10th week of 2017 patent applcation highlights part 47 |
Patent application number | Title | Published |
20170069506 | METHOD FOR PROCESSING WIDE-BANDGAP SEMICONDUCTOR SUBSTRATE AND APPARATUS THEREFOR | 2017-03-09 |
20170069507 | CHEMICAL-MECHANICAL PLANARIZATION PROCESS USING SILICON OXYNITRIDE ANTIREFLECTIVE LAYER | 2017-03-09 |
20170069508 | HYDROFLUOROCARBON GAS-ASSISTED PLASMA ETCH FOR INTERCONNECT FABRICATION | 2017-03-09 |
20170069509 | DATA COMPRESSION FOR EBEAM THROUGHPUT | 2017-03-09 |
20170069510 | METHOD AND SYSTEM FOR SELECTIVE SPACER ETCH FOR MULTI-PATTERNING SCHEMES | 2017-03-09 |
20170069511 | SYSTEMS AND METHODS FOR SELECTIVELY ETCHING TUNGSTEN IN A DOWNSTREAM REACTOR | 2017-03-09 |
20170069512 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2017-03-09 |
20170069513 | SEMICONDUCTOR CLEANING PROCESS SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2017-03-09 |
20170069514 | HIGH TEMPERATURE TUBULAR HEATERS | 2017-03-09 |
20170069515 | APPARATUS FOR MEASURING IMPURITIES ON WAFER AND METHOD OF MEASURING IMPURITIES ON WAFER | 2017-03-09 |
20170069516 | PURGE LOAD PORT | 2017-03-09 |
20170069517 | SUBSTRATE TRANSFER DEVICE | 2017-03-09 |
20170069518 | ELECTROSTATIC SUBSTRATE HOLDER WITH NON-PLANAR SURFACE AND METHOD OF ETCHING | 2017-03-09 |
20170069519 | ELECTROSTATIC CHUCK DEVICE | 2017-03-09 |
20170069520 | JOINED STRUCTURE | 2017-03-09 |
20170069521 | WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER | 2017-03-09 |
20170069522 | METHOD OF FORMING MASK PATTERN, METHOD OF PROCESSING SUBSTRATE, AND METHOD OF FABRICATING ELEMENT CHIPS | 2017-03-09 |
20170069523 | WORKPIECE HOLDING APPARATUS | 2017-03-09 |
20170069524 | CHUCK TABLE | 2017-03-09 |
20170069525 | TABLE DEVICE, MEASURING DEVICE, MACHINE TOOL, AND SEMICONDUCTOR MANUFACTURING DEVICE | 2017-03-09 |
20170069526 | CHUCK ASSEMBLY WITH TILTABLE CHUCK AND SEMICONDUCTOR FABRICATION SYSTEM INCLUDING THE SAME | 2017-03-09 |
20170069527 | SELECTIVE FORMATION OF METALLIC FILMS ON METALLIC SURFACES | 2017-03-09 |
20170069528 | MANUFACTURING METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | 2017-03-09 |
20170069529 | METHOD FOR FORMING PATTERNS FOR SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069530 | INTEGRATED CIRCUIT WITH A SIDEWALL LAYER AND AN ULTRA-THICK METAL LAYER AND METHOD OF MAKING | 2017-03-09 |
20170069531 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069532 | SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2017-03-09 |
20170069533 | Method for Fabricating Semiconductor Device | 2017-03-09 |
20170069534 | SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF | 2017-03-09 |
20170069535 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2017-03-09 |
20170069536 | PLASMA TREATMENT METHOD AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT | 2017-03-09 |
20170069537 | WAFER PROCESSING METHOD | 2017-03-09 |
20170069538 | Integrated Circuitry and Methods of Forming Transistors | 2017-03-09 |
20170069539 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-03-09 |
20170069540 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH NANOWIRE STRUCTURES | 2017-03-09 |
20170069541 | METHOD AND STRUCTURE FOR FORMING FINFET CMOS WITH DUAL DOPED STI REGIONS | 2017-03-09 |
20170069542 | CMOS DEVICE WITH DECREASED LEAKAGE CURRENT AND METHOD MAKING SAME | 2017-03-09 |
20170069543 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069544 | Formation of Nickel Silicon and Nickel Germanium Structure at Staggered Times | 2017-03-09 |
20170069545 | STRUCTURE AND FORMATION METHOD OF FIN-LIKE FIELD EFFECT TRANSISTOR | 2017-03-09 |
20170069546 | FABRICATION METHOD OF A METAL GATE STRUCTURE | 2017-03-09 |
20170069547 | METHODS OF FORMING CMOS BASED INTEGRATED CIRCUIT PRODUCTS USING DISPOSABLE SPACERS | 2017-03-09 |
20170069548 | SEMICONDUCTOR DEVICE STRUCTURE WITH GATE SPACER HAVING PROTRUDING BOTTOM PORTION AND METHOD FOR FORMING THE SAME | 2017-03-09 |
20170069549 | Self aligned PTS liner for bulk FINFET | 2017-03-09 |
20170069550 | METHOD OF FORMING A SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069551 | METHOD AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS CONNECTED WITH BUMPS | 2017-03-09 |
20170069552 | ELECTRICAL COMPONENT TESTING IN STACKED SEMICONDUCTOR ARRANGEMENT | 2017-03-09 |
20170069553 | MICROWAVE PROBE, PLASMA MONITORING SYSTEM INCLUDING THE MICROWAVE PROBE, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SYSTEM | 2017-03-09 |
20170069554 | Monitor Structures and Methods of Formation Thereof | 2017-03-09 |
20170069555 | LOW-COST PACKAGING FOR FLUIDIC AND DEVICE CO-INTEGRATION | 2017-03-09 |
20170069556 | ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE | 2017-03-09 |
20170069557 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING THE SAME | 2017-03-09 |
20170069558 | SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD | 2017-03-09 |
20170069559 | SEMICONDUCTOR DEVICE HAVING A SUBSTRATE RESTRAINED FROM THERMAL DEFORMATION | 2017-03-09 |
20170069560 | AIR CAVITY PACKAGE | 2017-03-09 |
20170069561 | Power Semiconductor Module Having a Two-Part Housing | 2017-03-09 |
20170069562 | Power Conversion Apparatus | 2017-03-09 |
20170069563 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2017-03-09 |
20170069564 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2017-03-09 |
20170069565 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SINGLE-LAYER SUPPORT STRUCTURE | 2017-03-09 |
20170069566 | Integrated Circuitry and Methods for Manufacturing Same | 2017-03-09 |
20170069567 | MEMORY STRUCTURE | 2017-03-09 |
20170069568 | CAPACITOR FORMED IN SEMICONDUCTOR | 2017-03-09 |
20170069569 | SEMICONDUCTOR PACKAGE | 2017-03-09 |
20170069570 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2017-03-09 |
20170069571 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2017-03-09 |
20170069572 | APPARATUS AND METHOD FOR PLACING STRESSORS WITHIN AN INTEGRATED CIRCUIT DEVICE TO MANAGE ELECTROMIGRATION FAILURES | 2017-03-09 |
20170069573 | Method of Preventing Pattern Collapse | 2017-03-09 |
20170069574 | SEMICONDUCTOR DEVICE ALLOWING METAL LAYER ROUTING FORMED DIRECTLY UNDER METAL PAD | 2017-03-09 |
20170069575 | MICROELECTRONIC ASSEMBLY WITH REDISTRIBUTION STRUCTURE FORMED ON CARRIER | 2017-03-09 |
20170069576 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-03-09 |
20170069577 | SEMICONDUCTOR DEVICE, INSPECTION PATTERN ARRANGEMENT METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069578 | Ultra-Thin Semiconductor Component Fabrication Using a Dielectric Skeleton Structure | 2017-03-09 |
20170069579 | SEMICONDUCTOR PACKAGES HAVING RESIDUAL STRESS LAYERS AND METHODS OF FABRICATING THE SAME | 2017-03-09 |
20170069580 | FOIL COMPOSITE CARD | 2017-03-09 |
20170069581 | FOIL COMPOSITE CARD | 2017-03-09 |
20170069582 | SEMICONDUCTOR DEVICE INCLUDING PASSIVE EQUALIZER CIRCUIT | 2017-03-09 |
20170069583 | SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069584 | SYSTEMS AND METHODS TO FABRICATE A RADIO FREQUENCY INTEGRATED CIRCUIT | 2017-03-09 |
20170069585 | RESIN MOLDED BODY WITH RFIC PACKAGE INCORPORATED THEREIN AND METHOD FOR MANUFACTURING SAME | 2017-03-09 |
20170069586 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ANTENNA SWITCH MODULE | 2017-03-09 |
20170069587 | CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURING SAME | 2017-03-09 |
20170069588 | SEMICONDUCTOR DEVICE | 2017-03-09 |
20170069589 | ANCHORED INTERCONNECT | 2017-03-09 |
20170069590 | Semiconductor Package and Method of Forming the Same | 2017-03-09 |
20170069591 | WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIBUTION LAYER | 2017-03-09 |
20170069592 | TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT | 2017-03-09 |
20170069593 | Air Trench in Packages Incorporating Hybrid Bonding | 2017-03-09 |
20170069594 | Warpage Control of Semiconductor Die Package | 2017-03-09 |
20170069595 | 3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJUSTING ANISOTROPIC MATRIX | 2017-03-09 |
20170069596 | MULTI-DEVICE FLEXIBLE ELECTRONICS SYSTEM ON A CHIP (SOC) PROCESS INTEGRATION | 2017-03-09 |
20170069597 | SILICON DIE WITH INTEGRATED HIGH VOLTAGE DEVICES | 2017-03-09 |
20170069598 | METHOD FOR DIRECT INTEGRATION OF MEMORY DIE TO LOGIC DIE WITHOUT USE OF THRU SILICON VIAS (TSV) | 2017-03-09 |
20170069599 | MICROELECTRONIC PACKAGE WITH HORIZONTAL AND VERTICAL INTERCONNECTIONS | 2017-03-09 |
20170069600 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2017-03-09 |
20170069601 | MEMORY DEVICE WITH SEPARATED CAPACITORS | 2017-03-09 |
20170069602 | INTERCONNECT SUBSTRATE HAVING CAVITY FOR STACKABLE SEMICONDUCOTR ASSEMBLY, MANUFACTURING METHOD THEREOF AND VERTICALLY STACKED SEMICONDUCTOR ASSEMBLY USING THE SAME | 2017-03-09 |
20170069603 | SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES | 2017-03-09 |
20170069604 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | 2017-03-09 |
20170069605 | Package-on-Package Structure with Through Molding Via | 2017-03-09 |