08th week of 2014 patent applcation highlights part 14 |
Patent application number | Title | Published |
20140048914 | WIRING BOARD WITH EMBEDDED DEVICE AND ELECTROMAGNETIC SHIELDING - In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a shielding frame, a semiconductor device, a stiffener, a first build-up circuitry and a second build-up circuitry with a shielding lid. The first and second build-up circuitries cover the semiconductor device, the shielding frame and the stiffener in the opposite vertical directions. The shielding frame and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the first build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices within the aperture of the stiffener. | 2014-02-20 |
20140048915 | SHIELDING STRUCTURE FOR TRANSMISSION LINES - A shielding structure for transmission lines comprises first and second comb-like structures defined in a first metallization layer on an integrated circuit, the teeth of each comb-like structure extending toward the other comb-like structure; a first plurality of electrically conducting vias extending upward from the first comb-like structure; a second plurality of electrically conducting vias extending upward from the second comb-like structure; first and second planar structures in a second metallization layer above the first metallization layer; a third plurality of electrically conducting vias extending downward from the first planar structure toward the first plurality of electrically conducting vias; and a fourth plurality of electrically conducting vias extending downward from the second planar structure toward the second plurality of electrically conducting vias. The comb-like structures, the planar structures and the first, second, third, and fourth electrically conducting vias are all at substantially the same potential, preferably ground. | 2014-02-20 |
20140048916 | WIRING BOARD WITH SHIELDING LID AND SHIELDING SLOTS AS ELECTROMAGNETIC SHIELDS FOR EMBEDDED DEVICE - In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a semiconductor device, a core layer, a shielding lid, shielding slots and build-up circuitry. The build-up circuitry covers the semiconductor device and the core layer. The shielding slots and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices. | 2014-02-20 |
20140048917 | EM PROTECTED SEMICONDUCTOR DIE - In one embodiment, a semiconductor die is formed to have sloped sidewalls. A conductor is formed on the sloped sidewalls. | 2014-02-20 |
20140048918 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a connection structure in which a power semiconductor chip is mounted on an insulating substrate having conductor patterns bonded to front and rear surfaces thereof, and the insulating substrate is connected to a heat-dissipating base member to dissipate heat generated from the power semiconductor chip to outside. The conductor pattern on the rear surface bonded to the heat-dissipating base member has a bonding portion having a rectangular shape and a predetermined curvature radius in vicinity of corners. | 2014-02-20 |
20140048919 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ARRAY CONTACTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an array of leads having a jumper lead and a covered contact; coupling an insulated bonding wire between the jumper lead and the covered contact; attaching an integrated circuit die over the covered contact; and coupling a bond wire between the integrated circuit die and the jumper lead including coupling the integrated circuit die to the covered contact through the insulated bonding wire. | 2014-02-20 |
20140048920 | Selective Leadframe Planishing - A metal leadframe strip ( | 2014-02-20 |
20140048921 | ENCAPSULATED ARRAYS OF ELECTRONIC SWITCHING DEVICES - An electronic switching device array encapsulated in an encapsulating structure; wherein said array is exposed to one or more gas pockets between said array and said encapsulating structure. | 2014-02-20 |
20140048922 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a base substrate made of silicon, a cap substrate and a leading electrode having a metal part. The base substrate has base semiconductor regions being insulated and separated from each other at a predetermined portion of a surface layer thereof. The cap substrate is bonded to the predetermined portion of the surface layer of the base substrate. The leading electrode has a first end connected to one of the plurality of base semiconductor regions of the base substrate Wand extends through the cap substrate such that a second end of the leading electrode is located adjacent to a surface of the cap substrate for allowing an electrical connection with an external part, the surface being opposite to a bonding surface at which the base substrate and the cap substrate are bonded. The leading electrode defines a groove between an outer surface thereof and the cap substrate. | 2014-02-20 |
20140048923 | Semiconductor Package for High Power Devices - A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages are mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction. | 2014-02-20 |
20140048924 | RIDGED INTEGRATED HEAT SPREADER - An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package level heat dissipation device, such as an integrated heat spreader, attached to the package substrate encapsulating the integrated circuit die. The package level heat dissipation device has a top side with a ridge formed on top of a perimeter of the top side, and a bottom side that couples to the integrated circuit die. | 2014-02-20 |
20140048925 | INTEGRATED CIRCUIT - An integrated circuit includes a main body, a number of connection tabs molded on the main body, and a number of pins respectively connected to the connection tabs. The connection tabs and the pins are made of metal. The connection tabs are electrically connected to a logic circuit in the main body. | 2014-02-20 |
20140048926 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer. | 2014-02-20 |
20140048927 | METHOD TO IMPROVE FINE CU LINE RELIABILITY IN AN INTEGRATED CIRCUIT DEVICE - Structure and methods for forming a semiconductor structure. The semiconductor structure includes a plurality of layers comprising at least one copper interconnect layer. The copper interconnect layer provides an electrical conduit between one of physically adjacent layers in the semiconductor structure and an integrated circuit in the semiconductor structure and an electronic device. A plurality of studs is positioned within the at least one copper interconnect layer. The studs are spaced apart by a distance less than or equal to a Blech length of the at least one copper interconnect layer. The Blech length is a length below which damage due to electromigration of metal atoms within the at least one copper interconnect layer does not occur. The plurality of studs comprises copper atom diffusion barriers. | 2014-02-20 |
20140048928 | Multi-Chip Module with Multiple Interposers - A Multi-Chip Module is presented herein that comprises a package substrate, at least two integrated circuit devices, each of which is electrically coupled to the package substrate, and an interposer. Formed in the interposer are electrical connections which are predominantly horizontal interconnects. The first interposer is arranged to electrically couple the two integrated circuit devices to each other. Methods for manufacturing a Multi-Chip Module are also presented herein. | 2014-02-20 |
20140048929 | Bonded Structures for Package and Substrate - The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance. | 2014-02-20 |
20140048930 | CONDUCTIVE BUMP, SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME - A conductive bump includes a step member formed to form a step on a portion of a connection pad; and a conductive member formed on the connection pad and the step member and having an inclined surface which is inclined with respect to the connection pad. | 2014-02-20 |
20140048931 | SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT - A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes a pre-solder material on the sidewall and the bonding surface of the conductive trace. | 2014-02-20 |
20140048932 | Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure - A semiconductor device has a first interconnect structure. A first semiconductor die has an active surface oriented towards and mounted to a first surface of the first interconnect structure. A first encapsulant is deposited over the first interconnect structure and first semiconductor die. A second semiconductor die has an active surface oriented towards and mounted to a second surface of the first interconnect structure opposite the first surface. A plurality of first conductive pillars is formed over the second surface of the first interconnect structure and around the second semiconductor die. A second encapsulant is deposited over the second semiconductor die and around the plurality of first conductive pillars. A second interconnect structure including a conductive layer and bumps are formed over the second encapsulant and electrically connect to the plurality of first conductive pillars and the first and second semiconductor die. | 2014-02-20 |
20140048933 | SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCING STRESS - A semiconductor device includes a semiconductor chip, wiring that is included in the semiconductor chip and has a coupling part between parts with different widths, a pad being formed above the wiring and in a position overlapping the coupling part, a bump being formed on the pad, a buffer layer being formed in a position between the coupling part and the pad so as to cover the entire coupling part, and inorganic insulating layers being formed between the wiring and the buffer layer and between the buffer layer and the pad, respectively. The buffer layer is made of a material other than resin and softer than the inorganic insulating layer | 2014-02-20 |
20140048934 | METHOD TO CONTROL UNDERFILL FILLET WIDTH - A semiconductor device assembly includes a substrate having an area of the surface treated to form a surface roughness. A die is mounted on the substrate by a plurality of coupling members. An underfill substantially fills a gap disposed between the substrate and the die, wherein a fillet width of the underfill is substantially limited to the area of surface roughness. | 2014-02-20 |
20140048935 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad. | 2014-02-20 |
20140048936 | HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECTRONICS UTILIZING TRANSITION PADS - An interconnect assembly that operates in environments well exceeding 200° C. without degradation and/or failure. The interconnect assembly of the present invention eliminates the incompatible metal interfaces of the prior art and relies on aluminum first-metal wire to electrically connect to first-metal pads on a chip and a second-metal wire to electrically connect to second-metal plated contacts on a package. Both wire types are then electrically connected together utilizing a high temperature transition pad disposed between the chip and contacts on the package, therefore eliminating incompatible metal interfaces of the prior art. | 2014-02-20 |
20140048937 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor substrate having two surfaces. First side faces second side and includes recesses, and a plurality of through silicon vias (TSV), which penetrate through the semiconductor substrate, are exposed by the recesses. Even when the TSVs have different heights from each other or the degree of back-grinding is changed, due to a process parameters, yield of the semiconductor device is improved by reducing failure caused when a TSV is not exposed. | 2014-02-20 |
20140048938 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device and a method for fabricating the same are disclosed, which can prevent migration of copper (Cu) ion when forming a Through Silicon Via (TSV). The semiconductor device includes a through silicon via (TSV) formed to pass through a semiconductor substrate; an oxide film located at a lower sidewall of the TSV; and a first prevention film formed to cover an upper portion of the TSV, an upper sidewall of the TSV, and an upper surface of the oxide film. | 2014-02-20 |
20140048939 | SEMICONDUCTOR DEVICE HAVING METAL PLUG AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a first insulating layer on a substrate; a first contact hole passing through the first insulating layer and exposing an upper surface of the substrate; a first barrier metal layer disposed on a sidewall and at a bottom of the first contact hole and a first metal plug disposed on the first barrier metal layer and in the first contact hole. A recess region is between the first insulating layer and the first metal plug. A gap-fill layer fills the recess region; and a second insulating layer is on the gap-fill layer. A second contact hole passes through the second insulating layer and exposes the upper surface of the first metal plug. A second barrier metal layer is on a sidewall and at the bottom of the second contact hole; and a second metal plug is on the second barrier metal layer. | 2014-02-20 |
20140048940 | Conductive Lines and Pads and Method of Manufacturing Thereof - A semiconductor device and method are disclosed. The semiconductor device includes a substrate having a first region and a second region and an insulating layer arranged on the substrate. A first conductive layer is arranged in or on insulating layer in the first region and a second conductive layer is arranged in or on the insulating layer in the second region. The first conductive layer comprises a first conductive material and the second conductive layer comprises a second conductive material wherein the first conductive material is different than the second conductive material. A metal layer is arranged on the first conductive layer. | 2014-02-20 |
20140048941 | Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers - A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls and reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width. The method further includes forming a photoresist over the plurality of contact pads and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls. | 2014-02-20 |
20140048942 | MOUNTED STRUCTURE - A mounted structure includes an electrode of a substrate, an electrode of a semiconductor element, and a mounted layers for bonding the electrode of the substrate and the electrode of the semiconductor element, and the mounted layers includes: a first intermetallic compound layer containing a CuSn-based intermetallic compound; a Bi layer; a second intermetallic compound layer containing a CuSn-based intermetallic compound; a Cu layer; and a third intermetallic compound layer containing a CuSn-based intermetallic compound, and the above layers are sequentially arranged from the electrode of the substrate toward the electrode of the semiconductor element to configure the mounted layers. | 2014-02-20 |
20140048943 | Semiconductor Constructions, Methods of Forming Conductive Structures and Methods of Forming DRAM Cells - Some embodiments include methods of forming conductive structures. An electrically conductive material may be deposited with a first deposition method. The first deposition method has a first deposition rate and forms a first portion of a conductive structure. A second portion of the conductive structure may be formed by depositing the electrically conductive material with a second deposition method having a second deposition rate. The second deposition rate may be different from the first deposition rate by at least about a factor of 3. In some embodiments, a region of the conductive structure is utilized as a transistor gate of a DRAM cell. Some embodiments include semiconductor constructions. | 2014-02-20 |
20140048944 | INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME - The present invention relates to an interconnect substrate with an embedded device, a built-in stopper and dual build-up circuitries and a method of making the same. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting a semiconductor device on the dielectric layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the dielectric layer; forming a first build-up circuitry and a second build-up circuitry that cover the semiconductor device, the stopper and the stiffener at both sides; and providing a plated through-hole that provides an electrical connection between the first and second build-up circuitries. Accordingly, the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 2014-02-20 |
20140048945 | NONVOLATILE MEMORY DEVICE AND A METHOD FOR FABRICATING THE SAME - A nonvolatile memory device including a substrate which includes a cell array region and a connection region, an electrode structure formed on the cell array region and the connection region and including a plurality of laminated electrodes, a first recess formed in the electrode structure on the connection region and disposed between the cell array region and a second recess formed in the electrode structure on the connection region, and a plurality of vertical wirings formed on the plurality of electrodes exposed by the first recess. | 2014-02-20 |
20140048946 | SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF VARIOUS SIZES | 2014-02-20 |
20140048947 | SYSTEM PACKAGE - A system package includes an interposer, a control chip mounted onto the interposer, and first and second semiconductor chips mounted onto the interposer and electrically coupled to the control chip through the interposer. The first and second chips are configured to operate under the control of the control chip. The first semiconductor chip is positioned along one side of the control chip, and the second semiconductor chip is positioned along another side of the control chip. | 2014-02-20 |
20140048948 | SEMICONDUCTOR MEMORY DEVICE INCLUDING ALIGNMENT KEY STRUCTURES - A semiconductor memory device includes a first chip and a second chip connected to the first chip physically and electrically, wherein the first chip and the second chip are coupled by through silicon vias (TSVs) formed in a first region, and the first chip and the second chip are coupled by alignment keys formed in second regions. | 2014-02-20 |
20140048949 | THERMALLY ENHANCED INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME - The present invention relates to a thermally enhanced interconnect substrate and a method of making the same. In accordance with one preferred embodiment, the method includes: forming a stopper on a metal layer of a laminate substrate; removing a selected portion of the metal layer to form a paddle layer; mounting a semiconductor device on the paddle layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the laminate substrate; forming first and second build-up circuitries that cover the semiconductor device, the paddle layer and the stiffener at both sides; and providing a plated through-hole that provides an electrical connection between the first and second build-up circuitries. Accordingly, the paddle layer can provide excellent heat spreading, and the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 2014-02-20 |
20140048950 | THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME - The present invention relates to a thermally enhanced semiconductor assembly and a method of making the same. In accordance with one preferred embodiment, the method includes: forming a stopper on a metal layer; mounting a semiconductor device on the metal layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the metal layer; forming a build-up circuitry that covers the stopper, the semiconductor device and the stiffener; providing a plated through-hole that provides an electrical connection between the build-up circuitry and the metal layer; and removing selected portions of the metal layer to form a thermal pad and a terminal. Accordingly, the thermal pad can provide excellent heat spreading, and the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 2014-02-20 |
20140048951 | SEMICONDUCTOR ASSEMBLY WITH DUAL CONNECTING CHANNELS BETWEEN INTERPOSER AND CORELESS SUBSTRATE - A semiconductor assembly includes a semiconductor device, a through-via interposer, a coreless substrate and a stiffener. The semiconductor device is flip mounted on the interposer, and the interposer is affixed on the coreless substrate by adhesive and extends into an aperture of a stiffener which provides mechanical support for the coreless substrate. The electrically connection between the interposer and the coreless substrate includes bond wire and conductive micro-via. The coreless substrate can provide fan-out routing for the interposer. | 2014-02-20 |
20140048952 | SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURES AND REDISTRIBUTION STRUCTURES - Semiconductor device including through via structure and redistribution structures is provided. The semiconductor device may include internal circuits on a first side of a substrate, a through via structure vertically penetrating the substrate to be electrically connected to one of the internal circuits, a redistribution structure on a second side of the substrate and electrically connected to the through via structure, and an insulating layer between the second side of the substrate and the redistribution structure. The redistribution structure may include a redistribution barrier layer and a redistribution metal layer, and the redistribution barrier layer may extend on a bottom surface of the redistribution metal layer and may partially surround a side of the redistribution metal layer. | 2014-02-20 |
20140048953 | SEMICONDUCTOR STRUCTURES INCLUDING SUB-RESOLUTION ALIGNMENT MARKS - A method of fabricating semiconductor structures comprising sub-resolution alignment marks is disclosed. The method comprises forming a dielectric material on a substrate and forming at least one sub-resolution alignment mark extending partially into the dielectric material. At least one opening is formed in the dielectric material. Semiconductor structures comprising the sub-resolution alignment marks are also disclosed. | 2014-02-20 |
20140048954 | STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS - A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle. | 2014-02-20 |
20140048955 | SEMICONDUCTOR ASSEMBLY BOARD WITH BACK-TO-BACK EMBEDDED SEMICONDUCTOR DEVICES AND BUILT-IN STOPPERS - In a preferred embodiment, a semiconductor assembly board with back-to-back embedded devices and built-in stoppers includes an intermediate layer, a first stopper, a first semiconductor device, a first core layer, a second stopper, a second semiconductor device, a second core layer, a first build-up circuitry, a second build-up circuitry and a plated through hole. The first and second semiconductor devices are mounted on opposite surfaces of the intermediate layer using the first and second stoppers as placement guides that are laterally aligned with peripheral edges of the first and second semiconductor devices. The first and second core layers laterally cover the first and second semiconductor devices. The first and second build-up circuitries cover the semiconductor devices and the core layers in the opposite vertical directions and provide signal routing for the first and second semiconductor devices. | 2014-02-20 |
20140048956 | FORMING ARRAY CONTACTS IN SEMICONDUCTOR MEMORIES - Array contacts for semiconductor memories may be formed using a first set of parallel stripe masks and subsequently a second set of parallel stripe masks transverse to the first set. For example, one set of masks may be utilized to etch a dielectric layer, to form parallel spaced trenches. Then the trenches may be filled with a sacrificial material. That sacrificial material may then be masked transversely to its length and etched, for example. The resulting openings may be filled with a metal to form array contacts. | 2014-02-20 |
20140048957 | THIN SUBSTRATE PoP STRUCTURE - A PoP (package-on-package) package includes a bottom package with a substrate encapsulated in an encapsulant with a die coupled to the top of the substrate. At least a portion of the die is exposed above the encapsulant on the bottom package substrate. A top package includes a substrate with encapsulant on both the frontside and the backside of the substrate. The backside of the top package substrate is coupled to the topside of the bottom package substrate with at least part of the die being located in a recess in the encapsulant on the backside of the top package substrate. | 2014-02-20 |
20140048958 | Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers - A method of making contact pad sidewall spacer and pad sidewall spacers are disclosed. An embodiment includes forming a plurality of contact pads on a substrate, each contact pad having sidewalls, forming a first photoresist over the substrate, and removing the first photoresist from the substrate thereby forming sidewall spacers along the sidewalls of the plurality of the contact pads. | 2014-02-20 |
20140048959 | MICROELECTRONIC PACKAGE HAVING NON-COPLANAR, ENCAPSULATED MICROELECTRONIC DEVICES AND A BUMPLESS BUILD-UP LAYER - A microelectronic package having an encapsulated substrate comprising a plurality of microelectronic devices encapsulated within an encapsulation material, wherein the encapsulated structure may have an active surface proximate the active surfaces of the plurality of microelectronic devices, and wherein at least one of the plurality of microelectronic devices may have a height greater than another of the plurality of microelectronic devices (e.g. non-coplanar), The microelectronic package further includes a bumpless build-up layer structure formed proximate the encapsulated structure active surface. The microelectronic package may also have an active surface microelectronic device positioned proximate the encapsulated structure active surface and in electrical contact with at least one of the plurality of microelectronic devices of the encapsulated substrate. | 2014-02-20 |
20140048960 | PACKAGE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND MOLD THEREFOR - There are provided a package substrate, a manufacturing method thereof, and a mold therefor. The method of manufacturing a package substrate includes: preparing a chip component and a substrate; mounting the chip component on a main surface of the substrate; preparing a mold having a cavity and protrusions formed on a ceiling surface thereof; disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity. | 2014-02-20 |
20140048961 | DIFFUSOR AND DIFFUSOR UNIT FOR DIFFUSING A GAS INTO A LIQUID - A diffusor for diffusing a gas into a liquid including a membrane, a supporting structure supporting the membrane and a holder arranged to connect the supporting structure to a gas supply conduit, at least a part of the membrane being perforated. The membrane defines an inner chamber, and at least a part of the supporting structure is arranged in the inner chamber of the membrane, the supporting structure including at least one channel extending from an inlet opening that is in, direct or indirect, fluid communication with the gas supply conduit to an outlet opening that is in fluid communication with the inner chamber of the membrane. | 2014-02-20 |
20140048962 | Integrated Fan Drive System For Cooling Tower - A drive system for driving a fan in a wet cooling tower, wherein the fan has a fan hub and fan blades attached to the fan hub. The drive system has a high-torque, low speed permanent magnet motor having a motor casing, a stator and a rotatable shaft, wherein the rotatable shaft is configured for connection to the fan hub. The drive system includes a variable frequency drive device to generate electrical signals that effect rotation of the rotatable shaft of the motor in order to rotate the fan. | 2014-02-20 |
20140048963 | Polyethylene Fibers and Processes of Forming the Same - Fibers and methods of forming the fibers are described herein. The fibers generally include an ethylene based polymer exhibiting a molecular weight distribution of from about 2 to about 8. | 2014-02-20 |
20140048964 | FLOATING CUT-OFF BAR FOR A MOLD BOX - A floating cut-off bar coupled to a feed drawer whereby a mechanism allows the floating cut-off bar to engage the specified contour of side rails and a division plate in a mold box assembly and aid in material distribution by screeding excess material and delivering additional material to areas of the mold box as necessary and method of making wall blocks therefrom. The specified contour of the side rails and optionally division plate is designed to optimally deliver material to achieve a specified uniform density of the block produced for greater structural integrity, strength and durability of the block. | 2014-02-20 |
20140048965 | PRESS FOR PRODUCING A MOULDED PART AND METHOD FOR CHANGING A DIE ON A PRESS - In order to shorten set-up times, a press for producing a molded part from pourable material, having an apparatus for driving a die comprising a cylinder unit having a cylinder housing and having a cylinder piston is proposed, wherein the cylinder housing is the actuator of the cylinder unit and the cylinder piston is the stator of the cylinder unit. | 2014-02-20 |
20140048966 | Portable Curing System - A method and apparatus for curing a composite workpiece to form a part. In one illustrative embodiment, an apparatus may comprise an object, a portable structure, and a heating system. The object may have a shape selected for a part. The portable structure may comprise a retaining structure configured to hold the object. The retaining structure may have a first side and a second side. The heating system may be configured to cover the object at the first side of the retaining structure and the second side of the retaining structure. The heating system may be further configured to generate heat for use in curing a workpiece placed over the object to form the part. | 2014-02-20 |
20140048967 | Three-Layer Rotomoulded Motorboats - This invention discloses three-layer rotomoulded motorboats having excellent floatability prepared from foamed polyethylene. | 2014-02-20 |
20140048968 | METHOD FOR PRODUCING LITHIUM TITANATE PRECURSOR, METHOD FOR PRODUCING LITHIUM TITANATE, LITHIUM TITANATE, ELECTRODE ACTIVE MATERIAL, AND ELECTRICITY STORAGE DEVICE - A method for producing a lithium titanate precursor includes the step of grinding a lithium compound and a titanium compound in a state where these compounds coexist. More preferably, a method for producing a lithium titanate precursor includes the steps of; mixing a lithium compound and a titanium compound; and grinding the lithium compound and the titanium compound in a state where these compounds coexist by the mixing. | 2014-02-20 |
20140048969 | PRINT HEAD NOZZLE FOR USE WITH ADDITIVE MANUFACTURING SYSTEM - A nozzle for printing three-dimensional parts with an additive manufacturing system, the nozzle comprising a nozzle body having an inlet end and a tip end offset longitudinally from the inlet end, a tip pipe for extruding a flowable material, an inner ring extending circumferentially around the tip pipe at the outlet end, an outer ring extending circumferentially around the inner ring, at least one annular recessed groove located circumferentially between the inner ring and the outer ring. | 2014-02-20 |
20140048970 | DRAW CONTROL FOR EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEMS - A method for improving part quality for a printed three-dimensional part, the method comprising moving a print head nozzle along a substantially linear segment of a tool path at a tip height above a previous layer of the three-dimensional part while extruding a flowable material, and producing an extruded road from the extruded flowable material having a road height above the previous layer, where the tip height is greater than the road height due at least in part to draw on the extruded road. | 2014-02-20 |
20140048971 | ADDITIVE MANUFACTURING TECHNIQUE FOR PRINTING THREE-DIMENSIONAL PARTS WITH PRINTED RECEIVING SURFACES - A method for printing three-dimensional parts with an additive manufacturing system, comprising printing successive layers having increasing cross-sectional areas, and printing layers of a three-dimensional part onto the previously printed layers, where a last layer of the previously printed successive layers has a cross-sectional area that is at least as large as a footprint area of the three-dimensional part. | 2014-02-20 |
20140048972 | Automated Sample Preparation - Mineral samples for use in analytical instruments are created by a system that greatly reduces the sample preparation time and facilitates automation. For example, in some implementations, rather than grinding to expose the interior of mineral particles in sample plug containing mineral particles in an epoxy compound, the sample plug is sliced with a saw, which more rapidly provides in many applications a sufficiently smooth surface on the exposed particle surfaces for observation. Rather than slowly mixing a slow curing epoxy to avoid introducing bubbles into the sample plug, some implementations use a fast settle fixative and a mechanical mixture that avoid bubbles. | 2014-02-20 |
20140048973 | METHOD FOR RATIONALISING PRODUCTION OF DISPENSERS - Disclosed is a method for rationalising production of a first series of first identical dispensers and a second series of second identical dispensers. The first identical dispensers are different from the second identical dispensers, except for: each of the first and second identical dispensers is constituted by a housing formed at least by a first and a second distinguishable component which abut each other. The first and second distinguishable components together form a motif-receiving surface which has a first region having a first change-in-depth-per-unit-width ratio of at least 0.25. The method includes injection-moulding the first and second distinguishable components; providing a motif on a transfer medium, and applying the motif to at least the first region of the motif-receiving surface to transfer the motif from the transfer medium to the motif-receiving surface, with the motif occupying a rectangular area of at least 30 cm | 2014-02-20 |
20140048974 | Method Of Making A Golf Ball - A method of making a golf ball is disclosed. The golf ball includes a resin inner core, a rubber outer core, and a cover. The resin inner core is made of a highly neutralized polymer and at least one ionomer. The cover is a dimpled ionomer cover, made of a blend of different grades of ionomer. This construction provides desirable compression, coefficient of restitution, and moment of inertia properties. The ball as a whole has properties to maximize performance and aesthetic properties, such as driver distance, iron control, feel, and sound. The ball is particularly well-suited to balancing driver initial velocity and compression so that driver trajectory and distance is maintained or improved while greater control and feel is enhanced. | 2014-02-20 |
20140048975 | Corrosion Protection of Cables in a Concrete Structure - Steel reinforcing cables in concrete are protected against corrosion by injecting a carrier fluid and corrosion inhibitors into interstitial spaces between the wires of the cable at a first location along the cable and causing the fluid to pass through the interstitial spaces between the wires of the cable to a second location along the cable. The cable comprises an array of wires confined together and intimately surrounded by a covering material which is engaged with a periphery of the cable so that there are insufficient interconnected spaces between the cable and the covering material to allow passage of fluid longitudinally along the cable outside the cable itself. The method can be used with pre-stressed concrete, with post-tensioned bonded cables and with extruded un-bonded mono-strand cables. | 2014-02-20 |
20140048976 | METHOD AND SYSTEM FOR DETERMINING AND DISPENSING RESIN FOR A COMPRESSION MOLDING PROCESS FLOW - The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound. | 2014-02-20 |
20140048977 | MOLDING OF A NEUROSTIMULATOR FOR DELIVERY INTO THE PTERYGOPALATINE FOSSA - A method and apparatus for molding a medical device utilizes a rigid outer stiffener and a flexible inner mold that nests with the outer stiffener. The medical device can be a stimulating apparatus used to deliver electrical stimulation to a peripheral, central or autonomic neural structure. More specifically, the medical device can be a neurostimulator apparatus designed to delivery electrical stimulation to the sphenopalatine ganglion (SPG) to treat primary headaches, such as migraines, cluster headaches and/or many other neurological disorders, such as atypical facial pain and/or trigeminal neuralgias. | 2014-02-20 |
20140048978 | CONSUMABLE CORE FOR MANUFACTURE OF COMPOSITE ARTICLES AND RELATED METHOD - Systems, methods and devices adapted to ease manufacture of composite articles (e.g., ceramic composite articles), particularly composite articles which include a hollow feature are disclosed. In one embodiment, a system includes: a consumable core formed to be disposed within an inner portion of a composite precursor, the consumable core adapted to convert into an infiltrant during a manufacturing process and infiltrate the composite precursor. | 2014-02-20 |
20140048979 | PROCESS FOR PRODUCING FORMED THERMOPLASTIC - A process for forming a sheet of thermoplastic material into a three-dimensional shape comprising at least one vertex, the process comprising the steps of (i) forming the sheet by means of a former having a profile such as to produce a first formed shape in the sheet, followed by (ii) positioning a male former within the first formed shape, the male former having a profile within the first formed shape comprising at least one vertex and (iii) raising the temperature of the first formed shape above that of forming in step (i), thereby causing the first formed shape to shrink back towards its original sheet form and thereby adopting the profile of the male former. | 2014-02-20 |
20140048980 | ADDITIVE MANUFACTURING SYSTEM WITH EXTENDED PRINTING VOLUME, AND METHODS OF USE THEREOF - An additive manufacturing system for printing three-dimensional parts, the system comprising a heatable chamber with a port, a print foundation, a print head configured to print a three-dimensional part onto the print foundation in a layer-by-layer manner along a printing axis, and a drive mechanism configured to index the print foundation along the printing axis such that, while the print head prints the three-dimensional part, the print foundation and at least a portion of the three-dimensional part pass through the port and out of the heated chamber. | 2014-02-20 |
20140048981 | ADDITIVE MANUFACTURING SYSTEM WITH EXTENDED PRINTING VOLUME, AND METHODS OF USE THEREOF - An additive manufacturing system for printing three-dimensional parts, the system comprising a heatable region, a receiving surface, a print head configured to print a three-dimensional part onto the receiving surface in a layer-by-layer manner along a printing axis, and a drive mechanism configured to index the receiving surface along the printing axis such that the receiving surface and at least a portion of the three-dimensional part out of the heated region. | 2014-02-20 |
20140048982 | Multizone Electroblowing Process and Apparatus - Methods and apparatuses are provided for producing fibers via electroblowing. In an embodiment of the present invention, a polymer stream, formed from a spinning nozzle, passes through a first temperature zone for a first residence time, and subsequently passes through a second temperature zone for a second residence time, where the second zone has a higher average temperature than the first zone. In an embodiment of an apparatus of the present invention, the apparatus has a region between the spinning nozzle outlet and collector that includes at least two zones through which a polymer stream passes, where the second zone has a higher average temperature than the first zone. | 2014-02-20 |
20140048983 | METHOD AND DEVICE FOR PRODUCING SYNTHETIC GRASS FIBERS - The invention relates to a method and to a device for producing synthetic grass fibers for artificial turf. For said purpose, a plurality of strips formed from a divided film or a plurality of individually extruded monofilaments made of a polymer material are produced in an extrusion process. The strips or monofilaments are then stretched and wound individually or as a fiber bundle to form coils. According to the invention, in order to in particular influence the physical properties of the synthetic grass fibers in addition to the visual properties, the roughness of the surfaces of the strips or monofilaments is changed before or after the winding. For said purpose, the device according to the invention has a treatment apparatus, the means of which are suitable for changing the surface roughness of the strips or monofilaments. | 2014-02-20 |
20140048984 | METHOD FOR PRODUCING FINE PARTICLES - The invention addresses the problem of providing a novel method for controlling the particle size of deposited fine particles in a fine particle production method that introduces a fluid to be processed between at least two processing surfaces, which are disposed facing each other, are advancible and retractable, and at least one rotates relative to the other, to deposit fine particles in the thin fluid film which forms between said processing surfaces. A fluid to be processed is introduced between processing surfaces ( | 2014-02-20 |
20140048985 | METHOD FOR MANUFACTURING A PLASTIC FUEL TANK WITH IMPROVED CREEP STRENGTH - A method for manufacturing a plastic fuel tank including: a) inserting a plastic parison including two distinct parts into an open two-cavity mold; b) inserting a core, bearing at least part of a reinforcing element configured to create a link between the two parison parts, inside the parison; c) pressing the parison firmly against the mold cavities, for example by blowing through the core and/or creating suction behind the cavities; d) fixing the part of the reinforcing element to at least one of the parison parts using the core; e) withdrawing the core; f) closing the mold, bringing its two cavities together to grip the two parison parts around their periphery to weld them together; g) injecting a pressurized fluid into the mold and/or creating a vacuum behind the mold cavities to press the parison firmly against the mold cavities; and h) opening the mold and extracting the tank. | 2014-02-20 |
20140048986 | Method of Creating Vessels with a Noise Chamber - A method for creating a vessel with a noise chamber comprising casting slip into a mold defining a vessel with a void in the foot, controlling the hardening process to facilitate the foot becoming leather-hard prior to the other parts of the vessel, placing a bead within the void in the foot, attaching a foot slab with a hole to the foot of the vessel to create a noise chamber out of the void in the foot, drying the vessel beyond a leather-hard state, applying a temporary cover to the hole in the foot slab, glazing the vessel, firing the vessel and applying a seal to the hole in the foot slab. | 2014-02-20 |
20140048987 | METHOD FOR SHORTENING OPERATION SHUTDOWN TIME OF HIGH PRESSURE ACID LEACH EQUIPMENT IN A HYDROMETALLURGICAL PROCESS - This invention provides a method for shortening operation shutdown time of high pressure acid leach equipment in a hydrometallurgical process, wherein the high pressure acid leach equipment comprises (i) means to transfer an ore slurry into the high pressure acid leach equipment; (ii) means to increase temperature and pressure of an ore slurry before leaching; (iii) means to add sulfuric acid into the high pressure acid leach equipment and to leach the ore slurry to obtain a leached slurry at high temperature under high pressure; (iv) means to adjust the pressure of the leached slurry; and (v) means to discharge the leached from the high pressure acid leach equipment; wherein, upon operation shutdown of the high pressure acid leach equipment, the leached slurry is subjected to self-circulation inside the high pressure acid leach equipment. | 2014-02-20 |
20140048988 | LEAF SPRING ASSEMBLY - A leaf spring assembly includes a main stage and a second stage. The main stage has at least one leaf, which is a steel leaf. The second stage has a composite leaf. The second stage is operatively attached to, and aligned with, the main stage. | 2014-02-20 |
20140048989 | VIBRATION ISOLATION SYSTEMS - A composite vibration isolation system utilizes isolators with negative-stiffness mechanisms to produce low vertical and horizontal natural frequencies to the system by allowing both the horizontal stiffness and horizontal natural frequencies to be adjusted, for example, by turning adjustment screws. | 2014-02-20 |
20140048990 | DUAL RADIUS ISOLATOR - A vibration isolator includes a base plate having a first attachment feature that enables attachment of the isolator to a first surface, the isolator further including a second attachment feature permitting attachment to a second surface. A spring section disposed between the base plate and the second attachment feature has a first radiused section and a second radiused section, each of the first and second radiused sections being formed in opposing directions on a continuous spring portion intermediate to the base plate and second attachment feature and in which the spring section provides noise attenuation and isolation between the first and second surfaces. | 2014-02-20 |
20140048991 | UNDULAR WASHER - The invention relates to a wave spring ( | 2014-02-20 |
20140048992 | Extruded Tube Spring for Container and Packaging Applications - A silicone extruded tubular spring that has the possibility to be folded around an axis perpendicular to its own axis of extrusion, thus creating the compression and release as of a spring. The base has a reach-in hole on its body to allow the user to reach through. The lid is the base's capping object; it is designed to cover the reach-in hole of the base. It should be designed in a way to limit the area of the remaining gaps of the base's reach-in hole. The extruded tubular spring can store and release energy in order to displace the lid. It can be of any material that provides the appropriate stiffness to activate the lid. The retention latch is the user interface on which he acts in order to have the lid pop-up. | 2014-02-20 |
20140048993 | SELECTIVE PLACEMENT OF COOLANT TO UNDERCUT AREAS - The described embodiment relates generally to the use of a specialized workpiece fixture to keep a workpiece surface covered with cutting fluid during a machining operation. More specifically the specialized workpiece fixture allows a downward facing undercut area to remain covered with coolant by utilizing nozzles arranged underneath the undercut area for coolant delivery. | 2014-02-20 |
20140048994 | Non-Contact Substrate Chuck and Vertical Type Substrate Supporting Apparatus Using the Same - A non-contact substrate chuck applies to sucking a substrate and comprises a first plate-like element, a second plate-like element paralleled the first plate-like element and a sucking element, wherein through holes of the first plate-like element and the second plate-like element jointly form a channel where the sucking element is accommodated. The chuck lets gas flow through a gas inlet of the sucking element toward the substrate to form a gap between an active surface of the substrate and a first surface of the first plate-like element. At least one side of the substrate is positioned by positioning protrusions of the first plate-like element. A least possible number of supporting points are used and arranged around the sides of the substrate without touching the substrate surface to prevent the substrate surface from being damaged. The present invention also discloses a vertical-type substrate supporting apparatus using the abovementioned chuck. | 2014-02-20 |
20140048995 | CLAMPING MECHANISM - A clamping mechanism includes a mounting plate, a driving assembly, and a clamping assembly. The mounting plate defines four through grooves. The driving assembly includes a driver mounted on the mounting plate, and a connecting member connected to the driver. The clamping assembly includes a reversing member mounted on the mounting plate, four clamping members, four transferring members, and four elastic members. The clamping members are movably mounted in the through grooves. The transferring members are wound on the reversing member. An end of each transferring member is connected to the connecting member, an opposite end of each transferring member is connected to the corresponding clamping member. The elastic members are sleeved on the transferring members, and resisting against the clamping members. The clamping members move toward the reversing member driven by the driver, for clamping a workpiece. | 2014-02-20 |
20140048996 | Stabilizing Device - A stabilizing device. The device can have a generally planar, polygonal shape defined by edges forming a perimeter. The device has a vertical axis and a horizontal axis. The device further includes at least one ground-contact edge generally parallel to the horizontal axis, the ground-contacting edge being in contact with the ground when the device is in use, and at least three edges defining an open-ended slot, the slot being oriented generally parallel to the horizontal axis. | 2014-02-20 |
20140048997 | DEVICE FOR ASSEMBLING CAMERA MODULE WITH HIGH QUALITY - A device for assembling a camera module includes a base and a buffer layer. The camera module includes a flexible printed circuit board (FPCB), a lens module positioned on the FPCB, and a stiffener adhering to the FPCB, opposite to the lens module. The lens module includes a first stepped surface facing away from the FPCB. The base includes a supporting surface for supporting the FPCB and defines a holding groove in the supporting surface for holding the lens module. The holding groove forms a second stepped surface for supporting the first stepped surface. The buffer layer is positioned on the second stepped surface and is elastically compressed when the camera module is subjected to a hot pressing process, which secures the stiffener adhering to the FPCB, to provide relief against, and extend the duration of, various pressures applied to the camera module. | 2014-02-20 |
20140048998 | SECTION SIGNATURE ACCUMULATING APPARATUS AND SECTION SIGNATURE ACCUMULATING METHOD - A section signature stacking body where one or more section signatures are stacked in a proper appearance is formed and carried out. A section signature accumulating apparatus includes: a first carrying part configured to receive and carry the manufactured section signature; a classifying/carrying part configured to classify N (N is an integer equal to or larger than 2 section signatures having the same configuration transported by the first carrying part to N different section signature accumulating parts one by one to carry the section signatures; N section signature accumulating parts configured to stock the section signatures carried by the classifying/carrying part and form a section signature stacking body where one or more sections signatures are stacked; and a second carrying part configured to carry N section signature stacking bodies discharged from the N section signature accumulating parts, respectively. | 2014-02-20 |
20140048999 | DEVICE FOR STACKING SHEETS OF PAPER OR SIMILAR - The device ( | 2014-02-20 |
20140049000 | SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS - A sheet conveying device includes a holder, a friction member, a rotary conveyance member having an outer circumferential surface and forming a nip area between the outer circumferential surface thereof and the friction member, the rotary conveyance member configured to rotate while contacting the friction member, and separate and convey multiple sheet-like materials one by one at the nip area, and a pair of guides configured to lift an underside of each of the sheet-like materials at a portion facing the friction member, the pair of guides disposed upstream from the nip area in a sheet conveying direction, outside both ends in an axial direction of the rotary conveyance member, separate from the nip area from the axial direction of the rotary conveyance member, and being overlaid with the outer circumferential surface of the rotary conveyance member. | 2014-02-20 |
20140049001 | IMAGE FORMING APPARATUS - An image forming apparatus includes a housing, an image forming unit disposed inside the housing, a discharging portion, a stacking unit and a pressing member. The discharging portion is configured to discharge a sheet medium on which an image is formed by the image forming unit. The stacking unit is configured to stack the sheet medium discharged from the discharging portion. The stacking unit includes a stacking surface portion on which the sheet medium is stacked. The stacking surface portion includes a planar portion formed flat and a protruding portion configured to protrude upwardly from the planar portion. The pressing member is disposed in contact with an upper surface of the sheet medium stacked on the stacking surface portion. | 2014-02-20 |
20140049002 | DOCUMENT GUIDE SYSTEMS AND METHODS EMPLOYING A DOCUMENT PLATEN - Document guide systems and methods employing a document platen are provided. According to an illustrative embodiment, a document guide system employing a document platen includes a document plates having a first, document-faceable side and a second, opposing side, and a document support sub-system adjacent the first side of the document platen. The document support sub-system and the first side of the document platen are adapted to receive a document therebetween, and the document platen forms an aperture adapted to allow electromagnetic radiation therethrough. | 2014-02-20 |
20140049003 | DOCUMENT STORAGE DEVICE FOR PRINTER - A document storage device includes a document storage rack, a document distributing apparatus, and a transmitting roller. The document storage rack defines a first storage space and a second storage space. A first protecting door is mounted on the document storage rack to close and lock the first storage space. The second storage space is readily accessible. The document distributing apparatus includes a controlling pole and a first distributing roller connected to the controlling pole. The transmitting roller transmits a document to the first distributing roller. The controlling pole moves the first distributing roller between a first position and a second position. In the first position, the first distributing roller transmits the document into the first storage space. In the second position, the first distributing roller transmits the document into the second storage space. | 2014-02-20 |
20140049004 | HAND PERSPIRATION REMOVAL DEVICE - A hand perspiration removal device comprises a base which includes top and bottom surfaces, a perspiration absorbing pad which is removably attached to the top surface, and an arrangement for securing the base to a part of a user's body. The bottom surface of the base comprises a concave configuration which extends from a first side of the base to a second, opposite side of the base such that the bottom surface is configured to conform to the part of the user's body to which the device is secured. | 2014-02-20 |
20140049005 | METHODS OF RANDOMIZING CARDS - Apparatuses and methods for moving playing cards from a first group of cards into plural hands of cards, wherein each of the hands contains a random arrangement of cards. The apparatus may comprise a card receiver for receiving the first group of cards, a single stack of card-receiving compartments generally adjacent to the card receiver, the stack generally vertically movable, an elevator for moving the stack, a card-moving mechanism between the card receiver and the stack, and a microprocessor that controls the card-moving mechanism and the elevator so that an individual card is moved into an identified compartment. The number of compartments receiving cards and the number of cards moved to each compartment may be selected. Apparatuses for feeding cards may comprise a surface for supporting a stack of cards, a feed roller with a frictional outer surface, a drive mechanism for causing rotation of the feed roller, a pair of speed-up rollers to advance the cards out of the feed roller, and a clutch mechanism for disengaging the feed roller from the drive mechanism as the card comes into contact with the speed-up rollers. | 2014-02-20 |
20140049006 | Bankers' Playing Card Game - A banker's card game in which: a player plays two double denomination playing cards from a deck of mutually different cards, and the player has a first hand value that is the sum of a) the designated value of the first playing field of the first card and the designated value of the first playing field of the second card and has a second hand value comprised of the sum of a) the designated value of the second playing field of the first card and b) the designated value of the second playing field of the second card; and a banker plays a third double denomination playing card and a fourth double denomination playing card from the deck under the same rules; and the player's first hand value is played/compared against the banker's initial hand value and the player's second hand value is played/compared against the banker's further hand value. | 2014-02-20 |
20140049007 | RING TOSS GAME AND SYSTEM INCLUDING PIERCED RING - A highly-portable and stylized ring toss game which includes a pierced ring. The piercing in the ring allows a string to be threaded directly through the ring, thereby removing the need to tie a string to the ring and removing the element of string tension from the game, thus allowing for more creative tricks and more uniform gameplay. The ring is suspended from the string a distance away from a backboard with a hook. The ring is tossed along a path toward the backboard with the intent of hooking the ring onto the hook. The ring may be spun or flipped to perform this feat in more dramatic fashion. | 2014-02-20 |
20140049008 | Sensorized Sealing System - The present invention relates to a sealing system comprising a seal that retains a liquid in a space between two concentrically mounted and relatively rotatable components. According to the invention, the sealing system comprises at least one magneto-elastic resonance sensor for measuring at least one parameter of interest associated with the sealed liquid, based on a detected resonant frequency of the at least one sensor. | 2014-02-20 |
20140049009 | INTERSHAFT SEAL - An intershaft seal is provided for inner and outer coaxial shafts which rotate relative to each other. The seal is located in an annular space between the shafts and maintains an axial pressure differential between a fluid pressure on the first side of the seal and a different fluid pressure on the other, second side of the seal. The seal includes a first runner which extends circumferentially around a first one of the shafts and projects therefrom into the annular space. The seal further includes a sealing ring which is coaxial with the shafts. | 2014-02-20 |
20140049010 | INTERSHAFT SEAL - An intershaft seal is provided for inner and outer coaxial shafts which rotate relative to each other. The seal is located in an annular space between the shafts and maintains an axial pressure differential between a fluid pressure on a first side of the seal and a different fluid pressure on a second side of the seal. The seal includes first and second runners which project into the annular space from a first one of the shafts and extend circumferentially around the first shaft such that a cavity is formed between the runners. The seal further includes a sealing ring which is coaxial with the shafts and is located in the cavity. | 2014-02-20 |
20140049011 | DEVICE FOR CHUCKING A TOOL OR WORKPIECE AND METHOD FOR OPERATING SUCH A CHUCKING DEVICE - A chucking device, which includes a rotationally-drivable spindle, a chucking means for mechanical chucking of a chucked object arranged on the spindle, a drive gearwheel, and a drive for rotationally driving the gearwheel. The chucking means has a rotating body, which has gear teeth and allows, through rotational movement, the chucked object to be chucked or unchucked. The drive gearwheel has gear teeth configured for complementary engagement with the gear teeth of the rotating body. The gear teeth of the rotating body and drive gearwheel are designed to provide flank play, such that the drive gearwheel can assume a neutral angular position with respect to the rotating body so that the gear teeth of the rotating body and drive gearwheel do not touch each other. | 2014-02-20 |
20140049012 | Vehicle Suspension System - To achieve a small and low power consumption suspension, which can be installed in a vehicle, such as a personal mobility vehicle, there is provided a vehicle suspension system including: a suspension that is connected to a vehicle body and a shaft mounted to wheels; an actuator that includes an output for vertically moving a suspension position of the suspension on the basis of inclination angle information of the vehicle; and a self-weight support mechanism that acts on the actuator to support vehicle weight. The self-weight support mechanism is composed of a spring mounted to the actuator, the actuator, and a link mechanism connected the suspension and the actuator. | 2014-02-20 |
20140049013 | AIR SPRING AND DAMPER UNIT WITH HEIGHT ADJUSTMENT - A vehicle suspension apparatus includes various elements, such as a self-pumping air spring and damper unit operating with compressed air for height adjustment of a vehicle body relative to a wheel suspension of a vehicle. The apparatus further at least one spring space filled with compressed air, which is at least partially bounded by at least one movable wall and a damper cylinder, which can be connected to the spring space ( | 2014-02-20 |