05th week of 2022 patent applcation highlights part 65 |
Patent application number | Title | Published |
20220037176 | TRANSFER DETECTION METHOD AND SUBSTRATE PROCESSING APPARATUS | 2022-02-03 |
20220037177 | ELECTROSTATIC CAPACITANCE SENSOR | 2022-02-03 |
20220037178 | SEMICONDUCTOR STORAGE APPARATUS WITH INTEGRATED SORTER | 2022-02-03 |
20220037179 | PACKAGING UNIT FOR SUBSTRATES | 2022-02-03 |
20220037180 | SYSTEM AND METHOD FOR CONTROLLING SEMICONDUCTOR MANUFACTURING EQUIPMENT | 2022-02-03 |
20220037181 | VACUUM TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD | 2022-02-03 |
20220037182 | APPARATUS AND METHOD FOR MANAGING POWER OF ARTICLE TRANSPORT VEHICLE IN ARTICLE TRANSPORT SYSTEM | 2022-02-03 |
20220037183 | TRANSFER SYSTEM AND TRANSFER METHOD | 2022-02-03 |
20220037184 | WAFER STOCKER | 2022-02-03 |
20220037185 | APPARATUS AND METHOD FOR ORIENTATION OF SEMICONDUCTOR DEVICE DIE | 2022-02-03 |
20220037186 | ELECTROSTATIC CHUCK, ETCHING APPARATUS, AND METHOD OF MANUFACTURING DISPLAY DEVICE | 2022-02-03 |
20220037187 | MEMBER FOR ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK | 2022-02-03 |
20220037188 | ELECTROSTATIC CHUCK HEATER | 2022-02-03 |
20220037189 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2022-02-03 |
20220037190 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | 2022-02-03 |
20220037191 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | 2022-02-03 |
20220037192 | Spacers for Semiconductor Devices Including Backside Power Rails | 2022-02-03 |
20220037193 | Spacers for Semiconductor Devices Including a Backside Power Rails | 2022-02-03 |
20220037194 | FORMING SINGLE AND DOUBLE DIFFUSION BREAKS FOR FIN FIELD-EFFECT TRANSISTOR STRUCTURES | 2022-02-03 |
20220037195 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | 2022-02-03 |
20220037196 | Gate Dielectric Preserving Gate Cut Process | 2022-02-03 |
20220037197 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | 2022-02-03 |
20220037198 | METHODS OF MANUFACTURING THIN FILM TRANSISTOR, BIOMETRIC DEVICE, AND DISPLAY APPARATUS | 2022-02-03 |
20220037199 | Multilayer Isolation Structure for High Voltage Silicon-On-Insulator Device | 2022-02-03 |
20220037200 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PACKAGING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SHALLOW TRENCH ISOLATION (STI) | 2022-02-03 |
20220037201 | ELECTRICAL COMPONENT WITH A DIELECTRIC PASSIVATION STACK | 2022-02-03 |
20220037202 | METHOD OF FORMING INTERCONNECT STRUCTURE | 2022-02-03 |
20220037203 | THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME | 2022-02-03 |
20220037204 | METHODS AND APPARATUS FOR FORMING STABILIZATION LAYERS | 2022-02-03 |
20220037205 | Subtractive Line with Damascene Second Line Type | 2022-02-03 |
20220037206 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE | 2022-02-03 |
20220037207 | METHOD FOR FABRICATING SEMICONDUCTOR MEMORY AND THE SEMICONDUCTOR MEMORY | 2022-02-03 |
20220037208 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE | 2022-02-03 |
20220037209 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | 2022-02-03 |
20220037210 | LOCAL ISOLATION OF SOURCE/DRAIN FOR REDUCING PARASITIC CAPACITANCE IN VERTICAL FIELD EFFECT TRANSISTORS | 2022-02-03 |
20220037211 | PREPARATION METHOD FOR SEMICONDUCTOR DEVICE | 2022-02-03 |
20220037212 | Scalable Device for FINFET Technology | 2022-02-03 |
20220037213 | TESTING OF LED DEVICES DURING PICK AND PLACE OPERATIONS | 2022-02-03 |
20220037214 | METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND AN APPARATUS FOR TESTING FLIP CHIPS | 2022-02-03 |
20220037215 | SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR SUBSTRATE MEASURING APPARATUS USING THE SAME | 2022-02-03 |
20220037216 | METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING | 2022-02-03 |
20220037217 | SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY | 2022-02-03 |
20220037218 | TEST PAD STRUCTURE OF CHIP | 2022-02-03 |
20220037219 | HERMETIC SEMICONDUCTOR PACKAGES | 2022-02-03 |
20220037220 | WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | 2022-02-03 |
20220037221 | SEMICONDUCTOR ENCAPSULATION MATERIAL AND SEMICONDUCTOR DEVICE | 2022-02-03 |
20220037222 | Semiconductor Package and Method for Fabricating a Semiconductor Package | 2022-02-03 |
20220037223 | ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF | 2022-02-03 |
20220037224 | PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER | 2022-02-03 |
20220037225 | CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME | 2022-02-03 |
20220037226 | POWER MODULE SUBSTRATE AND POWER MODULE | 2022-02-03 |
20220037227 | THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME | 2022-02-03 |
20220037228 | PACKAGE STRUCTURE | 2022-02-03 |
20220037229 | AN ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID | 2022-02-03 |
20220037230 | ENHANCING CONVECTION AND COOLING IN A CIRCUIT BREAKER | 2022-02-03 |
20220037231 | Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same | 2022-02-03 |
20220037232 | POWER DEVICE EMBEDDED DRIVER BOARD ASSEMBLIES WITH COOLING STRUCTURES AND METHODS THEREOF | 2022-02-03 |
20220037233 | SEMICONDUCTOR STRUCTURE AND LAYOUT METHOD OF A SEMICONDUCTOR STRUCTURE | 2022-02-03 |
20220037234 | METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES THEREOF | 2022-02-03 |
20220037235 | SEMICONDUCTOR DEVICE | 2022-02-03 |
20220037236 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2022-02-03 |
20220037237 | OMNIDIRECTIONAL FLEXIBLE LIGHT EMITTING DEVICE | 2022-02-03 |
20220037244 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2022-02-03 |
20220037245 | INTEGRATED SUBSTRATE STRUCTURE, ELECTRONIC ASSEMBLY, AND MANUFACTURING METHOD THEREOF | 2022-02-03 |
20220037246 | PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROSS-SECTION INTERCONNECTS | 2022-02-03 |
20220037247 | Semiconductor Package and Method of Manufacture | 2022-02-03 |
20220037248 | SEMICONDUCTOR PACKAGES | 2022-02-03 |
20220037249 | Thermal And Electrical Interface For Flip-Chip Devices | 2022-02-03 |
20220037250 | WIRING BOARD AND ELECTRIC DEVICE | 2022-02-03 |
20220037251 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | 2022-02-03 |
20220037252 | INTEGRATED CIRCUIT CELLS AND RELATED METHODS | 2022-02-03 |
20220037253 | MEMORY CELL ARRAY, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | 2022-02-03 |
20220037254 | SEMICONDUCTOR DEVICE INCLUDING POWER RAIL | 2022-02-03 |
20220037255 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2022-02-03 |
20220037256 | SEMICONDUCTOR STRUCTURE HAVING VIA THROUGH BONDED WAFERS AND MANUFACTURING METHOD THEREOF | 2022-02-03 |
20220037257 | INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTIONS, AND RELATED METHODS | 2022-02-03 |
20220037258 | SEMICONDUCTOR DEVICES WITH THERMAL BUFFER STRUCTURES | 2022-02-03 |
20220037259 | FAN-OUT SEMICONDUCTOR PACKAGE | 2022-02-03 |
20220037260 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2022-02-03 |
20220037261 | SEMICONDUCTOR PACKAGE | 2022-02-03 |
20220037262 | Component With Dielectric Layer for Embedding in Component Carrier | 2022-02-03 |
20220037263 | CARRIER, ASSEMBLY WITH A CARRIER, AND METHOD FOR PRODUCING A CARRIER | 2022-02-03 |
20220037264 | Die Traceability Using Backside Mask Layers | 2022-02-03 |
20220037265 | SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER | 2022-02-03 |
20220037266 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2022-02-03 |
20220037267 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES WITH SUPPORTING STRUCTURE FOR STAIRCASE REGION | 2022-02-03 |
20220037268 | EXTENDED SEAL RING STRUCTURE ON WAFER-STACKING | 2022-02-03 |
20220037269 | Semiconductor device for power electronics applications | 2022-02-03 |
20220037270 | PACKAGED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2022-02-03 |
20220037271 | ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE PACKAGE | 2022-02-03 |
20220037272 | SEMICONDUCTOR DEVICE | 2022-02-03 |
20220037273 | SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY | 2022-02-03 |
20220037274 | BUMP STRUCTURE OF THE SEMICONDUCTOR PACKAGE | 2022-02-03 |
20220037275 | FLOW GUIDING STRUCTURE OF CHIP | 2022-02-03 |
20220037276 | SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS ON COMMON CONNECTION STRUCTURE | 2022-02-03 |
20220037277 | Leadframes in Semiconductor Devices | 2022-02-03 |
20220037278 | FLEXIBLE CIRCUITS ON SOFT SUBSTRATES | 2022-02-03 |
20220037279 | SEMICONDUCTOR PACKAGE | 2022-02-03 |
20220037280 | MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS | 2022-02-03 |
20220037281 | VIAS IN COMPOSITE IC CHIP STRUCTURES | 2022-02-03 |