual switching in one self-contained device. A printed circuit board assembly is configured to operate two or more electrical switch functions to act from a remote signal input or autonomously, independently or simultaneously. The printed circuit board can be assembled into a housing where multiple independent circuits on the printed circuit board assembly can be permanently electrically connected to each other through electrical conductors thus reducing the number of independent circuits within the assembly. The assembly further consists of an electrically isolative housing and terminal studs and retaining nuts capable to receiving electrical cable ring terminals. | 2022-01-06 |
20220007533 | COVERS FOR ELECTRONIC DEVICES - The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate; a micro-arc oxidation layer or a non-transparent passivation treatment layer on a surface of the metal cover substrate; an outmold decoration layer on the micro-arc oxidation layer or the non-transparent passivation treatment layer, a chamfered edge including a chamfer at an edge of the metal cover substrate, wherein the chamfer cuts through the micro-arc oxidation layer or the non-transparent passivation treatment layer and the outmold decoration layer to expose the metal cover substrate at the chamfered edge; a transparent passivation layer on the chamfered edge where the metal cover substrate is exposed; and a protective coating on the transparent passivation layer. | 2022-01-06 |
20220007534 | DETACHABLY FIXING DEVICE AND ELECTRONIC APPARATUS CASING THEREWITH - A detachably fixing device includes a base, a circuit board carrying plate, and a sliding plate. The circuit board carrying plate is slidably disposed on the base in a first direction and has a carrying plate linkage portion. The sliding plate is slidably disposed on the base in a second direction. The first direction and the second direction are non-parallel. The sliding plate has a sliding plate linkage portion mechanically connected with the carrying plate linkage portion, and an engaging portion. The circuit board carrying plate is operable to move to make the sliding plate slide outward relative to the base to make the engaging portion protrude from the base. An electronic apparatus casing includes a casing frame and the detachably fixing device. The detachably fixing device is detachably disposed on the casing frame. The engaging portion is separably engaged with an engaging structure of the casing frame. | 2022-01-06 |
20220007535 | CABLE MANAGEMENT RACK AND CABLE MANAGEMENT APPARATUS FOR A SERVER CABINET - Provided are a cable management rack and a cable management apparatus for a server cabinet. The cable management rack includes a plurality of cable-bundling units sequentially connected, where each of the plurality of cable-bundling units includes a first cable-bundling piece; a second cable-bundling piece, which is detachably connected to the first cable-bundling piece; a through hole for cables to pass through, which is formed between the second cable-bundling piece and the first cable-bundling piece; and a plurality of cable guide outlets, which are formed on the first cable-bundling piece and the second cable-bundling piece and are spaced apart and distributed along an extending direction of the through hole. Each cable guide outlet is provided with a guide structure to guide an outlet direction of a cable. Two adjacent cable-bundling units are detachably connected, and through holes of the plurality of cable-bundling units are sequentially communicated. | 2022-01-06 |
20220007536 | Modular Rack Assembly - A frame structure for a cabinet enclosure has a front frame assembly having first and second front pillars, a rear frame assembly having first and second rear pillars, a first side brace member, and a second side brace member, each having a beam that has opposite ends, with the opposite ends of each side brace member connected to one of the front pillars and one of the rear pillars. The frame structure also includes cable management and air flow management features and functions. | 2022-01-06 |
20220007537 | CONTAINER MODULE, CONTAINER ASSEMBLY, AND DATA CENTER - A container module includes a baseplate assembly and a plurality of columns, where the baseplate assembly includes a base frame and a baseplate fixed on the base frame, the plurality of columns are fixed on the base frame in parallel to each other, each column has an extension section extending above the baseplate assembly, and/or a lower end of each column has an extension section extending below the baseplate assembly. A container assembly includes at least two container modules that are stacked vertically and/or connected laterally. A data center includes a function device and the container module. | 2022-01-06 |
20220007538 | WEARABLE DISPLAY DEVICE - A wearable display device is disclosed and includes a main body, a heat dissipation processing module and an inflatable actuation module. The main body includes a front cover, a lateral cover, an inflatable airbag, a circuit board and a microprocessor. The heat dissipation processing module is configured to perform heat exchange with the microprocessor, and includes a first actuator, a heat pipe and a cooling chip. The inflatable actuation module includes a base, a ventilation channel, a second actuator and a valve component. When the second actuator and the valve component are driven, the valve component is opened and the second actuator is enabled, the gas is transported and inflates the inflatable airbag through the ventilation channel, so that the main body is stably fitted and positioned on the head of the wearer. | 2022-01-06 |
20220007539 | ELECTRONIC CONTROL DEVICE - An electronic control device for suppressing mixing of foreign substances includes a control board including a heat generation component, a housing, a support member that is provided in the housing and supports the board, a heat radiation fin on a surface opposite to a surface of the support member on which the control board is supported, an air cooling fan that intersects an extension direction of the heat radiation fin, and blows wind to the heat radiation fin, a wall portion between the control board and the air cooling fan, and extending from the support member toward the control board, a wiring passage at a top end of the wall portion, a wiring that is laid in the wiring passage, and electrically connects the air cooling fan and the control board, and a cover that covers the housing, and includes a protrusion fitted in the wiring passage. | 2022-01-06 |
20220007540 | HOT SWAP CONDENSOR FOR IMMERSION COOLING - A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank. | 2022-01-06 |
20220007541 | DUAL INLINE MEMORY MODULE HEAT SINK FOR CONDUCTION COOLED ENVIRONMENTS - A system and method enabling the use of convection cooled dual-inline memory modules (DIMM) in non-convection environments, specifically used for computing applications for harsh environments. This system and method describes a design which transfers heat from the various components on the memory module to thermally opportunistic areas of an enclosure in the absence of sufficient or in some cases any convective cooling conditions. The system and method describes a sandwiched metal heat plate assembly, being constructed from a thermally conductive material, which is attached to a heat pipe, designed to be highly thermally conductive, which is further attached to a thermally conductive cold plate saddle, which in turn is connected to a thermal sink. The heat generated in the DIMM is conducted to the heat plate by way of a thermal interface material, this energy transferred to the heat pipe, and then to a cold plate which dissipates the energy to the ambient environment. The system does not require a plurality of fins inside the enclosure, liquid cooling, nor airflow within the enclosure to accomplish the memory thermal management. The invention includes a heat pipe saddle, a heat pipe, a clamshell heat extraction mechanism in conjunction with a thermal interface compound for improving the heat transfer from the DIMM to the heat sink. | 2022-01-06 |
20220007542 | COMPOSITE PIN FIN HEAT SINK WITH IMPROVED HEAT DISSIPATION PERFORMANCE - A composite pin fin heat sink configured to dissipate heat generated by a heating element including a background region and a hot spot region having a higher temperature than the background region while the heating element is generating heat, the heat sink including a base plate having a first surface and a second surface, the first surface being configured to contact the heating element; and an array of pin fins protruding from the second surface and arranged at regular intervals. The base plate and the array of pin fins are divided into a first heat sink region corresponding to the hot spot region of the heating element, and a second heat sink region corresponding to the background region of the heating element. The first heat sink region is made of a material having a higher thermal conductivity than a material of which the second heat sink region is made. | 2022-01-06 |
20220007543 | COOLING DEVICE - A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element. | 2022-01-06 |
20220007544 | SYSTEMS AND METHODS FOR EMPLOYING FLEXIBLE GRAPHITE FOR THERMAL CONTROL OF INFORMATION HANDLING RESOURCES - A system may include a thermal source, a thermal sink, and heat-rejecting media comprising flexible graphite thermally coupled between the thermal source and the thermal sink and configured to transfer heat from the thermal source to the thermal sink. | 2022-01-06 |
20220007545 | GRAPHITE THERMAL CABLE AND METHOD FOR IMPLEMENTING SAME - A system may include a thermal source, a thermal sink and heat-rejecting media comprising a thermal cable, the thermal cable comprising a main length comprising a flexible graphite layer rolled into a cylindrical shape covered on the outside thereof by a thermally-insulating layer of the same cylindrical shape, a first termination at which the flexible graphite layer thermally couples to the thermal source, and a second termination at which the flexible graphite layer thermally couples to the thermal sink. | 2022-01-06 |
20220007546 | APPARATUS FOR INCREASING HEAT DISSIPATION CAPACITY OF A DIN RAIL MOUNTED ENCLOSURE - A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed. | 2022-01-06 |
20220007547 | Modular Data Center Serverhall Assembly - A kit for forming a data center comprising a first rack, a second rack, a first support having a first end and a second end opposite the first end, the first support configured to be secured to the floor at the first end, a cooling frame having a cooling unit received therein, the cooling frame having a first face and a second face opposite the first face, the cooling frame configured to be secured to the second end of the first support, a first distribution frame having a first plurality of support arms extending therefrom, the first distribution frame configured to be coupled to the first face of the cooling frame, and a second distribution frame having a second plurality of support arms extending therefrom, the second distribution frame configured to be coupled to the second face of the cooling frame. | 2022-01-06 |
20220007548 | ONE-CHAMBERED CONSTANT PRESSURE APPARATUS FOR LIQUID IMMERSION COOLING OF SERVERS - The present invention discloses a one-chambered constant pressure apparatus for liquid immersion cooling of servers, which are submerged within a non-conductive coolant maintained in the apparatus. When servers start to operate, a large amount of heat will be dissipated from servers. The coolant is vaporized into a coolant vapor by absorbing heat dissipated from servers, which enables servers to be cooled. The coolant vapor is condensed into a cooling liquid by a condenser. However, in the process of condensation, the rising coolant vapor tends to scatter in all directions resulting in a failure to condense all of the coolant vapor. Therefore, the uncondensed coolant vapor will cause the pressure in the apparatus to gradually rise, which eventually leads to the ineffective cooling of servers. In view of this problem, the disclosed invention provides an enclosed-type condenser for completely condensing all of the coolant vapor, thereby maintaining the constant pressure in the apparatus and ensuring the reliability of the apparatus during operation and the sustainability of the cooling capacity thereof. | 2022-01-06 |
20220007549 | THERMAL CONTROL OPTIMIZATION BASED ON MONITORING/CONTROL MECHANISM - Apparatus and methods are provided for improving thermal control, including collecting data of a plurality of systems, each of the plurality of systems including at least one first cooling element and at least one first heat-generating element; conducting a first simulation using a simulation model based on the collected data to generate a first set of simulation results; conducting a first training on a control system using the first set of simulation results to obtain a first trained control system; and using the first trained control system to monitor a field system with a space having at least one second cooling element and at least one second heat-generating element and to control the at least one second cooling element and the at least one second heat-generating element. | 2022-01-06 |
20220007550 | REDUNDANT COOLING MODULE FOR AN AUTONOMOUS VEHICLE COMPUTER - Systems, methods, and computer-readable media are disclosed. An example coolant system can be configured in an autonomous vehicle. The system can include a first coolant loop configured with a first series of coolant hoses to communicate a first volume of coolant fluid between a first reservoir, a first coolant pump, a three-way heat exchanger, and a computer system heat exchanger and a second coolant loop configured with a second series of coolant hoses to communicate a second volume of coolant fluid between a second reservoir, a second coolant pump, the three way heat exchanger, and the computer system heat exchanger. The system can further include a third coolant loop configured with a third series of coolant hoses to communicate third volume of coolant fluid between the three-way heat exchanger and an engine heat exchanger of the vehicle. | 2022-01-06 |
20220007551 | IMPINGING JET COLDPLATE FOR POWER ELECTRONICS WITH ENHANCED HEAT TRANSFER - A coldplate for removing heat from one or more heat sources, such as power electronics devices, includes a baseplate including a first surface in thermally-conductive communication with the heat sources. The baseplate includes a second surface opposite the first surface to transfer heat into a cooling fluid in contact therewith. The second surface includes a peripheral flange surrounding a central region having a plurality of parallel ribs, which increase the surface area to improve heat transfer from the baseplate and into the fluid. A housing abuts the peripheral flange of the baseplate to define a cooling passage for circulation of the cooling fluid. A jet-array plate subdivides the cooling passage into a supply header and a main channel and defines a plurality of orifices to convey the fluid into the main channel and to direct the fluid toward predetermined zones on the baseplate. | 2022-01-06 |
20220007552 | DISPLAY APPARATUS - A display apparatus including a heat sink plane disposed on a bottom surface of a display panel and configured in such a way that a coupling groove with a circuit board accommodated therein is formed in the guide panel, which is coupled to the bottom surface of the heat sink plane, to attach and detach the circuit board into and from the coupling groove through a guide holder disposed on a guide panel. | 2022-01-06 |
20220007553 | CONDUCTIVE NONWOVEN FABRIC - A conductive nonwoven fabric comprising a metal layer on at least one surface thereof, the conductive nonwoven fabric having a sheet resistance of 200 to 600 Ω/□ and a density of 2.0×10 | 2022-01-06 |
20220007554 | ELECTRONIC DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - An electronic device package is disclosed. The electronic device package includes a board on which an electronic device is mounted, a molded portion formed to cover the electronic device on the board, and a conductive layer disposed on a surface of the molded portion and extended in a trench formed on the board. | 2022-01-06 |
20220007555 | Magnetic Shield Material - In a magnetic shield material comprising a magnetic layer containing a magnetic material and an electrically conductive layer containing an electrically conductive material, the electrically conductive layer is designed to have a thickness corresponding to a frequency band of electromagnetic wave to be shielded. More specifically, the thickness of the electrically conductive layer (thickness of the aluminum foil in the drawing) is designed to have a thickness to maximize magnetic field shield effect of the magnetic shield material (thickness of the aluminum foil corresponding to peak value frequency in curve E in the drawing) in a frequency band of electromagnetic wave to be shielded. This makes it possible to obtain good magnetic field shield effect of the magnetic shield material in the frequency band of electromagnetic wave to be shielded. | 2022-01-06 |
20220007556 | Electromagnetic Field Shielding Plate, Method for Manufacturing Same, Electromagnetic Field Shielding Structure, and Semiconductor Manufacturing Environment - Provided is an electromagnetic field shielding plate, etc., in which it is possible to reduce weight while achieving high shielding performance from relatively high-frequency electromagnetic fields. The electromagnetic field shielding plate is configured by layering a permalloy layer | 2022-01-06 |
20220007557 | PRINTED CIRCUIT BOARD HOMOGENIZATION TREATMENT DEVICE - A printed circuit board homogenization treatment device includes a load mechanism, a position mechanism and a drive mechanism. The load mechanism is disk-shaped and configured to fix the printed circuit board; the position mechanism at least includes a first position wheel and a second position wheel that can jointly support the load mechanism; the position mechanism is switchable between a first state and a second state; when the position mechanism is in the first state, the load mechanism and the drive mechanism are spaced apart; when the position mechanism is in the second state, the drive mechanism is configured to drive the load mechanism to rotate around its central axis; both the first position wheel and the second position wheel are configured to rotate with rotation of the load mechanism. | 2022-01-06 |
20220007558 | COMPONENT MOUNTING DEVICE - A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected. | 2022-01-06 |
20220007559 | WORK MACHINE - A work machine comprising a work head configured to hold an electrical component having multiple lead terminals; a moving device configured to move the work head in the up-down direction; an imaging device configured to image the electrical component held with work head while being illuminated from the side; and a control device configured to control the operation of the work head and the moving device; wherein the control device calculates the inclination of an electrical component held by the work head based on imaging data of lead terminals of the electrical component imaged by the imaging device while the work head is moved in the up-down direction by the moving device, so that the mounting work of the electrical component is performed by taking the calculated inclination into account. | 2022-01-06 |