08th week of 2022 patent applcation highlights part 58 |
Patent application number | Title | Published |
20220059402 | FORMATION METHOD OF SEMICONDUCTOR STRUCTURE | 2022-02-24 |
20220059403 | Removing Polymer Through Treatment | 2022-02-24 |
20220059404 | ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT | 2022-02-24 |
20220059405 | Bottom Lateral Expansion of Contact Plugs Through Implantation | 2022-02-24 |
20220059406 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | 2022-02-24 |
20220059407 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059408 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF RECYCLING SUBSTRATE | 2022-02-24 |
20220059409 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059410 | POWER REDUCTION IN FINFET STRUCTURES | 2022-02-24 |
20220059411 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC STRUCTURE | 2022-02-24 |
20220059412 | Method for Patterning a Lanthanum Containing Layer | 2022-02-24 |
20220059413 | OPTIMUM HIGH DENSITY 3D DEVICE LAYOUT AND METHOD OF FABRICATION | 2022-02-24 |
20220059414 | POWER RAILS FOR STACKED SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059415 | AUTOMATED INSPECTION TOOL | 2022-02-24 |
20220059416 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD | 2022-02-24 |
20220059417 | SEMICONDUCTOR CHIP INCLUDING CHIP PAD, REDISTRIBUTION WIRING TEST PAD, AND REDISTRIBUTION WIRING CONNECTION PAD | 2022-02-24 |
20220059418 | TEST CIRCUIT FOR DETECTING PARASITIC CAPACITANCE OF TSV | 2022-02-24 |
20220059419 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR-MODULE DETERIORATION DETECTING METHOD | 2022-02-24 |
20220059420 | SEMICONDUCTOR PACKAGE WITH STIFFENER | 2022-02-24 |
20220059421 | PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME | 2022-02-24 |
20220059422 | THROUGH ELECTRODE SUBSTRATE, MANUFACTURING METHOD THEREOF AND MOUNTING SUBSTRATE | 2022-02-24 |
20220059423 | ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES | 2022-02-24 |
20220059424 | LAMINATE, FILM FORMING METHOD, AND FILM FORMING APPARATUS | 2022-02-24 |
20220059425 | ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES | 2022-02-24 |
20220059426 | METHOD FOR PRODUCING A POWER MODULE UNIT, POWER MODULE UNIT, NETWORK PART AND FREQUENCY CONVERTER | 2022-02-24 |
20220059427 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE-MOUNTED APPARATUS, AND SEMICONDUCTOR DEVICE-MOUNTED APPARATUS | 2022-02-24 |
20220059428 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059429 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | 2022-02-24 |
20220059430 | DISPLAY DEVICE | 2022-02-24 |
20220059431 | HEAT CONDUCTING SHEET AND ELECTRONIC DEVICE USING SAME | 2022-02-24 |
20220059432 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059433 | SEMICONDUCTOR MEMORY DEVICE | 2022-02-24 |
20220059434 | SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA | 2022-02-24 |
20220059435 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | 2022-02-24 |
20220059436 | FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE | 2022-02-24 |
20220059437 | SEMICONDUCTOR PACKAGE | 2022-02-24 |
20220059438 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059439 | SOLDER PRINTING | 2022-02-24 |
20220059440 | SEMICONDUCTOR PACKAGE | 2022-02-24 |
20220059441 | DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR | 2022-02-24 |
20220059442 | INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2022-02-24 |
20220059443 | VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES | 2022-02-24 |
20220059444 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2022-02-24 |
20220059445 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2022-02-24 |
20220059446 | SEMICONDUCTOR DEVICE INCLUDING PLURALITY OF PATTERNS | 2022-02-24 |
20220059447 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | 2022-02-24 |
20220059448 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059449 | STACKED INTEGRATED CIRCUIT DEVICES INCLUDING A ROUTING WIRE | 2022-02-24 |
20220059450 | ELECTRONIC APPARATUS | 2022-02-24 |
20220059451 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH ALLEVIATION FEATURE | 2022-02-24 |
20220059452 | STORAGE SYSTEM INCLUDING A DECOUPLING DEVICE HAVING A PLURALITY OF UNIT CAPACITORS | 2022-02-24 |
20220059453 | TRANSFERING INFORMATIONS ACROSS A HIGH VOLTAGE GAP USING CAPACTIVE COUPLING WITH DTI INTEGRATED IN SILICON TECHNOLOGY | 2022-02-24 |
20220059454 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT VIA STRUCTURES FOR MULTI-LEVEL STEPPED SURFACES AND METHODS FOR FORMING THE SAME | 2022-02-24 |
20220059455 | DRAM CHIPLET STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2022-02-24 |
20220059456 | ANTIFUSE STRUCTURE | 2022-02-24 |
20220059457 | Layout Structure of eFuse Unit | 2022-02-24 |
20220059458 | METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH METAL PLUG HAVING ROUNDED TOP SURFACE | 2022-02-24 |
20220059459 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059460 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059461 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | 2022-02-24 |
20220059462 | SEMICONDUCTOR DEVICE INCLUDING HAVING METAL ORGANIC FRAMEWORK INTERLAYER DIELECTRIC LAYER BETWEEN METAL LINES AND METHODS OF FORMING THE SAME | 2022-02-24 |
20220059463 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH POROUS INSULATING LAYERS | 2022-02-24 |
20220059464 | SEMICONDUCTOR DEVICE WITH GRADED POROUS DIELECTRIC STRUCTURE | 2022-02-24 |
20220059465 | COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSEMBLY | 2022-02-24 |
20220059466 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | 2022-02-24 |
20220059467 | TUNGSTEN ALLOYS IN SEMICONDUCTOR DEVICES | 2022-02-24 |
20220059468 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE WITH AIR GAP | 2022-02-24 |
20220059469 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | 2022-02-24 |
20220059470 | SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME | 2022-02-24 |
20220059471 | SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING THE SAME | 2022-02-24 |
20220059472 | SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME | 2022-02-24 |
20220059473 | PACKAGED SEMICONDUCTOR DEVICES HAVING SPACER CHIPS WITH PROTECTIVE GROOVE PATTERNS THEREIN | 2022-02-24 |
20220059474 | SEMICONDUCTOR MODULE | 2022-02-24 |
20220059475 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | 2022-02-24 |
20220059476 | CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE | 2022-02-24 |
20220059477 | Semiconductor Device Including Bonding Pad Metal Layer Structure | 2022-02-24 |
20220059478 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059479 | DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME | 2022-02-24 |
20220059480 | MEMORY DEVICE INCLUDING PASS TRANSISTORS | 2022-02-24 |
20220059481 | SEMICONDUCTOR STORAGE DEVICE | 2022-02-24 |
20220059482 | SEMICONDUCTOR DEVICES HAVING ADJOINED VIA STRUCTURES FORMED BY BONDING AND METHODS FOR FORMING THE SAME | 2022-02-24 |
20220059483 | CONDUCTIVE PILLAR BUMP AND MANUFACTURING METHOD THEREFORE | 2022-02-24 |
20220059484 | DESIGNS AND METHODS FOR CONDUCTIVE BUMPS | 2022-02-24 |
20220059485 | BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF MANUFACTURING THE SAME | 2022-02-24 |
20220059486 | COPLANAR BUMP CONTACTS OF DIFFERING SIZES | 2022-02-24 |
20220059487 | DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR MANUFACTURING THEREOF | 2022-02-24 |
20220059488 | IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELATED METHOD | 2022-02-24 |
20220059489 | SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING | 2022-02-24 |
20220059490 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2022-02-24 |
20220059491 | Innovative Interconnect Design for Package Architecture to Improve Latency | 2022-02-24 |
20220059492 | SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY | 2022-02-24 |
20220059493 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2022-02-24 |
20220059494 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059495 | SEMICONDUCTOR DEVICE | 2022-02-24 |
20220059496 | ELECTRONIC DEVICE AND METHOD OF TRANSFERRING ELECTRONIC ELEMENT USING STAMPING AND MAGNETIC FIELD ALIGNMENT | 2022-02-24 |
20220059497 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2022-02-24 |
20220059498 | CHIP PACKAGE STRUCTURE | 2022-02-24 |
20220059499 | HIGH BANDWIDTH MODULE | 2022-02-24 |
20220059500 | STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES | 2022-02-24 |
20220059501 | SEMICONDUCTOR DEVICE IN 3D STACK WITH COMMUNICATION INTERFACE AND MANAGING METHOD THEREOF | 2022-02-24 |