07th week of 2021 patent applcation highlights part 51 |
Patent application number | Title | Published |
20210050291 | SEMICONDUCTOR DEVICES | 2021-02-18 |
20210050292 | CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME | 2021-02-18 |
20210050293 | ELECTRONIC MODULE | 2021-02-18 |
20210050294 | FAN-OUT CHIP PACKAGE ASSEMBLY AND FAN-OUT BOTTOM PACKAGE WITH FINE PITCH SILICON THROUGH VIA | 2021-02-18 |
20210050295 | Dual-sided Routing in 3D SiP Structure | 2021-02-18 |
20210050296 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-02-18 |
20210050297 | SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SEMICONDUCTOR DEVICE | 2021-02-18 |
20210050298 | METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE | 2021-02-18 |
20210050299 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | 2021-02-18 |
20210050300 | LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODITY FPGA IC CHIP WITH COOPERATING OR SUPPORTING CIRCUITS | 2021-02-18 |
20210050301 | APPARATUS COMPRISING ALUMINUM INTERCONNECTIONS, MEMORY DEVICES COMPRISING INTERCONNECTIONS, AND RELATED METHODS | 2021-02-18 |
20210050302 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 2021-02-18 |
20210050303 | SEMICONDUCTOR PACKAGING DEVICE COMPRISING A SHIELD STRUCTURE | 2021-02-18 |
20210050304 | SEMICONDUCTOR STRUCTURE OF WORK UNIT MODULE | 2021-02-18 |
20210050305 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2021-02-18 |
20210050306 | PACKAGE SUBSTRATE WITH REDUCED INTERCONNECT STRESS | 2021-02-18 |
20210050307 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME | 2021-02-18 |
20210050308 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2021-02-18 |
20210050309 | SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME | 2021-02-18 |
20210050310 | ELECTRONIC CHIP, THE REAR FACE OF WHICH IS PROTECTED BY AN IMPROVED EMBRITTLEMENT STRUCTURE | 2021-02-18 |
20210050311 | PACKAGE WITH INTEGRATED MULTI-TAP IMPEDANCE STRUCTURE | 2021-02-18 |
20210050312 | INTEGRATED STRUCTURES WITH ANTENNA ELEMENTS AND IC CHIPS EMPLOYING EDGE CONTACT CONNECTIONS | 2021-02-18 |
20210050313 | CRYPTOGRAPHIC DEVICE ARRANGED TO COMPUTE A TARGET BLOCK CIPHER | 2021-02-18 |
20210050314 | PAD STRUCTURE AND MANUFACTURING METHOD THEREOF IN SEMICONDUCTOR DEVICE | 2021-02-18 |
20210050315 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF | 2021-02-18 |
20210050316 | Interconnect Structure and Method of Forming Same | 2021-02-18 |
20210050317 | LOW STRESS PAD STRUCTURE FOR PACKAGED DEVICES | 2021-02-18 |
20210050318 | LEVEL SHIFTING BETWEEN INTERCONNECTED CHIPS HAVING DIFFERENT VOLTAGE POTENTIALS | 2021-02-18 |
20210050319 | METAL PARTICLE AGGREGATES, METHOD FOR PRODUCING SAME, PASTE-LIKE METAL PARTICLE AGGREGATE COMPOSITION, AND METHOD FOR PRODUCING BONDED BODY USING SAID PASTE-LIKE METAL PARTICLE AGGREGATE COMPOSITION | 2021-02-18 |
20210050320 | PACKAGE STRUCTURE FOR POWER DEVICE | 2021-02-18 |
20210050321 | NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE USING NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PRODUCING THE SAME | 2021-02-18 |
20210050322 | Package-On-Package Assembly With Wire Bonds To Encapsulation Surface | 2021-02-18 |
20210050323 | ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE | 2021-02-18 |
20210050324 | WAFER BONDING METHOD AND WAFER BONDING APPARATUS | 2021-02-18 |
20210050325 | LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THEREOF | 2021-02-18 |
20210050326 | SEMICONDUCTOR PACKAGE | 2021-02-18 |
20210050327 | MICROELECTRONIC DEVICES INCLUDING EMBEDDED BRIDGE INTERCONNECT STRUCTURES | 2021-02-18 |
20210050328 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | 2021-02-18 |
20210050329 | SENSOR SYSTEM | 2021-02-18 |
20210050330 | CHIP INTERCONNECTION STRUCTURE, CHIP, AND CHIP INTERCONNECTION METHOD | 2021-02-18 |
20210050331 | DIE STACK STRUCTURE | 2021-02-18 |
20210050332 | Packages with Stacked Dies and Methods of Forming the Same | 2021-02-18 |
20210050333 | LIGHT EMITTING DEVICE | 2021-02-18 |
20210050334 | THREE-LAYER COLOR DISPLAY USING STACKED LED LAYERS | 2021-02-18 |
20210050335 | Edge Interconnect Self-Assembly Substrate | 2021-02-18 |
20210050336 | MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF | 2021-02-18 |
20210050337 | LIGHT EMITTING STRUCTURE | 2021-02-18 |
20210050338 | Integrated Assemblies Comprising Vertically-Stacked Decks | 2021-02-18 |
20210050339 | Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer | 2021-02-18 |
20210050340 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT AND STRUCTURE THEREOF | 2021-02-18 |
20210050341 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD | 2021-02-18 |
20210050342 | Semiconductor Device | 2021-02-18 |
20210050343 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT | 2021-02-18 |
20210050344 | POWER DEVICE WITH CARRIER LIFETIME ZONE | 2021-02-18 |
20210050345 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-02-18 |
20210050346 | DEVICES INCLUDING CONTROL LOGIC STRUCTURES, AND RELATED METHODS | 2021-02-18 |
20210050347 | FUNCTIONAL BLOCKS IMPLEMENTED BY INTEGRATED CIRCUIT | 2021-02-18 |
20210050348 | Radiation Resistant Circuit Device, Pressure Transmission Device, and Nuclear Power Plant Measurement System | 2021-02-18 |
20210050349 | GATE DEVICES AND METHODS OF FORMATION USING ANGLED IONS | 2021-02-18 |
20210050350 | Semiconductor Structure Cutting Process and Structures Formed Thereby | 2021-02-18 |
20210050351 | INTEGRATED CIRCUIT LAYOUT CELL, INTEGRATED CIRCUIT LAYOUT ARRANGEMENT, AND METHODS OF FORMING THE SAME | 2021-02-18 |
20210050352 | APPARATUS COMPRISING MONOCRYSTALLINE SEMICONDUCTOR MATERIALS AND MONOCRYSTALLINE METAL SILICIDE MATERIALS, AND RELATED METHODS, ELECTRONIC DEVICES, AND ELECTRONIC SYSTEMS | 2021-02-18 |
20210050353 | SEMICONDUCTOR MEMORY DEVICE | 2021-02-18 |
20210050354 | Integrated Transistors and Methods of Forming Integrated Transistors | 2021-02-18 |
20210050355 | SEMICONDUCTOR DEVICE WITH AIR GAP STRUCTURE AND METHOD FOR PREPARING THE SAME | 2021-02-18 |
20210050356 | METHOD FOR MANUFACTURING STATIC RANDOM ACCESS MEMORY DEVICE | 2021-02-18 |
20210050357 | MICROELECTRONIC DEVICES AND MEMORY DEVICES | 2021-02-18 |
20210050358 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | 2021-02-18 |
20210050359 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOURCE LAYERS AND DRAIN LAYERS AND VERTICAL GATE ELECTRODES | 2021-02-18 |
20210050360 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ALTERNATING STACK OF SOURCE LAYERS AND DRAIN LAYERS AND VERTICAL GATE ELECTRODES | 2021-02-18 |
20210050361 | THREE-DIMENSIONAL MEMORY WITH CONDUCTIVE RAILS IN CONDUCTIVE TIERS, AND RELATED APPARATUS, SYSTEMS, AND METHODS | 2021-02-18 |
20210050362 | MICROELECTRONIC DEVICES INCLUDING AN OXIDE MATERIAL BETWEEN ADJACENT DECKS, ELECTRONIC SYSTEMS, AND RELATED METHODS | 2021-02-18 |
20210050363 | ELECTRONIC APPARATUS WITH AN OXIDE-ONLY TUNNELING STRUCTURE BY A SELECT GATE TIER, AND RELATED METHODS | 2021-02-18 |
20210050364 | Integrated Assemblies Having Rugged Material Fill, and Methods of Forming Integrated Assemblies | 2021-02-18 |
20210050365 | Bottom-Up Approach To High Aspect Ratio Hole Formation In 3D Memory Structures | 2021-02-18 |
20210050366 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | 2021-02-18 |
20210050367 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | 2021-02-18 |
20210050368 | VERTICAL MEMORY DEVICES | 2021-02-18 |
20210050369 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2021-02-18 |
20210050370 | SEMICONDUCTOR MEMORY DEVICE | 2021-02-18 |
20210050371 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING FERROELECTRIC MEMORY ELEMENTS ENCAPSULATED BY TRANSITION METAL NITRIDE MATERIALS AND METHOD OF MAKING THEREOF | 2021-02-18 |
20210050372 | FERROELECTRIC MEMORY DEVICES INCLUDING A STACK OF FERROELECTRIC AND ANTIFERROELECTRIC LAYERS AND METHOD OF MAKING THE SAME | 2021-02-18 |
20210050373 | IC INCLUDING STANDARD CELLS AND SRAM CELLS | 2021-02-18 |
20210050374 | SUB-PIXEL STRUCTURE, DISPLAY PANEL AND CONTROL METHOD THEREFOR, AND DISPLAY DEVICE | 2021-02-18 |
20210050375 | THIN FILM TRANSISTOR ARRAY PANEL AND A METHOD FOR MANUFACTURING THE SAME | 2021-02-18 |
20210050376 | DISPLAY DEVICE | 2021-02-18 |
20210050377 | SEMICONDUCTOR PACKAGE INCLUDING IMAGE SENSOR CHIP | 2021-02-18 |
20210050378 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME AND BIOMETRIC IDENTIFICATION APPARATUS USING THE SAME | 2021-02-18 |
20210050379 | IMAGE SENSOR | 2021-02-18 |
20210050380 | SENSOR CHIP AND ELECTRONIC APPARATUS | 2021-02-18 |
20210050381 | ELECTRONIC DETECTION INTERFACE AND ELECTRONIC DETECTION MODULE USING THE SAME | 2021-02-18 |
20210050382 | CIRCUIT MODULE | 2021-02-18 |
20210050383 | MAGNETIC MEMORY DEVICE | 2021-02-18 |
20210050384 | Crosspoint Phase Change Memory with Crystallized Silicon Diode Access Device | 2021-02-18 |
20210050385 | Photodetectors Integrated into Thin-Film Transistor Backplanes | 2021-02-18 |
20210050386 | DISPLAY PANEL | 2021-02-18 |
20210050387 | ORGANIC LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-02-18 |
20210050388 | DISPLAY DEVICE | 2021-02-18 |
20210050389 | DISPLAY PANEL AND DISPLAY DEVICE | 2021-02-18 |
20210050390 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | 2021-02-18 |