03rd week of 2021 patent applcation highlights part 56 |
Patent application number | Title | Published |
20210020531 | PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL | 2021-01-21 |
20210020532 | CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BUMP HEIGHT RANGE | 2021-01-21 |
20210020533 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2021-01-21 |
20210020534 | Semiconductor Device and Method of Forming the Same | 2021-01-21 |
20210020535 | WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-01-21 |
20210020536 | METHOD OF MANUFACTURING INSULATING CIRCUIT BOARD WITH HEATSINK | 2021-01-21 |
20210020537 | INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERIAL (STIM) BLEED-OUT RESTRICTING FEATURE | 2021-01-21 |
20210020538 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2021-01-21 |
20210020539 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE | 2021-01-21 |
20210020540 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | 2021-01-21 |
20210020541 | Thermal interface material having defined thermal, mechanical and electric properties | 2021-01-21 |
20210020542 | SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020543 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2021-01-21 |
20210020544 | SEMICONDUCTOR DEVICE INCLUDING THROUGH SUBSTRATE VIAS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020545 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2021-01-21 |
20210020546 | SEMICONDUCTOR DEVICE, IMAGING UNIT, AND ELECTRONIC APPARATUS | 2021-01-21 |
20210020547 | Molded Semiconductor Package with Double-Sided Cooling | 2021-01-21 |
20210020548 | SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020549 | LEADS FOR SEMICONDUCTOR PACKAGE | 2021-01-21 |
20210020550 | Double-Sided Cooled Molded Semiconductor Package | 2021-01-21 |
20210020551 | Power Semiconductor Device, Method for Manufacturing Power Semiconductor Device, and Power Conversion Device | 2021-01-21 |
20210020552 | ELECTRONIC COMPONENT PACKAGE | 2021-01-21 |
20210020553 | LEADFRAME LEADS HAVING FULLY PLATED END FACES | 2021-01-21 |
20210020554 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2021-01-21 |
20210020555 | METHOD OF MANUFACTURING A THIN SEMICONDUCTOR CHIP USING A DUMMY SIDEWALL LAYER AND A DEVICE THEREOF | 2021-01-21 |
20210020556 | Semiconductor Device and Method of Manufacture | 2021-01-21 |
20210020557 | INSULATING CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING INSULATING CIRCUIT SUBSTRATE | 2021-01-21 |
20210020558 | ELECTRONIC DEVICE INCLUDING A LATERAL TRACE | 2021-01-21 |
20210020559 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-01-21 |
20210020560 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2021-01-21 |
20210020561 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-01-21 |
20210020562 | SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020563 | SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020564 | HIGH PERFORMANCE HIGH VOLTAGE ISOLATORS | 2021-01-21 |
20210020565 | METALLIZATION LAYER FORMATION PROCESS | 2021-01-21 |
20210020566 | SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | 2021-01-21 |
20210020567 | NEW DUAL-GATE TRENCH IGBT WITH BURIED FLOATING P-TYPE SHIELD | 2021-01-21 |
20210020568 | TECHNIQUES FOR MAKING INTEGRATED INDUCTORS AND RELATED SEMICONDUCTOR DEVICES, ELECTRONIC SYSTEMS, AND METHODS | 2021-01-21 |
20210020569 | METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS | 2021-01-21 |
20210020570 | Random Cut Patterning | 2021-01-21 |
20210020571 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2021-01-21 |
20210020572 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-01-21 |
20210020573 | EMBEDDED PACKAGING FOR HIGH VOLTAGE, HIGH TEMPERATURE OPERATION OF POWER SEMICONDUCTOR DEVICES | 2021-01-21 |
20210020574 | Package with Bridge Die For Interconnection and Method Forming Same | 2021-01-21 |
20210020575 | INTEGRATED FAN-OUT PACKAGE | 2021-01-21 |
20210020576 | THREE-DIMENSIONAL MICRO-ELECTRO-MECHANICAL, MICROFLUIDIC, AND MICRO-OPTICAL SYSTEMS | 2021-01-21 |
20210020577 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-01-21 |
20210020578 | SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER | 2021-01-21 |
20210020579 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-01-21 |
20210020580 | METHOD AND SYSTEM FOR FABRICATING FIDUCIALS USING SELECTIVE AREA GROWTH | 2021-01-21 |
20210020581 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-01-21 |
20210020582 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2021-01-21 |
20210020583 | SHIELDED ELECTRONIC MODULES AND METHODS OF FORMING THE SAME UTILIZING PLATING AND DOUBLE-CUT SINGULATION | 2021-01-21 |
20210020584 | Integrated Circuit Package and Method | 2021-01-21 |
20210020585 | SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES | 2021-01-21 |
20210020586 | PHOTOVOLTAIC PROTECTION | 2021-01-21 |
20210020587 | MOISTURE BARRIER FOR METAL INSULATOR METAL CAPACITORS AND INTEGRATED CIRCUIT HAVING THE SAME | 2021-01-21 |
20210020588 | POWER INVERTER MODULE WITH REDUCED INDUCTANCE | 2021-01-21 |
20210020589 | COUPLED LINE STRUCTURES FOR WIDEBAND APPLICATIONS | 2021-01-21 |
20210020590 | ELECTRONIC DEVICE WITH AN INTEGRAL FILTERING COMPONENT | 2021-01-21 |
20210020591 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-01-21 |
20210020592 | Integrated Circuit Structures And Methods Of Forming An Opening In A Material | 2021-01-21 |
20210020593 | INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE | 2021-01-21 |
20210020594 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-01-21 |
20210020595 | SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICROELECTRONIC DEVICES CONTAINING THE SAME, AND ASSOCIATED FABRICATION METHODS | 2021-01-21 |
20210020596 | Chip Structure, Wafer Structure And Method For Manufacturing The Same | 2021-01-21 |
20210020597 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-01-21 |
20210020598 | METHOD FOR MANUFACTURING BONDING WIRE AND MANUFACTURING APPARATUS THEREOF | 2021-01-21 |
20210020599 | ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD OF FORMING THE SAME | 2021-01-21 |
20210020600 | METHOD OF MANUFACTURING FAN-OUT WAFER LEVEL PACKAGE | 2021-01-21 |
20210020601 | THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF MANUFACTURING THE SAME | 2021-01-21 |
20210020602 | PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-01-21 |
20210020603 | SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020604 | SEMICONDUCTOR DEVICE | 2021-01-21 |
20210020605 | SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF | 2021-01-21 |
20210020606 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-01-21 |
20210020607 | CHIP PACKAGE AND METHOD OF FORMING THE SAME | 2021-01-21 |
20210020608 | SEMICONDUCTOR PACKAGE | 2021-01-21 |
20210020609 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-01-21 |
20210020610 | HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION | 2021-01-21 |
20210020611 | Advanced INFO POP and Method of Forming Thereof | 2021-01-21 |
20210020612 | COLLAPSIBLE LIGHTING DEVICE HAVING CIRCUIT WIRE AND LED MODULE AND METHOD FOR MANUFACTURING THE SAME | 2021-01-21 |
20210020613 | Light Emitting Diode, Display Substrate and Transfer Method | 2021-01-21 |
20210020614 | DISPLAY DEVICE | 2021-01-21 |
20210020615 | CHIP TRANSFER SUBSTRATE, CHIP TRANSFER DEVICE AND CHIP TRANSFER METHOD | 2021-01-21 |
20210020616 | THREE-LAYER COLOR DISPLAY USING ACTIVE LED DIES | 2021-01-21 |
20210020617 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-01-21 |
20210020618 | DISPLAY DEVICE | 2021-01-21 |
20210020619 | MICRO LIGHT EMITTING ELEMENT AND IMAGE DISPLAY DEVICE | 2021-01-21 |
20210020620 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME | 2021-01-21 |
20210020621 | LIGHT EMITTING DEVICE | 2021-01-21 |
20210020622 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | 2021-01-21 |
20210020623 | INTEGRATED CIRCUIT HAVING FUNCTIONAL CELLS AND RECONFIGURABLE GATE-BASED DECOUPLING CELLS | 2021-01-21 |
20210020624 | DIODE DESIGN ON FINFET DEVICE | 2021-01-21 |
20210020625 | TRANSIENT VOLTAGE SUPPRESSION DEVICE | 2021-01-21 |
20210020626 | HALF-BRIDGE CIRCUIT INCLUDING INTEGRATED LEVEL SHIFTER TRANSISTOR | 2021-01-21 |
20210020627 | HETEROGENEOUS INTEGRATION STRUCTURE FOR ARTIFICIAL INTELLIGENCE COMPUTING | 2021-01-21 |
20210020628 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES | 2021-01-21 |
20210020629 | CIRCUIT STRUCTURE | 2021-01-21 |
20210020630 | HIGH-VOLTAGE TOLERANT SEMICONDUCTOR ELEMENT | 2021-01-21 |