04th week of 2022 patent applcation highlights part 64 |
Patent application number | Title | Published |
20220028674 | ION GENERATION USING MODIFIED WETTED POROUS MATERIALS | 2022-01-27 |
20220028675 | SYSTEMS AND METHODS FOR SECURING FABRIC, PAPER, AND FILM SAMPLES FOR ANALYSIS BY LASER ABLATION | 2022-01-27 |
20220028676 | MULTIPLEXED INDUCTIVE IONIZATION SYSTEMS AND METHODS | 2022-01-27 |
20220028677 | EFFECTIVE POTENTIAL MATCHING AT BOUNDARIES OF SEGMENTED QUADRUPOLES IN A MASS SPECTROMETER | 2022-01-27 |
20220028678 | THIN FILM DEPOSITION PROCESS | 2022-01-27 |
20220028679 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2022-01-27 |
20220028680 | MULTI-LAYER DEPOSITION AND TREATMENT OF SILICON NITRIDE FILMS | 2022-01-27 |
20220028681 | Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method of Preparing Semiconductor Wafer | 2022-01-27 |
20220028682 | GALLIUM ARSENIDE SUBSTRATE COMPRISING A SURFACE OXIDE LAYER WITH IMPROVED SURFACE HOMOGENEITY | 2022-01-27 |
20220028683 | METHOD OF PRODUCING A TWO-DIMENSIONAL MATERIAL | 2022-01-27 |
20220028684 | PHOTORESIST LAYER OUTGASSING PREVENTION | 2022-01-27 |
20220028685 | APPARATUSES FOR REDUCING METAL RESIDUE IN EDGE BEAD REGION FROM METAL-CONTAINING RESISTS | 2022-01-27 |
20220028686 | MOLECULAR LAYER DEPOSITION METHOD AND SYSTEM | 2022-01-27 |
20220028687 | METHOD OF DEPOSITING THIN FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | 2022-01-27 |
20220028688 | METHOD OF MANUFACTURING SILICON CARBIDE EPITAXIAL WAFER | 2022-01-27 |
20220028689 | Method for Forming Semiconductor Layer | 2022-01-27 |
20220028690 | LASER ANNEALING APPARATUS, LASER ANNEALING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028691 | DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS | 2022-01-27 |
20220028692 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2022-01-27 |
20220028693 | Sacrificial Capping Layer For Passivation Using Plasma-Based Implant Process | 2022-01-27 |
20220028694 | METHODS FOR FORMING A RHENIUM-CONTAINING FILM ON A SUBSTRATE BY A CYCLICAL DEPOSITION PROCESS AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | 2022-01-27 |
20220028695 | Plasma Processing Methods Using Low Frequency Bias Pulses | 2022-01-27 |
20220028696 | METHOD FOR ETCHING AN ETCH LAYER | 2022-01-27 |
20220028697 | DIRECTIONAL DEPOSITION IN ETCH CHAMBER | 2022-01-27 |
20220028698 | METHOD FOR MAKING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028699 | CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028700 | GALLIUM OXIDE SUBSTRATE AND METHOD OF MANUFACTURING GALLIUM OXIDE SUBSTRATE | 2022-01-27 |
20220028701 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028702 | Shutter Disk | 2022-01-27 |
20220028703 | PRECISION RECONSTRUCTION FOR PANEL-LEVEL PACKAGING | 2022-01-27 |
20220028704 | MOLDED PACKAGES IN A MOLDED DEVICE | 2022-01-27 |
20220028705 | METHOD OF MANUFACTURING SEMICONDUCTORS USING FLUID DELIVERY SYSTEM | 2022-01-27 |
20220028706 | MATERIAL PROCESSING APPARATUS AND OPERATING METHOD THEREOF | 2022-01-27 |
20220028707 | WARM WAFER AFTER ION CRYO-IMPLANTATION | 2022-01-27 |
20220028708 | SUPPORT UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | 2022-01-27 |
20220028709 | LASER ABLATION SYSTEM FOR PACKAGE FABRICATION | 2022-01-27 |
20220028710 | DISTRIBUTION COMPONENTS FOR SEMICONDUCTOR PROCESSING SYSTEMS | 2022-01-27 |
20220028711 | SUBSTRATE HOLDER REPLACEMENT WITH PROTECTIVE DISK DURING PASTING PROCESS | 2022-01-27 |
20220028712 | APPARATUS, SYSTEM, AND METHOD FOR NON-CONTACT TEMPERATURE MONITORING OF SUBSTRATE SUPPORTS | 2022-01-27 |
20220028713 | INTEGRATED SUBSTRATE MEASUREMENT SYSTEM TO IMPROVE MANUFACTURING PROCESS PERFORMANCE | 2022-01-27 |
20220028714 | ENHANCED AUTOMATIC WAFER CENTERING SYSTEM AND TECHNIQUES FOR SAME | 2022-01-27 |
20220028715 | A COMPONENT HANDLING ASSEMBLY | 2022-01-27 |
20220028716 | SUBSTRATE MEASUREMENT SUBSYSTEM | 2022-01-27 |
20220028717 | Wafer Notch Leveling Device | 2022-01-27 |
20220028718 | AUTOMATED SEMICONDUCTOR SUBSTRATE POLISHING AND CLEANING | 2022-01-27 |
20220028719 | SAMPLE HOLDER | 2022-01-27 |
20220028720 | LIFT PIN INTERFACE IN A SUBSTRATE SUPPORT | 2022-01-27 |
20220028721 | METHOD FOR FABRICATING ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF | 2022-01-27 |
20220028722 | SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPORARY FIXATION MATERIAL | 2022-01-27 |
20220028723 | CARRIER PLATE REMOVING METHOD | 2022-01-27 |
20220028724 | ADAPTER PLATE, MASS TRANSFER METHOD, AND MICRO-LED DISPLAY | 2022-01-27 |
20220028725 | MANUFACTURING OF CAVITIES | 2022-01-27 |
20220028726 | METHOD FOR FORMING A CAPACITIVE ISOLATION TRENCH AND SUBSTRATE COMPRISING SUCH A TRENCH | 2022-01-27 |
20220028727 | SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING | 2022-01-27 |
20220028728 | METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE | 2022-01-27 |
20220028729 | NANOSHEET TRANSISTOR WITH SELF-ALIGNED DIELECTRIC PILLAR | 2022-01-27 |
20220028730 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | 2022-01-27 |
20220028731 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028732 | PROCESS FOR PREPARING EPITAXY WAFER AND EPITAXY WAFER THEREFROM | 2022-01-27 |
20220028733 | Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | 2022-01-27 |
20220028734 | SEMICONDUCTOR STRUCTURE | 2022-01-27 |
20220028735 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028736 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2022-01-27 |
20220028737 | METHOD AND APPARATUS FOR PRODUCING STRUCTURE, AND LIGHT IRRADIATION APPARATUS | 2022-01-27 |
20220028738 | REMOVAL OF BARRIER AND LINER LAYERS FROM A BOTTOM OF A VIA | 2022-01-27 |
20220028739 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2022-01-27 |
20220028740 | VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME | 2022-01-27 |
20220028741 | SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION AND METHODS OF FORMING THE SAME | 2022-01-27 |
20220028742 | METHOD OF PROCESSING WAFER | 2022-01-27 |
20220028743 | Semiconductor Device With L-Shape Conductive Feature And Methods Of Forming The Same | 2022-01-27 |
20220028744 | SEMICONDUCTOR STRUCTURE AND RELATED METHODS | 2022-01-27 |
20220028745 | METHOD FOR MAKING SELF-ALIGNED POST-CUT SDB FINFET DEVICE | 2022-01-27 |
20220028746 | SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028747 | SELF-ALIGNED 3-D EPITAXIAL STRUCTURES FOR MOS DEVICE FABRICATION | 2022-01-27 |
20220028748 | INTEGRATED CIRCUIT TEST METHOD AND STRUCTURE THEREOF | 2022-01-27 |
20220028749 | TSV Check Circuit With Replica Path | 2022-01-27 |
20220028750 | ELECTRONIC COMPONENT MODULE | 2022-01-27 |
20220028751 | PINS FOR HEAT EXCHANGERS | 2022-01-27 |
20220028752 | SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME | 2022-01-27 |
20220028753 | Method for forming Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Windows for Thermal Transport | 2022-01-27 |
20220028754 | EVAPORATIVE MICROCHIP COOLING | 2022-01-27 |
20220028755 | SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028756 | MULTI-TERMINAL INTEGRATED PASSIVE DEVICES EMBEDDED ON DIE AND A METHOD FOR FABRICATING THE MULTI-TERMINAL INTEGRATED PASSIVE DEVICES | 2022-01-27 |
20220028757 | SEMICONDUCTOR CHIP STACK WITH LOCKING THROUGH VIAS | 2022-01-27 |
20220028758 | BACKSIDE POWER DISTRIBUTION NETWORK (PDN) PROCESSING | 2022-01-27 |
20220028759 | 3D SEMICONDUCTOR DEVICE WITH ISOLATION LAYERS | 2022-01-27 |
20220028760 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028761 | SEMICONDUCTOR MODULE | 2022-01-27 |
20220028762 | SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES | 2022-01-27 |
20220028763 | SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028764 | SEMICONDUCTOR DEVICES COMPRISING WIRELESS TRANSMITTERS AND/OR WIRELESS RECEIVERS | 2022-01-27 |
20220028765 | COATED SEMICONDUCTOR DEVICES | 2022-01-27 |
20220028766 | SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION | 2022-01-27 |
20220028767 | SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028768 | SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF ASSEMBLING THEREOF | 2022-01-27 |
20220028769 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | 2022-01-27 |
20220028770 | SEMICONDUCTOR DEVICE WITH A POWER CONVERTER MODULE | 2022-01-27 |
20220028771 | PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME | 2022-01-27 |
20220028772 | THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE | 2022-01-27 |
20220028773 | PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | 2022-01-27 |