06th week of 2022 patent applcation highlights part 76 |
Patent application number | Title | Published |
20220046817 | POWER SUPPLY POWERLINE NETWORKING MANAGEMENT SYSTEM - A power supply powerline networking management system includes a chassis housing a power system coupled to a plurality of components and a management subsystem. A powerline networking engine in the power system receives first powerline management communications along with power via its first power connector, and converts the first powerline management communications to first dataline management communications. The powerline networking engine then transmits the first dataline management communications to the management subsystem via its data connector, and provides the power to the plurality of components via its second power connector. The data connector and the second power connector may be provided by a single, integrated connector structure, or by separate connector structures. The power system may also be configured to convert power, monitor and report the provisioning of power to the plurality of components, and activate a cooling system if the power system exceeds a temperature threshold. | 2022-02-10 |
20220046818 | MEMORY DEVICES, CARRIERS FOR SAME, AND RELATED COMPUTING SYSTEMS AND METHODS - Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures may be located proximate to, and laterally outward from, the interface. The engagement structures may extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier may include supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier. | 2022-02-10 |
20220046819 | Server - The disclosure provides a server including a housing, a plurality of hash boards, a power module and an electrical connection board. Each hash board is slidably arranged in a first accommodating space. The plurality of hash boards and the power module are respectively connected to the electrical connection board. The power module supplies power to the plurality of hash boards through the electrical connection board. The electrical connection board includes two conductive connection boards, each of which is provided with a plurality of conductive pins. The pins form multiple pairs of conductive pins in one-to-one correspondence. Each pair of conductive pins corresponds to each hash board and is electrically connected to supply power to the hash board. Each pair of conductive pins is detachably matched with each hash board to connect or disconnect the power supply path of the hash board. | 2022-02-10 |
20220046820 | Server - The disclosure provides a server including a housing, a plurality of Hash boards, a power module, a control module, a power supply module, and an electrical connection board. Each Hash board is disposed in the first accommodation cavity of the housing; the power module is disposed in the second accommodation cavity; the control module is slidably disposed in the third accommodation cavity; the power supply module is slidably disposed in the fourth accommodation cavity; the electrical connection board is disposed in the housing. The plurality of Hash boards, the power module, the control module, and the power supply module are all connected to the electrical connection board; the power module supplies power to the plurality of Hash boards via the electrical connection board, and the power supply module supplies power to the control module via the electrical connection board. | 2022-02-10 |
20220046821 | HEAT TRANSFER SYSTEM FOR ELECTRONIC ENCLOSURES - Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure housing at least one electronic component and including a volume for a first fluid. A sealed cavity is disposed within the electronic enclosure and contains within itself a second fluid that is physically separated from the first fluid. A heat transfer device has a first surface configured to directly interface with the first fluid and a second surface configured to directly interface with the second fluid. | 2022-02-10 |
20220046822 | HYBRID DATA CENTER RACK - Embodiments are disclosed of an information technology (IT) rack. The IT rack includes an equipment enclosure with a front, a rear, and one or more partitions, each partition adapted to receive one or more pieces of liquid-cooled information technology (IT) equipment. One or more cooling doors are positioned on the back of the equipment enclosure, each having therein a heat exchanger, the heat exchanger that is fluidly coupled to at least one of the one or more pieces of liquid-cooled IT equipment forming liquid cooling loops. Each of the one or more cooling doors is movable between a first position where the cooling door extends across the back of at least one partition so that air from the interior of the at least one partition flows through the cooling door, and a second position where air from outside the equipment enclosure flows through the cooling door. Fans are used in the middle section of rack or between two enclosures for assisting airflow management. Dedicated space for the fans are designed on the rack. | 2022-02-10 |
20220046823 | LIQUID COOLING MANIFOLD - The present disclosure provides a liquid cooling manifold. The liquid cooling manifold includes a channel body and a plurality of fluid connectors. The channel body includes a base, a wall portion and a fixing portion. The wall portion is connected between the base and the fixing portion, and a fluid channel is formed among the base, the wall portion and the fixing portion. The fixing portion includes a plurality of fixing openings respectively in fluid communication with the fluid channel. The plurality of fluid connectors are respectively disposed on the fixing portion and fixed to the corresponding one of the plurality of fixing openings and respectively in fluid communication with the fluid channel. | 2022-02-10 |
20220046824 | COOLING DEVICE AND COOLING SYSTEM USING COOLING DEVICE - A cooling device that can reduce heat resistance by improving a heat exchange action of a condensation tube, and can exhibit excellent cooling characteristics, and a cooling system using the cooling device are provided. The cooling device includes a container to which at least one heating element is thermally connected, a primary refrigerant sealed inside the container, a condensation tube through which a secondary refrigerant flows and which penetrates through a gaseous phase portion inside the container, and a porous member provided at an outer surface of the condensation tube. | 2022-02-10 |
20220046825 | VAPOR CHAMBER - The vapor chamber includes a container having a cavity formed of one plate-shaped body to which a heating element is thermally connected and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity, and a wick structure that is enclosed in the cavity and separated from the container. The container includes a support part protruding from an inner surface of the other plate-shaped body toward the one plate-shaped body, the support part being formed of a recessed part provided to an outer surface of the other plate-shaped body. At the rising base portion of the support part from the inner surface of the other plate-shaped body, the defined angle between the support part and the inner surface of the other plate-shaped body is an obtuse angle. | 2022-02-10 |
20220046826 | UNIVERSAL PLUGGABLE DATACENTER COOLING SYSTEM - A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop. | 2022-02-10 |
20220046827 | Server - The disclosure provides a server including a housing in the shape of a frame structure, a plurality of Hash boards disposed side by side in the housing along a first direction, and a cooling module configured to cool at least the plurality of Hash boards; each of the plurality of Hash boards are disposed perpendicularly to the first direction, and each Hash board includes a board body provided with a Hash chip; the cooling module includes at least one first cooling plate disposed on the board body, a water-cooling plate disposed on a side surface of the board body, and at least one heat pipe disposed on the board body; one end of the at least one heat pipe is disposed on the at least one first cooling plate, and the other end is disposed on the water-cooling plate. | 2022-02-10 |
20220046828 | REDUNDANT ISOLATION OF RACK MANIFOLDS FOR DATACENTER COOLING SYSTEMS - A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform. | 2022-02-10 |
20220046829 | ELECTRONIC EQUIPMENT - Electronic equipment ( | 2022-02-10 |
20220046830 | ELECTRONIC CONVERTER DESIGNED ON THE BASIS OF WELDING TECHNOLOGIES - A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding. | 2022-02-10 |
20220046831 | POWER CONVERSION DEVICE - A power conversion device includes a semiconductor module, a cooling device, a case, which accommodates the semiconductor module and the cooling device, a connector, which is connected to an inlet pipe, which is a refrigerant flow pipe of the cooling device, and a sealing member, which seals between the inlet pipe and the connector. The connector includes a pipe portion, which communicates with the inlet pipe, and a flange portion, which is secured to the case. The pipe portion and the flange portion are joined to each other with the pipe portion located in an insertion hole of the flange portion. | 2022-02-10 |
20220046832 | POWER CONVERSION DEVICE - A power conversion device includes a connector and a sealing member. The connector is connected to a lead-in pipe of a cooling device on the outside of a case. The sealing member makes a watertight seal between a refrigerant flow pipe, which is the lead-in pipe, and the connector. The sealing member includes a connector-side tubular portion, a first watertight seal projection, and a second watertight seal projection. The connector-side tubular portion is located between an inner peripheral surface of the connector and an outer peripheral surface of the lead-in pipe. The first watertight seal projection projects radially outward in an annular shape from the connector-side tubular portion toward the inner peripheral surface of the connector. The second watertight seal projection projects radially inward in an annular shape from the connector-side tubular portion toward the outer peripheral surface of the lead-in pipe. | 2022-02-10 |
20220046833 | ELECTRONIC DEVICE - An electronic device includes a casing, a heat generating element, a heat dissipation plate, and a centrifugal fan. The casing has a front side, a rear side, a peripheral side, and a plurality of vents. The peripheral side is located between the front side and the rear side, and the vents are distributed on the peripheral side. The heat generating element and the heat dissipation plate are disposed in the casing, and the heat generating element covers the heat generating element. Heat generated by the heating generating element is conducted to the heat dissipation plate. The centrifugal fan is disposed in the casing and is located on a same side of the heat generating element and the heat dissipation plate. The centrifugal fan is adapted for omnidirectional air discharge and an airflow generated from the centrifugal fan dissipates the heat out of the casing through the vents. | 2022-02-10 |
20220046834 | INFRARED SAUNA ROOM WITH LOW ELECTRIC FIELD AND ELECTROMAGNETIC WAVE RADIATION - The present invention provides an infrared sauna room with a low electric field and low electromagnetic wave radiation comprising a room body, heating plates with a low electric field and low electromagnetic wave radiation and shielding lines, wherein a plurality of heating plates with a low electric field and low electromagnetic wave radiation are distributed in the room body; the first insulating layer has concave points or/and convex points; and the shielding line comprises a stranded power wire, an electric field absorbing shielding layer and a wire insulating layer. Through the above-mentioned manner, the infrared sauna room with a low electric field and low electromagnetic wave radiation can significantly reduce electromagnetic wave radiation and electric field radiation for sauna rooms. | 2022-02-10 |
20220046835 | ELECTROMAGNETIC WAVE ABSORBING PARTICLE DISPERSOID AND ELECTROMAGNETIC WAVE ABSORBING LAMINATED TRANSPARENT BASE MATERIAL - An electromagnetic wave absorbing laminated transparent base material includes a plurality of sheets of transparent base materials; and an electromagnetic wave absorbing particle dispersoid including at least electromagnetic wave absorbing particles and a thermoplastic resin. The electromagnetic wave absorbing particles contain hexagonal tungsten bronze having oxygen deficiency. The tungsten bronze is expressed by a general formula: M | 2022-02-10 |
20220046836 | ULTRA-THIN CONDUCTOR BASED SEMI-TRANSPARENT ELECTROMAGNETIC INTERFERENCE SHIELDING - Electromagnetic interference (EMI) shields and methods for broadband EMI shielding are provided. An EMI shield disposed in a path of electromagnetic radiation blocks a broad range of frequencies (> about 800 MHz to < about 90 GHz) to a shielding efficiency of > to 20 dB, while transmitting wavelengths in a visible range to an average transmission efficiency of > about 85% through the electromagnetic shield. The shield includes a flexible stack comprising a continuous ultrathin metal film comprising silver (Ag) and copper (Cu) and two antireflection dielectric layers disposed on either side of the ultrathin metal film. The shield may also include multiple stacks or an optional graphene layer that may be spaced apart from the flexible stack to achieve radiofrequency (RE) absorption, which provides additional form of EMI shielding. The EMI shield can be made via roll-to-roll sputtering. | 2022-02-10 |
20220046837 | LONG-STROKE FEEDING MECHANISM - A method of feeding a component tape towards a picking position of a component mounting machine is disclosed. The feeding is performed by means of a feeding mechanism configured to engage the component tape at an engaging position and to disengage the component tape at a disengaging position. The method comprises engaging the component tape at the engaging position, moving, by means of the feeding mechanism, the component tape from the engaging position to the disengaging position, disengaging the component tape at the disengaging position, and returning the feeding mechanism from the disengaging position to the engaging position and wherein the feeding mechanism moves the component tape in a linear motion between the engaging position and the disengaging position. | 2022-02-10 |
20220046838 | MOUNTING APPARATUS - A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes. | 2022-02-10 |
20220046839 | Fragaria Plant Named 'SRE36' - A new and distinct Mediterranean short-day cultivar of strawberry plant named ‘SRF36’ that is characterized by its uniformly medium to large and conical shaped berries, 300 its berries that are consistently glossy and orange-red in color, its sweet tasting berries that are high in sugar and low in acid, its vigorous and compact growth habit with dark green leaves, and its substantial fruit yields of marketable quality that is medium-late in season. | 2022-02-10 |
20220046840 | CHRYSANTHEMUM PLANT NAMED 'DLFHAPU1' - A new and distinct cultivar of | 2022-02-10 |
20220046841 | CHRYSANTHEMUM PLANT NAMED 'DLFSTAR1' - A new and distinct cultivar of | 2022-02-10 |
20220046842 | CHRYSANTHEMUM PLANT NAMED 'DLFFOOT5' - A new and distinct cultivar of | 2022-02-10 |
20220046843 | CHRYSANTHEMUM PLANT NAMED 'DLFHOLA6' - A new and distinct cultivar of | 2022-02-10 |