03rd week of 2022 patent applcation highlights part 71 |
Patent application number | Title | Published |
20220022291 | HOUSEHOLD OVEN WITH LED ILLUMINATION - A household oven includes a cooking chamber ( | 2022-01-20 |
20220022292 | HIGH-FREQUENCY HEATING APPARATUS - A high-frequency heating apparatus according to the present disclosure includes a first electrode ( | 2022-01-20 |
20220022293 | MICROWAVE REACTOR FOR CONTINUOUS TREATMENT BY MICROWAVES OF A FLOWING FLUID MEDIUM - A microwave reactor having a flow tube, transparent to microwave, extending longitudinally along a flow axis for a fluid medium flow; an input waveguide extending along a propagation axis orthogonal to the flow axis, having a rectangular cross-section with two large sides parallel to the flow axis and two small sides orthogonal to the flow axis; and an enclosure inside which the flow tube extends, made of a material reflective to microwaves, having a lateral dimension greater than the small dimension of the small sides of the input waveguide. The input waveguide is transversely fixed on the enclosure which has an input window surrounded by the input waveguide for propagation of microwaves through the input window to the inside of the enclosure. | 2022-01-20 |
20220022294 | LED Dimming Device With High Refresh Rate And Smooth Dimming - An LED dimming device with a high refresh rate and smooth dimming includes a constant current source circuit and an LED dimming circuit that are sequentially connected in series. The LED dimming circuit includes an LED and a first electronic switch. A positive electrode of the LED is connected to an output end of the constant current source circuit. The first electronic switch is connected in parallel at both ends of the LED. The LED dimming device further includes an energy quick release circuit and a first control circuit. The energy quick release circuit is connected in series with the first electronic switch to accelerate releasing excess energy in the constant current source circuit. The first control circuit is connected to the first electronic switch to control turning on or off of the first electronic switch. | 2022-01-20 |
20220022295 | SYSTEM AND METHODS FOR PROVIDING A UNIFORM AND TUNABLE HYPER-SPECTRAL SOURCE - An illumination system includes an illumination source configured to emit illumination light and a dispersive optical element configured to generate an angularly dispersed optical signal from the illumination light that is used to generate a spectral image. A digital micro-mirror device (DMD) includes an array of reflective elements that receive the spectral image and direct a portion of the spectral image to an integrating sphere. A controller is configured to calculate a subset of an array of reflective elements of the DMD to activate based on a target illumination output signal using a calibration model of the illumination system. The controller is also configured to activate the subset of the array of reflective elements to change the portion of the spectral image directed to the integrating sphere to generate an illumination output signal that substantially matches the target illumination output signal. | 2022-01-20 |
20220022296 | SWITCHING CONTROL CIRCUIT AND LED DRIVING CIRCUIT USING THE SAME - A switching control circuit configured to turn on a driving switching element by providing a gate signal to the driving switching element connected in series to an LED includes the switching control circuit configured to divide a PWM dimming signal into a normal PWM dimming section and a low PWM dimming section based on a timing selection signal, provide the gate signal of a first frequency to the driving switching element in the normal PWM dimming section, and provide the gate signal of a second frequency, greater than the first frequency, in the low PWM dimming section. | 2022-01-20 |
20220022297 | LIGHT BEAM GENERATING DEVICE, PROJECTION DEVICE, AND LIGHT BEAM GENERATING METHOD - The invention relates to a light beam generating device and method, and a projection device. The light beam generating device is configured to receive a color control signal and generate a target light beam having a target color, and includes a plurality of drivers, a current signal generating circuit, and a control circuit. The drivers respectively drive a plurality of light-emitting elements according to a plurality of current signals, wherein the plurality of light-emitting elements collectively generate the target light beam. The current signal generating circuit is coupled to the drivers and generates the plurality of current signals according to the color control signal corresponding to the target color. The control circuit is coupled to the drivers and controls whether each driver is enabled according to the color control signal. | 2022-01-20 |
20220022298 | LIGHTING APPARATUS - A lighting apparatus includes a LED module, a light source plate, a heat sink, an antenna, a driver and a light housing. The light source plate is used for holding the LED module. The heat sink has a bottom plate and a lateral wall. The light source plate is placed on the bottom plate. The antenna is disposed on the lateral wall. The driver is used for generating a driving current to the LED module. The driver has a wireless circuit. The wireless circuit is electrically connected to the antenna for transmitting a wireless signal. The light housing is used for holding the heat sink so that the LED module emits light toward a light opening of the light housing. | 2022-01-20 |
20220022299 | LIGHTING CIRCUIT OF AUTOMOTIVE LAMP - A lighting circuit turns on a plurality of semiconductor light sources. Multiple current sources are each coupled to a corresponding semiconductor light source. A switching converter supplies a driving voltage V | 2022-01-20 |
20220022300 | LIGHTING CIRCUIT OF AUTOMOTIVE LAMP - A lighting circuit turns on a plurality of semiconductor light sources. Multiple current sources are each coupled to a corresponding semiconductor light source. A switching converter supplies a driving voltage V | 2022-01-20 |
20220022301 | SYSTEM FOR STREET LIGHT LIGHTING CONTROL AND FOR IOT CONTROL FOR MONITORING SOLAR POWER GENERATION - A system for street light lighting control and for Internet-of Things control for monitoring solar power generation includes a solar panel configured to generate photovoltaic-based electricity using sunlight; a battery configured to store the electricity generated by the solar panel; a solar controller configured to control the battery to store the electricity; and a street light controller configured to control lighting of at least one street light using the electricity stored in the battery, wherein the solar controller includes a battery information detection module configured to detect remaining charge information and discharging time information, which are charging/discharging status information of the battery and a communication module configured to transmit the remaining charge information and discharging time information to a monitoring server, wherein the communication module transmits the charging/discharging status information, the remaining charge information, and the discharging time information to the monitoring server through a low-power wide area network. | 2022-01-20 |
20220022302 | ENTERTAINMENT APPARATUS, LIGHT EMISSION CONTROLLING APPARATUS, OPERATION DEVICE, LIGHT EMISSION CONTROLLING METHOD AND PROGRAM - A light emission controlling apparatus, an operation device, a light emission controlling method and a program that facilitate understanding of identification information associated with the operation device are disclosed. The light emission controlling apparatus includes an identification information specification unit that specifies the identification information associated with the operation device. A specific light emission region specification unit specifies a specific light emission region that is part of a light emission region set to the operation device, the specific light emission region according to the identification information. A light emission controlling unit controls such that at least part of the light emission region emits light in such a manner that a color according to the identification information and the specific light emission region are recognizable. | 2022-01-20 |
20220022303 | A MOTION DETECTOR, A LUMINAIRE, A CORRESPONDING METHOD - Some embodiments are directed to a motion detector configured to classify an environment as quiet or motion. The motion detector is configured to estimate if the frequency bins in a motion signal correspond to a motion source in the environment or to a noise source in the environment. Some embodiments are directed to a luminaire comprising a motion detector. | 2022-01-20 |
20220022304 | SYSTEM AND METHOD OF MONITORING ACTIVITY IN AN ENCLOSED ENVIRONMENT - The present invention discloses a lighting system for monitoring human activity within an enclosed environment. The system comprises one or more light fixtures including a thermal sensor housed within a sensor housing coupled to each light fixture, wherein the thermal sensor is communicatively coupled to the light fixture and configured to capture a plurality of thermal images indicative of human activity surrounding a fixture within the enclosed environment, wherein each thermal image includes a grid having a plurality of pixels corresponding to a section of the enclosed environment, a processor configured to receive the plurality of thermal images from the thermal sensor, wherein the processor is in data communication with the thermal sensor and the light fixture and a wireless transceiver communicatively coupled to the processor. | 2022-01-20 |
20220022305 | RECEIVING LIGHT SETTINGS OF LIGHT DEVICES IDENTIFIED FROM A CAPTURED IMAGE - An electronic device ( | 2022-01-20 |
20220022306 | LIGHTING CONTROL SYSTEM WITH LIGHT SHOW OVERRIDES - Systems and methods are disclosed for a load control system which produces a show by adjusting one or more parameter values, such as color temperature, intensity, spectrum, volume, load state, and position of a window covering, as a function of a show time equal to a current time of day. The load control system is responsive to receiving commands to adjust the show time with respect to the current time of day. The load control system is configured to respond to the received commands by initiating a temporary system override in which the one or more parameter values may rewind or forward in time according to the defined show. The temporary override may exit and the defined show may resume at the current time of day after a predetermined amount of time has passed, at a reset time, or in response to a command. | 2022-01-20 |
20220022307 | METHOD AND SYSTEM FOR CONTROLLING DISPLAY CONDITION WHICH IS PRE-WRITTEN INTO PASSIVE LIGHT BOARD BY MOBILE DEVICE - Disclosed are a method and system for controlling a display condition which is pre-written into a passive light board by a mobile device. A display status is pre-written into a passive light board which is not powered by electricity before, and a control application program loaded into the mobile device is provided for a user to input a brightness parameter and a color temperature parameter. The light board which is not powered by electricity before can carry out the presetting of the display condition, and related manufacturers can set the light boards quickly and easily after the light boards exit the factory, and the light boards can display according to the conditions in compliance with the brightness parameter and the color temperature parameter after the light boards are powered on. | 2022-01-20 |
20220022308 | Elongated Non-Thermal Plasma Reactor For Optimal Coupling To Pulsed Power Supply - A plasma reactor for a Dielectric Barrier Discharge (DBD) system, the system includes one or more plasma reactor modules, the one or more plasma modules are configured as transmission lines. A duration of a rise-time and/or a fall-time of a voltage pulse, fed into a first end of the one or more reactor modules is shorter than a run-time of the voltage pulse from a first end of the one or more reactor modules to a second end of the one or more reactor modules. | 2022-01-20 |
20220022309 | HEAT SINK FOR A PRINTED CIRCUIT BOARD - A heat dissipating circuit board assembly includes a heat sink having a first wall, a second wall spaced from the first wall, and an end wall extending between the first and second walls. The first wall, the second wall, and the end wall collectively define a cavity. The assembly additionally includes a printed circuit board having a first face and a second face opposite the first face. The printed circuit board is located within the cavity such that the first wall of the heat sink extends over the first face and the second wall of the heat sink extends over the second face to allow heat to be transferred from the printed circuit board to the heat sink. The heat sink is configured to interface with a connector socket when the circuit board is connected to the connector socket for stabilizing the printed circuit board. | 2022-01-20 |
20220022310 | SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN - A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect. | 2022-01-20 |
20220022311 | EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF - An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, the circuit board, and the heat dissipation element are electrically connected. The heat dissipation element includes a first part, a second part, and a third part located between the first part and the second part. The first part is in direct contact with a side wall of the chip. The second part is a ground terminal. A method for manufacturing an embedded component structure is also provided. | 2022-01-20 |
20220022312 | ELECTRIC CIRCUIT SYSTEM AND ASSEMBLING METHOD THEREOF - The present disclosure relates to an electric circuit system. The system includes a housing, a printed circuit board mounted within the housing, an electric component conductively mounted to the printed circuit board, and a cooling system for transferring heat away from of the electric component. The printed circuit board is compartmentalizing the inside of the housing into a first compartment and a second compartment, and the electric component is situated in the first compartment. The cooling system includes at least one first heat transferring element located adjacent to the electric component. The at least one first heat transferring element is secured to the housing surrounding the second compartment capable of forming a heat flowing path defined to transfer heat from the electric component to the housing via the at least one first heat transferring element. | 2022-01-20 |
20220022313 | ELECTRICAL CONNECTION ON A TEXTILE CARRIER MATERIAL - Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element. | 2022-01-20 |
20220022314 | COMPOSITE AND COPPER CLAD LAMINATE MADE THEREFROM - Disclosed are composites comprising copper foils having at least one smooth surface and an adhesive layer with low Dk and Df properties. Also disclosed are copper clad laminates made by laminating the present composites with flexible or rigid substrates that exhibit heat resistance and good to excellent bonding strength. The PCBs made therefrom exhibit low insertion loss and may be assembled with other components to form various electrical devices utilizing high speed of at least 1 Gps or high frequency signals of at least 1 GHz. | 2022-01-20 |
20220022315 | THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) INTEGRATION OF AN EMBEDDED CHIP AND A PREFORMED METAL ROUTING STRUCTURE - An integrated circuit (IC) package is described. The IC package includes a metallization structure. The IC package also includes a first die in a package substrate layer. The package substrate includes a first surface and a second surface, opposite the first surface. The second surface of the package substrate layer is on the metallization structure. The IC package further includes a second die on the first surface of the package substrate layer and on the first die. The IC package also includes through vias in the package substrate layer to couple pads of the second die to metal routing layers at a first surface of the metallization structure. The IC package further includes package bumps on a second surface of the metallization structure, opposite the first surface, and coupled to the pads of the second die through the metal routing layers. | 2022-01-20 |
20220022316 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - A package carrier includes a build-up circuit structure, a first insulation protective layer, a plurality of connection pads, and a plurality of metal balls. The build-up circuit structure has an upper surface. The first insulation protective layer is disposed on the upper surface of the build-up circuit structure and has a plurality of first openings. The connection pads are respectively disposed in the first openings of the first insulation protective layer and are structurally and electrically connected to the build-up circuit structure. Each of the connection pads has an arc-shaped groove. The metal balls are respectively disposed in the arc-shaped groove of the connection pads. The metal balls and the corresponding connection pads define a plurality of bump structures, and a plurality of top surfaces of the bump structures are on a same plane. | 2022-01-20 |
20220022317 | EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF - An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided. | 2022-01-20 |
20220022318 | DISPLAY DEVICE - A display device includes a display panel including first and second signal pads respectively disposed at one side and the other side of a center axis extending in a first direction and first and second fixing pads spaced apart from each other with the first and second signal pads interposed therebetween, and a flexible film including connection pads overlapping the signal pads and first and second alignment pads groups spaced apart from each other with the connection pads interposed therebetween. The first alignment pad group includes n first alignment pads arranged in the first direction, the second alignment pad group includes n second alignment pads corresponding to the first alignment pads, and a distance between corresponding first and second alignment pads decreases as a distance thereof from a display area decreases. | 2022-01-20 |
20220022319 | PRINTED CIRCUIT BOARD ASSEMBLY - A PCB assembly includes a second PCB disposed adjacent to a first PCB and have a second hole facing a first hole, an upper plate disposed at an upper of the first and second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, a holder disposed at a lower of the first and second hole and have a lower plate having a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole, a first fixing screw penetrating through the third first, and fifth hole, and a second fixing screw penetrating through the fourth, second and sixth hole, and the lower plate includes a protrusion penetrating through the second PCB coupling the first PCB and the second PCB. | 2022-01-20 |
20220022320 | CONNECTION PLATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE - An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch. | 2022-01-20 |
20220022321 | SUBSTRATE ASSEMBLY FOR CORRECTING POSITION OF CAMERA MODULE, METHOD FOR MANUFACTURING SAME, AND CAMERA MODULE INCLUDING SAME - A substrate assembly includes: a first substrate unit; and at least one second substrate unit electrically connected to the first substrate unit and having a coil pattern formed thereon, wherein: the first substrate unit is a flexible substrate; the second substrate is a rigid substrate; the second substrate unit has a coil pattern formed on one of the front surface and the rear surface thereof and includes multiple second substrates laminated in the upward/downward direction and electrically connected to each other; the at least one second substrate unit includes multiple second substrate units arranged on the first substrate unit; the second substrate unit has a through-hole vertically formed therethrough; the coil pattern is formed around the through-hole; the first substrate unit includes a Hall sensor; and the second substrate unit is coupled to the first substrate unit such that the Hall sensor is exposed through the through-hole. | 2022-01-20 |
20220022322 | Electricity Meter - An electricity meter ( | 2022-01-20 |
20220022323 | DRIVER BOARD ASSEMBLIES AND METHODS OF FORMING A DRIVER BOARD ASSEMBLY - A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate. | 2022-01-20 |
20220022324 | METHOD FOR MANUFACTURING WATER RESISTANT PRINTED CIRCUIT BOARD - A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate. | 2022-01-20 |
20220022325 | Barrier Layer - A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish. | 2022-01-20 |
20220022326 | MULTILAYER BODY - There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal M | 2022-01-20 |
20220022327 | METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD - A method includes preparing a first substrate member in which a cavity is formed. Moreover, the method includes preparing a magnetic member having a plurality of magnetic pieces. The magnetic member is placed in the cavity, and the second substrate member is placed on the first substrate member to close the cavity. The cavity is defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opens upward in an up-down direction perpendicular to the lateral direction. The magnetic pieces are coupled with each other by positioning members so as to be arranged at regular intervals in a predetermined direction. The placing of the magnetic member in the cavity is carried out so that the predetermined direction coincides with the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction. | 2022-01-20 |
20220022328 | Electronic Component with Cooling Clearance, and Assembly Method - An electronic component includes a circuit carrier unit and a housing at least partly encompassing the circuit carrier unit. The circuit carrier unit has an electronic element assembled on the circuit carrier unit. The circuit carrier unit has a first section and a second section arranged at a distance from the first section and opposing the first section. The housing has a first receiving portion receiving the first section and a second receiving portion receiving the second section. The first receiving portion and the second receiving portion are separated from each other by a cooling clearance. | 2022-01-20 |
20220022329 | PROTECTIVE DEVICE AND PROTECTIVE METHOD FOR ELECTRONIC PRODUCTS AND ELECTRONIC DEVICE FOR AGRICULTURAL MACHINERY - A protective device and a protective method for insulating and buffering an electronic product against the vibration, humidity, heat, and chemicals found in outdoor agricultural machines and thus safeguarding and extending the service life of the electronic products includes a protection space in the device, the electronic products being protected by being suspended in the protection space of the protection device. | 2022-01-20 |
20220022330 | ALIGNMENT FOR TILES OF TILED DISPLAYS - Tiled displays having display tiles, are described as well as methods of making and/or operating tiled displays and tiles. Methods and devices are described for a tiled display having tiles lying in an X-Y plane, the methods and devices being for setting or adjusting the position of neighbouring tiles in a tiled display to reduce differences in the Z direction between tiles of a tiled display, whereby the tiles lie in the X-Y plane. | 2022-01-20 |
20220022331 | ELECTRONIC APPARATUS - An electronic apparatus includes a display module divided into a bending area and a non- bending area arranged in a first direction and having a front surface and a rear surface opposing the front surface, a cover member covering a portion of the bending area and disposed on the front surface, a first protection member disposed on the rear surface overlapping the non-bending area, a second protection member disposed on the rear surface overlapping the bending area and spaced apart from the first protection member, a driving element disposed on the front surface overlapping the bending area, and a stiffener disposed between the cover member and the driving element on the front surface. The bending area is bent along a virtual bending axis extending in a second direction perpendicular to the first direction, and the cover member and the stiffener expose a portion of the front surface through a space therebetween. | 2022-01-20 |
20220022332 | DISPLAY DEVICE - The present embodiment comprises: a stand having a side plate provided with a cable receiving groove portion for receiving a cable; a cable bracket fastened to the stand and having a separation portion being spaced apart from the side surface of the cable receiving groove portion; and a cover body having a side cover that covers the side surface of the cable receiving groove portion and the cable bracket, and a rear cover that is bent from the side cover, wherein a through hole, through which the cable passes, is formed between the rear cover and the side plate, and a part of the cable is accommodated between the side surface and the separation portion of the cable receiving groove portion. | 2022-01-20 |
20220022333 | WIRELESS TERMINAL DEVICE - This wireless terminal device includes: an input portion; an output portion; a circuit board module electrically connected to the input portion and the output portion; an external power supply module which is detachably connected to the circuit board module, includes an input terminal for receiving input from an external power supply, converts an input voltage inputted to the input terminal, and outputs an output voltage; and a case for storing the input portion, the output portion, the circuit board module, and the external power supply module. In a storage space, a battery can be stored when the external power supply module is detached from the circuit board module. The circuit board module includes a connector connection portion to which a connector of the external power supply module or a connector of the battery can be selectively connected, and which is provided at a position spatially connected to the storage space. | 2022-01-20 |
20220022334 | COVER WINDOW, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE HAVING THE SAME - A cover window includes a base layer including a bending portion bent about a bending axis extending in one direction, a first flat portion, and a second flat portion spaced apart from the first flat portion with the bending portion interposed therebetween in a direction crossing the one direction and facing each other and a first coating portion disposed on the bending portion and having a first modulus less than a modulus of the base layer. | 2022-01-20 |
20220022335 | CASING FOR ELECTRICAL APPARATUS AND POWER CONTROL APPARATUS - Provided are a casing for an electrical apparatus for housing an electrical apparatus includes: a casing body having an opening; a cover body that includes a flat plate-like cover portion having a rectangular shape for covering the opening, and outer side surface cover portions that are continuous to respective sides of the flat plate-like cover portion and cover outer side surfaces of the casing body; and first ribs that are provided on the outer side surfaces of the casing body covered by the outer side surface cover portions and extend along the respective sides, and a power control apparatus that includes the casing for an electrical apparatus and the electrical apparatus housed in the casing for an electrical apparatus. | 2022-01-20 |
20220022336 | PACKAGING UNIT FOR A SUBSTRATE - The present invention relates to a packaging unit for a substrate, a package stack with such packaging units and a process for packaging a substrate. The packaging unit for a substrate comprises a first shell, a substrate and a second shell. The substrate is inserted into the first shell, and the second shell is mounted on the first shell so that a first side of the substrate is surrounded by the first shell and an opposite, second side of the substrate is covered by the second shell. A metal deposit is applied to the second side of the substrate and an adhesive point is arranged on the metal deposit. The second shell is supported on the first shell in such a way that the second shell is only in contact with the substrate outside the adhesive point. | 2022-01-20 |
20220022337 | CIRCUIT BOARD - A power circuit includes multiple bus bars that are connected to multiple terminals of an FET, are provided flush with each other, and are each insulated from each other. The power circuit includes one bus bar that is connected to drain terminals of the FET, a solder fixing portion of the FET that is arranged on the bus bar, and another bus bar that is connected to source terminals of the FET via a conductive connection sheet. | 2022-01-20 |
20220022338 | RACK FOR STORING ELECTRICAL EQUIPMENT - A rack for storing electrical equipment includes a columnar frame formed by combining a vertical frame and a horizontal frame and a connecting member attached to the horizontal frame. The horizontal frame has a first portion including the connecting member and a second portion other than the first portion. The connecting member is movably attached to the second portion so that an inside of the rack is opened in the first portion. | 2022-01-20 |
20220022339 | HEAT DISSIPATION DEVICE - A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit. | 2022-01-20 |
20220022340 | SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE - A semiconductor module has a heat conduction section provided between a multilayer substrate, on which semiconductor chips are mounted, and a cooler. The heat conduction section includes a frame and an opening, and the opening has a grease portion which is provided partly in the opening and is in contact with the multilayer substrate and the cooler, and a space portion which is provided between the grease portion and the frame in a partial and band-shaped manner. | 2022-01-20 |
20220022341 | PLENUM FOR GENERATOR SET AND SYSTEMS AND METHODS THEREOF - A plenum for processing one or more byproducts output from a generator, and systems and methods thereof, can have the plenum in the form of a hollow elongate rectangular box having a first end and a second end opposite the first end. The plenum can have a frame and a sidewall fixed to the frame, and can be adapted to be oriented vertically when operatively coupled to receive the one or more byproducts from the generator. The sidewall can include an opening adapted to receive heated air from the generator as one of the byproducts from the generator. | 2022-01-20 |
20220022342 | VARIABLE HEIGHT FAN - An information handling system may include a processor, a memory, and a power source; a base chassis including an outer cover surface; a variable height fan including: a main shaft including a cavity formed centrally within the main shaft; a first set of fan blades operatively coupled to the main shaft; a slide shaft placed within the cavity of the main shaft where the slide shaft is operatively coupled to the main shaft to rotate with the main shaft; a second set of fan blades operatively coupled to the slide shaft; a biasing member to bias the slide shaft to extend out of the main shaft; and a contact point prominence as a rotational point interface with the slide shaft operatively coupled to the outer cover surface. | 2022-01-20 |
20220022343 | FAST FLOW COOLING BATH FOR MULTIPROCESSOR CIRCUIT BOARDS - A system and a method are disclosed for a cooling bath designed to cool a high density of devices within the bath. Coolant is circulated between the cooling bath and external pumps, which use a high flow rate of coolant to cool the high density of devices. The cooling bath includes inlet pipes, distribution pipes, a device chamber, and draining sections. The inlet pipes and distribution pipes are structured such that a mound of coolant may accumulate within the bath, forming a peak near the center of the bath. Coolant flows in a direction from the center of the bath towards draining sections on opposing ends of the bath. Draining sections are structured to receive hot coolant at a relatively slow flow rate and prevent air from being expelled from the cooling bath with the hot coolant. | 2022-01-20 |
20220022344 | TELEMETRY SYSTEM SUPPORTING IDENTIFICATION OF DATA CENTER ZONES - Telemetry system metric data that is collected within a data center may be collectively analyzed in order to identify zones within the data center that exhibit deviations in reported metric data. The analyzed metric data is collected from IHSs (Information Handling Systems), such as servers, operating in the data center. The metric data reported by the respective IHSs identifies the location the IHS within the data center. The collected metric data is analyzed to identify metrics that are correlated with locations within the data center. Within the identified metric data that is correlated with data center locations, a zone of the data center is identified that includes a subset of IHSs that have reported anomalous metric data relative to the metric data reported by neighboring IHSs. For instance, such a zone may be an aisle of the data center, one or more racks, and/or rows of servers spanning multiple racks. | 2022-01-20 |
20220022345 | DETERMINING THE FLOW VELOCITY IN A COOLANT CIRCUIT - A conversion device converts an input power into an output power, and gives rise to a power loss. The conversion device is cooled by a coolant circuit in which a coolant flows. A monitoring device determines, using operating data of the conversion device and/or of the coolant circuit, a flow velocity of the coolant and compares the flow velocity with a limit velocity. If the flow velocity reaches or exceeds the limit velocity, the monitoring device resorts to a special reaction. As long as the flow velocity does not reach the limit velocity, the monitoring device resorts either to no reaction or to a normal reaction that is not the same as the special reaction. The monitoring device determines the flow velocity by using a quantity of heat that is to be removed by the coolant per unit time, a local temperature of the conversion device, and an inflow temperature. | 2022-01-20 |
20220022346 | ISOLATION TORTUOUS PATH SEAL ENCLOSOURE - A modular system of plastic walls having embedded and coextensive electrically conductive components configured to electrically connect with each other when the walls are mated. The walls have joining edges that form joint seams with other walls when joined together to create an enclosure. When enough walls are used to surround a storage space, a Faraday cage is created. The walls additionally have portions of tortuous paths at each joining edge that mate with a complementary portion of a tortuous path of another wall when the walls are joined together. A torturous path seal is thereby created at each joint seam. The plastic walls can be configured in a multiplicity of combinations to create various enclosures necessary for RFID-enabled storage and tracking of medical articles. Containers, enclosures, cabinets, and drawers of differing heights and sizes can be made and they may be stacked or otherwise assembled. | 2022-01-20 |
20220022347 | Frames For Electromagnetic Interference (EMI) Shielding Assemblies Including Detachable Pickup Members - According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same. | 2022-01-20 |
20220022348 | Shielded Interconnect System - A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps. | 2022-01-20 |
20220022349 | Active Shield Structure - Various implementations described herein are related to a device having a first coil-shaped spiral structure for an active shield and a second coil-shaped spiral structure that is wound in-between windings of the first coil-shaped spiral structure. The first coil-shaped spiral structure may provide for a coil-based electro-magnetic (EM) shield as a counter-measure circuit for protecting an underlying circuit. | 2022-01-20 |
20220022350 | GRAPHENE LAMINATE STRUCTURES - Provided are methods of forming graphene laminate compositions and architectures. The method comprises: (i) contacting a graphene structure comprising one or more planar graphene sheets with a first interlayer material; (ii) depositing of a conductive material, where in the conductive material is deposited along an edge of the graphene and one end of the first interlayer; and (iii) contacting the graphene structure with a second interlayer material. Also provided are graphene laminates structures comprising doped graphene films having improved mechanical strength, electrical mobility and optical transparency. | 2022-01-20 |
20220022351 | COMPONENT MOUNTING SYSTEM - A component mounting system includes a plurality of component mounters, a characteristic inspection device, and a management device. Each of the component mounters transmits inspection area component information including identification information of the corresponding component mounter, information of a conveyed-in board, and identification information of an inspection-required component installed in an inspection area, to the management device. The characteristic inspection device determines whether or not the inspection-required component installed in the inspection area is an error component, and transmits the information on the determined inspection-required component to the management device as error information. The management device specifies the component mounter in which the inspection-required component determined to be an error component is installed in the inspection area as an error component mounter, based on the transmitted error information, and stops an operation of the identified component mounter. | 2022-01-20 |
20220022352 | OLIVE TREE NAMED 'I-30' - A new and distinct variety of olive tree, herein referred to by its cultivar name, ‘1-30’, is provided which forms an upright to spreading growth habit. Fruit with a low weight and acute shape is produced. The fruit exhibit black coloration and the fruit nipple is moderately present. The stone of the fruit of the new variety is of very low to low weight, very elongated and possess a weak rugose surface. | 2022-01-20 |
20220022353 | OLIVE TREE NAMED 'I-16' - A new and distinct variety of olive tree, herein referred to by its cultivar name, ‘I-16’, is provided which forms an upright to spreading growth habit. Fruit with a low weight and obtuse shape is produced. The fruit exhibit dark violet coloration and the fruit nipple is absent or weak. The stone of the fruit of the new variety is of medium weight, moderately elongated and possesses a moderately rugose surface. | 2022-01-20 |
20220022354 | Hop plant named 'CV12' - A new hop plant named ‘CV12’ is disclosed. ‘CV12’ is notable for its increased cone size, relatively high myrcene content and unique spicey, piney, citrus aroma profile. | 2022-01-20 |