08th week of 2011 patent applcation highlights part 45 |
Patent application number | Title | Published |
20110045632 | Methods of Manufacturing Solid State Image Pickup Devices - A method of manufacturing a solid state image pickup device having a plurality of pixels each including a photoelectric conversion region for converting light into a signal charge, and a plurality of wiring layers including first and second wiring layers. The method includes steps of forming the first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing the plurality of patterns, and forming the second wiring layer as a pattern by batch exposure processing. A connecting position along which the divided patterns are connected is arranged in a pixel area in which the plurality of pixels are arranged. The wiring included in the first wiring layer is formed by a vertical direction wiring arranged in parallel with and not crossing the connecting position in the pixel area, and the wiring included in the second wiring layer is formed by a horizontal direction wiring arranged in parallel with and crossing the connecting position in the pixel area. | 2011-02-24 |
20110045633 | THIN FILM TRANSISTOR HAVING N-TYPE AND P-TYPE CIS THIN FILMS AND METHOD OF MANUFACTURING THE SAME - Provided is a thin film transistor (TFT) which uses CIS (CuInSe | 2011-02-24 |
20110045634 | Semiconductor Device and Method of Forming Dual-Active Sided Semiconductor Die in Fan-Out Wafer Level Chip Scale Package - In a semiconductor device, a plurality of conductive pillars is formed over a temporary carrier. A dual-active sided semiconductor die is mounted over the carrier between the conductive pillars. The semiconductor die has first and second opposing active surfaces with first contact pads on the first active surface and second contact pads on the second active surface. An encapsulant is deposited over the semiconductor die and temporary carrier. A first interconnect structure is formed over a first surface of the encapsulant. The first interconnect structure is electrically connected to the conductive pillars and first contact pads of the dual-active sided semiconductor die. The temporary carrier is removed. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive pillars and second contact pads of the dual-active sided semiconductor die. | 2011-02-24 |
20110045635 | VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS - Prepackaged chips, such a memory chips, are vertically stacked and bonded together with their terminals aligned. The exterior lead frames are removed including that portion which extends into the packaging. The bonding wires are now exposed on the collective lateral surface of the stack. In those areas where no bonding wire was connected to the lead frame, a bare insulative surface is left. A contact layer is disposed on top of the stack and vertical metalizations defined on the stack to connect the ends of the wires to the contact layer and hence to contact pads on the top surface of the contact layer. The vertical metalizations are arranged and configured to connect all commonly shared terminals of the chips, while the control and data input/output signals of each chip are separately connected to metalizations, which are disposed in part on the bare insulative surface. | 2011-02-24 |
20110045636 | LIGHTWEIGHT AND COMPACT THROUGH-SILICON VIA STACK PACKAGE WITH EXCELLENT ELECTRICAL CONNECTIONS AND METHOD FOR MANUFACTURING THE SAME - A through-silicon via stack package contains package units. Each package unit includes a semiconductor chip; a through-silicon via formed in the semiconductor chip; a first metal line formed on an upper surface and contacting a portion of a top surface of the through-silicon via; and a second metal line formed on a lower surface of the semiconductor chip and contacting a second portion of a lower surface of the through-silicon via. When package units are stacked, the second metal line formed on the lower surface of the top package unit and the first metal line formed on the upper surface of the bottom package unit are brought into contact with the upper surface of the through-silicon via of the bottom package unit and the lower surface of the through-silicon via of the top package unit, respectively. The stack package is lightweight and compact, and can form excellent electrical connections. | 2011-02-24 |
20110045637 | Ultra Thin Bumped Wafer With Under-Film - A method of making a semiconductor device includes forming an under-film layer over bumps disposed on a surface of a wafer to completely cover the bumps, and forming an adhesive layer over the under-film layer. The method further includes attaching a support layer over the adhesive layer, removing a portion of a back surface of the wafer, and removing the support layer to expose the adhesive layer that remains disposed over the under-film layer. The method further includes removing the adhesive layer to expose the under-film layer while the bumps remain completely covered by the under-film layer, and singulating the wafer to form a semiconductor die. The method further includes pressing the bumps into contact with a substrate while the under-film layer provides an underfill between the semiconductor die and the substrate. | 2011-02-24 |
20110045638 | HEAT RESISTANT MASKING TAPE AND USAGE THEREOF - The present invention provides a masking tape which can be easily released without leaving an adhesive residue. A heat resistant masking tape, comprising (1) a heat resistant backing film layer, and (2) a pressure-sensitive adhesive layer disposed on the heat resistant backing film layer, wherein the adhesive layer comprises a polymer having a solubility parameter (SP) value at 25° C. of 20 MPa | 2011-02-24 |
20110045639 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 2011-02-24 |
20110045640 | METHOD AND SYSTEM FOR BONDING ELECTRICAL DEVICES USING AN ELECTRICALLY CONDUCTIVE ADHESIVE - A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together. | 2011-02-24 |
20110045641 | Semiconductor Device Having Solder-Free Gold Bump Contacts for Stability in Repeated Temperature Cycles - A semiconductor device has a chip ( | 2011-02-24 |
20110045642 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A method of manufacturing a semiconductor package comprises: preparing a photosensitive insulating material having a first surface and a second surface opposite to the first surface; bonding a semiconductor chip to the first surface of the photosensitive insulating material with a connecting terminal of the semiconductor chip facing the first surface of the photosensitive insulating material; exposing the second surface of the photosensitive insulating material after the bonding the semi-conductor to the first surface of the photosensitive material; encapsulating the first surface of the photosensitive insulating material, and the semiconductor chip bonded to the first surface, with a resin to form a resin encapsulated portion after exposing the second surface of the photosensitive insulating material; and developing the photosensitive insulating material, thereby forming a through-hole communicating with the connecting terminal of the semiconductor chip in the photosensitive insulating material after the exposing the second surface of the photosensitive insulating material. | 2011-02-24 |
20110045643 | Method of forming active region structure - A method of forming an active region structure includes preparing a semiconductor substrate including a cell array region and a peripheral circuit region, forming preliminary cell active regions in the cell array region of the semiconductor substrate, and forming cell active regions in the preliminary cell active regions and at least one peripheral active region in the peripheral circuit region of the semiconductor substrate, such that the preliminary cell active regions, the cell active regions, and the at least one peripheral active region are integrally formed with the semiconductor substrate and protrude from the semiconductor substrate. | 2011-02-24 |
20110045644 | FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS OF MANUFACTURE - A method of forming a programmable fuse structure includes forming at least one shallow trench isolation (STI) in a substrate, forming an e-fuse over the at least one STI and depositing an interlevel dielectric (ILD) layer over the e-fuse. Additionally, the method includes removing at least a portion of the at least one STI under the e-fuse to provide an air gap below a portion of the e-fuse and removing at least a portion of the ILD layer over the e-fuse to provide the air gap above the portion of the e-fuse. | 2011-02-24 |
20110045645 | HIGH-EFFICIENCY FILLER CELL WITH SWITCHABLE, INTEGRATED BUFFER CAPACITANCE FOR HIGH FREQUENCY APPLICATIONS - A cell based integrated circuit chip includes a top voltage supply rail and a bottom voltage supply rail and a plurality of metal layers defining at least one filler cell. The filler cell is formed by a first field effect transistor of a first type conductivity, typically an n-channel MOSFET. The source or drain electrodes of the n-channel MOSFET are arranged to as act as a capacitor with respect to the bottom voltage supply rail and to which at least one of the source and drain electrodes is connected. A second field effect transistor of anopposite-type conductivity to the first field effect transistor, typically a p-channel MOSFET, is also provided. The source or drain electrodes of the p-channel MOSFET are connected in series between the top voltage supply rail and a gate electrode of the n-channel MOSFET. The gate electrode of the p-channel MOSFET is connected to a source of ground potential via a resistor. | 2011-02-24 |
20110045646 | SELECTIVE DEPOSITION OF SIGE LAYERS FROM SINGLE SOURCE OF SI-GE HYDRIDES - Single-source silyl-germanes hydrides can be used to deposit Gei_xSix seamlessly, conformally and selectively in the “source/drain” regions of prototypical transistors, leading to potentially significant performance gains derived from mobility enhancement, and applications in optoelectronics. Low-temperature heteroepitaxy (300-430° C.) produces monocrystalline microstructures, smooth and continuous surface morphologies and low defect densities. Strain engineering can be achieved by incorporating the entire SiGe content of precursors into the film. | 2011-02-24 |
20110045647 | METHODS OF FORMING NON-VOLATILE MEMORY DEVICES - A non-volatile memory device includes a dielectric layer between a charge storage layer and a substrate. Free bonds of the dielectric layer can be reduced to reduce/prevent charges from leaking through the free bonds and/or from being trapped by the free bonds. As a result, data retention properties and/or durability of a non-volatile memory device may be enhanced. | 2011-02-24 |
20110045648 | METHODS FOR FABRICATING BULK FINFET DEVICES HAVING DEEP TRENCH ISOLATION - Methods are provided for fabricating Bulk FinFET devices having deep trench isolation. One or more deep isolation trenches are formed in a bulk silicon wafer. Mandrel-forming material is deposited overlying the bulk silicon wafer and dielectric pad layer thereon and simultaneously into the trench(es) as filler material. Mandrels are formed, overetching thereof creating a recess at the trench upper end. A conformal sidewall spacer material from which sidewall spacers are fabricated is deposited overlying the mandrels and into the recess forming a spacer overlying the filler material in the trench(es). Mandrels are removed using the spacer as an etch stop. Fin structures are formed from the bulk silicon wafer using the sidewall spacers as an etch mask. The mandrel-forming material is amorphous and/or polycrystalline silicon. | 2011-02-24 |
20110045649 | METHOD FOR MANUFACTURING TWIN BIT STRUCTURE CELL WITH Al2O3/NANO-CRYSTALLINE Si LAYER - A method and system for forming a non-volatile memory structure. The method includes providing a semiconductor substrate and forming a gate dielectric layer overlying a surface region of the semiconductor substrate. A polysilicon gate structure is formed overlying the gate dielectric layer. The method subjects the polysilicon gate structure to an oxidizing environment to cause formation of a first silicon oxide layer overlying the polysilicon gate structure and formation of an undercut region underneath the polysilicon gate structure. An aluminum oxide material is formed overlying the polysilicon gate structure filling the undercut region. In a specific embodiment, the aluminum oxide material has a nanocrystalline silicon material sandwiched between a first aluminum oxide layer and a second aluminum oxide layer. The aluminum oxide material is subjected to a selective etching process while maintaining the aluminum oxide material in an insert region in a portion of the undercut region. The method forms a sidewall structure overlying a side region of the polysilicon gate structure. | 2011-02-24 |
20110045650 | Method of manufacturing semiconductor device - A method of manufacturing a semiconductor device may include, but is not limited to the following processes. First and second electrodes are formed in a first insulating film over a semiconductor substrate. The first and second electrodes upwardly extend from the semiconductor substrate. The first and second electrodes have first and second upper portions protruding from an upper surface of the first insulating film, respectively. A support film, which covers the upper surface of the first insulating film and the first and second upper portions, is formed. The support film is patterned so that a remaining portion of the support film connects the first and second upper portions. The first insulating film is removed while the remaining portion mechanically supports the first and second electrodes. | 2011-02-24 |
20110045651 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF - A method includes the steps of: introducing insulation film into a trench to provide a trench isolation; planarizing the trench isolation to expose a passivation film; and removing the passivation film and depositing a second silicon layer on a first silicon layer and the trench isolation; and in the step of depositing the first silicon layer the first silicon layer is an undoped silicon layer and in the step of depositing the second silicon layer the second silicon layer is a doped silicon layer or an undoped silicon layer subsequently having an impurity introduced thereinto or the like and thermally diffused through subsequent thermal hysteresis into the first silicon layer. | 2011-02-24 |
20110045652 | TECHNIQUES TO REDUCE SUBSTRATE CROSS TALK ON MIXED SIGNAL AND RF CIRCUIT DESIGN - An integrated circuit has a buried insulation layer formed over a semiconductor substrate, and a semiconductor mesa formed over the buried insulation layer. A low resistivity guard ring substantially surrounds the semiconductor mesa and is in contact with the semiconductor substrate. The low resistivity guard ring is grounded and isolates the semiconductor mesa from RF signals. | 2011-02-24 |
20110045653 | BONDING METHOD AND BONDING APPARATUS - [Object] To facilitate bonding of articles at a low temperature without degrading electrical contact between the articles. | 2011-02-24 |
20110045654 | GERMANIUM LAYER POLISHING - In order to polish a layer of germanium ( | 2011-02-24 |
20110045655 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MANUFACTURING APPARATUS OF THE SAME - Instead of forming a semiconductor film by bonding a bond substrate (semiconductor substrate) to a base substrate (supporting substrate) and then separating or cleaving the bond substrate, a bond substrate is separated or cleaved at a plurality of positions to form a plurality of first semiconductor films (mother islands), and then the plurality of first semiconductor films are bonded to a base substrate. Subsequently, the plurality of first semiconductor films each are partially etched, whereby one or more second semiconductor films (islands) are formed using one of the first semiconductor films and a semiconductor element is manufactured using the second semiconductor films. The plurality of first semiconductor films are bonded to the base substrate based on a layout of the second semiconductor films so as to cover at least a region in which the second semiconductor films of the semiconductor element are to be formed. | 2011-02-24 |
20110045656 | SYSTEM AND PROCESS FOR DICING INTEGRATED CIRCUITS - An assembly for cutting a plurality of substrates into individual integrated circuit units includes a first block for receiving a first substrate. The first block is movable between a first loading position, a first alignment inspection station and a first cutting zone. A second block for receiving a second substrate is movable between a second loading position, a second alignment inspection station and a second cutting zone. A cutting device for cutting a substrate into individual integrated circuit units is movable between the first cutting zone and the second cutting zone. An alignment inspection device for determining the alignment of a substrate positioned on either the first or second block is movable between the first alignment inspection station and the second alignment inspection station. | 2011-02-24 |
20110045657 | METHOD FOR FABRICATING REWRITABLE THREE-DIMENSIONAL MEMORY DEVICE - A method for fabricating a three-dimensional semiconductor memory device including three-dimensionally arranged transistors includes forming a thin film structure comprising a plurality of thin films on a semiconductor substrate, patterning the thin film structure such that a penetration region is formed to expose the semiconductor substrate, forming a polycrystalline semiconductor layer to cover the resultant structure where the penetration region is formed, patterning the semiconductor layer to locally form a semiconductor pattern within the penetration region, and performing a post-treatment process to treat the semiconductor layer or the semiconductor pattern with a post-treatment material containing hydrogen or deuterium. | 2011-02-24 |
20110045658 | METHOD FOR FABRICATING A SEMI-POLAR NITRIDE SEMICONDUCTOR - A method for fabricating a semi-polar nitride semiconductor is disclosed, comprising following steps: firstly, a (001) substrate tilted at 7 degrees and having a plurality of V-like grooves is provided, and tilted surfaces of the V-like groove are a (111) surface at 61.7 degrees and a ( | 2011-02-24 |
20110045659 | SEMICONDUCTOR BUFFER ARCHITECTURE FOR III-V DEVICES ON SILICON SUBSTRATES - A composite buffer architecture for forming a III-V device layer on a silicon substrate and the method of manufacture is described. Embodiments of the present invention enable III-V InSb device layers with defect densities below 1×10 | 2011-02-24 |
20110045660 | Large-Area Nanoenabled Macroelectronic Substrates and Uses Therefor - A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed to have a sufficient density of nanowires to achieve an operational current level. A plurality of semiconductor regions are defined in the thin film of nanowires. Contacts are formed at the semiconductor device regions to thereby provide electrical connectivity to the plurality of semiconductor devices. Furthermore, various materials for fabricating nanowires, thin films including p-doped nanowires and n-doped nanowires, nanowire heterostructures, light emitting nanowire heterostructures, flow masks for positioning nanowires on substrates, nanowire spraying techniques for depositing nanowires, techniques for reducing or eliminating phonon scattering of electrons in nanowires, and techniques for reducing surface states in nanowires are described. | 2011-02-24 |
20110045661 | METHOD FOR MANUFACTURING NANO-CRYSTALLINE SILICON MATERIAL FOR SEMICONDUCTOR INTEGRATED CIRCUITS - A method for forming a nanocrystalline silicon structure for the manufacture of integrated circuit devices, e.g., memory, dynamic random access memory, flash memory, read only memory, microprocessors, digital signal processors, application specific integrated circuits. In a specific embodiment, the present invention includes providing a semiconductor substrate including a surface region. The method includes forming an insulating layer (e.g., silicon dioxide, silicon nitride, silicon oxynitride) overlying the surface region according to a specific embodiment. The method includes forming an amorphous silicon material of a determined thickness of less than twenty nanometers overlying the insulating layer. The method includes subjecting the amorphous silicon material to a thermal treatment process to cause formation of a plurality of nanocrsytalline silicon structures derived from the thickness of amorphous silicon material less than twenty nanometers. | 2011-02-24 |
20110045662 | LOW-TEMPERATURE FORMATION OF LAYERS OF POLYCRYSTALLINE SEMICONDUCTOR MATERIAL - The present invention provides a method for forming a layer ( | 2011-02-24 |
20110045663 | Field-effect transistor and method for fabricating the same - A field-effect transistor that increases the operation speeds of complementary field-effect transistors. Each of an nMOSFET and a pMODFET has a Ge channel and source and drain regions formed of an NiGe layer. The height of Schottky barriers formed at a junction between a channel region and the source region of the nMOSFET and at a junction between the channel region and the drain region of the nMOSFET is changed by very thin high-concentration segregation layers formed by making As atoms, Sb atoms, S atoms or the like segregate at the time of forming the NiGe layer. As a result, Schottky barrier height suitable for the nMOSFET and the pMODFET can be obtained, this being capable of realizing high-speed CMOSFETS. | 2011-02-24 |
20110045664 | TRANSISTOR STRUCTURE HAVING A TRENCH DRAIN - A semiconductor device is formed having a trench adjacent to a current carrying region of the device. The trench is formed having a depth greater than the depth of a tub region of the device. Increasing the trench depth moves a region of higher field strength from the tub region to a region along the trench. The region along the trench does not have a junction and may withstand the higher field strength. | 2011-02-24 |
20110045665 | REDUCING THE CREATION OF CHARGE TRAPS AT GATE DIELECTRICS IN MOS TRANSISTORS BY PERFORMING A HYDROGEN TREATMENT - By performing a heat treatment on the basis of a hydrogen ambient, exposed silicon-containing surface portions may be reorganized prior to the formation of gate dielectric materials. Hence, the interface quality and the material characteristics of the gate dielectrics may be improved, thereby reducing negative bias temperature instability effects in highly scaled P-channel transistors. | 2011-02-24 |
20110045666 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device, including forming gate patterns over a substrate, forming conductive layer covering top and sidewalls of each gate pattern, forming a metal layer for a silicidation process over the conductive layer, and silicifying the conductive layer and the gate patterns using the metal layer. | 2011-02-24 |
20110045667 | Gate of a transistor and method of forming the same - A gate of a transistor includes a gate oxide layer formed on a semiconductor device, a first conductive layer pattern including polysilicon doped with boron and formed on the gate oxide layer, a diffusion preventing layer pattern including amorphous silicon formed by a chemical vapor deposition process using a reaction gas having trisilane (Si | 2011-02-24 |
20110045668 | Method of manufacturing wafer level device package - There is provided a method of manufacturing a wafer level device package, the method including: forming a conductive pad on at least one area of a substrate; forming a first insulation layer on the substrate, the first insulation layer having an opening allowing the conductive pad to be exposed; forming a wiring layer connected to the conductive pad on the first insulation layer; forming a conductive diffusion barrier layer on the wiring layer to seal the wiring layer; forming a second insulation layer on the diffusion barrier layer, the second insulation layer having a contact hole allowing a part of diffusion barrier layer to be exposed; and forming a bump pad in the contact hole. This method allows for a reduction in processing time and costs by substituting a simple electroless plating process for a complicated photolithography process in the formation of the bump pad and the diffusion barrier layer. | 2011-02-24 |
20110045669 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The method of manufacturing a semiconductor device according to the present invention includes: an insulating layer forming step of forming an insulating layer made of an insulating material containing Si and O; a groove forming step of forming a groove in the insulating layer; a metal film applying step of covering the inner surface of the groove with a metal film made of MnO | 2011-02-24 |
20110045670 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE FOR PREVENTING OCCURRENCE OF SHORT CIRCUIT BETWEEN BIT LINE CONTACT PLUG AND STORAGE NODE CONTACT PLUG - A method for manufacturing a semiconductor device includes the steps of forming a plug on a semiconductor substrate, forming an insulation layer over the semiconductor substrate having the plug formed thereon, defining a line type trench through a first etching of a partial thickness of the insulation layer; and defining a contact hole through a second etching of a portion of the insulation layer corresponding to the bottom of the trench so as to expose the plug. | 2011-02-24 |
20110045671 | COMPOSITION FOR POLISHING SURFACES OF SILICON DIOXIDE - A composition for polishing surfaces comprises the following components:
| 2011-02-24 |
20110045672 | MULTI-FILM STACK ETCHING WITH POLYMER PASSIVATION OF AN OVERLYING ETCHED LAYER - A method and apparatus for plasma etching a workpiece, such as a semiconductor wafer, including a thin film stack having a top film disposed over a bottom film with an intervening middle film there between. Etch selectivity between the top and bottom films may be as low as between 1:1 and 2:1 and a first carbon-lean gas chemistry is used to etch through the top film, a second carbon-lean gas chemistry is used to etch through the middle film, and the bottom film is etched through by alternating between depositing a polymer passivation on the top film using a carbon-rich gas chemistry and an etching of the bottom film with a third carbon-lean gas chemistry, which may be the same as the first carbon-lean gas chemistry. | 2011-02-24 |
20110045673 | METHOD FOR MANUFACTURING A SILICON SURFACE WITH PYRAMIDAL TEXTURE - The invention relates to a method for manufacturing a silicon surface with a pyramidal structure, in which a silicon wafer containing the silicon surface is dipped into an etching solution. To produce a pyramidal structure that is as homogeneous as possible, according to the invention it is proposed that the silicon surface be treated with ozone prior to coming into contact with the etching solution. | 2011-02-24 |
20110045674 | METHOD AND APPARATUS FOR INLINE DEPOSITION OF MATERIALS ON A NON-PLANAR SURFACE - In manufacturing a semiconductor device, a first chamber is provided. An opening couples the first chamber to a first environment through which at least one substrate can pass. A first seal environmentally isolates the first chamber from the first environment. A process chamber is coupled to the first chamber. Another seal environmental isolates the first and the process chambers. The substrate is placed within the first chamber, and the first chamber and the outside environment are isolated. The second opening is opened, and the substrate moves into the semiconductor process chamber. The first chamber is again environmentally isolated from the second volume. A semiconductor processing step is performed on the substrate within the processing chamber. While the substrate is processed, the substrate is rotated and translated through the processing chamber. | 2011-02-24 |
20110045675 | SUBSTRATE PROCESSING APPARATUS AND PRODUCING METHOD OF SEMICONDUCTOR DEVICE - Disclosed is a substrate processing apparatus, comprising a processing chamber, a holder to hold at least a plurality of product substrates, a heating member, a supplying member to alternately supply at least a first reactant and a second reactant, and a control unit, wherein the control unit executes forming thin films on the substrates by supplying the first reactant, removing a surplus of the first reactant after the first reactant has been adsorbed on the product substrates, subsequently supplying the second reactant, to cause the second reactant to react with the first reactant adsorbed on the substrates, and executes the forming the thin films in a state where a number of the product substrates is insufficient when a number of the product substrates is less than a maximum number of the product substrates which can be held by the holder. | 2011-02-24 |
20110045676 | REMOTE PLASMA SOURCE SEASONING - Methods of seasoning a remote plasma system are described. The methods include the steps of flowing a silicon-containing precursor into a remote plasma region to deposit a silicon containing film on an interior surface of the remote plasma system. The methods reduce reactions with the seasoned walls during deposition processes, resulting in improved deposition rate, improved deposition uniformity and reduced defectivity during subsequent deposition. | 2011-02-24 |
20110045677 | ROTATING PLUG ADAPTOR WITH INTEGRAL TWO BLADE AND GROUNDING POST RECEPTACLE - A rotating plug adapter includes a housing including a top and bottom coupled to freely rotate about a rotary cap disposed between the housing top and bottom. Right and left electrical spades and an optional grounding post extend from the rotary cap, A receptacle, integral to the periphery of the housing, which accepts an electrical plug may be selectively oriented at a wall receptacle by rotating the adapter housing and receptacle to a desired orientation about an axis perpendicular to the wall. Internal flanges define grooves in which rotary electrical contacts are maintained through rotation of the housing and integral receptacle. | 2011-02-24 |
20110045678 | MICRO ELECTROMECHANICAL SYSTEM CONNECTOR AND METHOD FOR MANUFACTURING SAME - A micro electromechanical system connecter includes a u-shaped plug connecter and a socket connector. The plug connecter includes two opposite substrates and a spacing element sandwiched therebetween and positioned at one ends of the two substrates. Two parallel grooves are defined in outer surfaces of the two substrates at the other ends the two substrates. A plurality of parallel first electrodes formed on the outer surfaces of the two substrates and configured to extend along a direction perpendicular to grooves. The socked connecter includes a base having a top surface. A recess is defined in the top surface. Two protrusions are respectively formed on two internal walls of the recess adjacent to the entrance of the recess. A plurality of parallel second electrodes formed on the base according to the first electrodes. Each second electrode extends from the top surface of the base to one of the two internal walls of the recess. | 2011-02-24 |
20110045679 | ELECTRICAL TERMINAL AND BOARD-TO-BOARD CONNECTOR WITH THE ELECTRICAL TERMINAL - An electrical terminal is adapted for being mounted in a connector. The electrical terminal includes an elastic portion of a substantially U-shape which includes a fastening arm and a contact arm spaced from the fastening arm, and a soldering tail connected with a free end of the fastening arm. The contact arm defines a contact area back to the fastening arm for electrically contacting an external mating terminal. The contact area includes a plurality of concave fillisters and contact ribs parallel one another to be alternately arranged and each extended at an incline to an inserting direction of the external mating terminal so that ensures a firm contact between the electrical terminal and the mating terminal. | 2011-02-24 |
20110045680 | PLUG SYSTEM FOR SURGICAL DEVICES - A plug system for surgical devices includes a plurality of sockets into which connecting plugs of electrosurgical instruments can be inserted, and a switching matrix having a plurality of switches for connecting at least one of the sockets to at least two different outputs or inputs of an electrosurgery device. A control system having a preselection device for controlling the switching matrix is arranged in the plug system. The switching matrix connects predetermined sockets to predetermined inputs or outputs, depending on data input into the preselection device. | 2011-02-24 |
20110045681 | ELECTRICAL CONNECTOR - An electrical connector includes a plastic base and an engaging member. The base has a longitudinally extended connection slot to be connected to a circuit board having one side formed with a notch. The engaging member disposed on one side of the base has an elastic arm, which has a handle, a guide-in inclined surface, an engaging portion and an elastic member. When the circuit board is inserted into the slot, the one side thereof presses the guide-in inclined surface to make the arm elastically move outwardly. When the arm elastically moves back, the engaging portion engages with the notch. When the handle is moved to make the arm elastically move outwardly and to disengage the engaging portion from the notch, the elastic member can stop the engaging member from elastically moving back to engage with the notch, so that the circuit board can be conveniently taken out. | 2011-02-24 |
20110045682 | BURN-IN SOCKET CONNECTOR - A socket connector ( | 2011-02-24 |
20110045683 | CONNECTOR LOCKING DEVICE - Embodiments of the present invention relate to a connector locking device for network cables and methods of utilizing the same. In one embodiment of the present invention, a self-releasing connector locking device comprises a locking tongue support for supporting a locking tongue of a connector, a first retaining mechanism for engaging a portion of a body of a terminal, and a first release arm for releasing the retaining mechanism from the portion of the body of the terminal. | 2011-02-24 |
20110045684 | EXTRACTION PREVENTING DEVICE FOR CONNECTOR - A connector containing member on an electrical junction box is provided on an inner surface with a connector latching projection. A flexible piece being latched protrudes from a housing outer surface of a connector fitted in the connector containing member. A projection being latched that is provided on the piece being latched is locked on the connector latching projection. A cover attaching portion protrudes from a peripheral edge along one side of the connector containing member at the projecting side of the connector latching projection. A cover is secured to a cover attaching portion by screws after the connector is fitted in the connector containing member. The cover includes an interfering rib that protrudes outward from a connector receiving port, and a latching holder that is bent from a distal end of the interfering rib and is inserted into a clearance between the housing outer surface of the connector and the piece being latched. | 2011-02-24 |
20110045685 | Electrical Connector Assembly - An electrical connector assembly, which can easily disengage a first connector from a second connector without damaging constructional elements when excessive rotational moment is exerted on the one connector when connected to the second connector, is provided. The electrical connector assembly includes a first connector and a second connector that connect with each other. The first connector includes a first housing, a first contact, and a latch. The second connector includes a second housing having a second contact and a shell attached to the second housing so as to cover the second housing. | 2011-02-24 |
20110045686 | SYSTEMS AND METHODS FOR POWER CONNECTION - The invention provides systems and methods for power connection, which may be a sealed power connection. The sealed power connection may be used with an electric machine or any device that may require electrical and/or mechanical connection for power. The sealed power connection may provide an effective electrical connection while providing a robust mechanical connection. The electric machine or device may be fluid-sealed and/or fluid-cooled. The sealed power connection may provide for electrical insulation of the connection from the machine or device enclosure, and may also be sealed to provide for fluid sealing and/or internal fluid cooling of the electric machine or device, as well as fluid cooling of the connection. | 2011-02-24 |
20110045687 | ELECTRICAL CONNECTOR ASSEMBLY FOR FACILITATING HEAT DISSIPATION - An electrical connector assembly ( | 2011-02-24 |
20110045688 | CABLE CONNECTION GUIDING METHOD AND APARATUS FOR IMPLEMENTING METHOD THEREOF - A cable connection guiding method includes the steps of extracting conductor identification information being used to identify a conductor from a RFID tag connected to the conductor of a cable, and indicating a terminal indicating device associated with an obtained terminal, according to terminal identification information. | 2011-02-24 |
20110045689 | POWER SUPPLY DEVICE WITH A POWER OUTPUT ASSEMBLY - A power supply device with a power output assembly for computers and other peripherals comprises a power supply having a circuit board and a casing plate; the casing plate being formed with at least one assembly hole; a first output module and a second output module installed to the power supply; the second output module including a substrate, at least one slot and at least one conductive wire; the second output module passing through the assembly hole of the casing plate; the second output module being made of transparent material and being positioned on the substrate; and at least one light-emitting element installed on the substrate and aside the second output module. When the second output module is combined to the substrate, light from the light-emitting element passing through the second output module and emitting out from the joint of the conductive wire. | 2011-02-24 |
20110045690 | ALIGNABLE ELECTRIC CONNECTOR, AN ELECTRIC CONNECTOR SYSTEM, AND A METHOD FOR CONNECTING AN ALIGNABLE ELECTRIC CONNECTOR WITH A SECOND ELECTRIC CONNECTOR - The present invention relates to an alignable electric connector ( | 2011-02-24 |
20110045691 | EASILY INSTALLABLE NETWORK WIRING DEVICE - An easily installable network wiring device includes a sliding cable hub body and a fixed frame. The sliding cable hub body includes a front panel and the sliding cable hub body is installed into the fixed frame through an opening of the fixed frame, and slid horizontally along an edge of the opening, such that two first slide latching portions of the front panel and two corresponding first notches on the opening are disposed alternately with one another, and a positioning portion and a second notch are provided for latching the sliding cable hub body with the fixed frame. Therefore, the sliding cable hub body can be installed onto the fixed frame easily, and achieve the effects of lowering the level of difficulty of the construction, enhancing the stability of the installation, and saving the time required for the construction. | 2011-02-24 |
20110045692 | CONNECTOR ASSEMBLY FOR A COMPRESSIBLE GASKET - A connector assembly for use with a compressible gasket includes a housing having a mating end and a cable end, the housing being configured to hold a contact. The connector assembly also includes a deflectable shroud extending from the housing rearward of the cable end to the compressible gasket. The shroud surrounds a hollow chamber that is configured to receive the compressible gasket. The shroud is deflectable between an expanded state and a collapsed state, wherein a volume of the hollow chamber is reduced when in the collapsed state as compared to the expanded state. The shroud compresses the gasket when in the collapsed state. | 2011-02-24 |
20110045693 | SHIELD CONNECTOR MOUNTING STRUCTURE AND SHIELD CONNECTOR - A shield connector ( | 2011-02-24 |
20110045694 | COAXIAL CONNECTOR - A connector for use in attaching a coaxial cable includes a conducting body having a pair of insulators mounted at the ends of the conducting body. The insulators support the ends of a center pin formed from a conducting material. The ends of the center pin can include contact structures having pairs of front and back contact leaves defining pin-shaped connectors that each provide an area of increased surface contact with a center conducting wire of the coaxial cable to enable larger and more consistent current flows and enhanced radio frequency return loss for the connector. | 2011-02-24 |
20110045695 | FILM-SHAPED ELECTRICALLY CONNECTING BODY AND MANUFACTURING METHOD THEREOF - A film-shaped electrically-connecting body | 2011-02-24 |
20110045696 | CONNECTOR - A connector has an inner housing ( | 2011-02-24 |
20110045697 | WATER STOP STRUCTURE FOR WIRE HARNESS AND METHOD OF FORMING WATER STOP SECTION - A water stop structure is provided for a wire harness connected to an electronic control unit installed in an automotive vehicle or a motorcycle. Terminals mounted on ends of wires constituting the wire harness are inserted and locked for connection in a unit connecting connector to be mated with a connector of the electronic control unit, each wire connected to the unit connecting connector includes a water stop section at a position very close to the connector, and the water stop section is formed by filling a waterproofing agent into clearances between strands of a core exposed part formed by removing an insulation coating covering the core of each wire and coating the core exposed part with a waterproof member. | 2011-02-24 |
20110045698 | EMI connector filter assembly - A connector and cable assembly is disclosed that provides a means to protect another piece of electronic hardware in a system from disruptions due to electromagnetic interference by introducing an appropriate filtering element to the connector filter assembly, external to the affected electronic hardware, eliminating the need to redesign the hardware. The assembly can also accommodate a circuit breaker in one embodiment of the invention. | 2011-02-24 |
20110045699 | ELASTIC MEMBER AND SHIELDED CONNECTOR ASSEMBLY HAVING THE SAME - The present invention relates to an elastic member that is installed outside of a terminal contact portion where a male shielded connector is connected to a female shielded connector, and consequently prevents metal powder generated due to its friction with the male shielded connector or the female shielded connector from intruding into the terminal contact portion, and permits easy connection and detachment of the male shielded connector to/from the female shielded connector and stably maintains the connection between the male shielded connector and the female shielded connector, and a shielded connector assembly having the same. | 2011-02-24 |
20110045700 | WIRE TO BOARD CONNECTOR WITH MULTIPLE CONTACT POINTS - A wire to board connector has improved contact reliability and includes a receptacle connector for mounting to a circuit board and a plug connector with a mating blade for insertion into an opening of the receptacle connector. Both connectors have shields that are formed around their exterior and the receptacle connector has an interior shield member that envelops the insertion opening of the receptacle connector. Individual connect legs are formed with this interior shield member and they are spaced apart from each other widthwise of the insertion opening. A contact spring is disposed within the interior of the receptacle connector to exert a contact force on the mating plug connector. | 2011-02-24 |
20110045701 | SHIELDING CONNECTOR AND WIRE HARNESS - A shielding connector has a housing ( | 2011-02-24 |
20110045702 | ELECTRICAL CABLE CONNECTOR ASSEMBLY WITH IMPROVED WIRE ORGANIZER - An electrical cable connector assembly includes a printed circuit board, a wire organizer comprising a body portion defining a plurality of through holes and a retention slot recessed from an outer surface thereof, and a cable including a plurality of wires protruding through the through holes of the wire organizer for being soldered to the corresponding conductive pads of the printed circuit board, respectively. The printed circuit board has an outer side edge, and a plurality of conductive pads arranged at opposite front and rear ends thereof. The wires The outer side edge of the printed circuit board is retained into the retention slot of the wire organizer for preventing the printed circuit board from moving relative to the wires. | 2011-02-24 |
20110045703 | Card connector capable of scraping - A card connector composed of a base frame, at least one terminal set, and a detective terminal. While a card enters a card space inside of the base frame, it works on and forces a working portion of a working springy piece of the detective terminal toward a passive springy piece of the detective terminal for electric conduction with the same. When the working springy piece is moved to contact the passive springy piece, a scraping portion of the working springy piece contacts and scraps a contact portion of the passive springy piece to force the passive springy piece to deform; meanwhile, the resilience generated by the deformation of the passive springy piece keeps it in contact with the working springy piece. In this way, during the contact, the oxide or stain can be scraped off f to make the contact more perfect to secure the detective accuracy. | 2011-02-24 |
20110045704 | LIGHTING CONNECTOR DEVICES AND USES THEREOF - A multi-way connector connects a plurality of lighting apparatuses together. The multi-way connector comprises: (a) a plurality of lighting connectors, each lighting connector comprising: (i) an upper housing having: plural connector pins, and one or more interlocking grooves; and (ii) a lower housing, the lower housing having a plurality of connector pin guide holes, and one or more interlocking tongue portions, the lower housing being connectable with the upper housing to form each lighting connector by coupling at least one of the one or more interlocking grooves with at least one of the one or more interlocking tongue portions, and by coupling at least one of the plural connector pins with at least one of the connector pin guide holes; (b) a multi-way connecting portion configured to permit power and/or signals to pass between and among the plurality of lighting connectors; and (c) plural flexible connectors electrically connecting an inner side of each lower housing with the multi-way connecting portion. | 2011-02-24 |
20110045705 | ELELCTRICAL CONNECTOR WITH IMPROVED TERMINALS ASSEMBLED TO INSULATIVE HOUSING FROM TOP TO BOTTOM - An electrical connector includes an insulative housing and a plurality of first terminals secured in the housing. The insulative housing includes a base with a front face, a tongue portion extending forwardly from the front face of the base and a plurality of passageways located on a first side face of the insulating housing. The passageways extend from the tongue portion to the base across the front face of the base. The passageways communicate with an exterior through the first side face along a whole length thereof. The plurality of first terminals are received and retained in the passageways. Each first terminal includes a contact portion located on the tongue portion and exposing to the first side face of the tongue portion, a retention portion located on the base portion and a tail portion. | 2011-02-24 |
20110045706 | ELECTRICAL CONNECTOR, CABLE AND APPARATUS UTILIZING SAME - An electrical connector, such as a circuit board connector, includes a first group or subassembly of electrical contacts physically separate from an adjacent and second group or subassembly of contacts. The first group of electrical contacts and second group of electrical contacts each include a row of lower contacts and upper contacts. The second group of electrical contacts has an identical but mirrored configuration as the first group of electrical contacts. | 2011-02-24 |
20110045707 | ELECTRICAL CONNECTOR WITH METALLIC WIRE CONTACTS - An electrical connector includes an insulating housing and contacts made from metallic wire. The insulating housing includes a front portion with a mating cavity and a rear portion. Each contact includes a contacting portion, a leg portion and a connecting portion connecting with the contacting portion and the leg portion. Each leg portion includes a linking portion, a first soldering portion and a second soldering portion. The linking portion connects with the connecting portion and the first soldering portion, and the second soldering portion connects with the first soldering portion. Two soldering portions are on a same plane and parallel to each other. | 2011-02-24 |
20110045708 | ELECTRICAL CONNECTOR - An electrical connector includes a housing to be disposed on a circuit board, a receiving recess portion formed in the housing for receiving a mating connector, and a terminal arranged in the housing. The terminal includes a U-shape portion, an extending portion extending outside the receiving recess portion a first sidewall facing outside, and a connecting portion. The U-shape portion includes a first arm portion and a second arm portion. The first arm portion is fitted along the sidewall and the second arm portion is fitted along a second sidewall. The first arm portion and the second arm portion include locking portions for being fixed against an inner surface of the receiving recess portion, respectively. The extending portion is arranged to be away from the first sidewall to form a space in between. | 2011-02-24 |
20110045709 | ELECTRICAL CONNECTOR WITH A STABLE STRUCTURE - An electrical connector ( | 2011-02-24 |
20110045710 | Electrical connector - The invention relates to an electrical connector for accommodating an electrical conductor or mating connector, having a first plastic section having a first degree of hardness or elasticity, and a second plastic section having a second degree of hardness or elasticity, wherein the first degree of hardness or elasticity and the second degree of hardness or elasticity are different, and the first plastic section cooperates with the second plastic section in order to accommodate the electrical conductor. | 2011-02-24 |
20110045711 | BANANA PLUG - The invention relates to an electrical plug connector, in particular a banana plug, having a base body ( | 2011-02-24 |
20110045712 | FEMALE TERMINAL HARDWARE - A female terminal hardware ( | 2011-02-24 |
20110045713 | CRIMP TERMINAL, TERMINAL-EQUIPPED ELECTRIC WIRE WITH THE CRIMP TERMINAL, AND METHODS FOR PRODUCING THEM - Provided is a crimp terminal designed to be crimped onto an end portion of an electric wire to form a terminal-equipped electric wire, achieving both of ensuring mechanical strength of the terminal-equipped electric wire and reducing a contact resistance between the electric wire and the crimp terminal. The crimp terminal comprises an electric contact section and an electric-wire crimp section to be crimped onto a conductor in the end portion of the electric wire, the crimp terminal being formed of a metal plate which has a copper-containing plate body and a tin-plating layer covering a surface of the plate body. In the crimp terminal, the tin-plating layer has a smaller thickness in a crimp surface region where the electric-wire crimp section is to make contact with the end portion of the electric wire is less than that in an electrical contact surface region where the electric contact section is to make contact with a counterpart terminal. | 2011-02-24 |
20110045714 | ELECTRICAL CONNECTOR ASSEMBLIES - An electrical connector assembly having a wiring harness terminal includes a body and a protrusion. The protrusion extends from the body, and is configured to mate with the wiring harness terminal. The protrusion comprises six sides. Four of the sides have a first length, and two of the sides having a second length that is different from the first length. | 2011-02-24 |
20110045715 | AMPHIBIAN - The present invention provides, with reference to FIG. | 2011-02-24 |
20110045716 | BUOYANT TRACK AMPHIBIOUS TRANSPORTER - An amphibious vehicle for transiting deep or shallow waters and/or the full range of wetland and dry soil environments, consists of a box-like structure with buoyant tracks that are powered to move around the structure. The buoyant tracks encircle the vehicle's length and extend laterally for a substantial portion of the vehicle's width or beam. When operating in water the buoyant tracks provide a majority of the buoyancy keeping the box-like structure above water surface or its tracks can be flooded to submerge the vessel. The amphibious vehicle can transport heavy equipment and personnel from ships located offshore, across undeveloped beaches, to positions ashore. | 2011-02-24 |
20110045717 | Method For System For A Water Jet Propulsion System For A Ship - A system and method of starting a water jet propulsion system for a ship in which the propulsion system includes a stator shell adapted to be mounted to the hull and having a nozzle ending in an outlet with a cross-sectional outlet area, an impeller housing attached to the stator shell and having an upstream inlet, and an impeller rotatably mounted in the impeller housing for receiving water from the inlet and discharging it through the nozzle of the stator shell so as to create a water jet upon rotation of the impeller. The method includes reducing the outlet area by partly closing the nozzle during a start up phase of the water jet propulsion system, wherein there is provided a back flow hindering arrangement arranged to hinder air to enter into the impeller housing via the nozzle. | 2011-02-24 |
20110045718 | MARINE PROPULSION SYSTEM AND METHOD - A marine propulsion system comprises a propulsion wheel that is rotary driven and that includes an arrangement of water-channeling members located to extend only partially below the water level. As a member is partially submerged, water is collected, compressed, accelerated, and ejected as a water jet. An ejection end of each member may be specifically designed to achieve desired thrust characteristics. The water-channeling members may be non-complex, such as being cup-shaped or spoon-shaped, but may include complex curvatures in order to achieve desired thrust characteristics. A hull may be used to precondition the water level presented to the water-channeling members. | 2011-02-24 |
20110045719 | DISCONNECTABLE MOORING ASSEMBLY - A disconnectable mooring assembly for a vessel comprises a mooring buoy and a swivel positioned above the mooring buoy. The mooring buoy is provided with a central member for being anchored to the seabed and comprises a number of passages each adapted for receiving a riser. The mooring buoy further comprises an outer member surrounding the central member and capable of a rotation relative thereto. Said outer member is adapted to be housed in and locked to a corresponding receiving opening of the vessel. The swivel is located above the mooring buoy in such a manner that an interspace is defined between the mooring buoy and the swivel. | 2011-02-24 |
20110045720 | SURFBOARD HAVING A HONEYCOMB CORE - An aquatic gliding board such as a surfboard is constructed using a honeycomb material for the core. The composite outer skin of the surfboard is constructed of materials having similar flexibility properties as found in a traditional foam/fiberglass surfboard. In a particularly preferred embodiment an aluminum honeycomb core is employed along with a fiberglass skin in order to achieve a surfboard with decreased weight and increased strength to resist failure in bending relative to a traditional foam/fiberglass surfboard, but having similar flexibility characteristics to such a traditional surfboard, or having increased flexibility relative to such a traditional surfboard. | 2011-02-24 |
20110045721 | Body board and reinforcing element - A body board ( | 2011-02-24 |
20110045722 | FLOTATION DEVICE - A flotation device includes a hollow body, a container attached to the hollow body and comprising a nozzle extending into the hollow body, and a latching member formed at the hollow body to attach the hollow body to an object requiring flotation. The hollow body and the container respectively contain two chemical materials, such that when the container is pressed, it ejects material therefrom via the nozzle into the hollow body, whereby the material from the container reacts with the material in the hollow body to produce a gas to inflate the hollow body. | 2011-02-24 |
20110045723 | TWO-COMPONENT COMPOSITION FOR PRODUCING FLEXIBLE POLYURETHANE GELCOATS - Two-component composition for producing flexible polyurethane gelcoats The invention relates to the use of a two-component composition which comprises a polyol component, a polyisocyanate component and, as filler, a pyrogenically pre-pared silica which has been hydrophobicized with hexamethyldisilazane (HMDS) and then structurally modified by means of a ball mill, for producing flexible polyurethane gelcoats for epoxy resin and vinyl ester composites. | 2011-02-24 |
20110045724 | Multi-layer composite material - A composite having a first layer and a second layer. The first layer is a nonwoven layer containing high modulus fibers having a modulus of at least 8 GPa and thermoplastic binder fibers, where at least a portion of the high modulus fibers are connected to the binder fibers, and where the first layer has a solidity of between about 10 and 90%. The second layer is a textile layer selected from the group consisting of a knit layer, a woven layer, bidirectional laminates, and a unidirectional layer. The second layer contains high modulus fibers having a modulus of at least 8 GPa in a thermoplastic matrix. | 2011-02-24 |
20110045725 | FILM-FORMING COMPOSITIONS, RELATED PROCESSES AND COATED SUBSTRATES - Film-forming coating compositions are disclosed. The composition comprises a) an epoxy-containing polymer system; and b) a polyacid curing agent comprising two acid functional groups per molecule; wherein the epoxy-containing polymer system comprises: (i) an epoxy resin comprising at least two epoxy functional groups per molecule and which is different from (ii); and (ii) an epoxy functional silsesquioxane. Also disclosed are processes for applying the film-forming composition to a basecoat, and substrates coated in part by a coating deposited from the film-forming compositions. | 2011-02-24 |
20110045726 | SALT WATER SWELLABLE COMPOSITIONS AND ARTICLES - The compositions, articles and methods described herein remain intact for sealing between and around structures that contact salt water. The compositions include: (i) a partially cross-linked polyacrylamide/partially neutralized polyacrylic acid copolymer; (ii) a smectite clay; (iii) an elastomer, e.g., butyl rubber; (iv) a polyolefin polymer or copolymer; and (v) a cationic flocculant, the compositions have exceptional and unexpected free swell and cohesiveness when in contact with high conductivity water or multivalent ion-containing-contaminated water. The articles of manufacture described herein all include a combination of (i) a partially cross-linked acrylamide/acrylate/acrylic acid copolymer; (ii) a smectite clay; (iii) an elastomer, e.g., butyl rubber; (iv) polyisobutene or polyisopropene; and (v) a cationic flocculent, and are used for waterproofing against high conductivity salt-containing water preferably when used in putty-like or paste-like consistency to fill areas between and around structures, e.g., to surround a pipe inserted in a concrete wall, or to seal between two concrete sections. | 2011-02-24 |
20110045727 | Method and Apparatus for Manufacturing Vehicle Parts - The invention relates to a method for manufacturing at least partly plastic vehicle parts in a mold with at least one mold cavity, comprising the steps of at least partly closing the mold, wherein the at least one mold cavity is brought in a first position by means of at least one movable wall part of the at least one mold cavity; introducing plastic into the at least one mold cavity; upon complete closure of the mold and/or movement of the at least one movable wall part, bringing the at least one mold cavity in a second position, the at least one mold cavity in the second position having a different volume than in the first position; all this in such a manner that by bringing the at least one mold cavity from the first into the second position, the plastic fills the respective mold cavity completely. | 2011-02-24 |
20110045728 | Fiber Blends, Yarns And Fabrics Made Thereof - The invention relates to blends of high wet modulus cellulosic fibers and solvent spun cellulosic fibers and yarns and fabrics made thereof. | 2011-02-24 |
20110045729 | SANITARY MATS MADE OF NATURAL FIBRES, METHOD OF OBTAINING SANITARY MATS AND USE OF NATURAL FIBRES TO PRODUCE SANITARY MATS - The subjects of the invention are sanitary mats made of natural fibres, the method of obtaining sanitary mats and use of natural fibres to produce sanitary mats. In order to minimise hazards caused by viruses and bacteria, it is very important to consequently implement the cleaning and disinfection programme, which is aimed to decrease the infection hazard by taking the number of microorganisms present in the environment down below a certain secure level. The mat is used to disinfect vehicle wheels and pedestrian shoes. | 2011-02-24 |
20110045730 | Deposition of Electronic Circuits on Fibers and Other Materials - Fibers, such as textile fibers, having electrical components deposited thereon. More particularly, one or more electrical components are formed directly onto the surface of at least one fiber. The fiber having the electrical component formed thereon may then be interlaced with other fibers to form a larger piece of fabric, which can be employed to produce an article of clothing. A group of transistors and piezoelectric components forming an accelerometer may be woven onto one or more natural or synthetic fibers. The fibers may then be employed as the warp, weft, or both, of a woven piece of fabric, or used to form a knitted piece of fabric. The fabric piece can then be cut and sewn to form a wearable item, such as a shirt, a pair of pants, a hat, or the upper piece of a shoe that includes the accelerometer. | 2011-02-24 |
20110045731 | METHOD OF PRODUCING A SPARK PLUG - To provide a method of producing a spark plug in which a spark discharge gap with a suitable distance can easily be obtained without bending to deform a ground electrode in a direction in which the ground electrode moves towards or away from a metal tip of a center electrode, in the method of producing a spark plug, when a metal tip (a noble metal tip) | 2011-02-24 |