09th week of 2010 patent applcation highlights part 29 |
Patent application number | Title | Published |
20100055868 | Method of forming insulation layer of semiconductor device and method of forming semiconductor device using the insulation layer - A method of forming an insulating layer of a semiconductor device, the method including preparing a semiconductor substrate having a plurality of structures and gaps between adjacent structures, forming an insulating layer for oxygen supply on the semiconductor substrate, forming an SOG (spin-on-glass) layer on the insulating layer for oxygen supply to fill the gaps, and curing the SOG layer, wherein the insulating layer for oxygen supply supplies oxygen to the SOG layer during curing of the SOG layer. | 2010-03-04 |
20100055869 | Semiconductor device and method of manufacturing same - A method of manufacturing a semiconductor device comprises forming a trench in a semiconductor substrate, forming a first insulating film having a first recessed portion in the trench, forming a coating film so as to fill the first recessed portion therewith, transforming the coating film into a second insulating film, planarizing the second insulating film to expose the first insulating film and the second insulating film, removing at least the second insulating film from the first recessed portion to moderate an aspect ratio for the first recessed portion formed in the trench, thereby forming a second recessed portion therein, and forming a third insulating film on a surface of the semiconductor substrate so as to fill the second recessed portion therewith. | 2010-03-04 |
20100055870 | MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a manufacturing method of a semiconductor substrate and a manufacturing method of a semiconductor device, which prevent reduction in breakdown voltage of a gate oxide film of a device formed in a semiconductor substrate to improve a reliability of the gate oxide film. A manufacturing method of a semiconductor substrate according to the present invention includes: exposing a silicon surface of an active layer substrate | 2010-03-04 |
20100055871 | MEMORY IN LOGIC CELL - Methods, devices, and systems for a memory in logic cell are provided. One or more embodiments include using a cell structure having a first gate, a second gate, and a third gate, e.g., a control gate, a back gate, and a floating gate, as a memory in logic cell. The method includes programming the floating gate to a first state to cause the memory in logic cell to operate as a first logic gate type. The method further includes programming the floating gate to a second state to cause the memory in logic cell to operate as a second logic gate type. | 2010-03-04 |
20100055872 | METHOD FOR MANUFACTURING SEMICONDUCTOR LAYER AND SEMICONDUCTOR DEVICE - An object is that a region separated from a semiconductor substrate when a supporting substrate is larger than the semiconductor substrate does not easily move. A method for manufacturing a semiconductor layer includes the steps of: irradiating a plurality of semiconductor substrates with ions to form embrittlement layers in the plurality of semiconductor substrates; forming bonding layers on respective surfaces of the plurality of semiconductor substrates; placing, over a supporting substrate, the surfaces of the plurality of semiconductor substrates on which the bonding layers are formed; placing a cover including depressed portions which house the plurality of semiconductor substrates over the plurality of semiconductor substrates; and heating the plurality of semiconductor substrates housed in the depressed portions of the cover, and thereby collecting semiconductor layers fixed to the supporting substrate, and regions separated from the plurality of semiconductor substrates along with the embrittlement layers. | 2010-03-04 |
20100055873 | LED-LASER LIFT-OFF METHOD - The present invention discloses an LED-laser lift-off method, which applies to lift off a transient substrate from an epitaxial layer grown on the transient substrate after a support substrate having an adhesion metal layer is bonded to the epitaxial layer. Firstly, the epitaxial layer is etched to define separation channels around each chip section, and the epitaxial layer between two separation channels is not etched but preserved to form a separation zone. Each laser illumination area only covers one illuminated chip section, the separation channels surrounding the illuminated chip section, and the separation zones surrounding the illuminated chip section. Thus, the adhesion metal layer on the separation channels is only heated once. Further, the outward stress generated by the illuminated chip section is counterbalanced by the outward stress generated by the illuminated separation zones, and the stress-induced structural damage on the chip section is reduced. | 2010-03-04 |
20100055874 | Layer transfer of films utilizing controlled propagation - A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled to achieve controlled propagation by either KII or energy propagation control. According to certain embodiments, an in-plane shear component (KII) is maintained near zero by adiabatic heating of silicon through exposure to E-beam radiation. According to other embodiments, a surface heating source in combination with an implanted layer serves to guide fracture propagation through the cleave sequence. | 2010-03-04 |
20100055875 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER - In a laser processing step S | 2010-03-04 |
20100055876 | Laser processing method and laser processing apparatus - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 2010-03-04 |
20100055877 | WAFER PROCESSING METHOD - Disclosed herein is a wafer processing method for dividing a wafer along a plurality of streets. The wafer processing method includes a back grinding step of grinding the back side of the wafer in an area corresponding to a device area to thereby reduce the thickness of the device area to a predetermined finished thickness and to simultaneously form an annular reinforcing portion on the back side of the wafer in an area corresponding to a peripheral marginal area, a wafer supporting step of attaching the back side of the wafer to a dicing tape, a kerf forming step of cutting the front side of the wafer along each street to thereby form a kerf having a depth corresponding to the thickness of the device area along each street, thereby dividing the device area into individual devices, and a peripheral marginal area removing step of peeling off the peripheral marginal area from the dicing tape. | 2010-03-04 |
20100055878 | Fabrication Method of Semiconductor Device - A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes. | 2010-03-04 |
20100055879 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A wafer is mounted on the top surface of the stage having an electrostatic chuck function, and the wafer at 50° C. or more is cooled to a temperature lower than 50° C. In this step, the voltage to be applied to the internal electrode provided in the stage is raised stepwise to gradually increase the contact area between the back surface of the wafer and the top surface of the stage. Finally, a chuck voltage is applied to the internal electrode, so that the entire back surface of the wafer is uniformly attracted to the top surface of the stage. This reduces damage occurring in the top surface of the stage due to rubbing between the back surface of the wafer and the top surface of the stage. | 2010-03-04 |
20100055880 | SELECTIVE GROWTH OF POLYCRYSTALLINE SILICON-CONTAINING SEMICONDUCTOR MATERIAL ON A SILICON-CONTAINING SEMICONDUCTOR SURFACE - A method of depositing polycrystalline silicon exclusively on monocrystalline first silicon surface portions of a substrate surface which besides the first surface portions additionally has insulator surface portions, comprising the steps of depositing boron on the first silicon surface portions in an amount which in relation to the first silicon surface portions respectively corresponds to more than a monolayer of boron, and depositing silicon on the first silicon surface portions treated in that way. | 2010-03-04 |
20100055881 | HEAT TREATMENT METHOD FOR COMPOUND SEMICONDUCTOR AND APPARATUS THEREFOR - A heat treatment method for compound semiconductors includes a step for placing an object to be treated on a stage in a process chamber, and a step for irradiating the surface of the object with an electromagnetic wave having a specific frequency by introducing the electromagnetic wave into the process chamber. A compound semiconductor is heat-treated by the electromagnetic wave irradiated upon the surface of the object to be treated. | 2010-03-04 |
20100055882 | Junction Termination Extension with Controllable Doping Profile and Controllable Width for High-Voltage Electronic Devices - Methods for producing a junction termination extension surrounding the edge of a cathode or anode junction in a semiconductor substrate, where the junction termination extension has a controlled arbitrary lateral doping profile and a controlled arbitrary lateral width, are provided. A photosensitive material is illuminated through a photomask having a pattern of opaque and clear spaces therein, the photomask being separated from the photosensitive material so that the light diffuses before striking the photosensitive material. After processing, the photosensitive material so exposed produces a laterally tapered implant mask. Dopants are introduced into the semiconductor material and follow a shape of the laterally tapered implant mask to create a controlled arbitrary lateral doping profile and a controlled lateral width in the junction termination extension in the semiconductor. | 2010-03-04 |
20100055883 | GROUP III-NITRIDE SEMICONDUCTOR THIN FILM, METHOD FOR FABRICATING THE SAME, AND GROUP III-NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE - Disclosed herein is a high-quality group III-nitride semiconductor thin film and group III-nitride semiconductor light emitting device using the same. To obtain the group III-nitride semiconductor thin film, an AlInN buffer layer is formed on a (1-102)-plane (so called r-plane) sapphire substrate by use of a MOCVD apparatus under atmospheric pressure while controlling a temperature of the substrate within a range from 850 to 950 degrees Celsius, and then, GaN-based compound, such as GaN, AlGaN or the like, is epitaxially grown on the buffer layer at a high temperature. The group III-nitride semiconductor light emitting device is fabricated by using the group III-nitride semiconductor thin film as a base layer. | 2010-03-04 |
20100055884 | MANUFACTURING METHOD FOR SILICON WAFER - In a manufacturing method for a silicon wafer, a first heat treatment process is performed on the silicon wafer while introducing a first gas having an oxygen gas in an amount of 0.01 vol. % or more and 1.00 vol. % or less and a rare gas, and a second heat treatment process is performed while stopping introducing the first gas and introducing a second gas having an oxygen gas in an amount of 20 vol. % or more and 100 vol. % or less and a rare gas. In the first heat treatment process, the silicon wafer is rapidly heated to first temperature of 1300° C. or higher and a melting point of silicon or lower at a first heating rate, and kept at the first temperature. In the second heat treatment process, the silicon wafer is kept at the first temperature, and rapidly cooled from the first temperature at a first cooling rate. | 2010-03-04 |
20100055885 | METHOD OF MAKING LOW WORK FUNCTION COMPONENT - A method for fabricating a component is disclosed. The method includes: providing a member having an effective work function of an initial value, disposing a sacrificial layer on a surface of the member, disposing a first agent within the member to obtain a predetermined concentration of the agent at said surface of the member, annealing the member, and removing the sacrificial layer to expose said surface of the member, wherein said surface has a post-process effective work function that is different from the initial value. | 2010-03-04 |
20100055886 | SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a mask layer on a first-conductivity-type semiconductor substrate, etching the semiconductor substrate using the mask layer as a mask, thereby forming a projecting semiconductor layer, forming a first insulating layer on the semiconductor substrate to cover a lower portion of the projecting semiconductor layer, doping a first-conductivity-type impurity into the first insulating layer, thereby forming a high-impurity-concentration layer in the lower portion of the projecting semiconductor layer, forming gate insulating films on side surfaces of the projecting semiconductor layer which upwardly extend from an upper surface of the first insulating layer, and forming a gate electrode on the gate insulating films and on the first insulating film. | 2010-03-04 |
20100055887 | Laser Diffusion Fabrication of Solar Cells - A method of semiconductor junction formation in Laser diffusion process for fabrication of solar cells provides for delivery of inert gases in the vicinity of the Si wafer while dopant species are being diffused form a dopant source into the surface of the wafer irradiated by a laser beam. The laser beam is emitted by CW- or pulsed operated lasers including fiber lasers. Optionally, the passivation of the surface and formation of the antireflection coating are performed simultaneously with the diffusion of the dopant species. | 2010-03-04 |
20100055898 | METHOD FOR FABRICATING AN INTEGRATED CIRCUIT - A method for fabricating an integrated circuit is provided. A substrate having thereon a first conductive wire and a second conductive wire is provided. A liner is formed on the first conductive wire and second conductive wire. An ashable material layer is filled into a gap between the first conductive wire and second conductive wire. The ashable material layer is then polished to expose a portion of the liner. A cap layer is formed on the ashable material layer and on the exposed liner. A through hole is etched into the cap layer to expose a portion of the ashable material layer. Thereafter, the ashable material layer is removed by way of the through hole. | 2010-03-04 |
20100055899 | PARTICLE REDUCTION IN PECVD PROCESSES FOR DEPOSITING LOW-K MATERIAL BY USING A PLASMA ASSISTED POST-DEPOSITION STEP - When forming dielectric materials of reduced dielectric constant in sophisticated metallization systems, the creation of defect particles on the dielectric material may be reduced during a plasma enhanced deposition process by inserting an inert plasma step after the actual deposition step. | 2010-03-04 |
20100055900 | MASK AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A mask for forming a metal line and a via contact, and a method for fabricating a semiconductor device using the same, minimizes misalignment. The mask includes a first mask region having a dark tone for light shading, a second mask region having a half tone, being disposed within the first mask region to form the metal line, and a third mask region having a clear tone, being disposed within the second mask region to form the via contact. | 2010-03-04 |
20100055901 | LASER MATERIAL REMOVAL METHODS AND APPARATUS - Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that precisely removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern and deposits a conductive layer over the patterned dielectric layer. In one embodiment, the apparatus also removes portions of the conductive layer in a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer. | 2010-03-04 |
20100055902 | REDUCING CRITICAL DIMENSIONS OF VIAS AND CONTACTS ABOVE THE DEVICE LEVEL OF SEMICONDUCTOR DEVICES - Contact elements may be formed on the basis of a mask layer having openings, the width of which may be reduced by etching or deposition, thereby extending the process margins for a given lithography technique. Consequently, yield losses caused by short circuits in the contact level of sophisticated semiconductor devices may be reduced. | 2010-03-04 |
20100055903 | ENHANCING STRUCTURAL INTEGRITY OF LOW-K DIELECTRICS IN METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES BY USING A CRACK SUPPRESSING MATERIAL LAYER - During the formation of metallization layers of sophisticated semiconductor devices, the damaging of sensitive dielectric materials, such as ULK materials, may be significantly reduced during a CMP process by applying a compressive stress level. This may be accomplished, in some illustrative embodiments, by forming a compressively stressed cap layer on the ULK material, thereby suppressing the propagation of micro cracks into the ULK material. | 2010-03-04 |
20100055904 | METHOD FOR REDUCING TUNGSTEN ROUGHNESS AND IMPROVING REFLECTIVITY - Methods of producing low resistivity tungsten bulk layers having lower roughness and higher reflectivity are provided. The smooth and highly reflective tungsten layers are easier to photopattern than conventional low resistivity tungsten films. The methods involve CVD deposition of tungsten in the presence of alternating nitrogen gas pulses, such that alternating portions of the film are deposited by CVD in the absence of nitrogen and in the presence of nitrogen. According to various embodiments, between 20-90% of the total film thickness is deposited by CVD in the presence of nitrogen. | 2010-03-04 |
20100055905 | METHOD OF FORMING AN ALUMINUM OXIDE LAYER - Methods of forming aluminum oxide layers on substrates are disclosed. In some embodiments, the method includes depositing an aluminum oxide seed layer on the substrate using a first process having a first deposition rate. The method further includes depositing a bulk aluminum oxide layer atop the seed layer using a metalorganic chemical vapor deposition (MOCVD) process having a second deposition rate greater than the first deposition rate. | 2010-03-04 |
20100055906 | TWO-STEP HARDMASK FABRICATION METHODOLOGY FOR SILICON WAVEGUIDES - Techniques are disclosed for efficiently fabricating semiconductors including waveguide structures. In particular, a two-step hardmask technology is provided that enables a stable etch base within semiconductor processing environments, such as the CMOS fabrication environment. The process is two-step in that there is deposition of a two-layer hardmask, followed by a first photolithographic pattern, followed by a first silicon etch, then a second photolithographic pattern, and then a second silicon etch. The process can be used, for example, to form a waveguide structure having both ridge and channel configurations, or a waveguide (ridge and/or channel) and a salicide heater structure, all achieved using the same hardmask. The second photolithographic pattern allows for the formation of the lower electrical contacts to the waveguides (or other structures) without a complicated rework of the hardmask. | 2010-03-04 |
20100055907 | Method for achieving very small feature size in semiconductor device by undertaking silicide sidewall growth and etching - In the present method of fabricating a semiconductor device, initially, a semiconductor substrate is provided. An oxide layer is provided on and in contact with the substrate, and a polysilicon layer is provided on and in contact with the oxide layer. A layer of photoresist is provided on the polysilicon layer, and the photoresist is patterned to provide a photoresist body, which is used as a mask to etch away polysilicon and oxide, forming a polysilicon element thereunder. The photoresist body is then removed. A nickel layer is provided on the resulting structure, and a reaction step is undertaken to provide that nickel diffuses into the exposed top and side portions of the polysilicon body, forming nickel silicide. After the reaction step, the remaining nickel is removed, and a chemical-mechanical polishing step is undertaken to remove nickel silicide so that a pair of nickel silicide bodies remain, separated by polysilicon. Using the nickel silicide bodies as masks, the polysilicon and oxide thereunder are etched away. | 2010-03-04 |
20100055938 | SOCKET CONNECTOR HAVING REINFORCED AND COMPACT MOUNTING ARRANGEMENT - An electrical connector assembly for establishing electrical connection between an Integrated Package (IC) and a Printed Circuit Board (PCB) is provided. The electrical connector assembly comprises an insulative housing, a plurality of contacts received in the insulative housing, a PCB adapted to have the insulative housing mounted thereon and a metal reinforcement element disposed on a lower surface of the housing and soldered to the PCB. By way abovementioned, a back plate may be canceled and space under the PCB is saved under a condition that steady mechanical connection between the PCB and the housing is achieved. | 2010-03-04 |
20100055939 | SOCKET WITH FIXING EQUIPMENT - A socket, adapted for electrically connecting an IC package to a printed circuit board, comprises an insulative housing accommodating a plurality of contacts and a cover pivotally assembled on an end of the insulative housing. The insulative housing has two lateral sides and a base portion disposed between the lateral sides, and each lateral side is formed with two incepting portions on two opposite ends thereof. The cover has two fixing portions extending downwardly from two sides thereof and corresponding to the incepting portions of the insulative housing. When the cover rotates to a close position, the fixing portion of the cover directly latches the incepting portion of the insulative housing to prevent the cover from tilting. | 2010-03-04 |
20100055940 | FPC CONNECTOR HAVING MOVEABLE SLIDER FACILITATING ELECTRICAL INTERCONNECTION BETWEEN FLEXIBLE PRINTED CIRCUIT AND FPC CONNECTOR - An electrical connector includes an insulative housing ( | 2010-03-04 |
20100055941 | System and method for connecting flat flx cable with an integrated circuit, such as a camera module - A Flat Flex Connector (FFC) has connector flanges embedded in its insulated electrical traces. The flanges engage electrical circuits in a camera module such as a CMOS or CCD and are clamped into electrical engagement. The opposite end of the FFC makes electrical contact with another electrical device such as a semiconductor circuit. The assembly allows electrical connection of two or more devices in a confined space in which the electrical device are not easily aligned for electrical contact. | 2010-03-04 |
20100055942 | ELECTRICAL CONNECTOR - The present invention is to present an electrical connector of a connector assembly having a detachable flexible C-shaped clip and a visor-like ferruled docking cantilever with a lower semicircular cutout and an arched groove configured in front end thereof, wherein said flexible C-shaped clip, which is to be lodged in the arched groove, has a pair of jutted noses for being latched and gripped by a corresponding pair of dents at the docking cantilever and a pair of bent latching toes for running through a pair of corresponding bores on the PCB in securely stable manner. | 2010-03-04 |
20100055943 | CIRCUIT BOARD FOR MEMORY CARD, AND MEMORY CARD HAVING THE SAME - A circuit board for a memory card includes a circuit board body having a chip region and a peripheral region defined along a periphery of the chip region. The circuit board body includes circuit lines and element mounting parts which provide receiving spaces in the peripheral region. First connection pads are located in the peripheral region and are connected to the circuit lines. Second connection pads are located adjacent to the element mounting parts and are connected to the circuit lines. Passive elements are mounted in the element mounting parts so that at least a portion of the passive elements are formed within the circuit board body, and the passive elements are electrically connected to the second connection pads. | 2010-03-04 |
20100055944 | ELECTRICAL CONTACT HAVING ADDITIONAL MOUNTING FEET ARRANGED TO ENSURE RELIABLE ELECTRICAL CONNECTIONS WITH CONDUCTIVE PAD AROUND VIA OF CIRCUIT BOARD - A contact ( | 2010-03-04 |
20100055945 | ELECTRICAL CONTACT - A contact used in an electrical connector for mounting onto a PCB includes: a base portion with a horizontal bottom surface and at least one locking hole formed on the bottom surface, a spring beam bended from one end of the base portion and extending upwardly to contact with a mating object, and at least one soldering pad received in the locking hole correspondingly. The soldering pad includes a pair of soldering legs with soldering surfaces thereon for soldering onto the PCB. The soldering material on the soldering surfaces of the soldering pads is not easy to creep upwardly onto the spring beam so that the spring beam can keep a good performance during a mating process with a mating object. | 2010-03-04 |
20100055946 | ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly, for electrically connecting an IC package and a printed circuit board (PCB) ( | 2010-03-04 |
20100055947 | Adapter For Line Voltage Track - An adapter for an electrical line voltage track system includes a housing having a first end adapted for mounting to an electrical source or an electrical fixture, and a second end adapted for mounting to a line voltage track. The housing includes a housing cover coupled to a housing body. The housing cover is movable relative to the housing body between a closed position and an open position. A supporting sleeve is movably coupled to the housing, and a plurality of electrical contacts, including a fixed contact and a movable contact, are also coupled to the housing. The movable contact is movable, relative to the housing, between an engaged position and a disengaged position. In the engaged position, the movable contact causes electrical contact with the line voltage track. In the disengaged position, electrical contact is removed. | 2010-03-04 |
20100055948 | CARD SOCKET ASSEMBLY - A card socket assembly used to mount a data card includes a body member, and a controlling member. The body member defines a battery receiving space and a card slot adjacent to the battery receiving space. The card slot is used to receive the data card. The controlling member is used to abut against the data card, thus ejecting the data card out of the card slot. | 2010-03-04 |
20100055949 | Memory card connector - A memory card connector is able to insert and remove a memory card ( | 2010-03-04 |
20100055950 | ELECTRONIC APPARATUS AND FLAT CABLE - An electronic apparatus includes: first and second electronic units opposed to each other and connected to relatively rotate in a given plane; and a flat cable electrically connecting the first and second electronic units. The flat cable includes: first and second extending portions respectively connected to the first and second electronic units sides, and each having a surface extending along the given plane; and a bent portion having a bent surface located between the first and second extending portions, and the bent surface bent to surround a normal line perpendicular to the given plane. | 2010-03-04 |
20100055951 | BACK PLUG-IN CONNECTOR DEVICE - A back plug-in connector device having a floating structure, comprises: a body chassis, a cover and a support plate on which a connector is mounted. The support plate is sandwiched by the body chassis and the cover so as to constitute the floating structure. | 2010-03-04 |
20100055952 | FIXTURE AND FLOATING CONNECTOR USING THE SAME - A fixture for a floating connector is to be mounted on a substrate and has at one end a connection portion to be connected to the substrate. The two fixtures are used in the floating connector including a plurality of contacts, an insulator fixing the contacts therein and having flanges, and a housing covering the insulator and fixing the contacts therein. The fixtures each include at the other end an anchoring bent piece adapted to engage the flange of the insulator to prevent the insulator from floating upwardly to an excessive extent. The floating connector using the fixtures is able to completely prevent the contacts from being buckled or deformed to an excessive extent when the floating connector is being fitted with or removed from a mating connector. | 2010-03-04 |
20100055953 | CONNECTOR ASSEMBLY HAVING A PLURALITY OF DISCRETE COMPONENTS - A connector assembly includes a boot body, a contact housing, and a contact. The boot body extends between a boot coupling end and a boot back end. The back end receives a cable that includes a conductor. The boot body defines an internal chamber. The contact housing extends between a housing mating end and a housing back end. The contact housing includes a housing coupling element between the housing mating end and the housing back end. The housing back end is coupled to the boot coupling end. The housing mating end is configured to mate with a mating connector to electrically connect the connector assembly and the mating connector. The contact is held in the housing and electrically connected to the conductor. An adhesive is disposed in the internal chamber to secure the boot body and the contact housing together. | 2010-03-04 |
20100055954 | SEALED ELECTRICAL CONNECTOR - A connector assembly is comprised of a connector housing and a terminal position assurance member (TPA). The connector housing has an outer shroud wall which defines a gap between a central body portion of the connector housing. The TPA has an integrally co-molded seal thereon, which is receivable in the gap when the TPA is in position. | 2010-03-04 |
20100055955 | CONNECTOR HOUSING AND CONNECTOR - This invention provides with a connector housing in which a retaining arm for fixing a metal terminal to be inserted into a receiving chamber is formed within the receiving chamber, and extends in a direction of insertion of the metal terminal, and the retaining arm has a convex retaining portion to be engaged with a predetermined retaining hole formed in the metal terminal, wherein the retaining portion has a first slanting surface formed at a central portion of the retaining portion in a direction perpendicular to the direction of insertion of the metal terminal, and a pair of second slanting surfaces formed respectively at opposite side portions to the central portion, the second slanting surfaces being gentler in inclination angle than the first slanting surface; and at an arbitrary position in the direction of extending of the retaining arm in a range in which the first slanting surface is disposed above a predetermined height, the second slanting surfaces are disposed lower than the first slanting surface. | 2010-03-04 |
20100055956 | SLIDING CONTACT RETAINING DEVICE - In a sliding contact retaining device for a contacting device of a rotor, the rotor can have a plurality of slip rings, wherein the contacting device serves to retain the sliding contact retaining device, and wherein an electrical contact can be established between the slip rings of the rotor and sliding contacts of the sliding contact retaining device, wherein using the sliding contact retaining device, sliding contact retainers can be disposed in a first and a second serial arrangement parallel to a rotational axis of the rotor, and wherein adjacently arranged slip rings can be contacted alternately from a sliding contact of the first serial arrangement and a sliding contact of the second serial arrangement, wherein the sliding contact retaining device has at least one holding device for receiving at least two serial arrangements of sliding contact retainers. | 2010-03-04 |
20100055957 | SOCKET CONNECTOR WITH LOAD PLATE EQUIPPED WITH LOCKING DEVICE - An electrical connector ( | 2010-03-04 |
20100055958 | CPU SOCKET WITH LOCKING DEVICE - A CPU socket ( | 2010-03-04 |
20100055959 | SOCKET CONNECTOR WITH LOCKING DEVICE - An electrical connector ( | 2010-03-04 |
20100055960 | ELECTRICAL CONNECTOR HAVING LID OPERATING AS ACTUATOR - An electrical connector comprises a base having a plurality of passageways for receiving a number of contacts, a cover mounted to the base and including a plurality of through holes corresponding to the passageways, and a lid having two opposite edges. One edge is mounted upon the cover to drive the cover to move relative to the base, and the other edge locks the base when the lid is located at a close position relative to the base. | 2010-03-04 |
20100055961 | TERMINAL POSITION ASSURANCE MEMBER FOR ELECTRICAL CONNECTOR - A connector assembly is comprised of a connector housing and a terminal position assurance member (TPA). The connector housing has a latch which abuts with a tine on the TPA. The terminal, when received in the fully inserted position, deflects the tine, and the TPA may move to its fully locked position. | 2010-03-04 |
20100055962 | Electric connection box - The present invention is to provide an electric connection box, which can easily attach electric components to an attachment portion of box body. The electric connection box includes a box body having the attachment portion attaching the relay on an upper surface of the box body, and a relay fixed on the box body. The attachment portion includes a tube, a plurality of openings and a plurality of holding portions arranged in the opening. The tube inserts the relay into an inside thereof, and stands from the upper surface. The opening passes through the tube | 2010-03-04 |
20100055963 | CONNECTOR COVER AND A CONNECTOR - A connector cover ( | 2010-03-04 |
20100055964 | Connecting Apparatus - There is provided a connecting apparatus for connecting to an electronic apparatus including a connector, the connecting apparatus including: a body that includes a base portion and a back portion substantially perpendicular to each other so as to define a holding space for holding the electronic apparatus; a connector provided on the base portion, and to be connected with the connector of the electronic apparatus; and a positioning unit which adjusts the electronic apparatus to a predetermined position with respect to the base portion in a state where the connector of the electronic apparatus is connected to the connector of the connecting apparatus. | 2010-03-04 |
20100055965 | LATCHING ELEMENT AND METHOD OF MANUFACTURING THE SAME - A latching element includes a main section having a first end and a second end opposite thereto, a connecting portion formed on the edge of the first end, a locking portion formed on the second end; and a shaft spaced from the main section. The present disclosure also discloses a method of manufacturing the latching element and a portable electronic device having the latching element. | 2010-03-04 |
20100055966 | DEVICE FOR CONNECTING AN ELECTRONIC HOUSING IN A HOLDER THROUGH AT LEAST TWO TRANSLATION MOVEMENTS - The present invention relates to the field of devices for mounting and connecting an electronic module in a support comprising guidance and/or rotation means making it possible to position said module. The electronic module is designed to be slotted into an aircraft instrument panel. The module has: a rear face and a front face that are substantially flat and parallel. Means are provided for attaching the module to the instrument panel. The attachments are situated on the front face of the module. At least one connector-module can be plugged in and attached on the rear face of the module. The direction of plugging in the connector-module situated on the rear face is substantially in the plane of the rear face. The support comprises guidance and rotation means making it possible to guide, plug in and insert the module into the instrument panel. | 2010-03-04 |
20100055967 | Electronic Module Having A Plug Connection - A module, particularly an electronic module of a commercial vehicle, includes at least one plug connection, having a plug element and a mating plug element, by which an electrical connection can be established when plugged together. At least one of the plug elements is mounted floatingly or movably within a clearance. A method for assembling the module plugs together the plug elements, at least one of the plug elements moving within a clearance relative to the mounting thereof. | 2010-03-04 |
20100056018 | Weighted Stuffed Animal - A figure toy has a body, characterized by a head and torso, with a fabric covering that is at least partially filled with a stuffing material. A plurality of appendages with a fabric covering, which may include contact pads, are substantially unfilled except that the ends are partially filled with a first particulate material that is preferably in a bag that is sewn to the fabric covering of the appendages. Additionally, a second particulate material that may also be sewn into a bag is preferably sewn to a seam of the torso that normal includes a tag or label. | 2010-03-04 |
20100056019 | TOY EYE - A toy eye includes a casing having a transparent top portion, a lens defining a through hole, and a pupil received in through hole of the lens. The lens and the pupil are both made of soft resilient material, and clung to the transparent top portion of the casing. The toy eye also includes a push-pull element for pushing the pupil towards the transparent top portion of the casing or pulling the pupil reversely. The toy eye further includes a light processing element for sensing the change of the outside light intensity and generating a driving signal when the value of the change of the light intensity reaches or exceeds a predetermined value, and a driving element for driving the push-pull element to push or pull the pupil, upon receiving the driving signal from the light processing element. | 2010-03-04 |
20100056020 | Toy Track Section With Alignment Feature - The present invention relates to section of track that can be used with a toy train track set that has a toy vehicle and a track. The section of track is configured to align a toy train that is placed on the track section. The alignment section of track includes guide surfaces that are configured to align the toy train on the track. | 2010-03-04 |
20100056021 | ORNAMENT WITH MODULAR DESIGN MOTION SYSTEM - A motion device capable of incorporation into an ornament has a module drive mechanism and one or more visual elements capable of being set in motion by a user's interaction with the drive mechanism. The module drive mechanism includes a plurality of motion components, such as gears. The motion components are activated via manual rotation of a crank arm. | 2010-03-04 |
20100056022 | Brassieres - A breast cup for a bra that has an outermost layer and an innermost layer and at least one intermediate panel that is captured between the innermost layer and the outermost layer. At least part of an edge of the intermediate panel is positioned at a location that is non-contiguous the perimeter of the cup. This defines within the cup perimeter at least two zones of different cross sectional composition that may offer a different hand feel of different parts of the cup. | 2010-03-04 |
20100056023 | Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing - A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit. | 2010-03-04 |
20100056024 | STRUCTURED ABRASIVE ARTICLE, METHOD OF MAKING THE SAME, AND USE IN WAFER PLANARIZATION - A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed. | 2010-03-04 |
20100056025 | GUIDED ROTARY FILE - A rotary file includes: (a) a body having first and second ends, and an outer surface comprising at least one cutting edge; (b) a shank extending from the first end of the body which is adapted to be mounted in a rotary tool; and (c) a pilot extending from the second end of the body, the pilot defining an annular peripheral surface with an arcuate cross-section. | 2010-03-04 |
20100056026 | POLISHING LIQUID COMPOSITION - A polishing liquid composition includes composite oxide particles containing cerium and zirconium, a dispersing agent, and an aqueous medium. A powder X-ray diffraction spectrum of the composite oxide particles obtained by CuKα1 ray (λ=0.154050 nm) irradiation includes a peak (first peak) having a peak top in a diffraction angle 2θ (θ is a Bragg angle) range of 28.61 to 29.67°, a peak (second peak) having a peak top in a diffraction angle 2θ range of 33.14 to 34.53°, a peak (third peak) having a peak top in a diffraction angle 2θ range of 47.57 to 49.63°, and a peak (fourth peak) having a peak top in a diffraction angle 2θ range of 56.45 to 58.91°. A half-width of the first peak is 0.8° or less. | 2010-03-04 |
20100056027 | Method For Polishing A Semiconductor Wafer - Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side. | 2010-03-04 |
20100056028 | SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS - The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion. | 2010-03-04 |
20100056029 | Adapter For Mounting A Tool On An Oscillating Drive - An adapter is disclosed for mounting a tool on an oscillating drive having a drive shaft that can be driven to oscillate about its longitudinal axis, wherein the adapter is passed by a central opening, and has at its drive end at least one positive-locking element for positive connection with the tool, the positive-locking element having the shape of a regular polygon, or a plurality of positive-locking elements arranged on a circle concentric to the center axis, or a plurality of outwardly extending convex projections having rounded tips and being connected with neighboring projections via rounded concave lateral flanks, wherein the positive-locking elements on the drive end are configured for positive-locking connection with a matching positive-locking counter-element on the drive shaft, and wherein the adapter has a second receptacle on its tool end for effecting connection with a tool having a shape different from the first receptacle and being configured as a circle, or as a plurality of positive-locking elements arranged along a circle concentric to the center axis, or as plurality of outwardly extending convex projections with rounded tips and being connected with neighboring projections via rounded concave lateral flanks. | 2010-03-04 |
20100056030 | MECHANISM FOR DETECTING SHAFT MOTION, AND CONDITIONER HEAD - To provide a shaft motion detection mechanism capable of detecting the displacement of a rotating body in a direction along a rotational axis and whether or not the rotating body is rotated, and a conditioner head capable of detecting the displacement of a polishing disk in a direction along a rotational axis and whether or not the polishing disk is rotated. A conditioner head | 2010-03-04 |
20100056031 | Polishing Pad - The present invention provides a polishing pad, and is more particularly related to a polishing pad, the width of groove bottom of polishing surface of which is 0 mm. The polishing pad includes a polishing surface on which comprises a plurality of grooves, wherein each groove includes a groove opening and a groove bottom, the characteristic of which being that the width of groove bottom of polishing surface is 0 mm. Therefore, when the polishing step is performed, it is not easy for polishing particles suspended in the slurry to deposit on the groove bottom and the deposits can be prevented from scratching the concerned work piece to avoid damage of work piece. | 2010-03-04 |
20100056032 | Method of manufacturing revolving whetstone and revolving whetstone manufactured by the same - In a method of manufacturing a revolving whetstone comprising a central portion in which a whetstone center hole into which a whetstone driving shaft of a grinder is inserted is arranged and a disk-shaped whetstone body that has an effective whetstone circular portion arranged in the circumferential outside of the central portion as one body, the wall thickness of the central portion is formed thinner than the wall thickness of the effective whetstone circular portion, and a whetstone material for the thinned wall thickness of the central portion is put on the wall thickness surface of the effective whetstone circular portion, and the wall thickness of the effective whetstone circular portion is formed thicker than the wall thickness of the central portion. | 2010-03-04 |
20100056033 | MAGNETIC TAILPIPE EXHAUST NOZZLE DEVICE - The present invention is a tailpipe exhaust nozzle device that can be used with a vehicle with a side exhaust pipe that attaches magnetically to a vehicle exhaust removal system. The exhaust pipe nozzle device is made up of a body ring portion, a male adaptor that is integral with the body ring portion forming a clamp groove. There is also a plurality of magnets disposed on the male adaptor for attachment to the vehicle exhaust pipe removal system and a polymeric boot on the bottom of the body ring portion. The exhaust pipe nozzle device may or may not be in the shape of a cylinder The device also includes a 90 degree stainless steel transition elbow and galvanized steel tailpipe adapter which is attached to the end of the vehicle tailpipe. There is also a vertical stack exhaust pipe embodiment of the device. | 2010-03-04 |
20100056034 | Smoker's Enclosure - A coin operated smoker's enclosure in the form of an upright booth with polycarbonate walls, aluminum framing and a hinged door. An air recirculation system provides treated air within the enclosure as well as carbon monoxide and smoke detection. An air exhaust system filters the air for particulate matter before exhausting it from the enclosure. The coin acceptor is wired to turn on the various electrically powered devices only when the appropriate coin requirements are met. An upright compartment in one corner of the enclosure houses all of the active components and is accessible from the outside of the enclosure. | 2010-03-04 |
20100056035 | Replaceable Aerator for Recreational Vehicle - A replaceable aerator for recreational vehicle mainly comprises an air bleeder cap, a metal frame under the air bleeder cap and fixed on the air vent of the ceiling and a ventilating device fixed on the metal frame. The air bleeder cap and the metal frame are connected by a hinge on one side and the air bleeder cap is pivoted about the hinge. The ventilating device has a bottom frame fixed on the metal frame. The motor shell, motor and fan blade are installed inside the bottom frame. The fan blade is fixed with the transmission shaft of the motor and is protected by a wire mesh on its periphery. The device is simple in structure, easy for use, effective in ventilation and easy in replace. | 2010-03-04 |
20100056036 | NOISE-REDUCING SIDE CHAMBERS FOR AIR EXHAUST FROM COMPUTER RACKS AND A METHOD OF EXHAUSTING AIR AND REDUCING NOISE BY USING THE SAME - A method of exhausting exhaust air and reducing exhaust-air associated noise from a computer rack includes exhausting the exhaust air and the exhaust-air associated noise from a rear-mounted blower directly through a side opening at a rear portion of the computer rack, channeling the exhaust air and the exhaust-air associated noise through an acoustically absorptive side chamber, the acoustically absorptive side chamber sealed to the side opening of the computer rack such that the exhaust air and the exhaust-air associated noise is ducted through the acoustically absorptive side chamber and exits the acoustically absorptive side chamber at an upper portion of the acoustically absorptive side chamber in a vertical direction towards a ceiling of a data center in which the computer rack is installed, and using an acoustically absorptive duct of the acoustically absorptive side chamber to significantly attenuate the exhaust-air associated noise prior to radiating the exhaust-air associated noise from the upper portion of the acoustically absorptive side chamber. | 2010-03-04 |
20100056037 | VENTILATION GRILL - This utility model discloses a ventilation grill that consists of a face cover ( | 2010-03-04 |
20100056038 | STATIC ROOF VENTILATOR - A roof ventilator including: a first module defining a first module passageway having a first passageway longitudinal axis. The first module including a first module louver support extending substantially parallel to the first passageway longitudinal axis and a first module louver for creating a draft within the first module passageway upon wind blowing onto the first module louver. The first module louver extending from the first module louver support, located peripherally relatively to the first module passageway. A second module attached to the first module, defining a second module passageway, in fluid communication with the first module passageway and defining a second passageway longitudinal axis. The second module including a second module louver support, extending substantially parallel to the second passageway longitudinal axis. A second module louver creates a draft within the second module passageway upon wind blowing onto the second module louver. The second module louver extending from the second module louver support located peripherally relatively to the second module passageway. A fastener operatively couples the first and second modules biasing the first and second module louver supports towards each other. | 2010-03-04 |
20100056039 | DRIVE SYSTEM FOR A FIRE PROTECTION FLAP - The invention relates to a drive system (A) for a fire protection flap ( | 2010-03-04 |
20100056040 | Adaptive Crosspole Technique - An RF signal processing device which includes a countermeasure set connected to the processing device. The RF signal processing device shifts an incoming RF signal by ninety degrees and combines the phase shifted RF signal with RF jamming signals from a jammer. The processing device next transmits the RF signal including the RF jamming signals from the jammer. | 2010-03-04 |
20100056041 | HIERARCHICAL BROADCAST TRANSMISSION VIA MULTIPLE TRANSMITTERS - A technique for controlling a wireless broadcast transmission of media data via multiple transmitter sites into a broadcast area with different inter-site distances is proposed. The broadcast area comprises a region of large inter-site distance (ISD) and a region of small inter-site distance. The technique provides for a high spectral efficiency in regions of small ISD and at the same time for an acceptable reception quality in regions of large ISD. A first transmission is initiated into the broadcast area, wherein the first transmission is adapted for reception in a first of the regions. A second transmission is initiated into a second of the regions, the second transmission being adapted for reception in the second region. | 2010-03-04 |
20100056042 | PROVIDING CONTENT TO A DEVICE - Providing content to a device. Content stored on a device can be examined or searched based on the programming of channels that are available to the device over various networks. The content can be searched using other rules related to user preferences or content characteristics. Based on the results of the examination of the content, playlists are generated. Each playlist includes content from the device that matches or partially matches the content associated with one of the channels. Using the playlists, a user can load content from their device that has a theme consistent with a particular channel. When signal loss is detected for a given channel, the playlist associated with that channel can be loaded and played by the device. The device can resume playing the channel when the signal is again adequately detected. | 2010-03-04 |
20100056043 | Radio Service Registry - A service registry for a radio broadcasting system includes a memory for storing information relating to services to be provided over the broadcasting system, a processor coupled to the memory, and a core interface for exchanging messages between the processor and a plurality of users, the processor being programmed to retrieve the information from the memory in response to the messages received on the interface, and to output the retrieved information to an importer. A method of broadcasting and a broadcasting system are also provided. | 2010-03-04 |
20100056044 | RADIO FREQUENCY (RF) TRANSCEIVER - Systems and methods are disclosed for transmitting and receiving RF signals. An exemplary RF transceiver includes a signal generator, a frequency multiplier circuit, a receiver circuit, a transmitter circuit, and a switching device. The signal generator is configured to output a first signal and a second signal. The first signal comprises a local oscillator signal, and a frequency of the second signal is derived from a frequency of the first signal. The frequency multiplier circuit is configured to upconvert the output of the signal generator by frequency multiplication. The receiver circuit is configured to process a received signal using an upconverted first signal, and the transmitter circuit is configured to provide an upconverted second signal to a transmitter channel. The switching device is configured to provide the upconverted first signal to the receiver circuit and the upconverted second signal to the transmitter circuit. | 2010-03-04 |
20100056045 | Ultra Low Frequency-Based Radio Transmission System - An ultra low frequency transmission system can provide communications, for example, messages, to an individual or a group in areas of a building where conventional transmission reception is limited. A communication system for a structure includes a transmitter and an antenna network extending substantially throughout the structure. The antenna network includes a first portion and a second portion. At least one location in the structure can receive a transmission from the first portion and the second portion of the antenna network. The antenna network is configured to receive the transmission from the transmitter and to communicate the transmission throughout the antenna network to at least one receiver configured to receive the transmission from the transmitter via the antenna network. The antenna network transmits the transmission using an ultra low frequency to the at least one receiver. | 2010-03-04 |
20100056046 | WIRELESS COMMUNICATION DEVICE - According to one embodiment, a wireless communication device includes a housing provided with a first face, a radio-frequency coupler installed in the housing so as to face the first face, a close proximity wireless transfer device configured to execute close proximity wireless transfer with the external device existing within a prescribed wirelessly communicable distance from the radio-frequency coupler, a pressure sensitive sensor configured to measure the pressure applied to the first face near the radio-frequency coupler, a reception data processor configured to process data received by the radio-frequency coupler and the close proximity wireless transfer device, and a controller configured to report to the reception data processor that close proximity wireless transfer is available when the close proximity wireless transfer is available and also a measured value of the pressure sensitive sensor is not smaller than a threshold value. | 2010-03-04 |
20100056047 | METHOD OF EXCHANGING DATA BETWEEN TWO ELECTRONIC ENTITIES - A method of exchanging data between a first electronic entity and a second electronic entity includes the following steps:
| 2010-03-04 |
20100056068 | MULTI-MODE TRANSMITTER HAVING ADAPTIVE OPERATING MODE CONTROL - Methods and apparatus for transmitting communications signals that are both power efficient and effective at avoiding or reducing transmitter-generated receive band noise. An exemplary transceiver apparatus includes a multi-mode transmitter that is configurable to operate in a plurality of operating modes (e.g., a polar mode, a quadrature mode and a hybrid mode), a receiver, and an operating mode controller. The operating mode controller is configured to control which operating mode the transmitter is to operate, depending on one or more of a transmit (Tx) power, receive (Rx) power, the Tx power relative to the Rx power, a level of frequency separation between a Tx frequency band and a Rx frequency band (Tx/Rx band separation), and modulation type employed by the transmitter. | 2010-03-04 |
20100056069 | WIRELESS COMMUNICATION APPARATUS - A wireless communication apparatus receives a radio signal, compensates a frequency offset of received radio signal, stores, in a memory, a frequency offset of the received radio signal which includes an address used as a destination of a transmission signal, compensates a frequency of the transmission signal having the address as the destination by using the frequency offset stored in the memory, and transmits the transmission signal whose frequency is compensated. | 2010-03-04 |
20100056070 | Digital signal processor - The digital signal processor is for correcting a DC output at an output terminal of an internal circuit of an analog circuit device. The digital signal processor includes a digital register for storing a digital value, a D/A converter for converting the digital value stored in the digital register into an analog voltage and applying the converted analog voltage to the output terminal as the DC output, a polarity determining circuit which outputs a first signal when an analog DC voltage at a reference correction point different from the output terminal in the internal circuit is higher than a predetermined threshold value and otherwise outputs a second signal, and an updating function configured to monotonously increase or decrease the digital value stored in the digital register while a predetermined one of the first and second signals is outputted from the polarity determining circuit. | 2010-03-04 |
20100056071 | RF TRANSCEIVER WITH UNDESIRED SIGNAL REJECTION AND METHODS FOR USE THEREWITH - A radio frequency (RF) transceiver includes an RF transmitter that generates an outbound RF signal at a carrier frequency that is based on a transmitter local oscillation. An RF front-end receives an inbound RF signal that includes a desired signal component that is based on the outbound RF signal and that includes an undesired signal component. The RF front-end includes a first RF combiner module that attenuates the undesired signal component to produce a desired RF signal. A down conversion module generates a down converted signal from the desired RF signal based on a receiver local oscillation. A receiver processing module generates inbound data from the down converted signal. A frequency control module controls a frequency of the transmitter local oscillation and a frequency of the receiver local oscillation, based on an interference rejection signal, to control the attenuation of the undesired signal component. | 2010-03-04 |
20100056072 | IN-CABLE FM TUNER-TRANSMITTER CONNECTOR - An apparatus consisting of a connecting cable with a built-in FM tuner and transmitter that connects a portable entertainment device with an external entertainment system over a number of preset frequencies, and which the user can quickly operate without needing to look at the apparatus in order to select a different FM frequency for playback operation if the need arises. | 2010-03-04 |
20100056073 | IN-CABLE FM TUNER-TRANSMITTER CONNECTOR - A connecting cable with a built-in FM tuner and transmitter for connecting a portable entertainment device with an external entertainment system for wireless playback from the device to the system over preset frequencies, and which the user can operate without needing to look at the apparatus in order to select a different FM frequency for playback operation if the need arises. | 2010-03-04 |
20100056074 | BASE STATION APPARATUS, USER APPARATUS AND COMMUNICATION CONTROL METHOD - A base station apparatus in a radio communication system where transmit diversity is applied in uplinks includes a reference signal measurement unit configured to measure a receive level of the reference signal, a switch pitch determination unit configured to determine the antenna switch pitch of transmitting the reference signal based on the receive level measured by the reference signal measurement unit, and a transmitting unit configured to transmit the antenna switch pitch determined by the switch pitch determination unit. | 2010-03-04 |
20100056075 | ADJUSTABLE ANTENNA INTERFACE AND APPLICATIONS THEREOF - An adjustable antenna interface includes a single-ended to differential conversion circuit, an adjustable impedance matching circuit, an RF differential switch, and an input. The single-ended to differential conversion circuit converts inbound RF signals from single-ended signals to differential signals and converts outbound RF signals from differential signals to single-ended signals. The adjustable impedance matching circuit provides an impedance based on an impedance control signal. The RF differential switch provides the differential outbound RF signals from the IC to the single-ended to differential conversion circuit in accordance with a first antenna control signal and provides the differential inbound RF signals from the single-ended to differential conversion circuit to the IC in accordance with a second antenna control signal. The input receives the first antenna control signal, the second antenna control signal, and the impedance control signal from the IC. | 2010-03-04 |
20100056076 | METHOD AND SYSTEM FOR THE DELIVERY OF USER REQUESTED PROGRAM CONTENT USING BROADCAST CHANNELS - Aspects of the disclosure describe a method and system for the delivery and notification of user requested radio content. Aspects include a radio unit that is physically integrated with and is part of a telematics unit and receives user requested content data from a radio control center over a wireless network. The radio unit processes the user requested content data using a user request application. Further, the user requested data includes the scheduled times for one or more items of user requested content. The user request application orders the scheduled times for the one or more items of user requested content chronologically and displays the one or more items of user requested content data on the user display accordingly. | 2010-03-04 |
20100056077 | METHOD AND SYSTEM FOR INTERRUPTED FLOOR RECOVERY IN PUSH-TO-TALK OVER CELLULAR NETWORK - As described above, when a particular PoC client participating in a PoC session requests media transmission to a PoC server during transmission of media from another PoC client, the PoC server transitions the PoC client with the floor to a suspended state by sending an MB Suspend message and grants the floor to the requesting PoC client. After media transmission of the interrupting PoC client, the PoC server returns the floor to the interrupted PoC client. Therefore, the privileged PoC client in a current PoC infrastructure interrupts the ongoing conversation and sends media, after which the floor is returned to the interrupted PoC client without issuing an explicit media request from the interrupted PoC client. Even in the pre-emptive case scenario where the pre-emptive PoC client interrupts the ongoing conversation, the conversation can be continued in a natural way. | 2010-03-04 |