11th week of 2021 patent applcation highlights part 83 |
Patent application number | Title | Published |
20210084769 | PATTERN FORMING METHOD - A pattern forming method capable of easily removing a discontinuous portion in a pattern while keeping resistance of the pattern low. A pattern forming method including at least a printing step of printing a pattern intermediate containing a conductive material on a base material 1, and a plating step of subjecting the pattern intermediate to an electroplating treatment, in which the pattern intermediate printed in the printing step has a plating target portion that is energized in the plating step and a discontinuous portion that is discontinuously formed from the plating target portion and is not energized in the plating step, and in the plating step, by performing an electric field plating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent, the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film. | 2021-03-18 |
20210084770 | CONFORMAL COATING FOR ELECTRONIC DEVICES AND METHODS OF COATING - A method of forming an electronic circuit component comprises (a) depositing nanoparticle ink comprising conductive material on a substrate; (b) curing the nanoparticle ink to form cured nanoparticle ink; (c) subjecting the cured nanoparticle ink to a first precursor gas to form a first layer of precursor material on the cured nanoparticle ink; and (d) subjecting the first layer of precursor material to a second precursor gas so that the first layer of precursor material reacts with the second precursor gas to form an oxide layer on the cured nanoparticle ink. | 2021-03-18 |
20210084771 | Roll-To-Roll Additive Manufacturing Method and Device - A method of manufacturing a flexible laminate electronic device and the flexible laminate electronic device itself is disclosed. The method includes placing electronic components over a flexible substrate layer that includes electrical connections between ones of the electronic components. A first flexible additive layer that includes apertures is positioned to align ones of the electronic components in respective ones of the apertures. A subsequent flexible additive layer is arranged over the first flexible additive layer and the apertures are aligned around respective portions of ones of the electronic components protruding above the first flexible additive layer. A flexible cover layer is emplaced over the subsequent flexible additive layer. | 2021-03-18 |
20210084772 | CONNECTING ELECTRONIC COMPONENTS TO MOUNTING SUBSTRATES - A method of connecting an electronic component on a mounting substrate where the electronic component is arranged with a first surface of the electronic component facing the mounting substrate and an opposite surface of the electronic component is facing away from the mounting substrate. A first component-side conductor on the second surface of the electronic component is electrically connected to a first substrate-side conductor on the mounting substrate by an electrically-conductive adhesive. | 2021-03-18 |
20210084773 | DIVERSIFIED ASSEMBLY PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME - A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board. | 2021-03-18 |
20210084774 | METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD - Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate. | 2021-03-18 |
20210084775 | MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR - A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space. | 2021-03-18 |
20210084776 | Thin Resin Films and Their Use in Layups - The disclosure provides an improved resin film product is comprised of a partially cured b-staged resin film that has a thickness in the range of 1 mils to about 10 mils and that is disposed between two protective layers, as well as methods for their manufacture and use in the production of layups used to manufacture printed circuit boards. | 2021-03-18 |
20210084777 | Display System and Rigid Flex PCB with Flip Chip Bonded Inside Cavity - A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel. | 2021-03-18 |
20210084778 | Flexible Display Device - Provided is a flexible display device, including a flexible display panel and a support structure, the flexible display panel includes a main structure region, a bending region and an extension region, the bending region is bent to locate the extension region at a back of the main structure region, an accommodation space is formed between the main structure region, the extension region and the bending region, at least part of the support structure is located in the accommodation space, and one end of the support structure extends into a bending space surrounded by the bending region. | 2021-03-18 |
20210084779 | ELECTRONIC APPARATUS HAVING FLEXIBLE DISPLAY DEVICE - A disclosed electronic device includes a housing having an opening, a roll mounted in the housing, a flexible display wound on the roll and being extendable and retractable through the opening based on a rotation direction of the roll, and a roll guide configured to guide the roll to move in a direction capable of constantly maintaining a proceeding direction of the flexible display toward the opening in the housing, based on a variation in a wound length of the flexible display on the roll. | 2021-03-18 |
20210084780 | FLEXIBLE DISPLAY DEVICE - Disclosed is a flexible display device, comprising a display panel, including a backside away from a display side; an elastic strip, fixed to the backside, wherein in a width direction of the elastic strip, the elastic strip comprises a pair of ends and a deformable section located between the pair of ends, and as the elastic strip is flattened in a longitudinal direction, the deformable section arches with respect to the pair of ends, and as the elastic strip is curled in the longitudinal direction, the deformable section is leveled with the pair of ends, and the elastic strip is used to flatten the display panel or curl the display panel. An initial state of the elastic strip is an elastic structure of a curled shape. The flexible display device can be automatically switched from a flattened state to a curled state by simply pressing the deformable section. | 2021-03-18 |
20210084781 | TELECOMMUNICATIONS ENCLOSURE WITH MODULAR LOCKING SYSTEM - The present disclosure relates to telecommunications enclosures that can be customizable to meet customer needs. A telecommunications enclosure can be customized to included added security as desired. That is, a modular security lock may be utilized as an add-on feature for telecommunications enclosures. | 2021-03-18 |
20210084782 | MEDIA DEVICE INCLUDING DISPLAY AND POWER-DELIVERY MECHANISM WITH INTEGRATED STAND - A media device may include (i) a display device having a front side including a display surface, (ii) a support housing for supporting the display device in each of a plurality of alternative orientations on an external surface, the support housing extending from a back side of the display device between a mounting surface of the support housing abutting the back side of the display device and a distal end of the support housing, (iii) a coupling member disposed at the mounting surface of the support housing and mounted to the display device, and (iv) a battery power supply disposed within the support housing and electrically coupled to the display device via an electrical path extending through the coupling member. Various other systems, devices, assemblies, and methods are also disclosed. | 2021-03-18 |
20210084783 | TRAY AND ELECTRONIC DEVICE - A tray inserted in an electronic device, and housing a card removable from the electronic device, the tray includes: a first interior wall partially defining a housing space housing the card; a second interior wall facing the first interior wall, and partially defining the housing space; and an elastic member provided to the second interior wall, wherein the elastic member is formed of rubber, and configured to change in shape in conformity with a shape of the card while the card is housed in the tray, and to apply to the card elastic force toward the first interior wall. | 2021-03-18 |
20210084784 | DOPED METAL OXIDE COATING HAVING INCREASED COLOR DURABILITY - This application relates to a portable electronic device. The portable electronic device includes an enclosure having a metal oxide coating, the metal oxide coating including a metal alloy substrate that is doped with a dopant, and a metal oxide layer overlaying and formed from the metal alloy substrate so that the metal oxide layer includes the dopant. | 2021-03-18 |
20210084785 | ELECTRONIC DEVICE - The disclosure relates to an electronic device including a housing filled to a fill level with a first matrix produced from a first potting compound, and a circuit board having a component arranged thereon and having a passageway that connects a component side arranged within the housing interior filled with the first matrix and a front face of the component arranged outside the housing interior filled with the first matrix, the passageway acts as capillaries for media whose viscosity is less than a limit and as barriers for media whose viscosity is greater than the limit, the component is arranged in a spatially bounded region adjoining the component side, a second matrix produced from a second potting compound having a viscosity exceeding the limit, which second matrix effects a terminal sealing of the connection formed by the passageway against the first potting compound used for producing the first matrix. | 2021-03-18 |
20210084786 | DEVICE HAVING AN ELECTRONICS UNIT AND A HOUSING, AND METHOD FOR PRODUCING SUCH A DEVICE - A device having an electronics unit and a housing. The housing has at least one first housing part and a second housing part, which are developed and joined in such a way that the housing encloses the electronics unit, the first housing part and/or the second housing part being developed as a foil. A method for producing a device is also described. | 2021-03-18 |
20210084787 | JAM FOR INTEGRATION RELIABILITY OF RULER FORM FACTOR COMPONENT - An apparatus is described. The apparatus includes an electronic component to be plugged into an electronic system. The electronic component includes a housing. The housing includes a jam. The jam is to push through a first opening in a bottom of the housing and a second opening in a surface when the first and second openings are at least partially aligned. The surface is a mechanical component of the electronic system that the electrical component is to slide upon when being plugged into the electronic system. The jam includes tooth edges to engage with an edge of the second opening. | 2021-03-18 |
20210084788 | Ejectable Cassette, Guide Column, and Ejectable Cassette - An example ejectable cassette, guide column, and ejectable cassette system is provided. The ejectable cassette includes a housing including a proximal end, a distal end, a first side, and a second side. The ejectable cassette includes a first locking mechanism assembly at the first side of the housing. The first locking mechanism assembly includes a first locking tab slidably disposed along the first locking mechanism assembly. The first locking tab is biased towards the proximal end of the housing. The ejectable cassette includes a second locking mechanism assembly at the second side of the housing. The second locking mechanism assembly includes a second locking tab slidably disposed along the second locking mechanism assembly. The second locking tab is biased towards the distal end of the housing. | 2021-03-18 |
20210084789 | SERVER RACK ASSEMBLY - A server rack assembly includes a pair of mounting units each including a panel, an adjustment plate, and rails. The panel has a first panel flange to connect a front support post. The adjustment plate is movably connected to the panel for connecting a rear support post and is adjustable to suit varying distances between front and rear support posts. The rails are detachably mounted on the panel; a gap between two rails is adjustable to accommodate different server devices. | 2021-03-18 |
20210084790 | VAPOR COOLING OF ELECTRONICS - A cooling assembly according to various aspects of the present disclosure includes a housing, an electronic component, a dielectric coolant, and a cover. The housing includes an interior compartment having a basin region in which the electronic component and the coolant are disposed. The coolant undergoes phase change between a liquid state and a gas state. The coolant is in direct contact with the electronic component in the liquid state. The cover component extends transversely through the interior compartment and is coupled to the body. The cover component is disposed in a direction with respect to the basin region. The cover component at least partially defines a port in fluid communication with the basin region. The cover component is configured to permit flow therethrough of the dielectric coolant in the gas state in at least the direction. | 2021-03-18 |
20210084791 | HEAT EXCHANGE ASSEMBLY FOR A COMMUNICATION SYSTEM - A heat exchange assembly includes a thermal bridge including upper and lower bridge elements including upper and lower plates arranged in plate stacks. The lower plates include lower fin plates and lower spacer plates with lower ends configured to be mechanically and thermally coupled to the electrical component. The upper plates include upper fin plates and upper spacer plates with upper ends configured to be mechanically and thermally coupled to a heat exchanger. The upper and lower fin plates are interleaved. The heat exchange assembly includes installation spring elements coupled between the upper and lower plates and biased against the upper and lower plates during installation. The installation spring elements are removable after the upper and lower plates are coupled to the electrical component and the heat exchanger to remove the biasing force between the upper and lower plates. | 2021-03-18 |
20210084792 | CENTRIFUGAL FAN - A centrifugal fan including an impeller housing and an impeller. The impeller housing has an accommodation space, an air inlet and an air outlet. The air inlet and the air outlet are connected to the accommodation space. The impeller is located in the accommodation space. The impeller includes a hub, a plurality of blades, and at least one heat conductive annular portion. The hub is rotatably disposed in the impeller housing. The plurality of blades are connected to an outer circumferential surface of the hub. The at least one heat conductive annular portion is connected to the plurality of blades. | 2021-03-18 |
20210084793 | COOLING CHASSIS DESIGN FOR SERVER LIQUID COOLING OF ELECTRONIC RACKS OF A DATA CENTER - An electronic rack includes a number of server chassis arranged in a stack. Each server chassis includes one or more servers and each server includes one or more processors. The electronic rack further includes a number of cooling chassis corresponding to the server chassis. Each cooling chassis is configured to provide liquid cooling to the processors of the server chassis. The cooling chassis includes a cooling module having one or more cooling devices arranged and positioned vertical aligned with the processors of the corresponding server chassis to extract the heat generated from the processors. The cooling chassis further includes a cooling unit coupled to the cooling modules to form a cooling loop to circulate the cooling liquid between the cooling devices and the cooling unit to cool the cooling liquid carrying the heat extracted from the cooling devices. A natural convection cooling loop is assembled and adapted on the cooling chassis. | 2021-03-18 |
20210084794 | PCM-BASED HEAT SINK STRUCTURE - A PCM (phase change material)-based heat sink structure includes an evaporation unit, a condensation unit, and a connecting pipe. The evaporation unit has a first space provided with a plurality of spaced first partitions that are integrally formed by an aluminum extrusion process. The first partitions partition the first space into a plurality of first branch passages. The first partitions are formed with a first main passage communicating with each first branch passage. The condensation unit has a second space provided with a plurality of spaced second partitions that are integrally formed by an aluminum extrusion process. The second partitions partition the second space into a plurality of second branch passages. The second partitions are formed with a second main passage communicating with each second branch passage. The connecting pipe is connected between the condensation unit and the evaporation unit to form a circulating heat dissipation loop. | 2021-03-18 |
20210084795 | FLUID COOLED HEATSINK WITH FLOW CONTROL FOILS - An active fluid cooled heatsink is provided. The heatsink includes a heatsink body having a cavity therein, the heatsink body having at least a top internal surface and a bottom internal surface; at least an inlet for receiving fluid at a first temperature into the cavity; at least an outlet for expelling fluid at a second temperature from the cavity; a plurality of foils within the cavity, disposed in contact with the bottom internal surface of the heatsink body, where the plurality of foils direct the flow of the fluid; and a surface area on which to mount a plurality of resource adapters. | 2021-03-18 |
20210084796 | INROW LIQUID COOLING MODULE - According to one embodiment, an InRow liquid cooling module for a database center includes a main fluid distribution manifold and a mounting section. The manifold has a main supply line that is configured to receive coolant from a coolant source and a main return line that is configured to return warmed coolant to the coolant source. The mounting section is configured to receive cooling modules, each module is configured to 1) couple to the main supply line and the main return line to circulate the coolant through the module and 2) couple to a piece of IT equipment in an electronic rack to create a heat-transfer loop that transfers thermal energy away from the equipment and into the coolant that circulates through the module. In one embodiment, the InRow concept may be deployed as part of a data center infrastructure or combined as part of an electronic IT rack. | 2021-03-18 |
20210084797 | PERFORMANCE-PER-WATT OPTIMAL CONTROL LOGIC IN LIQUID COOLING SOLUTION FOR HIGH PERFORMANCE MACHINE-LEARNING COMPUTING - An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack further includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU is configured to supply cooling liquid to the processors and to receive the cooling liquid carrying the heat exchanged from the processors. The CDU includes a liquid pump to pump the cooling liquid and a pump controller to control a pump speed of the liquid pump. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed of the liquid pump by optimizing an objective function based on processor power consumption of the processors, cooling power consumption of the CDU, and a benchmark performance measurement of the data processing services and to control the pump speed of the liquid pump based on the optimal pump speed. | 2021-03-18 |
20210084798 | COOLING STRUCTURE OF VEHICLE DRIVE INVERTER AND CONTROL SYSTEM OF THE SAME - A cooling structure of a vehicle drive inverter includes: a switching element disposed in the vehicle drive inverter; a heat dissipation fin connected to and heat-exchangeable with the switching element; a cooling flow path in which a coolant flows and heat-exchanges with the heat dissipation fin; and an auxiliary cooling module connected to and heat-exchangeable with the switching element to be heated by a heat generation of the switching element or to be cooled together with the switching element. | 2021-03-18 |
20210084799 | SEMICONDUCTOR MODULE AND VEHICLE - A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall. | 2021-03-18 |
20210084800 | ELECTRO-OPTIC MODULATOR - An electro-optic modulator includes a base plate, an optical waveguide, at least one set of modulation electrodes, and an electromagnetic shielding structure. The electromagnetic shielding structure includes a top shielding member covering the set of modulation electrodes from above, and a side shielding member disposed on two sides of the set of modulation electrodes. At least a portion of the side shielding member extends into the base plate to isolate the set of modulation electrodes. | 2021-03-18 |
20210084801 | MOUNTING DEVICE, INFORMATION PROCESSING DEVICE, AND MOUNTING METHOD - The mounting device comprises: a mounting head, having a pickup member picking up a component, which moves and places the component at a placement position by picking up the component with the pickup member from a supply section having a holding member holding the component; an imaging section configured to image the component held by the mounting head; and a control section configured to execute: a first placement process in which the component is picked up by the mounting head, positional deviation is corrected based on imaging results of the component captured by the imaging section, and the component is placed at the placement position, and a second placement process in which the component is placed at the placement position by omitting the imaging process by the imaging section at the mounting head when the positional deviation is within a predetermined allowable range. | 2021-03-18 |
20210084802 | Thuja Tree Named `Thusid4` - A new cultivar of | 2021-03-18 |