01st week of 2016 patent applcation highlights part 75 |
Patent application number | Title | Published |
20160007411 | TEMPERATURE CONTROL APPARATUS INCLUDING GROOVE-ROUTED OPTICAL FIBER HEATING, SUBSTRATE TEMPERATURE CONTROL SYSTEMS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND PROCESSING METHODS - Substrate temperature control apparatus including groove-routed optical fibers. Substrate temperature control apparatus includes upper and lower members including grooves in one or both, and a plurality of optical fibers routed in the grooves. In one embodiment, the optical fibers are adapted to provide light-based pixelated heating. In another embodiment, embedded optical temperature sensors are adapted to provide temperature measurement. Substrate temperature control systems, electronic device processing systems, and methods including groove-routed optical fiber temperature control and measurement are described, as are numerous other aspects. | 2016-01-07 |
20160007412 | APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS - Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects. | 2016-01-07 |
20160007413 | HEATING PLANT FOR CONTAINER PREFORMS - A heating plant ( | 2016-01-07 |
20160007414 | INDUCTION HOB - An induction hob including in a stacked arrangement a coil carrier plate ( | 2016-01-07 |
20160007415 | DETECTION OF A HAZARD CONDITION OF A LOAD - An electrical circuit is described for detection of an electrical hazard condition of a load | 2016-01-07 |
20160007416 | LIGHT-EMITTING DIODE LIGHTING DEVICE HAVING MULTIPLE DRIVING STAGES AND LINE/LOAD REGULATION CONTROL - An LED lighting device includes multiple luminescent devices driven by a rectified AC voltage. The multiple luminescent devices are turned on flexibly in a multi-stage driving scheme using multiple current controllers. The current settings of the two driving stages with the highest current level and the second highest current level are adjusted according to the variation in the rectified AC voltage V | 2016-01-07 |
20160007417 | Multi-Function Terminal - Embodiments described herein describe a power supply controller configured to control a power supply that provides power to an output load via a power supply transformer. The power supply controller includes a first terminal that provides supply voltage to the controller. The controller also includes a second terminal coupled to a switch external to the controller, the switch is part of a power converter controlled by the controller, wherein the second terminal is used for an initial power up of the power converter when the switch is turned on and used for a second functionality when the switch is turned off. | 2016-01-07 |
20160007418 | CONTROL CIRCUIT OF LED LIGHTING APPARATUS - A control circuit of an LED lighting apparatus divided into a plurality of LED channels may include: a current control circuit configured to provide a current path corresponding to sequential light emissions of the LED channels in response to a rectified voltage; and a residual voltage buffer circuit configured to correspond to an LED channel which finally emits light, and buffer a residual voltage when the rectified voltage rises to a preset value such that the residual voltage occurs. | 2016-01-07 |
20160007419 | LED Illuminator Apparatus, Using Multiple Luminescent Materials Dispensed Onto An Array of LEDs, For Improved Color Rendering, Color Mixing, and Color Temperature Control - An LED array includes three or more strings of bare LEDs mounted in close proximity to each other on a substrate. The strings of LEDs emit light of one or more wavelengths of blue, indigo and/or violet light, with peak wavelengths that are less than 490 nm. Luminescent materials deposited on each of the LED chips in the array emit light of different wavelength ranges that are of longer wavelengths than and in response to light emissions from the LED chips. A control circuit applies currents to the strings of LEDs, causing the LEDs in the strings to emit light, which causes the luminescent materials to emit light. A user interface enables users to control the currents applied by the control circuit to the strings of LEDs to achieve a Correlated Color Temperature (CCT) value and hue that are desired by users, with CIE chromaticity coordinates that lie on, or near to the black body radiation curve. Preferably a transparent material is dispensed on the substrate between the LED semiconductor chips to substantially surround the LED semiconductor chips. Thereafter at least one layer containing luminescent materials is applied on the LED semiconductor chips and the transparent material. | 2016-01-07 |
20160007420 | LED LIGHTING DEVICE - An LED lighting device comprises: a rectification circuit unit for receiving input power from a power source unit and outputting a rectified power; an LED unit having a plurality of LED channels connected in series and a resistor unit connected to the last end of the LED channels; a current sensing resistor; and a switch circuit unit comprising a plurality of switches, wherein an nth switch is connected to the rear end of an nth LED channel so as to control an operation of the nth LED channel and is controlled by a sum of a current of the nth switch and a current of an (n+1)th switch, which flows through the current sensing resistor. | 2016-01-07 |
20160007421 | LIGHTING DEVICE AND METHOD FOR MANAGING A LIGHTING SYSTEM - Lighting device including a plurality of lighting elements, at least one sensor receiving sensory stimuli from an establishment, and a control means connected with the at least one sensor and with the lighting elements. The control means can send lighting management instructions to the lighting elements depending on the captured and processed information. The lighting device also allows managing lighting in an intelligent manner. The lighting device can light with greater intensity the areas of an establishment where there are more people or the areas where greater attention is needed but are not visited often enough. The lighting device can also light in any other suitable manner depending on the information provided by the implemented sensory metrics or other independent business rules. | 2016-01-07 |
20160007422 | SOLID-STATE SOURCES OF LIGHT FOR PREFERENTIAL COLOUR RENDITION - Polychromatic light sources of white light, which have spectral power distributions composed of at least three different components, such as clusters of coloured light-emitting diodes (LEDs) or LEDs with partial or complete conversion in phosphors. Disclosed are the peak wavelengths and relative partial radiant fluxes of the spectral components that allow rendering certain fractions of an extended colour palette with high fidelity and with increased chromatic saturation, respectively, and hence meeting subjective preferences to colour quality of illumination. | 2016-01-07 |
20160007423 | METHODS AND APPARATUS FOR CONTROLLING LIGHTING - Disclosed are methods and apparatus for lighting control. Presence of a lighting control element ( | 2016-01-07 |
20160007424 | ILLUMINATION AND GROW LIGHT SYSTEM AND ASSOCIATED METHODS - A lighting system with selectable emission characteristics may include a housing, a controller, a first plurality of light sources operatively coupled to the controller and carried by the housing, and a second plurality of light sources operatively coupled to and controlled by the controller and carried by the housing. The first and second pluralities of light sources may be operable to emit first and second combined lights, respectively, and to emit a first light having a wavelength within the range of 650 nanometers to 700 nanometers, a second light having a wavelength within the range of 500 nanometers to 570 nanometers, and a third light having a wavelength within the range of 430 nanometers to 470 nanometer. The second light may be characterized by a human photopic response of greater than 0.0 and less than 0.4 throughout the range from 500 nanometers to 570 nanometers. | 2016-01-07 |
20160007425 | ILLUMINATING DEVICES AND SYSTEMS - Illuminating devices and systems are described herein. One illuminating device embodiment includes a computing component configured to determine a change in a state associated with a room in which the illuminating device is located based on a signal from a sensor, and an illuminating component configured to illuminate the illuminating device at a predefined setting associated with the determined state change and discontinue illuminating the illuminating device a predefined amount of time after the change in the state. | 2016-01-07 |
20160007426 | PREDICTIVE DAYLIGHT HARVESTING SYSTEM - In an example, an expected sky condition is calculated for a geographic location, a time of day, and a date based on a mathematical model. A predicted distribution of direct and interreflected solar radiation within the environment is calculated based on the expected sky condition. Measurement data from one or more photosensors is obtained that provides measurements of an initial distribution of direct and interreflected radiation within the environment, including radiation from solar and electrical lighting sources. A target distribution of direct and interreflected artificial electromagnetic radiation produced by electrical lighting is determined, based on the measurement data and the predicted distribution of direct and interreflected solar radiation, to achieve the target distribution of direct and interreflected radiation within the environment. Output parameters are set to one or more devices to modify the initial distribution to achieve the target distribution of direct and interreflected radiation within the environment. | 2016-01-07 |
20160007427 | METHOD AND SYSTEM FOR ACTUATING LOADS CONNECTED TO A BUS SYSTEM - A method for actuating loads connected to a bus system, in particular lamp operating devices, by at least one command generator which is likewise connected to the bus system. The actuation is carried out by the transmission of data packets, wherein the command generator fills a data packet region assigned to the command generator after the data packet transmission is initiated by a central clock generator. | 2016-01-07 |
20160007428 | INTEGRATED LIGHT-EMITTING DIODE DRIVER CIRCUIT AND METHOD OF OPERATING THE SAME - An integrated light-emitting diode (LED) driver circuit includes a bi-directional power line communication (PLC) unit, a power conversion module, and a constant current (CC)/constant voltage (CV) control unit. The bi-directional PLC unit receives an AC voltage, and converts a modulation signal on the AC voltage to generate a light-dimming control signal. The power conversion module receives the AC voltage and converts the AC voltage to generate an output voltage. The CC/CV control unit receives the light-dimming control signal to generate a dimming constant current or a dimming constant voltage. The integrated LED driver circuit outputs the dimming constant current or the dimming constant voltage and the output voltage to drive a LED string. | 2016-01-07 |
20160007429 | Lighting Control System and Method for Association of Nodes in a Multi-Node Network - The invention relates to a lighting control system and method for association of nodes in a multi-node network. The system comprises a number of lighting nodes forming a multi-node network, each lighting node comprising: —a light source; —a controller connected to the light source; and —communication means connected to the controller, wherein the lighting control system further comprises: —a memory component adapted to store information relating to at least one group of interrelated coordinates defined in a geographical coordinate system; and —a processing component in communication with the lighting nodes and adapted to automatically associate at least one lighting node with the at least one group on the basis of the geographical location of said at least one lighting node. | 2016-01-07 |
20160007430 | REMOTELY CONTROLLED HOLIDAY LIGHTING AND SOUND SYSTEM - A remotely controlled holiday lighting and sound system provides a remotely controlled and decorated control module that integrates into a holiday symbol, such as a Christmas tree, to control a holiday themed lighting pattern and audio recording for a plurality of light strings and a speaker. The system provides a plurality of light strings having spaced apart lights connected together in series around the holiday symbol. The system further includes a speaker that integrates into the holiday symbol and emits a holiday themed audio recording that is consistent with the theme of the holiday symbol. A control module is associated with the light strings and the speaker for selective control of each. The control module is covered with a holiday themed ornamental member. A receiver in the control module uses Wi-Fi or Bluetooth protocol to receive command signals from a transmitter in a mobile communication device. | 2016-01-07 |
20160007431 | SWITCH AND METHOD OF OPERATION - A control system including: a base including a central axis; a knob rotatably connected to the base, the knob rotatable about the central axis; a plurality of individually indexed light emitting elements distributed along the base perimeter and arranged to direct light radially outward of the central axis; a diffuser arranged radially outward of the light emitting elements; a wireless communication module enclosed between the knob and base; and a processor enclosed between the knob and base, the processor connected to the wireless communication mechanism and plurality of light emitting elements, the processor configured to individually control each light emitting element based on a control signal received from the wireless communication mechanism. | 2016-01-07 |
20160007432 | RADIOGRAPHIC IMAGE CAPTURING APPARATUS AND RADIOGRAPHIC IMAGE CAPTURING SYSTEM - A radiographic image capturing apparatus has a radiation source device including a radiation source for outputting radiation, and a detector device including a radiation detector for detecting radiation that is transmitted through a subject when the subject is irradiated with radiation by the radiation source, and converting the detected radiation into a radiographic image. At least one of the radiation source device and the detector device has an electric power supply limiting unit for limiting supply of electric power, and the electric power supply limiting unit controls supply of electric power between the radiation source device and the detector device, depending on timing of an image capturing process. | 2016-01-07 |
20160007433 | EXTREME ULTRAVIOLET SOURCE WITH MAGNETIC CUSP PLASMA CONTROL - A laser-produced plasma extreme ultraviolet source has a buffer gas to slow ions down and thermalize them in a low temperature plasma. The plasma is initially trapped in a symmetrical cusp magnetic field configuration with a low magnetic field barrier to radial motion. Plasma overflows in a full range of radial directions and is conducted by radial field lines to a large area annular array of beam dumps. | 2016-01-07 |
20160007434 | EXTREME ULTRAVIOLET LIGHT SOURCE - An initial pulse of radiation is generated; a section of the initial pulse of radiation is extracted to form a modified pulse of radiation, the modified pulse of radiation including a first portion and a second portion, the first portion being temporally connected to the second portion, and the first portion having a maximum energy that is less than a maximum energy of the second portion; the first portion of the modified pulse of radiation is interacted with a target material to form a modified target; and the second portion of the modified pulse of radiation is interacted with the modified target to generate plasma that emits extreme ultraviolet (EUV) light. | 2016-01-07 |
20160007435 | SYSTEMS AND METHODS FOR SYNCHRONOUS OPERATION OF DEBRIS-MITIGATION DEVICES - Systems and methods for synchronous operation of debris-mitigation devices (DMDs) in an EUV radiation source that emits EUV radiation and debris particles are disclosed. The methods include establishing a select relative angular orientation between the first and second DMDs that provides a maximum amount of transmission of EUV radiation between respective first and second rotatable vanes of the first and second DMDs. The methods also include rotating the first and second sets of vanes to capture at least some of the debris particles while substantially maintaining the select relative angular orientation. The systems employ DMD drive units, and an optical-based encoder disc in one of the DMD drive units measures and controls the rotational speed of the rotatable DMD vanes. Systems and methods for optimally aligning the DMDs are also disclosed. | 2016-01-07 |
20160007436 | METHOD AND APPARATUS FOR PROVIDING HIGH CONTROL AUTHORITY ATMOSPHERIC PLASMA - Embodiments of the invention relate to a method and apparatus for providing high thrust density plasma, and/or high control authority plasma. In specific embodiments, such high thrust density, and/or high control authority, plasma can be at or near atmospheric pressure. Embodiments pertain to a method and apparatus that use electron confinement via one or more magnetic fields, and/or one or more electric fields, in a manner to improve the ionization due to surface plasma actuators. Specific embodiments can improve ionization by several orders of magnitude. This improved ionization can result in a high electric field inside the sheath for the same applied voltage and can result in very high thrust. | 2016-01-07 |
20160007437 | ELECTROMAGNETIC WAVE EMISSION DEVICE - The purpose of the present invention is to provide an electromagnetic wave emission device in which the destination to which an electromagnetic wave is supplied can be switched among a plurality of emission antennas, wherein there are no problems such as breakage of a switching element even in a case where a large-power electromagnetic wave is emitted. The present invention is an electromagnetic wave emission device characterized by the following: an electromagnetic wave output from an electromagnetic wave generator is distributed to a plurality of emission antennas, and then from among the plurality of emission antennas, a target antenna having plasma nearby is supplied with an electromagnetic wave distributed to the target antenna and all or part of the electromagnetic waves reflected by the emission antennas other than the target antenna; and the all or part of the electromagnetic waves distributed to the target antenna and all or part of the electromagnetic waves supplied to the target antenna after reflection by the emission antennas other than the target antenna are emitted from the target antenna to the plasma. | 2016-01-07 |
20160007438 | SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF - A substrate structure with invisible inner electrode patterns is provided. The substrate structure includes a substrate, an electrode pattern, a first laminated structure, and a passivation layer. The electrode pattern is disposed on the substrate. The first laminated structure is disposed on the electrode pattern, in which the first laminated structure includes a first upper layer, a second upper layer, and a third upper layer. The first upper layer is adjoined to the electrode pattern and the substrate. The first upper layer, the second upper layer, and the third upper layer are stacked sequentially. The passivation layer is disposed on the first laminated structure. The refractive indexes of the electrode pattern, the first upper layer, the second upper layer, the third upper layer, and the passivation layer are decreased sequentially. | 2016-01-07 |
20160007439 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor. | 2016-01-07 |
20160007440 | HEAT CHANNELING AND DISPERSING STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat channeling and dispersing structure includes a substrate, a printed circuit board, and a heat-producing electronic element on the printed circuit board. The printed circuit board is mounted on the substrate, which defines a through hole filled with filler. The electronic element covers the hole infilled with filler. The heat generated by the electronic element is conducted through the filler directly to the substrate for heat dissipation. | 2016-01-07 |
20160007441 | FOLDING TYPE DISPLAY APPARATUS AND ELECTRIC EQUIPMENT - Disclosed are folding type display apparatuses. The folding type display apparatus comprises a flexible display section, and a plurality of housings, which includes a first housing having a space formed therein, and second and third housings bendably connected to both ends of the first housing. The display section is fixed to the second and third housings, and in a closed state of the second and third housings, a folding portion of the display section is housed in the space formed by the first housing, while in an open state of the second and third housings away from each other, the display section becomes flat, and the first housing functions as a leg protruding from flat surfaces of the second and third housings, so that the second and third housings are fixed to each other and the folding portion of the display section is supported, by a holding member for connecting these housings. | 2016-01-07 |
20160007442 | Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs - Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs. | 2016-01-07 |
20160007443 | CIRCUIT BOARD DEVICE AND CIRCUIT BOARD DEVICE FOR REDUCING ACOUSTIC NOISE - A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a second pad, a third pad and a fourth pad. The first and second capacitor packaging areas are respectively disposed on a first side and a second side of the substrate in a back-to-back manner. The first and second pads are disposed in the first capacitor packaging area for mounting a first capacitor. The third and fourth pads are disposed in the second capacitor packaging area for mounting a second capacitor, wherein the first and third pads are set back-to-back and electrically connected to each other, and the second and fourth pads are set back-to-back and electrically connected to each other. | 2016-01-07 |
20160007444 | REINFORCING MEMBER FOR FLEXIBLE PRINTED WIRING SUBSTRATE, FLEXIBLE PRINTED WIRING SUBSTRATE, AND SHIELD PRINTED WIRING SUBSTRATE - A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick. | 2016-01-07 |
20160007445 | HIGH-FREQUENCY SIGNAL PROCESSING METHOD - The high-frequency signal processing method provides at least two isolation terminals between adjacent signal transmission conductor sets. For two adjacent signal transmission conductor sets of a substrate, at least two vias through the substrate are embedded with conductive pillars, respectively. Each conductive pillar penetrates the dielectric layers of the substrate from a top side to a bottom side of the substrate. Each via with the embedded conductive pillar functions as an isolation terminal. The signal transmission conductor sets are as such segregated by the isolation terminals and the isolation terminals provides two layers of shielding. With the present invention, there is no requirement of having a casing and the miniaturization of form factors of the electronic appliances is not compromised. The dual isolation terminals significantly suppress the strength and influence of interference produced by a signal transmission conductor. | 2016-01-07 |
20160007446 | MULTILAYER CERAMIC CAPACITOR WITH INTERPOSER, AND INTERPOSER FOR MULTILAYER CERAMIC CAPACITOR - An embodiment of an multilayer ceramic capacitor with interposer includes: an interposer | 2016-01-07 |
20160007447 | ELECTRONIC DEVICE MOUNTING SUBSTRATE, ELECTRONIC APPARATUS, AND IMAGING MODULE - There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; and a first conductor disposed on a side surface of the frame section, the first conductor being electrically connected to the electrode pad, the electrode pad extending over a side surface of the first conductor from the upper surface of the frame section. By suppressing separation of the first conductor from the insulating base by means of the electrode pad, disconnection at the first conductor can be suppressed. | 2016-01-07 |
20160007448 | S-Shaped Ceramic Feedthrough - An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic substrate with one of the first and second opposing sides exposed at the first end and one of the first and second opposing sides exposed at the second end. The electrical interconnect is useful to join an integrated circuit in a hybrid package to a circuit board in high frequency communication applications. | 2016-01-07 |
20160007449 | CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof. | 2016-01-07 |
20160007450 | Method for Producing a Printed Circuit Board with MultiLayer Sub-Areas in Sections - A method for producing a printed circuit board ( | 2016-01-07 |
20160007451 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate. | 2016-01-07 |
20160007452 | CIRCUIT SUBSTRATE AND PROCESS FOR PREPARING THE SAME - The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay. | 2016-01-07 |
20160007453 | HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD USING THE PREPREG, AND SEMICONDUCTOR DEVICE USING THE MULTILAYER PRINTED WIRING BOARD - Problem: To prepare a prepreg having high thermal conductivity and a low thermal expansion coefficient. Resolution Means: The prepreg of the present disclosure is composed of a composite layer including an alumina-containing cloth including ceramic fibers and a thermosetting resin composition impregnated into the alumina-containing cloth and having a thermal conductivity coefficient greater than or equal to 1.0 W/(mK). | 2016-01-07 |
20160007454 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD - The present invention relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol group-containing compound, and (E) a photopolymerizable compound, wherein the component (A) contains at least one acid-modified vinyl group-containing epoxy resin (A1) which is obtained from a bisphenol-novolak epoxy resin (a1) having a structural unit represented by a general formula (IV) or (V), and an acid-modified vinyl group-containing epoxy resin (A2) which is obtained from an epoxy resin (a2) differing from the epoxy resin (a1). | 2016-01-07 |
20160007455 | COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD - Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. A copper particulate dispersion includes a dispersion vehicle and copper particulates dispersed in the dispersion vehicle. The copper particulate dispersion contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates during the photo-sintering of the copper particulates. | 2016-01-07 |
20160007456 | ELECTROCONDUCTIVE NANOWIRE NETWORK, AND ELECTROCONDUCTIVE SUBSTRATE AND TRANSPARENT ELECTRODE USING SAME, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE NANOWIRE NETWORK, ELECTROCONDUCTIVE SUBSTRATE, AND TRANSPARENT ELECTRODE - There are provided a conductive nanowire network, a conductive board and transparent electrode utilizing it, and a method for producing the same. The conductive nanowire network of the invention has essentially unbroken, continuous conductive nanowires randomly formed into a network. In the method for producing a conductive nanowire network according to the invention, nanofibers are applied in a random network-like fashion onto a substrate covered with a conductive layer, the conductive layer regions that are not covered with the nanofibers are removed, and then the nanofibers are removed. The network structure (wire diameter and network density) are also controlled to obtain a transparent electrode exhibiting both transparency and conductivity. | 2016-01-07 |
20160007457 | Ball Grid Array Rework - Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. | 2016-01-07 |
20160007458 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion. | 2016-01-07 |
20160007459 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME - A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads. | 2016-01-07 |
20160007460 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes a core layer, a first wiring layer, a first insulating layer, a first via wiring, a second wiring layer, a second insulating layer, a second via wiring, a third wiring layer, a third insulating layer, a third via wiring, and a through-wiring. The through-wiring includes upper and lower end surfaces. The upper end surface has an area that is smaller than an area of the lower end surface. The upper surface of the first insulating layer is more flat than the lower surface of the third insulating layer. The second wiring layer has a wiring density that is higher than a wiring density of the first wiring layer. | 2016-01-07 |
20160007461 | Insulating Substrates Including Through Holes - It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the through hole is 20 to 100 μm. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 μm in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 μm. | 2016-01-07 |
20160007462 | METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES - A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer. The first layer is stacked with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified after printing. | 2016-01-07 |
20160007463 | ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME - An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor. | 2016-01-07 |
20160007464 | ELECTRONIC DEVICE AND MOUNTING STRUCTURE OF THE SAME - An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes. | 2016-01-07 |
20160007465 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the first circuit and the second circuit to each other, a substrate on which the semiconductor chip is disposed, and substrate wirings that are arranged on the substrate and electrically connect the first circuit and the second circuit to each other. | 2016-01-07 |
20160007466 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path from a signal terminal on an inner circumference side of the first semiconductor package via a via hole and the second surface layer to a signal terminal on an outer circumference side of the second semiconductor package and a second bus wiring path from a signal terminal on an outer circumference side of the first semiconductor package via the second surface layer and a via hole to a signal terminal on an inner circumference side of the second semiconductor package are provided, thus securing a return current path for a signal current and realizing a high density wiring while suppressing radiation noise. | 2016-01-07 |
20160007467 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post. | 2016-01-07 |
20160007468 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat. | 2016-01-07 |
20160007469 | EMBEDDED COMPONENT SUBSTRATE AND METHOD FOR FABRICATING THE SAME - An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between the at least one electronic component and the at least one cavity. The first wiring layer extends from the first surface of the substrate to a sidewall of the at least one cavity, and directly contacts the at least one electronic component. | 2016-01-07 |
20160007470 | Method and Device for Electrically Coupling a Plurality of Semiconductor Device Layers by a Common Conductive Layer - An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad including a first conductive via. The second laminate electronic component includes a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad including a second conductive via. The first conductive via is electrically coupled to the second conductive via by a common conductive layer. | 2016-01-07 |
20160007471 | VIA ADDING METHOD AND PRINTED CIRCUIT BOARD - A via adding method comprising: identifying a target area where a via is to be added in a printed circuit board; determining a starting point for starting a search for a location of the via in the target area; and moving a search point along a path in an intersecting direction that intersects a radial direction around the starting point while moving the search point in the radial direction and determining whether the via is to be added at a moved search point. | 2016-01-07 |
20160007472 | METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE - A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical device, the electrode and the first conductive pattern, wherein a first caving pattern is foamed in the dielectric layer by the first conductive pattern. The dielectric layer is patterned to form a through hole and a second caving pattern connecting with the through hole and exposing the electrode. A conductive material is filled in the through hole and the second caving pattern to form a conductive via in the through hole and a second conductive pattern in the second caving pattern. The substrate is removed. | 2016-01-07 |
20160007473 | METHOD FOR FABRICATING PRINTED ELECTRONICS - A method for fabricating printed electronics and optical components includes printing a trace of electrically conductive, semiconductive or insulating material on a substrate and shrinking the substrate to a target size. The material can include an ink, solution, dispersion, powder, slurry, paste or the like. The step of shrinking can include heating the substrate at a predetermined temperature based on properties of the substrate. The step of shrinking can also include heating the substrate for a predetermined duration based on properties of the substrate. The step of shrinking can also include releasing an external electrical potential used to stretch the substrate during printing. For example, the substrate may decrease in area by at least fifty percent during heating. | 2016-01-07 |
20160007474 | HEATING CIRCUIT ASSEMBLY AND METHOD OF MANUFACTURE - A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste. | 2016-01-07 |
20160007475 | METHOD OF PRINTING ELECTRONIC SYSTEMS ON TEXTILE SUBSTRATES - The present invention relates to the very innovative field of smart textiles. More particularly the present invention discloses an innovative process for screen printing of textile substrates, by means of primers, for depositing on said substrates dielectric, conductive, resistive, magnetic, electroluminescent materials and many others. | 2016-01-07 |
20160007476 | ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE - Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step. | 2016-01-07 |
20160007477 | METHOD FOR FORMING ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, AND ELECTRIC CIRCUIT - There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method. | 2016-01-07 |
20160007478 | DISPLAY DEVICE - A display device includes a first substrate, at least one trace, a hydrophobic protective layer, a flexible printed circuit board (FPCB), a second substrate and a sealant. The first substrate has a display region and a peripheral region having an outer lead bonding (OLB) portion. The trace and the hydrophobic protective layer are disposed on the first substrate and extend from the display region to the OLB portion. The hydrophobic protective layer covers the trace and has at least one opening exposing a portion of the trace to define at least one lead and a surface microstructure. The lead and the surface microstructure are located in the OLB portion, and the surface microstructure is located on a surface of the hydrophobic protective layer away from the trace. One end of the FPCB leans against the surface microstructure and the FPCB is electrically connected to the lead. | 2016-01-07 |
20160007479 | CHIP SPACING MAINTAINING APPARATUS - A chip spacing maintaining apparatus for maintaining the spacing between any adjacent ones of a plurality of chips obtained by dividing a workpiece attached to an expand sheet, the expand sheet being supported at its peripheral portion to an annular frame is provided. The chip spacing maintaining apparatus includes a far-infrared radiation applying unit for applying far-infrared radiation toward the expand sheet expanded in a target area between the outer circumference of the workpiece and the inner circumference of the annular frame, thereby shrinking the expand sheet in the target area, and an air layer forming unit provided adjacent to the far-infrared radiation applying unit, the air layer forming unit having a nozzle hole for discharging a gas toward the workpiece in applying the far-infrared radiation from the far-infrared radiation applying unit toward the expand sheet, thereby forming an air layer above the workpiece. | 2016-01-07 |
20160007480 | COMPONENT BUILT-IN MULTILAYER SUBSTRATE FABRICATING METHOD AND COMPONENT BUILT-IN MULTILAYER SUBSTRATE - A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component ( | 2016-01-07 |
20160007481 | ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS - A method of assembling a packaged semiconductor device starts by dropping a pre-formed capacitor precursor on a surface of or within a first substrate. An integrated circuit die is dropped on either of the first substrate. If the pre-formed capacitor precursor lacks at least a first pair of vias for providing an electrical contact between capacitor plates of said chip capacitor, then at least a first pair of vias is formed in said pre-formed capacitor precursor. The first pair of vias are filled with an electrically conductive material to form the chip capacitor, wherein said filling of said vias provides an electrical contact between said first and second capacitor plates of said chip capacitor and said electrically conductive contact regions on said first substrate. A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of said electrically conductive material, and said second pattern comprises at least a second pair of overlaying areas free of said electrically conductive material. The first pair of areas overlay areas of the second pattern having said electrically conductive material and the second pair of areas overlay areas of the first pattern having said electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers. | 2016-01-07 |
20160007482 | Prepregs and Laminates Having a UV Curable Resin Layer - Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component. | 2016-01-07 |
20160007483 | FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT - A carrier board having two opposite surfaces is provided and a releasing film and a metal layer are formed on the two opposite surfaces respectively. Each metal layer formed with positioning pads is covered with a first hot-melt-dielectric layer where a passive component is disposed. The passive component has upper and lower surfaces each having electrode pads. Each first hot-melt-dielectric layer is disposed on a core board having a cavity to receive the passive component. A second hot-melt-dielectric layer is stacked on each core board. The first and second hot-melt-dielectric layers are heat pressed to form two dielectric layer units each having a top surface and a bottom surface. The carrier board and the releasing films are removed to separate the dielectric layer units. Wiring layers are formed on each top surface and each bottom surface and electrically connected to the electrode pads of the upper and lower surfaces respectively. | 2016-01-07 |
20160007484 | Bag computer display panel improvements - Disclosed are improvements on a display panel mounted to a bag. For a display panel mounted in a pocket and with a retainer for angle holding capability, protective spacers may be provided. To hold a vertical operating position, alternative plug and socket, sliding and pivoting prop and pivoting prop mounted to a fixed prop may be provided. A bag made for display panel mounting may include an attachment area and including a display panel to bag front prop is disclosed. For display panels mounted with right and left free sections, a loop of material may serve as the free sections for quick mounting and dismounting. An electrical connection, specialized holder and removable display panel including free sections are also disclosed. The display panel may be mounted to the bag with a two panel arrangement where a cover folds over the display panel in a way reminiscent of folding portable clock. | 2016-01-07 |
20160007485 | SEMICONDUCTOR MODULE WITH ULTRASONICALLY WELDED TERMINALS - A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the substrate, and at least one terminal having one end which protrudes from the housing and another end which has a terminal foot attached on a terminal pad of the metallization by means of ultrasonic welding. The housing has a protective wall which encloses the terminal and divides an interior space of the housing into an unprotected region and a protected region. The protective wall is formed such that a gap is formed between the substrate and the protective wall. The gap is designed to carry a fluid flow such that particles produced during the ultrasonic welding of the terminal foot to the terminal pad are prevented from penetrating into the protected region from the unprotected region. | 2016-01-07 |
20160007486 | PACKAGE SUBSTRATE - There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an upper surface and a lower surface of the substrate; an electronic component mounted in a cavity formed by the metal post; and a metal lid bonded to an upper portion of the metal post. | 2016-01-07 |
20160007487 | PROTECTING CASING FOR A PORTABLE ELECTRONIC DEVICE - A protecting casing for a portable electronic device has a shell and a detachable actuating panel. The actuating panel has a curved clamping sheet crossing over a front edge of the portable electronic device. A lock cylinder is mounted between the shell and the actuating panel. When the lock cylinder is locked, the actuating panel is secured. When the lock cylinder is unlocked, the actuating panel is detachable. Therefore, the actuating panel increases the stability for the protecting casing to be mounted around the portable electronic device. Further, a bolt is connected detachably to the actuating panel and the shell to selectively fasten the protecting casing and the portable electronic device at a fixed position so that the portable electronic device is kept from being stolen. | 2016-01-07 |
20160007488 | CONNECTION BOX, MAIN BOX, AND BASE STATION TRANSCEIVER - Embodiments provide a connection box, a main box, and a base station transceiver. The connection box | 2016-01-07 |
20160007489 | SUPPORT ASSEMBLY AND DISPLAY DEVICE - A support assembly and a display device are provided. The support assembly comprises a support frame ( | 2016-01-07 |
20160007490 | TRANSFORMER SECURITY ENCLOSURE - A security enclosure for a transformer includes a first sidewall, a second sidewall, and a bottom at least partially enclosing an interior. The bottom has an aperture configured to receive a transformer tank. A front opening provides access to an interior having a first panel. At least one terminal block is connected to the first panel. A door pivots between an open position spaced from the front opening and a closed position covering the front opening. | 2016-01-07 |
20160007491 | UNIVERSAL SYSTEM FOR MOUNTING RACK DOORS - A mount for mounting a door to rack includes a rack including a first pair of vertically-extending supports, each support including an array of openings; a first mount coupled to the rack at a first position thereon, the first mount including: a first plate extending between the first pair of vertically-extending supports and including a first end and a second end, and a first hinge arm adjustably coupled with the first plate; a second mount coupled to the rack at a second position located below the first position, the second mount including: a second plate extending between the first pair of vertically-extending supports and including a first end and a second end, and a second hinge arm adjustably coupled with the second plate. | 2016-01-07 |
20160007492 | Power Semiconductor Device and Power Conversion Device - A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed. | 2016-01-07 |
20160007493 | METHOD OF FABRICATING HOUSING AND HOUSING - A method of fabricating a housing includes: providing a metal member including a base plate and a sidewall, the base plate having an inner surface connected to the sidewall; providing a filler having a connecting surface and a first top surface; fixing the filler onto the metal member to make the connecting surface connect to the inner surface and the first top surface to respectively form first and second included angles larger than 90 degrees and smaller than 180 degrees; providing a film attached with an ink layer, and then performing a process of In-Mold-Roller Injection Molding to form a plastic on the sidewall and the filler, the ink layer attached to the plastic; and removing a part of the filler and a part of the plastic at the sidewall to form a machined surface connected to the inner surface and the upper appearance surface. | 2016-01-07 |
20160007494 | Compact Casing Structure - This invention illustrates a compact casing structure, integrally made by press-fitting at least one metallic material and adapted to be connected with a preset electronic device. The casing structure has a base portion which has a first stress region and a plurality of second stress regions. The plurality of circle shape second stress regions are arranged in intervals within the first stress region. The larger stress first stress region combining with the lesser stress and toughness second stress region can improve the strength of whole casing structure relatively, and the thickness of the casing structure can be made lighter to thinner, same and the usage amount of the material required in the casing structure can be reduced, and the cost of the casing structure can be decreased. | 2016-01-07 |
20160007495 | ASSEMBLY FOR ATTACHING A CIRCUIT BOARD TO A HOUSING - The present invention provides an assembly for attaching a circuit substrate to a housing. The assembly includes a fastener having a first end and a second end opposite the first end, where the first end is larger than a second end. The assembly further includes a circuit substrate including a through hole having a first opening on a first side of the circuit substrate and a second opening on a second side of the circuit substrate, the through hole for receiving the fastener. The assembly still further includes a mounted structure attached to the circuit substrate, which at least partially covers the second opening of the through hole on the second side of the circuit substrate, wherein the mounted structure restricts the size of an exposed portion of the second opening of the through hole. The second end of the fastener, which is received in the through hole of the circuit substrate is sized to extend through the through hole, as well as the restricted size of the exposed portion of the second opening restricted by the mounted structure. The larger first end of the fastener is sized to extend through the through hole, but not through the restricted size of the exposed portion of the second opening. The assembly further includes a housing having a boss adapted and aligned for receiving the second end of the fastener after the second end of the fastener has been received by the through hole of the circuit substrate, and extends therethrough, wherein the boss is adapted to grip the received second end of the fastener. | 2016-01-07 |
20160007496 | SPARK PREVENTING ELEMENT FOR PRINTED CIRCUIT BOARD - A spark-preventing element embedded in a printed circuit board includes a capacitive output electrode, a capacitive input electrode, an interlayer conductive member electrically connecting the capacitive output electrode to a signal line, and an interlayer insulation member electrically insulating the capacitive input electrode from the signal line, The capacitive input electrode is spaced apart from the capacitive output electrode with an air gap disposed between the capacitive output electrode and the capacitive input electrode, surrounds the capacitive output electrode, and is electrically connected to the ground layer. The spark-preventing element has an improved electrical characteristic and an increased durability. | 2016-01-07 |
20160007497 | APPARATUS AND METHOD FOR CONDUCTIVE COOLING OF AN INFORMATION HANDLING SYSTEM - An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs. | 2016-01-07 |
20160007498 | HEAT RADIATION SHEET - Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores inside the heat-radiating layer, and an adhesive layer disposed on at least one surface of the heat-radiating layer. | 2016-01-07 |
20160007499 | HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS - A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device. | 2016-01-07 |
20160007500 | POWER CONVERTER APPARATUS - A power converter apparatus is provided, which includes a horizontal switching device, a control switching device connected with the horizontal switching device and for controlling drive of the horizontal switching device, and a heat insulating member disposed between the horizontal switching device and the control switching device and for reducing that heat generated from the horizontal switching device is transferred to the control switching device. | 2016-01-07 |
20160007501 | COOLING SYSTEM AND ELECTRONIC DEVICE - An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies. | 2016-01-07 |
20160007502 | HEAT EXCHANGER, COOLING SYSTEM, AND ELECTRONIC DEVICE - An object of technology disclosed herein is improving cooling efficiency. | 2016-01-07 |
20160007503 | MOUNTING FRAMEWORK FOR ARRANGING ELECTRONIC COMPONENTS - A mounting frame for arrangement of electronic components includes a set of horizontal shelves and vertical posts of the frame with, at least, one internal channel for coolant to pass therethrough, forming coolant feed channel and coolant drain channel. The mounting frame includes at least two horizontal shelves, attached to the horizontal shelves of the frame, and at least one an electronic component installed thereon. One of the horizontal shelf includes at least one flexible hose, connected to the coolant feed channel to connect the coolant feed channel to it of at least one electronic component. The adjacent horizontal shelf includes at least one flexible hose connected with coolant drain channel, so that to link it with own coolant drain channel of, at least, one electronic component, inlet opening for feeding the coolant into coolant feed channel, and outlet opening for removal of coolant from coolant drain channel. | 2016-01-07 |
20160007504 | ELECTRONIC SUBSTRATE WITH HEAT DISSIPATION STRUCTURE - An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency. | 2016-01-07 |
20160007505 | SERVER HEAT DISSIPATION SYSTEM - A heat dissipation system includes a main body part, an inner unit and a rear surface part. The main body part has first and second surfaces at both ends so as to form a receiving space therein. The inner unit is received in the receiving space through a first opening portion provided to the first surface and coupled thereto so as to be sealed. The rear surface part is coupled to the second surface so as to be sealed. | 2016-01-07 |
20160007506 | MODULAR DATA CENTER - A modular data center includes: a rack which houses an electronic device; a blower device capable of switching a flowing direction of air and configured to feed the air into the rack; a space housing a moisture absorbent; an in-rack temperature detector which detects a temperature inside the rack; a dew-point temperature detector which detects a dew-point temperature of outside air; and a controller. The controller receives signals inputted from the in-rack temperature detector and the dew-point temperature detector, and controls shutters and the blower device. | 2016-01-07 |
20160007507 | Power Conversion Device - A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers | 2016-01-07 |
20160007508 | PORTABLE MECHANICAL SWITCH FOR SELECTIVE DEACTIVATION OF RADIO FREQUENCY IDENTIFICATION CIRCUITS - Systems and methods for providing security for authentication devices—such as electronically readable cards or ID badges with embedded RFID chips or NFC capability—may include an envelope or pocket-like case for carrying an electronically readable card, having an electrically conductive, non-opaque sleeve that can be moved to cover or expose the electronically readable card and that prevents information on the the card from being electronically read when covered yet still allows the card to be seen when covered. In one or more embodiments, the sleeve may be a wire mesh that is flexible enough to be compressed to expose the card yet stiff (or rigid) enough to be extended to cover the card and that is transparent enough to allow reading visual information on the surface of the card when covering the card. Protection can be switched off by a mechanical switch that leaves the protection normally on. | 2016-01-07 |
20160007509 | FLAME RETARDANT, ELECTRICALLY CONDUCTIVE ADHESIVE MATERIALS AND RELATED METHODS - Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin. | 2016-01-07 |
20160007510 | ELECTROMAGNETIC INTERFERENCE SHIELDING FILM - The invention relates to an electromagnetic interference shielding film comprising an electromagnetic wave absorptive layer which contains electromagnetic wave absorptive particles; a conductive layer which contains conductive particles, and the conductive layer is disposed on a surface of the electromagnetic wave absorptive layer; a metallic layer disposed on another surface of the electromagnetic wave absorptive layer; and an insulating layer disposed on the metallic layer. The electromagnetic interference shielding film according to the invention can prevent the circuits and components from the electromagnetic interference. | 2016-01-07 |