07th week of 2016 patent applcation highlights part 60 |
Patent application number | Title | Published |
20160050765 | MOTION-BASED RECONFIGURABLE MICROELECTRONICS SYSTEM - A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit. | 2016-02-18 |
20160050766 | METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD - A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred. | 2016-02-18 |
20160050767 | TIN FUSION JOINING FOR ROBUST INTEGRATION OF ELECTRICAL COMPONENTS WITH AXIAL LEADS - A method of joining a first tin-plated electrical component to a second tin-plated electrical component, and components joined to exhibit reduced stress levels at the joined location. The method includes defining a pocket in the second component that is shaped to accept a portion of the first component, placing the portion of the first component substantially within the pocket to define an interfacial region, and using a resistance welder to both form a solid-state diffusion bond along at least a portion of the interfacial region and fill a substantial remainder of the interfacial region with melted tin plating from one or both of the first and second components. | 2016-02-18 |
20160050768 | Module with Integrated Power Electronic Circuitry and Logic Circuitry - A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided. | 2016-02-18 |
20160050769 | METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE - To provide a method for manufacturing a multilayer wiring substrate, in which an insulating layer and a metal foil provided thereon are integrally laminated on an inner layer material having a wiring formed thereon, in which a hole for via hole is formed in the metal foil and the insulating layer, and in which the hole for via hole is filled with an electrolytic filled plating layer after a base electroless plating layer is formed, the method being featured in that, after the base electroless plating layer is formed, first, an electrolysis filled plating layer is formed to the extent that the hole for via hole is not completely filled, and then, after the surface of the electrolytic filled plating layer is etched, the hole for via hole is completely filled by an electrolytic filled plating layer. | 2016-02-18 |
20160050770 | BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME - A method of fabricating a display device includes placing a first anisotropic conductive film on a display panel; aligning a first electronic device on the first anisotropic conductive film; performing a pre-compression process on the first electronic device using a first pressure unit; placing a second anisotropic conductive film on the display panel; aligning a second electronic device on the second anisotropic conductive film; performing a pre-compression process on the second electronic device using a second pressure unit separated from the first pressure unit; and simultaneously performing a first main compression process on the first electronic device at a first temperature using the first pressure unit and a second main compression process on the second electronic device at a second temperature different from the first temperature using the second pressure unit. The second thermal compression process is performed by maintaining the second temperature using a first temperature control unit. | 2016-02-18 |
20160050771 | MANUFACTURING METHOD OF CIRCUIT STRUCTURE EMBEDDED WITH HEAT-DISSIPATION BLOCK - A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided. | 2016-02-18 |
20160050772 | DISPLAY DEVICE - A display device is provided. The display device includes a display module; and a transforming device configured to transform the display module between a flat state and a curved state. The transforming device includes a base panel provided behind the display module at a center portion of the display panel along a width direction of the display module, and a pair of rotating panels, each of the pair of rotating panels having a first end rotationally engaged with the base panel and a second end opposite to the first end attached to opposite ends of the display module along the width direction. | 2016-02-18 |
20160050773 | OUTPUT MODULE FOR VEHICLE GAUGES - Presently disclosed output modules may be removably and directly connected to a vehicle gauge. For example, the output module may be directly mounted on or plugged into the back of the gauge, such as by using the existing mounting bosses of the gauge. Disclosed output modules may be used with existing micro-processor-controlled gauges to send a desired switch signal to an external device, such as a warning light or a kill switch, when measured data hits a trigger point. Prior to attachment of the output module, the end-user may program the gauge via connection to a computer or other device, in order to set the desired trigger point or threshold value. Once the gauge is programmed with the desired trigger point, the output module may be attached to the back side of the gauge and may be wired to the external device to be controlled. | 2016-02-18 |
20160050774 | RETRACTABLE STORAGE SYSTEM - A retractable storage system for a handheld electronic device includes a protective housing member operative shaped and sized to bound the handheld electronic device and enable wrapping around the handheld electronic device. At least one accessory station structured is on the housing member, and has an aperture to arrest and dispense an accessory item. At least one storage chamber is structured on the housing member to store the accessory item. The protective housing member has a first housing part and a second housing part which combine to form one protective housing member. | 2016-02-18 |
20160050775 | SUBSTRATES INCLUDING OPTOELECTRONIC COMPONENTS - This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer. | 2016-02-18 |
20160050776 | COMPONENT PROTECTIVE OVERMOLDING USING PROTECTIVE EXTERNAL COATINGS - Techniques for component protective overmolding using protective external coatings include a device having a framework configured to be worn, a button assembly coupled to the framework, the button assembly configured to send a signal to a circuit, the button assembly including a button configured to be depressed to displace a button shaft, a button inner housing coupled to the button and the button shaft, and a button outer housing coupled to the button inner housing, a first ring configured to form a first seal disposed substantially between the button inner housing and the button shaft, a second ring configured to form a second seal disposed substantially between the button inner housing and the button outer housing, and an outer molding formed over a portion of the button assembly. | 2016-02-18 |
20160050777 | ELECTRONIC COMPONENT - An electronic component includes a housing formed to have a box shape, and a terminal derived from inside to outside of the housing to be exposed and extending along a wall surface of the housing. The housing includes a pair of projecting portions formed by causing both external ends of end portions in an end surface on a side where the terminal is derived to project beyond the terminal. The external ends are external ends in a width direction crossing an extending direction in which the terminal extends. The end portions are located on a deriving source side in the extending direction. The terminal has an exposed portion that is located on an imaginary plane, or closer to the wall surface than the imaginary plane is. The imaginary plane includes a pair of corner portions of the wall surface facing the terminal and end portions of the projecting portions. | 2016-02-18 |
20160050778 | DUAL POSITION LATCH APPARATUS - A latch apparatus is provided with a dual action mechanism that can either pivot a cam hook from a first side of the apparatus for securing a sub-chassis into a chassis of laterally extend a component lock from a second side of the apparatus for securing a component within the sub-chassis. A single rotary actuator may be rotated in a first rotational direction to pivot the cam hook to an extended position and move the component lock to a retracted position, and rotated in a second rotational direction to pivot the cam hook to a retracted position and move the component lock to an extended position. The latch apparatus may include one or more of the dual action mechanisms actuated by the single actuator. | 2016-02-18 |
20160050779 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - A mounting structure of an electronic component includes an electronic component, a housing member, a counterpart terminal, and at least one locking mechanism. The electronic component includes: an electronic component main body; a housing formed by assembling a casing member in which a chamber for the electronic component main body is formed and a base member to which the electronic component main body is attached; and a terminal exposed from the chamber to outside of the housing. The housing member includes a housing space including: a first chamber that accommodates the housing; and a second chamber that accommodates a terminal. The counterpart terminal is fitted into the second chamber and electrically coupled to the terminal. The locking mechanism maintains the accommodation state of the electronic component to the housing member by engaging a first engaging part and a second engaging part. | 2016-02-18 |
20160050780 | ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS - An electronic apparatus includes: a first case and a second case assembled to each other; a first cable that couples a first component provided in the first case and a second component provided in the second case; and a second cable that couples a pair of members provided in the first case, and provided with a bent section at an intermediate part of the second cable in a longitudinal direction thereof, the second cable supporting the first cable inside the bent section. | 2016-02-18 |
20160050781 | MOVABLE GROUND RING FOR MOVABLE SUBSTRATE SUPPORT ASSEMBLY OF A PLASMA PROCESSING CHAMBER - A movable ground ring of a movable substrate support assembly that includes a step configured to support a consumable isolation ring. The consumable isolation ring is configured to electrically isolate the movable ground ring from a dielectric ring of the movable substrate support assembly. | 2016-02-18 |
20160050782 | VARIOUS METHODS AND APPARATUSES FOR AN INTEGRATED POWER DISTRIBUTION PLATFORM - A method, apparatus, and system are described for a pre-wired and pre-engineered integrated platform for power supply and distribution that is pre-assembled, scalable, and modular. The skeletal framework of the integrated platform acts as an equipment support structure as well as a cable routing support system. A set of cables having wiring is routed along the skeletal framework of the integrated platform and goes to two or more cabinet enclosures mounted onto the skeletal framework. The skeletal framework acts as a National Electric Code approved raceway system to support and route the set of cables to the electrical equipment in the mounted cabinet enclosures. The integrated platform supports the weight of the one or more cabinet enclosures mounted onto the skeletal framework. | 2016-02-18 |
20160050783 | ELECTRONIC DEVICE AND TRAY UNIT THEREOF - An electronic device includes a main body, a slot formed on a side of the main body, and a tray unit received in the slot. The tray unit includes a cover, a supporting base, a shaft, and a waterproof member. The supporting base is configured to receive an external card. The shaft pivotally connects the cover with the supporting base, and the supporting base is rotatable with respect to the cover along the shaft. The waterproof member is disposed on the cover. When the tray unit is received in the slot, the waterproof member abuts the main body of the electronic device. | 2016-02-18 |
20160050784 | WATERPROOF STRUCTURE FOR ELECTRONIC COMPONENT HOUSING UNIT - A waterproof structure for an electronic component housing unit provided with a connection unit on the upper side in the vertical direction of a vehicle, to which the terminal of an electric wire is connected, includes a top cover. The top cover is provided with a bottom opening portion opening to the lower end and covers the electronic component housing unit from the upper side in the vertical direction of the vehicle while forming a space between the top side of the electronic component housing unit in the vertical direction of the vehicle and the top cover, in which the terminal of the electric wire connected to the connection unit is housed. The electric wire led out from the terminal connected to the connection unit is led out from the bottom opening portion of the top cover. | 2016-02-18 |
20160050785 | ELECTRONIC DEVICE WITH SUPPORT - An electronic device with a support includes a main body and a support arm. The support arm includes a fixed component and a support component. The support component comprises a pivot end and a leaning end. The support component pivots relative to the fixed component, such that the support arm has a first usage state and a second usage state. When in the first usage state, an acute angle is formed between the support component and the fixed component, and the leaning end of the support component and a bottom edge of the main body both support the main body. When in the second usage state, an obtuse angle is formed between the support component and the fixed component, and the leaning end of the support component is assembled with a seat which is for supporting the main body. | 2016-02-18 |
20160050786 | SYSTEMS AND METHODS FOR COUPLING A CIRCUIT BOARD TO AN INFORMATION HANDLING SYSTEM CHASSIS - In accordance with embodiments of the present disclosure, an information handling system may include a chassis and a circuit board. The chassis may have one or more structural posts. The circuit board may mechanically couple to the chassis, and the circuit board may comprise a substrate having formed therein one or more through-holes and one or more hooks each configured to mechanically couple the circuit board to the chassis via a corresponding structural post of the one or more structural posts, each of the one or more hooks comprising one or more mounting features, wherein each of the one or more mounting features is sized and shaped to engage with a corresponding one of the one or more through-holes in order to mechanically couple such hook to the substrate. | 2016-02-18 |
20160050787 | DRIVE MODULE, SERVER MECHANISM AND CONTAINING FRAME THEREOF - A drive module is inserted into an extraction opening of a server and includes a casing, a circuit board, a fixing member fixed on the casing, a plurality of drives, and a cover having a clamping portion and forming a space cooperatively with the casing. The fixing member has engaging and pressing arms. The engaging arm is engaged with the circuit board when the clamping portion and the casing clamp the circuit board. The pressing arm has a hole for engaging with a protruding portion of the server to fix the drive module. The plurality of drives is inserted into the space and plugged into the circuit board. When the pressing arm is pulled toward a first direction or a second direction opposite to the first direction, the hole is disengaged from the protruding portion or the pressing arm drives the engaging arm to be separate from the circuit board. | 2016-02-18 |
20160050788 | MOBILE DATA PROCESSING CENTER - The present mobile processing data center comprises a support structure, which consisting in ISO standard containers of 10, 20, 40 or 53 feet, wherein the container comprises: a) automatic transfer switch; b) uninterruptible power system; c) precision air conditioners; d) cabinets having a bearing and rails system, and 42 RMS in order to install the IT equipment; f) two levels of trays ladder type installed on the top of the cabinets, one tray for data wiring and other for power wiring; g) removable floor panels; and h) additionally the mobile data center comprises a fire protection system “zero-footprint”. | 2016-02-18 |
20160050789 | PROFILE BASED FAN CONTROL FOR COMPUTING DEVICES - An unmanageable component may be any component in a computing system that does not expose a temperature sensor thereby preventing the component's temperature from being monitored. The embodiments described herein control a fan using settings that decrease the likelihood that an unmanageable component will overheat. Before a user-selected fan profile is used to control the fan, a power system management uses safeguarding profiles to mitigate the risk of overheating the unmanageable components in the computing system when selecting a fan profile. Stated differently, the power management system ensures the computing system does not use the user-selected profile to operate a fan if that profile may cause an unmanageable component to overheat. | 2016-02-18 |
20160050790 | MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING - A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. | 2016-02-18 |
20160050791 | RAM AIR FAN AND POWER ELECTRONICS COOLING SYSTEMS - A power electronics cooling system includes a ram air fan with one or more blades and a ram air fan motor connected via an output shaft. The ram air fan draws in air and passes it across a heat exchanger to cool one or more cooling liquids. One or more pumps pressurize and pump the cooling liquids to various electronic components, including one or more motor controllers. The pumps may be mechanically or electrically coupled to the output shaft of the ram air fan, such that the motor of the ram air fan provides energy to the pumps. | 2016-02-18 |
20160050792 | HEAT DISSIPATING SUBSTRATE - There is provided a heat dissipating substrate including: a base substrate having a first through hole formed therein; a first substrate disposed on an upper end portion of the base substrate and including a second through hole having a diameter smaller than that of the first through hole; and a heat dissipating pad disposed on an upper end portion of the second through hole. In addition, a flow phenomenon of a thermal conduction member (lead) may be reduced using the thermal conduction member by forming a second through hole smaller than a first through hole. | 2016-02-18 |
20160050793 | LEADFRAME PACKAGE WITH INTEGRATED PARTIAL WAVEGUIDE INTERFACE - A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers. | 2016-02-18 |
20160050794 | Electronic Component Mounting Structure, Manufacturing Method and Electronic Component Product - An electronic component mounting structure, manufacturing method and an electronic component product are provided. The electronic component mounting structure comprises a printed circuit board, a metal flange, and a plurality of electronic components provided on the metal flange; a groove is provided on the printed circuit board, a metal layer is coated on a wall of the groove, the metal flange is restricted to the metal layer on the wall and is fixed in the groove, the one or more electronic components are connected to each other through a plurality of wires based on a circuit requirement, an input electrode and an output electrode are provided on the printed circuit board in a portion adjacent to the metal flange, and the input electrode and the output electrode are connected to the one or more electronic components mounted on the metal flange through wires respectively. | 2016-02-18 |
20160050795 | TOP LOADING CARTRIDGE - A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge. | 2016-02-18 |
20160050796 | HIGH DENSITY NETWORKING SHELF AND SYSTEM - A system, a shelf, and a high density platform optimize the physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double-size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another. | 2016-02-18 |
20160050797 | SYSTEMS AND METHODS FOR COOLING DATA CENTERS AND OTHER ELECTRONIC EQUIPMENT - Temperature, humidity, and pressure control systems and methods for enclosed spaces, including data centers. In some embodiments, the rotational frequency of the air supply fans is controlled based on a pressure associated with the enclosed space. In some embodiments, the rotational frequency of the air supply fans is controlled based on a pressure differential between an inlet region and an exhaust region within the enclosed space. In some embodiments, air within the inlet region is segregated from air within the exhaust region. In some embodiments, the cooling capacity of the cooling equipment is controlled responsive to a temperature associated with the enclosed space. In some embodiments, the cooling capacity is controlled based on a temperature associated with the inlet region of the enclosed space. In some embodiments, the humidity within the enclosed space is controlled. | 2016-02-18 |
20160050798 | Shrub Rose Plant Named 'Poulren023' - A new garden rose plant of the Shrub class which has abundant, light pink flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050799 | Rosa hybrida shrub named 'AUSmixture' - A variety of rose plant of the shrub class, named ‘AUSmixture’. The ‘AUSmixture’ is a variety of a rose having cupped buds that gradually open to become large shallow-cupped fragrant rosettes of a soft pink with excellent disease resistance and vigor, and which repeat-flowers well. | 2016-02-18 |
20160050800 | Shrub rose plant named 'Poulren024' - A new garden rose plant of the Shrub class which has abundant, red flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050801 | Climbing Rose Plant Named 'Poulcy033' - A new garden rose plant of the Climbing class which has abundant, mauve flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050802 | Climbing rose plant named 'Poulcy028' - A new garden rose plant of the Climbing class which has abundant, yellow flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050803 | Climbing Rose Plant Named 'Poulcy031' - A new garden rose plant of the Climbing class which has abundant, pink blend flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050804 | Climbing Rose Plant Named 'Poulcy029' - A new garden rose plant of the Climbing class which has abundant, pink flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050805 | Climbing rose plant named 'Poulcy016' - A new garden rose plant of the Climbing class which has abundant, red flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050806 | Miniature Rose Plant Named 'Poulpal057' - A new garden rose plant of the Miniature class which has abundant, yellow flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050807 | Miniature rose plant named 'Poulpah073' - A new garden rose plant of the Miniature class which has abundant, yellow flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050808 | Rose Plant Named 'Poulcas041' - A new garden rose plant which has abundant, yellow flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050809 | Miniature rose plant named 'Poulpar083' - A new garden rose plant of the Miniature class which has abundant, yellow flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050810 | Miniature rose plant named 'Poulpah070' - A new garden rose plant of the Miniature class which has abundant, orange blend flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050811 | Miniature Rose Plant Named 'Poulpah071' - A new garden rose plant of the Miniature class which has abundant, red flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050812 | Hybrid tea rose plant named 'Poulht009' - A new garden rose plant of the Hybrid Tea class which has abundant, white flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050813 | Floribunda rose plant named 'Poulcas044' - A new garden rose plant of the floribunda class which has abundant, mauve flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050814 | Floribunda rose plant named 'Poulcas043' - A new garden rose plant of the Floribunda class which has abundant, white flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050815 | Ground cover rose plant named 'Poultc021' - A new garden rose plant of the Ground Cover class which has abundant, orange flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050816 | Compact Floribunda Rose Plant Named 'Poulpal058' - A new garden rose plant of the Compact Floribunda class which has abundant, orange red flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050817 | Ground cover rose plant named 'Poultc019' - A new garden rose plant of the Ground Cover class which has abundant, orange red flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050818 | Compact floribunda rose plant named 'Poulpal059' - A new garden rose plant of the Compact Floribunda class which has abundant, red flowers and attractive foliage. This new and distinct variety has shown to be uniform and stable in the resulting generations from asexual propagation. | 2016-02-18 |
20160050819 | Bannana plant named "CQB 114" - ‘CQB 114’ is a hybrid banana variety that has high provitamin A cartenoid content, has resistance to black Sigatoka, and produces very sweet fruit that can be eaten fresh or used in desserts. | 2016-02-18 |
20160050820 | Blackberry plant named 'DRISBLACKTEN' - This invention relates to a new and distinct variety of blackberry plant named ‘DrisBlackTen’, particularly characterized by high productivity, large, black berries and self-fruitful plants, is disclosed. | 2016-02-18 |
20160050821 | Raspberry plant named 'PS-9514' - This invention relates to a new and distinct everbearing variety of raspberry plant named ‘PS-9514’. The new variety is primarily adapted to the growing conditions of the central coast of California and is characterized by the following: medium to late primocane production with medium to large sized fruit of medium orange coloration and medium gloss. Fruit is of consistent conic shape, weak adherence of receptacle and is of excellent flavor. Foliage is flat to slightly convex, medium to dark green; possessing medium rugosity and always 3 foliates. Primocanes have a weak waxy coat, sparse thorn density and absent anthocyanin coloration. | 2016-02-18 |
20160050822 | Raspberry plant named 'PARAGON' - This invention relates to a new and distinct everbearing variety of raspberry plant named ‘PARAGON’. The new variety is primarily adapted to the growing conditions of the central coast of California and is characterized by the following: early primocane production with medium sized fruit of light-red coloration and high gloss. Fruit is of consistent conic shape, medium adherence of receptacle and is of excellent flavor. Foliage is slightly concave, medium green; possessing very strong rugosity and equal 3-5 foliates. Primocanes have an absent or very weak waxy coat, medium thorn density and weak, anthocyanin coloration. | 2016-02-18 |
20160050823 | Raspberry plant named 'BOUNTIFUL' - This invention relates to a new and distinct everbearing variety of raspberry plant named ‘BOUNTIFUL’. The new variety is primarily adapted to the growing conditions of the central coast of California and is characterized by the following: late primocane production with medium sized fruit of light-red coloration. Fruit is of consistent conic shape, releases very easily from the receptacle and is of good flavor. Foliage is flat to slightly concave, medium green; possessing weak rugosity and equal 3-5 foliates. Primocanes have an absent or very weak waxy coat, medium to dense thorn density and no anthocyanin coloration. | 2016-02-18 |
20160050824 | Raspberry plant named 'OVATION'' - This invention relates to a new and distinct everbearing variety of raspberry plant named ‘OVATION’. The new variety is primarily adapted to the growing conditions of the central coast of California and is characterized by the following: mid-season primocane production with medium sized fruit of medium red coloration and medium gloss. Fruit is of consistent conic shape, weak adherence of receptacle and is of excellent flavor. Foliage is slightly concave, medium green; possessing medium rugosity and mostly 5 foliates. Primocanes have an absent or very weak waxy coat, sparse thorn density and strong anthocyanin coloration. | 2016-02-18 |
20160050825 | Clematis plant named 'Evipo071' | 2016-02-18 |
20160050826 | Clematis plant named 'Evipo069' | 2016-02-18 |
20160050827 | Clematis plant named 'Evipo066' | 2016-02-18 |
20160050828 | Clematis plant named 'Evipo062' | 2016-02-18 |
20160050829 | Clematis Plant Named 'Evipo061' | 2016-02-18 |
20160050830 | Clematis plant named 'Evipo056' | 2016-02-18 |
20160050831 | Clematis Plant Named 'Evipo054' | 2016-02-18 |
20160050832 | Clematis plant named Evipo051 | 2016-02-18 |
20160050833 | Clematis plant named 'Evipo027' | 2016-02-18 |
20160050834 | Clematis plant named 'Evipo048' | 2016-02-18 |
20160050835 | Clematis plant named 'Evipo070' | 2016-02-18 |
20160050836 | Eremochloa ophiuroides (Munro) Hack plant named ' SS-0607' - A new and distinct variety of Centipedegrass named ‘SS-0607’, is characterized by its green and purple stolons, white and purple flowers, long leaf blades, aggressive root system fast lateral growth, compared to other Centipedegrass varieties. | 2016-02-18 |