12th week of 2015 patent applcation highlights part 31 |
Patent application number | Title | Published |
20150077868 | IMAGING LENS MODULE - An imaging lens module includes first, second and third optical lenses that are arranged sequentially from an object side to an image side along an optical axis, and a constant-aperture diaphragm disposed between the first and second optical lenses. The first optical lens has a positive refractive power, and the second optical lens has a negative refractive power. The third optical lens has a positive refractive power and has an object-side surface and an image-side surface, At least one of which has at least an inflection point. The imaging lens module satisfies: 0.8 | 2015-03-19 |
20150077869 | APPARATUS FOR DELIVERY OF LASER-BEAMS OF DIFFERENT WAVELENGTHS TO A FLOW-CYTOMETER - An optical apparatus for delivering to a flow-cell of a flow-cytometer a plurality of beams of laser radiation each thereof having a different wavelength. The apparatus includes a dispersion compensation-prism and a plurality of directing-prisms equal in number to the number of laser-beam. The directing-prisms are arranged to direct the laser radiation beams directly therethrough into the dispersion compensation-prism as converging fan of beams in a first plane. The beams are transmitted by the compensation-prism as a converging fan of beams intersecting then proceeding as a diverging fan of beams in the first plane. A spherical focusing lens is arranged cooperative with a cylindrical lens for focusing the plurality of laser-beams as a plurality of spaced apart elongated focal spots in a plane in which the cytometer flow-cell is located. | 2015-03-19 |
20150077870 | ScreenScope - The ScreenScope is a computer screen magnifier for people who wear bifocals. The ScreenScope is a specially designed optical grade, acrylic lightweight panel that is placed over the computer screen to help accommodate people wearing bifocal glasses for reading fine print on the screen. | 2015-03-19 |
20150077871 | LENS CAP FOR OPTICAL MODULE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING LENS CAP FOR OPTICAL MODULE - A lens cap for an optical module includes: a barrel of a metal material; and a press lens of glass and held in the barrel. The coefficient of linear expansion of the glass is 6 to 8 ppm/K, and the coefficient of linear expansion of the metal material is at least 10 ppm/K at 150° C. to 800° C. and no more than 8 ppm/K at up to 100° C. or below. | 2015-03-19 |
20150077872 | DEVICE INTEGRATING REARVIEW MIRROR AND DRIVING RECORDER SCREEN - The present invention discloses a device integrating a rearview mirror and a driving recorder screen, which comprises a rearview mirror baseplate having at one rotary shaft on one lateral thereof; a mirror installed in the rearview mirror baseplate; and a driving recorder screen having at least one pivotal coupling member on one lateral thereof. The rotary shaft is coupled to the pivotal coupling member. Thereby, the driving recorder screen is integrated with the rearview mirror baseplate. Thus, the driver can watch the mirror and the driving recorder screen simultaneously, neither distracted nor fatigued. Therefore, the present invention not only can increase convenience of drivers but also can improve safety of driving. | 2015-03-19 |
20150077873 | ADHESIVE ARTICLES CONTAINING LIGHT SHIELDING FILM SUBSTRATES, METHOD OF MAKING THEREOF AND ARTICLES THEREFROM - Provided are adhesive articles and display components that include a film substrate and an adhesive. The film substrate includes a reflecting layer and an opaque layer. The adhesive may be disposed on at least one major surface of the reflecting layer and opaque layer. The inclusion of the film substrate in the adhesive articles enables the adhesive article to inhibit the transmission of visible light through the film substrate. The film substrate includes at least one cavity extending from the first major surface of the reflecting layer to the first major surface of the opaque layer, wherein the cavity volume is at least partially filled by the adhesive. The display component includes at least one display element adhered to an adhesive article via the adhesive. Methods of making adhesive articles and display components are also provided. | 2015-03-19 |
20150077874 | Optimal Kinematic Mount for Large Mirrors - A high performance kinematic mirror mount facilitating the reduction of thermally and mechanically induced optical distortion of a precision mirror is disclosed. The mirror mount assembly includes a mirror with a front reflective surface and a rear support surface. A set of sub-tier mounting assemblies are provided being affixed to the rear support surface of the mirror utilizing a number of strut pairs and a number of bonded mount pads arranged so as to connect the sub-tier mounting assemblies to the mirror with numerous strut pairs arranged as bipods. | 2015-03-19 |
20150077875 | DISK DRIVE WITH DIFFERENT SYNCHRONIZATION FIELDS AND SYNCHRONIZATION MARKS IN THE DATA SECTOR PREAMBLES IN ADJACENT DATA TRACKS - A hard disk drive has disks with data sector preambles that allow for inter-track interference. The same data sector preamble is used for all data sectors in a track but the preamble in each track is different from the preamble in radially adjacent tracks. In a first embodiment each preamble includes a synchronization field (SF) and synchronization mark (SM) that are the same in each track but different from the SF and SM in radially adjacent tracks. Only two unique SFs and two unique SMs are required, with the two SFs and two SMs alternating in radially adjacent tracks. In a second embodiment the preambles are “integrated”, meaning that the preamble is a sequence of bits that does not include separate dedicated fields, like SF and SM. The preamble bit sequences are decoded using matched filters to provide bit synchronization and start-of-data information. | 2015-03-19 |
20150077876 | DISK DRIVE WITH DIFFERENT DATA SECTOR INTEGRATED PREAMBLES IN ADJACENT DATA TRACKS - A hard disk drive has disks with data sector preambles that allow for inter-track interference. The same data sector preamble is used for all data sectors in a track but the preamble in each track is different from the preamble in radially adjacent tracks. In a first embodiment each preamble includes a synchronization field (SF) and synchronization mark (SM) that are the same in each track but different from the SF and SM in radially adjacent tracks. Only two unique SFs and two unique SMs are required, with the two SFs and two SMs alternating in radially adjacent tracks. In a second embodiment the preambles are “integrated”, meaning that the preamble is a sequence of bits that does not include separate dedicated fields, like SF and SM. The preamble bit sequences are decoded using matched filters to provide bit synchronization and start-of-data information. | 2015-03-19 |
20150077877 | ENLARGED SUBSTRATE FOR MAGNETIC RECORDING MEDIUM - An enlarged substrate for a magnetic recording medium used in a data storage device such as a hard disc drive (HDD). In some embodiments, an apparatus includes a substrate for a magnetic recording disc for installation in a 3½ inch form factor hard disc drive, the substrate having an overall diameter of nominally from 96.9 mm to 100.4 mm. In other embodiments, an apparatus comprises a substrate for a magnetic recording disc for installation in a 2½ inch form factor hard disc drive, the substrate having an overall diameter of nominally from 66.9 mm to 71.8 mm. In other embodiments, a data storage device has a magnetic recording medium that uses an enlarged substrate as set forth above. | 2015-03-19 |
20150077878 | DATA WRITING METHOD AND PROGRAM FOR TAPE DRIVE - One embodiment includes a method. The method includes sending data from a buffer to a tape drive, and allocating buffer space when a wrap turn is anticipated. The write data is accumulated in the buffer space during the wrap turn. The buffer space is released after the write data accumulated in the buffer space has been transferred to the tape drive. | 2015-03-19 |
20150077879 | Disk Drive with Preamplifier for Multiple Readers in a Slider with a Common Return Signal - Disk drive embodiments with common lead connections in the slider, suspension, and preamplifier are described. The arm electronics IC includes a preamplifier with single-ended input from the set of signal traces that include a common signal return lead for the plurality of read transducers (readers) in the slider. Two embodiments of the preamps are described that include a single-ended design and a pseudo-single-ended design. Each embodiment supplies the required bias to each read transducer using an operational transconductance amplifier (OTA) that drives a variable current source connected to the transducer. The positive input to the OTA is a DC voltage with the AC signal from the transducer imposed on it. The negative input is a DC reference voltage. Various embodiments of the signal trace configuration on the suspension are described including a single and double layer embodiments. | 2015-03-19 |
20150077880 | MINISKIRT TAPE HEAD HAVING QUASI-STATICALLY TILTED TRANSDUCER ARRAYS - In one general embodiment, an apparatus includes a magnetic head. The magnetic head has a first portion and a second portion, the first portion and the second portion together providing a tape bearing surface. The first portion has an opening at least partially encircling the second portion. The second portion has at least one array of transducers. A longitudinal axis of each of the at least one array is defined between opposite ends thereof. The longitudinal axis of each of the at least one array of transducers is oriented at an angle relative to a line oriented orthogonally to the intended direction of tape travel thereacross, the angle being between 0.2° and about 10°. | 2015-03-19 |
20150077881 | APPARATUS WITH A LAPPING GUIDE WITHIN A SPAN OF THE TRANSDUCER ARRAY - An apparatus according to one embodiment includes a magnetic head having an array of transducers. An axis of the array is defined between outermost ones of the transducers. The transducers are arranged in at least two clusters of adjacent transducers, and the transducers in each respective cluster have about a same transducer pitch. A gap is defined between proximally adjacent clusters. A width of the gap measured along the axis of the array is greater than the transducer pitch of one of the clusters. An electrical lapping guide (ELG) located in the gap or aligned with the gap orthogonally to the axis. | 2015-03-19 |
20150077882 | READER STRUCTURE - Implementations described and claimed herein provide a synthetic antiferromagnetic (SAF) layer with canted pinning, wherein a down-track direction facing surface of the SAF layer has edges that are substantially parallel to pinning direction of the SAF layer. | 2015-03-19 |
20150077883 | MAGNETIC RECORDING APPARATUS - According to an embodiment, a magnetic recording apparatus includes following elements. The spin torque oscillator generates a first oscillating magnetic field. The recording medium unit includes one or more recording medium layers which are stacked, each of the one or more recording medium layers including a recording medium and spin-wave lines each of which generates a second oscillating magnetic field. The write magnetic field source generates a write magnetic field. The controller is configured to control the spin torque oscillator, the spin-wave lines, and the write magnetic field source to simultaneously apply the write magnetic field, and the first and second oscillating magnetic fields to target medium magnetization in the recording medium. | 2015-03-19 |
20150077884 | Method and Apparatus for Localizing and Quenching an Arc - The disclosure relates to a method for localizing and quenching an arc in a PV generator of a PV system, wherein the PV generator includes at least two PV subgenerators. An arc quenching circuit is associated with each PV subgenerator. The method includes detecting an arc in the PV generator. Then, a probability value is determined for each of the PV subgenerators, wherein the probability value is correlated with a probability that the arc is located in the corresponding PV subgenerator. A sequence for activating the arc quenching circuits is then determined that is dependent on the determined probability values. Then, the arc quenching circuits are activated successively in the order of the determined sequence. | 2015-03-19 |
20150077885 | TEMPERATURE PROTECTION DEVICE AND CIRCUIT ARRANGEMENT - Temperature protection device for use in an electrical power circuit for protecting said electrical power circuit against heating, comprising a first contact element and a second contact element, which are connected to one another by the ends thereof, and are designed in such a way that the ends of said first and said second contact elements that are connected to one another separate from one another when a limit temperature is exceeded because of a mechanical pretension between the two ends, thereby interrupting the electrical circuit, wherein at least the ends of the contact elements have a material with a higher recrystallization temperature than pure copper. | 2015-03-19 |
20150077886 | Electrostatic Discharge Protection Circuit and Related Method - A device includes a first power transistor, a second power transistor electrically connected in series with the first power transistor, a first electrostatic discharge (ESD) detection circuit, and a first control circuit electrically connected to the first ESD detection circuit and the first power transistor. | 2015-03-19 |
20150077887 | STATIC CURRENT IN IO FOR ULTRA-LOW POWER APPLICATIONS - An input/output (IO) circuit including: an IO driver circuit; an electrostatic discharge (ESD) protection semiconductor switch with a first input configured to receive an ESD, a second input connected to an ESD rail, and a switch control input; an ESD trigger circuit connected to the switch control input, wherein the ESD trigger circuit is configured to produce a trigger signal to close the protection semiconductor switch when the ESD detection circuit detects an ESD; and a bias circuit configured to provide a back bias signal to an isolated well of the ESD protection semiconductor switch when IO circuit is in normal operation. | 2015-03-19 |
20150077888 | Electronic Device for ESD Protection - A device includes a transistor configured for operating in a hybrid mode, an element configured for generating and injecting a current into the substrate of the transistor in the presence of an ESD pulse, and a thyristor triggerable at least by the element. | 2015-03-19 |
20150077889 | PROTECTIVE DEVICE - A device designed to protect low-voltage circuits includes a transmission line for transmitting electromagnetic signals of an operational frequency band, a capacitor located in series on the transmission line, and a diode-based clamping component connecting the transmission line to ground. In use, the capacitor is designed to filter any unwanted transient energy that falls beneath the operational frequency band and the clamping component is designed to limit unwanted transient energy that falls within the operational frequency band. A gas discharge tube (GDT) connecting the transmission line to ground preferably protects low-voltage circuits from higher current threats. An inductive component constructed of a ferrite material, such as a ferrite bead, is connected in series with the GDT. Upon activation of the GDT, the inductive component manages the fall time of the GDT and thereby prevents the output waveform generated in response to GDT activation from shifting into the operational frequency band. | 2015-03-19 |
20150077890 | ESD PROTECTION CIRCUIT - In an ESD protection circuit, the overvoltage detection circuit detects application of an overvoltage to a power supply node. A clamp circuit connects the power supply node to a ground node to clamp a voltage of the power supply node. A voltage regulation circuit drops the voltage of the power supply node to generate a predetermined regulated voltage to be supplied to the overvoltage detection circuit as a power supply voltage. At the predetermined regulated voltage, the overvoltage detection circuit is not activated at Power-On, and is activated under ESD events. A voltage compensation circuit compensates for the voltage of the detection signal, so that the voltage of the detection signal becomes equal to the overvoltage, when the overvoltage is applied to the power supply node. | 2015-03-19 |
20150077891 | POWER SUPPLY MONITORING SYSTEM - A method for detecting predetermined fault conditions associated with the supply of AC electrical power to a consumer, the supply having an active conductor and a neutral conductor with the neutral conductor being connected to earth. The method comprises providing a first current detector associated with the active conductor; providing a second current detector associated with the neutral conductor; providing a voltage detector to detect voltage between the active conductor and the neutral conductor; and checking a current ratio of neutral current to active current whereby the current ratio is indicative of a predetermined fault condition. Also disclosed is a method of checking the condition of supply line active and neutral conductors in a consumer's supplied premises including determining the impedance of the active conductor and the impedance of the neutral conductor to indicate the condition of each of the active and neutral conductors. | 2015-03-19 |
20150077892 | PROTECTION CIRCUIT AND RELATED METHOD - A protection circuit is connected between a power supply for providing a working voltage and a load. The protection circuit comprises an interface, a detecting module connected to the interface, a control module, and a switch module. The control module generates a plus width modulation (PWM) signal with a predetermined duty cycle when the interface interconnects with the load. The switch module periodically turns on and turns off based on the PWM signal with the predetermined duty cycle. | 2015-03-19 |
20150077893 | ELECTROMAGNETIC DC PULSE POWER SYSTEM INCLUDING INTEGRATED FAULT LIMITER - An electromagnetic direct current (DC) power system includes a plurality of pulse forming networks (PFN) modules. Each pulse forming network (PFN) module includes a PFN circuit, a fault current limiting (FCL) circuit and a cooling system. The pulse PFN circuit is configured to generate a pulsed DC output power. The PFN circuit further includes at least one energy storage inductor with primary winding having a primary winding inductance that controls a primary impedance of the PFN circuit. The FCL circuit includes a secondary winding that electrically communicates with the primary winding. The FCL circuit is configured to receive fault energy existing in the PFN circuit during a fault event. The cooling system is configured to cool at least one of the primary winding and the secondary winding, and remove a portion of the fault energy. | 2015-03-19 |
20150077894 | SURGE ARRESTER - A surge arrester comprises an electrical insulator ( | 2015-03-19 |
20150077895 | COOLING PLATE, METHOD FOR MANUFACTURING THE SAME, AND MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS | 2015-03-19 |
20150077896 | Electrical Circuit for Ignition System for Jet Engine - An electrical circuit for ignition system for jet engines comprises: main inverter, secondary inverter, main Diode, Secondary Diode, main capacitor, secondary capacitor, controller, main transformer, secondary transformer, transistor, wire connection to electrode and wire connections to the power source and switch. | 2015-03-19 |
20150077897 | Multilayer Ceramic Electronic Component - A multilayer ceramic electronic component that has a multilayer portion having an outer layer portion adjacent region including an area in contact with an outer layer portion that forms a thermal-shock absorbing portion that includes curved ceramic layers and inner electrode layers smoothly varying in thickness from point to point. A region to an inside of the thermal-shock absorbing portion forms a normal multilayer portion that includes ceramic layers with less curvature than the ceramic layers in the thermal-shock absorbing portion and inner electrode layers with less variation in thickness from point to point in a direction along a principal surface of the outer layer portion than the inner electrode layers in the thermal-shock absorbing portion. | 2015-03-19 |
20150077898 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer. | 2015-03-19 |
20150077899 | GRAPHENE-BASED METALLIC POLYMER DOUBLE-LAYER SUPERCAPACITOR - A multilayered graphene-based supercapacitor, including a generally planar separator with a plurality of graphene sheets on each side of the separator, wherein each of the graphene sheets on each side of the separator are separated by a layer of electrically conductive metallic adhesive or encapsulant. | 2015-03-19 |
20150077900 | Wet Electrolytic Capacitor Containing a Hydrogen Protection Layer - A wet electrolytic capacitor that contains a casing within which is positioned an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a metal substrate over which is disposed a hydrogen protection layer that contains a plurality of sintered agglomerates formed from a valve metal composition. The present inventors have discovered that through careful selection of the relative particle size and distribution of the agglomerates, the resulting protection layer can effectively absorb and dissipate hydrogen radicals generated during use and/or production of the capacitor, which could otherwise lead to embrittlement and cracking of the metal substrate. | 2015-03-19 |
20150077901 | Wet Electrolytic Capacitor Containing a Composite Coating - A wet electrolytic capacitor that contains a casing within which is positioned an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a composite coating disposed on a surface of a metal substrate. The composite coating includes a noble metal layer that overlies the metal substrate and a conductive polymer layer that overlies the noble metal layer. | 2015-03-19 |
20150077902 | Electro-Polymerized Coating for a Wet Electrolytic Capacitor - A wet electrolytic capacitor that contains a casing within which is positioned an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a conductive coating disposed on a surface of a metal substrate. The casing contains a metal substrate coated with a conductive coating. The conductive coating contains a conductive polymer layer formed through anodic electrochemical polymerization (“electro-polymerization”) of a colloidal suspension on the surface of the metal substrate. The conductive coating also contains a precoat layer that is discontinuous in nature and contains a plurality of discrete projections of a conductive material that are deposited over the surface of the metal substrate in a spaced-apart fashion so that they form “island-like” structures. | 2015-03-19 |
20150077903 | SOLID ELECTROLYTIC CAPACITOR - An electrically conductive polymer composition has high electrical conductivity, excellent water resistance, high density, and excellent smoothness. Also disclosed is a solid electrolyte capacitor which is prevented from the reduction in electrical conductivity, has low ESR, and also has excellent reliability. Further disclosed is a method for producing the solid electrolyte capacitor. The electrically conductive polymer composition is produced by removing a dispersion medium from an electrically conductive polymer suspension, wherein the electrically conductive polymer suspension includes: an electrically conductive polymer material including a dopant composed of a polyacid or a salt thereof and an electrically conductive polymer; at least one compound (A) selected from erythritol, xylitol and pentaerythritol; and the dispersion medium. | 2015-03-19 |
20150077904 | SOLID ELECTROLYTIC CAPACITOR AND PRODUCTION METHOD THEREOF - A solid electrolytic capacitor of the present invention includes: a capacitor element having an anode wire inserted in one side surface thereof; a cathode terminal disposed on one side under the capacitor element to be electrically connected to the capacitor element; an anode terminal disposed on the other side under the capacitor element and having a bending portion integrally formed to be inclined to the capacitor element for electrical connection with the anode wire; and a molding portion surrounding the outside of the capacitor element and formed to expose lower surfaces of the cathode terminal and the anode terminal. | 2015-03-19 |
20150077905 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire formed on one end portion thereof; a mounting board formed on a lower surface of the capacitor body and including an insulating layer and wiring layers formed on an upper surface and a lower surface of the insulating layer; a side electrode contacting an end portion of the tantalum wire and connected to the wiring layers of the mounting board; and a molding part enclosing the capacitor body and the tantalum wire. The mounting board may have a via electrode penetrating through the insulating layer and electrically connecting the wiring layers formed on the upper surface and the lower surface of the insulating layer. | 2015-03-19 |
20150077906 | BUSBARS HAVING DIFFERENT CROSS SECTIONS FOR A BUSBAR SYSTEM WITH A COMMON PROTECTION OR NEUTRAL CONDUCTOR - An embodiment of the invention relates to busbars having different cross sections for a busbar system with a common protection and/or neutral conductor for the transport of electrical energy. The busbar system includes at least one first segment and a second segment, the segments having each at least one first busbar with a first cross-sectional area, at least a second busbar with a second cross-sectional area, a holding element and at least one connection. According to an embodiment of the invention, the busbars of the segments are held by the respective holding element and are electrically connected to each other via the at least one connection, and a busbar from either the first busbars or second busbars serves as a common protection conductor and/or as a common neutral conductor. | 2015-03-19 |
20150077907 | SYSTEM FOR THE CONTACTLESS DATA SUPPLY OF BUS PARTICIPANT MODULES - The present invention relates to a modular data transmission system which is constructed for contactless data transmission by means of electromagnetic waves having a wavelength in the millimetre range. A modular data transmission system according to the invention comprises a mounting rail, a first bus participant and a second bus participant. The first bus participant comprises a transmitting/receiving module. The second bus participant also comprises a transmitting/receiving module. The first bus participant and the second bus participant are releasably secured to the mounting rail so as to be able to be attached to each other, and the transmitting/receiving modules of the first and second bus participants are constructed in order to transmit data by means of electromagnetic waves having a wavelength in the millimetre range. Another modular data transmission system according to the invention comprises a mounting rail and at least a first bus participant. The mounting rail comprises at least one transmitting/receiving module. The first bus participant comprises a transmitting/receiving module and is releasably secured to the mounting rail. The mounting rail allows additional bus participants to be secured in an attachable manner to the first bus participant. Furthermore, the transmitting/receiving modules of the mounting rail and the first bus participant are constructed for data transmission by means of electromagnetic waves having a wavelength in the millimetre range. | 2015-03-19 |
20150077908 | MODULAR ELECTRONIC DEVICE - A grommet for a modular electronic device includes a body including a first side and a second side opposite the first side. A head extends from the first side of the body. A channel extends through the body and the head. At least one buttress extends outward and along a length of the body. The buttress extends outward a first length adjacent the first side and a shorter second length adjacent the second side. | 2015-03-19 |
20150077909 | Electronic Device With Reworkable Midplate Attachment Structures - An electronic device may be provided with a display mounted in a display frame assembly that includes a plastic structure overmolded over a display frame. A housing midplate may be used to provide the electronic device with mechanical rigidity and strength, and may also be used as a sensor plane. For sensor plane applications, accurate placement and assembly of the midplate in the housing can be critical. The housing midplate may be accurately assembled to the display frame using connections formed using welded tabs, welded and screwed nuts, overmolded plastic heat stake structures, or overmolded plastic structures and adhesive. Rework and repair operations may be performed by disconnecting connections such as welds using cutting equipment, by using solvent to dissolve adhesive, by unscrewing welded nuts, or by removing heat stake structures. Following rework or repair, a fresh midplate and associated components may be attached to the display frame. | 2015-03-19 |
20150077910 | MANUFACTURING METHOD OF HOUSING AND ELECTRONIC DEVICE - The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing. The housing made of the first material exhibits a second material effect in visual and/or tactile senses. | 2015-03-19 |
20150077911 | TECHNIQUES FOR INDICATING AND CHANGING NETWORK COMMUNICATION SETTINGS OF A COMPUTER HOST - A technique for setting network communications for a computer host having multiple network interface controllers (NICs) includes performing network communication for a baseboard management controller (BMC) using a first NIC. In response to actuation of a switch of a network connector jack that is associated with the first NIC, a switching signal is sent from the switch to the BMC. In response to receipt of the switching signal at the BMC, network communication for the BMC is performed using a second NIC. | 2015-03-19 |
20150077912 | ELECTRONIC DEVICE - An electronic device includes a case body which includes an opening and a battery holder holding a battery, an inward flange which is disposed at least a part of a circumference of the opening, a display panel which is mounted on the inward flange so as to cover the opening of the case body, and an adhesive layer which is provided between the display panel and the inward flange. The adhesive layer gradually peels off to leak gas in a space sealed by the case body and the display panel, so as to prevent the display panel from swiftly popping out of the opening when an inner pressure of the space increases. | 2015-03-19 |
20150077913 | WEARABLE COMPUTER SYSTEM - A wearable computer system that provides for convenient and efficient use of all fingers while the user is standing, reclining or using hands intermittently for other tasks. The central unit hangs from a neck strap and communicates with a head mounted display. The central unit's front surface has keys, accessible from opposite edges by each hand. Typing is similar to the traditional, but rotated 90 degrees on each side. Keys are individually assignable to any letter, symbol, musical note, color, action, or macro. Back panels have thumb keys and controls, and can be modified to accept alternate thumb controls and additional hardware, such as sensors, circuits, cameras, and auxiliary connectors for specific tasks such as musical instrument performance or augmented reality game play. Smartphones, can be incorporated within or connected to the central unit. Desktop use can be accomplished by unfolding the panels of one embodiment. | 2015-03-19 |
20150077914 | ELECTRONIC PERIPHERAL AND ELECTRONIC DEVICE - An electronic device adapted to be electrically connected to an electronic peripheral is provided. The electronic peripheral includes a main body and a plurality of peripheral pads. The peripheral pads are disposed on a corresponding surface of the main body. The electronic device includes a body and a plurality of device pads. The body includes a receiving surface. The device pads are disposed on the receiving surface. When the corresponding surface is disposed on the receiving surface and each of the peripheral pads is in contact with the corresponding device pad, the main body is electrically connected with the body. | 2015-03-19 |
20150077915 | ELECTRONIC DEVICE - An electronic device includes an arm that pivots with respect to a body of the electronic device, a device that pivots with respect to the arm, and a link mechanism that includes a slider disposed along the arm, the link mechanism moving the slider along the arm upon pivoting of the device such that the arm pivots in a direction opposite to a pivoting direction of the device. | 2015-03-19 |
20150077916 | Point of Sale System - A point of sale system includes a display device, a pivoting mechanism, a first electronic component and a base having a top surface. The display device includes a casing formed with a first receiving groove and a screen coupled to the casing and movable relative to the base between unfolded and folded positions. The pivoting mechanism interconnects pivotally the display device and the base. The first electronic component is connected to the casing and is movable between an inactive position where the first electronic component is retracted within the first receiving groove, and an active position where the first electronic component protrudes out of the first receiving groove. | 2015-03-19 |
20150077917 | FLEXIBLE DISPLAY DEVICE HAVING GUIDE MEMBER - A flexible display device having a guide member is disclosed. The flexible display device having a guide member according to the present invention includes a first plate and a second plate for attaching a flexible display screen having bending capability on the front side; a hinge member B for connecting the first plate and the second plate and performing a folding operation while being bent or spread; and a variable means formed at each of the first plate and the second plate, configured of movable plates connected to the hinge member and the guide members combined with the movable plates to guide forward and backward movement of the movable plates, and associated with the folding operation of the first plate and the second plate. | 2015-03-19 |
20150077918 | STIFFENING ELECTRONIC PACKAGES - Stiffening is provided for an electronic package assembly having a substrate. A first electronic package, having a first function, is electromechanically fastened to a first surface of the substrate with a first array of electrically conductive interconnects, which is disposed over a central area of the substrate first surface. A second electronic package, having a second function, is fastened to the first substrate surface with a second conductive interconnect array. At least a pair of the first array conductors is electrically coupled to at least a pair of the second array conductors for data/signal exchange and at least a component of the first electronic package interacts with at least a component of the second package. A metallic stiffener ring is disposed about an outer periphery of at least the central area of the substrate. | 2015-03-19 |
20150077919 | TRANSMISSION LINE WITH DATA STORAGE FUNCTION - A transmission line with both data storage function portable structure thereof includes a cable, a memory module, a Micro USB connector, a cover, a housing and a shell. The memory module and the Micro USB connector are connected to two opposite ends of the cable. The cover covers over the memory module. The housing has a front wall, a rear wall and two side walls which corporately define a receiving chamber. A partition is defined at the center of the receiving chamber and divides the receiving chamber into a first receiving cavity and a second receiving cavity. The memory module and the Micro USB connector are respectively located in the first and second receiving cavities of the housing. The shell encloses the housing. | 2015-03-19 |
20150077920 | Assembled Module and Electronic Apparatus Having the Same - An assembled module and an electronic apparatus having the same are disclosed. The assembled module is disposed in a case of the electronic apparatus. The assembled module includes a backplane and an actuating unit. The backplane is disposed on the case and used to be moved between a first position and a second position. The actuating unit is disposed on the backplane and used to be operated so as to drive the backplane moving relative to the first position and the second position. The actuating unit includes a first rack, a complex gear, and a second rack; wherein when the first rack is operated to move along a first direction, the complex gear is carried by the first rack to allow the second rack to move along a second direction, such that the assembled module is able to move between the first position and the second position. | 2015-03-19 |
20150077921 | GROUNDING MEMBER AND MOUNTING APPARATUS FOR HARD DISK DRIVE - A mounting apparatus is used to mount a hard disk drive to a storage rack. The mounting apparatus includes a supporting frame and two grounding members. The supporting frame includes a handle, and two side brackets extending from opposite ends of the handle, and attached to opposite sides of the hard disk drive. Each grounding member is made of resilient and conductive material, and includes a mounting plate mounted to the side bracket, and two abutting plates extending out from two opposite ends of the mounting plate. A part of each abutting plate is exposed out of the corresponding side bracket. when the mounting apparatus mounting the hard disk drive in a storage rack, the abutting plates are sandwiched between the storage rack and the hard disk drive. | 2015-03-19 |
20150077922 | HIGH CAPACITY STORAGE UNIT - A rack mountable 10U storage unit includes a plurality of memory modules arranged in multiple rows. The storage unit also has control circuitry. Each of the memory modules have multiple heating zones and a heat spreader coupled to it. The memory modules may have heat spreaders having differing thermal dissipation capacity coupled to them. The storage unit can accommodate up to 120 memory modules due to a unique method of placing the individual memory modules. | 2015-03-19 |
20150077923 | CHASSIS FOR STORAGE DEVICES - Provided herein is an apparatus, including a chassis defining a storage compartment; a printed circuit board, wherein the printed circuit board is substantially parallel to a floor of the storage compartment; and a number of connectors mounted on the printed circuit board, wherein the number of connectors are configured to respectively connect to a number of digital data storage devices oriented substantially parallel to the printed circuit board. | 2015-03-19 |
20150077924 | CHASSIS FOR STORAGE DEVICES - Provided herein is an apparatus, including a storage compartment; a central partition of the storage compartment, wherein the central partition of the storage compartment provides a housing for a number of connectors for respectively connecting a number of digital data storage devices into both sides of the central partition of the storage compartment. | 2015-03-19 |
20150077925 | SET TOP BOX HAVING REMOVABLE HARD DRIVE - An electronic device such as a set top box is provided that includes a frame having flat bottom; a flat circuit board generally parallel to the flat bottom in which the flat circuit board has at least one aperture; at least one boss that extends from the flat bottom and extends through the at least one aperture in which the at least one boss has a screw receiving aperture; and an electronic component such as a hard drive or smart card assembly over the circuit board and electrically connected to the circuit board in which the electronic component has at least one screw to fasten the electronic device to the boss. The electronic component is supported by the bosses and not supported by the flat circuit board. | 2015-03-19 |
20150077926 | POWER DISTRIBUTION IN A DOCKING STATION - Docking stations that may facilitate the sharing or transfer of power among a portable computing device, a docking station, and an accessory. One example may provide power from an accessory to a portable computing device. Switches may be used to avoid harm from inadvertent contact with voltages on exposed terminals. Another example may provide power directly from a battery on a portable computing device to an accessory. Another may limit this direct connection to a first type of accessory. Examples may limit a power connection to another type of accessory through a regulator. Another example may power one or more internal circuits either through a portable computing device or an accessory, depending on a mode of operation of the portable computing device. | 2015-03-19 |
20150077927 | Docking Connector Platform For Mobile Electronic Devices - Docking platforms formed in one of the largest-surface-area surfaces (the back surfaces) of mobile electronic devices ( | 2015-03-19 |
20150077928 | DOCKING STATION WITH RUGGEDIZED CASE - A docking station for an electronic device that is contained within a case, in which the case includes a retractable connector access panel at least partially overlying a portion of a connector port of the electronic device, includes a base to support the electronic device. An electrical connector is coupled to the base and configured positioned to receive the connector port of the electronic device. A retraction member is coupled to the base and positioned to contact the connector access panel to retract the panel to at least partially expose the connector port during docking of the electronic device. | 2015-03-19 |
20150077929 | SHEET-TYPE HEAT PIPE AND MOBILE TERMINAL USING THE SAME - Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal. | 2015-03-19 |
20150077930 | DATA PROCESSING RACK UNIT - A data processing rack unit including: a rack; a data processing device; a cable; a coupling member that is connected to a water pipe that is formed at a column positioned on the one side out of a plurality of columns and through which cooling water flows, and that extends toward one side; a cooling water pipe that is provided at the data processing device and cools an internal portion of the data processing device; and a coupled-to member that is provided at a location on the one side of the data processing device, that is connected to the cooling water pipe, that extends toward the opposite side from the one side, and that is coupled to the coupling member accompanying insertion of the data processing device into the rack. | 2015-03-19 |
20150077931 | ELECTRONIC DEVICE WITH SERVICEABLE CPU - An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink. | 2015-03-19 |
20150077932 | SHIELDING ASSEMBLY AND ELECTRONIC DEVICE - A shielding assembly is used to shield electronic element positioned on a motherboard of an electronic device. The shielding assembly includes a shielding frame fixed to a first surface of the motherboard, a heat dissipating module, and a shielding plate. The heat dissipating module is detachably assembled to the shielding frame. When the heat dissipating module is assembled to the shielding frame, the heat dissipating module and the shielding frame form a shielding space to receive the electronic element. The shielding plate is fixed to a second surface of the motherboard opposite to the shielding frame to completely shield the electronic element. | 2015-03-19 |
20150077933 | ELECTRIC MACHINE WITH CLOSED CIRCUIT AIR COOLING - An electric machine with a closed circuit air cooling provides using only passive elements to realize an efficient and compact heat transfer from inside the electric machine to an ambient heat sink. | 2015-03-19 |
20150077934 | SYSTEMS AND METHODS FOR DISSIPATING HEAT IN AN ENCLOSURE - An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array. | 2015-03-19 |
20150077935 | Air Filter And Cable Management Assemblies For Network Communication Systems - Air filter and cable management assemblies for network communication systems are disclosed. The assemblies include filters that cover one or more communication line cards and their associated connection panels. The assemblies also include cable support structures with cable support brackets that support connected cables while restricting airflow so that airflow is forced through the filter towards the connection panels. This airflow can then pass into housings for the line cards and other circuitry, such as fabric cards, to provide desired cooling. Fan subsystems can also be provided to facilitate airflow. Advantageously, the disclosed air filter and cable management assemblies allow for filtered cooling of stacked network communication systems while greatly simplifying the complexity of the filter and cable installation and maintenance. | 2015-03-19 |
20150077936 | LIQUID COOLED ELECTRONIC MODULES AND METHODS FOR REPLACING THE SAME - Embodiments include a liquid cooled electronic device including a compartment configured to enclose an electronic module therein. The compartment includes a stationary cooling plate disposed on an interior portion of the compartment, the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate and a plurality of electrical connectors configured to connect to the electronic module. The electronic module includes a mobile cooling plate configured to intimately fit with the stationary cooling plate when the plurality of electrical connectors are connected to the electronic device module. The heat generated by the electronic module is removed by the mobile cooling plate and the stationary cooling plate. | 2015-03-19 |
20150077937 | APPARATUS FOR COOLING BOARD MOUNTED OPTICAL MODULES - An apparatus comprising a fluid-circulator loop configured to be located on a circuit board, wherein a heat-removal portion of the fluid-circulator loop is configured to be located adjacent to an optical transceiver module on the circuit board. | 2015-03-19 |
20150077938 | VARIABLE CONDUCTANCE THERMOSIPHON - The present invention relates cooling system comprising at least one Thermo syphon, which Thermo syphon comprises at least one indoor evaporator, which is by first tubing connected to at least one outdoor condenser. It is the object of the present application to achieve effective automatic cooling of electronic systems placed inside a housing. This can be achieved by a system as disclosed in that the second tubing comprises a valve, which valve comprises a valve seat and a moveable valve piston, which valve piston is by decreasing temperature by the actuator moving towards the valve seat for closing the valve. Hereby a highly efficient cooling system can be achieved which can operate automatically without any energy supply from the outside, due to the use of the Thermo syphon principle. In situations where the outdoor temperature is decreasing to a low level which could occur in situations where the outdoor condensers in winter periods is cooled to a low temperature, there is a valve, which reduces or stops condensate and liquid refrigerant backwards to the evaporator. | 2015-03-19 |
20150077939 | AIR CONDITIONER - An air conditioner is provided. The air conditioner may include an electronic device, which may include a control component to drive a refrigerant cycle, and a cooling tube through which a refrigerant to cool the electronic device may flow. The cooling tube may be coupled to one side of the electronic device. The electronic device may include an electronic case having at least one through hole, an electronic board to which the control component may be coupled, the electronic board being disposed in the electronic case, at least one heat transfer plate disposed to contact the control component, the at least one heat transfer plate being coupled to the electronic case, and at least one heat sink, to which the cooling tube may be coupled, the at least one heat sink contacting the at least one heat transfer plate through the at least one through hole. | 2015-03-19 |
20150077940 | Solder and Lead Free Electronic Circuit and Method of Manufacturing Same - An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet. | 2015-03-19 |
20150077941 | Electronic Power Device and Method of Fabricating an Electronic Power Device - An electronic device comprises a power module comprising a first main surface and a second main surface opposite to the first main surface, wherein at least a portion of the first main surface is configured as a heat dissipating surface without electrical power terminal functionality. The electronic device comprises a porous metal layer arranged on the portion of the first main surface. | 2015-03-19 |
20150077942 | ELECTRONIC POWER MODULE ARRANGEMENT - The invention provides an electrical power module, including power transistors, and control components for controlling said power transistors, said module being cooled, in particular, by heat conduction. The module of the invention further includes a main substrate of the AMB/Si3N4 type carrying the power transistors, this main substrate itself constituting a heat-dissipating baseplate for dissipating the heat generated by the power transistors by being arranged in the module to be directly in contact with the carrier structure that provides cooling by conduction when said module is in place, and a ceramic substrate carrying the control components, this ceramic substrate itself being carried by the main substrate. | 2015-03-19 |
20150077943 | SEMICONDUCTOR DEVICE COMPONENT AND SEMICONDUCTOR DEVICE - A semiconductor device component includes a first portion having a first hole usable as a nut insertion hole, and a second portion having a second hole adjacent to the first hole with a wall interposed therebetween. The first hole includes a first surface facing the wall, a second surface adjacent to the first surface, a third surface adjacent to the second surface, a fourth surface adjacent to the third surface and facing the first surface, a fifth surface adjacent to the fourth surface and facing the second surface, and a sixth surface adjacent to the fifth surface and the first surface and facing the third surface. A distance between the first and fourth surfaces is greater than a distance between the second and fifth surfaces, and greater than a distance between the third and sixth surfaces. | 2015-03-19 |
20150077944 | MULTICHIP MODULE WITH STIFFENING FRAME AND ASSOCIATED COVERS - A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings. | 2015-03-19 |
20150077945 | PORTABLE ELECTRONIC DEVICE AND BATTERY PACK FOR THE SAME - A portable electronic device and a battery pack for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) in which at least one electronic component is disposed, and a battery pack including a heat conductor separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell. | 2015-03-19 |
20150077946 | TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING SAME - A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions. | 2015-03-19 |
20150077947 | FORMULATED RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES - Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations. | 2015-03-19 |
20150077948 | PRINTED CIRCUIT BOARD CONNECTION STRUCTURE - A printed circuit board connection structure is formed by clamping and connecting a first printed circuit board and a second printed circuit board, at least one of which is a flexible printed circuit board, with a conductive adhesion layer therebetween, and includes first marks formed on the first printed circuit board and second marks and formed on the second printed circuit board. The area enclosed by the perimeter of one set of marks out of the first marks and the second marks is greater than the area enclosed by the perimeter of the other set of marks, and with the printed circuit boards in an allowable state of connection, at least a portion of the region enclosed by the perimeter of the other set of marks is located within the region enclosed by the perimeter of the one set of marks when viewed in a direction of stacking of the printed circuit boards. | 2015-03-19 |
20150077949 | METHOD FOR PACKAGING FLEXIBLE DEVICE USING HOLDING WAFER, AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME - Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps. | 2015-03-19 |
20150077950 | DISPLAY DEVICE - A display device includes: a glass substrate including a driver circuit and a plurality of connection terminals that is connected to the driver circuit and is arranged in array, and an elongated FPC, which has a plurality of panel connection terminals that correspond to the connection terminals and which is mounted on the glass substrate, wherein the FPC has a coverlay. The FPC has a chamfered-area end gap between an end portion of the coverlay facing an end face of the glass substrate and a chamfered-area end portion of the glass substrate in a mounted state, wherein the chamfered-area end gap is covered with an insulating resin, and wherein the chamfered-area end gap at a center portion of the FPC is narrower than the chamfered-area end gap at both end portions of the FPC. | 2015-03-19 |
20150077951 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly is described. The circuit board assembly ( | 2015-03-19 |
20150077952 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device and a manufacturing method thereof. The display device includes a substrate including at least one plastic layer; and a display layer on the substrate and including a plurality of signal lines and a plurality of pixels. The substrate includes at least one antistatic layer. | 2015-03-19 |
20150077953 | DISPLAY APPARATUS AND METHOD OF FABRICATING THE SAME - A display apparatus may include a substrate, a pad unit on the substrate, a display panel on the substrate, an encapsulation layer covering the display panel, and a protective layer on the pad unit. The protective layer may have an elastic coefficient ranging from about 10 MPa to about 200 GPa. | 2015-03-19 |
20150077954 | ROTARY PADDLE LEVEL SWITCH - A rotary paddle level switch has a housing, a driving unit, two switches, a resilient member, a clutch, a transmission shaft, and a propeller. A resilient clip of the clutch holds a non-circular actuation section of the transmission shaft. When the driving unit drives the clutch to rotate, the transmission shaft and the propeller are driven by the clutch. When the propeller is rapidly rotated by suddenly exerting an excessively large external force thereon, as the resilient clip holds the transmission shaft by elastic force, the fast rotating transmission shaft removes itself from the holding of the resilient clip and is rotated without driving the resilient clip to rotate, thereby avoiding the transmission of the external force and damage to the driving unit. As the clutch just needs a clutch stand and a resilient clip to achieve the foregoing function, the level switch is structurally simple and relatively inexpensive. | 2015-03-19 |
20150077955 | MOTOR DRIVE WITH INHERENT POWER ISOLATION - A motor drive comprises a power sub-assembly and a control sub-assembly. The control sub-assembly includes components that may be accessed within the sub-assembly housing during installation and maintenance of the drive. A main circuit board is configured to define a high voltage region and a low voltage region. The high voltage region is isolated by an interior barrier of the housing so that the components can be conveniently accessed. An operator interface is provided in the control sub-assembly. An interface circuit board is also isolated by the barrier. Desired spacing between the interface circuit board and a surface of the interface is provided by integrally molded spring structures and plungers that interface with underlying switches. | 2015-03-19 |
20150077956 | VEHICULAR ELECTRONIC CONTROL UNIT WITH DRAINAGE STRUCTURE - An electronic control unit for a vehicle includes a circuit board, a connector and a case. The circuit board has an electronic component disposed thereon. The connector is integrated to a surface of the circuit board to electrically connect the circuit board and an external device. The case accommodates the circuit board and the connector therein in a state where an end surface of the connector exposes from the case. The circuit board is disposed in the case such that the surface to which the connector is integrated faces down, and a clearance between the circuit board and the connector is located at a position lower than the circuit board. A droplet entering the case flows along an upper surface of the connector, which is located lower than the circuit board due to a force of gravity. The droplet is discharged from the case without affecting the circuit board. | 2015-03-19 |
20150077957 | COMPOSITE SHEET, MOUNTING STRUCTURE INCLUDING THE COMPOSITE SHEET AND ELECTRONIC APPARATUS INCLUDING THE MOUNTING STRUCTURE - A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps. | 2015-03-19 |
20150077958 | ELECTRONIC APPARATUS - Electronic apparatus includes a housing configured to have an inner layer portion forming an inner surface and an outer layer portion forming an outer surface. The inner layer portion and the outer layer portion are formed by two-color molding. The electronic apparatus includes one of a region in which the inner layer portion is not formed and a region in which the inner layer portion is thin. The one region is set in the inner surface of the housing. The electronic apparatus further includes a component configured to be housed in the housing and is disposed in the one region. | 2015-03-19 |
20150077959 | CONNECTOR DEVICE FOR A PRINTED CIRCUIT BOARD OF A CONTROL DEVICE FOR A VEHICLE TRANSMISSION, CONTROL SYSTEM FOR A VEHICLE TRANSMISSION AND METHOD FOR ASSEMBLING A CONTROL SYSTEM FOR A VEHICLE TRANSMISSION - A proposal is made for a plug device ( | 2015-03-19 |
20150077960 | LOW-TEMPERATURE PACKAGING METHODOLOGY FOR ELECTRONIC DEVICES AND OTHER DEVICES - A method includes depositing a metal seal material onto a first component of a protective module. The method also includes placing a second component of the protective module into contact with the metal seal material. The components of the protective module define a cavity configured to hold one or more devices. The method further includes heating the metal seal material to create a metal seal between the components of the protective module. In addition, the method includes depositing an outer metal material over and in contact with the metal seal. Heating the metal seal material to create the metal seal could include performing an anneal process with a peak temperature of about 150° C. to about 200° C. The method could optionally include alloying part of the metal seal with part of the outer metal material to create alloyed regions between the components of the protective module. | 2015-03-19 |
20150077961 | CONTROLLED IMPEDANCE PCB ENCAPSULATION - The present invention discloses methods and devices for encapsulating PCBs, assemblies of PCBs, and their electronic components. The encapsulation methods disclosed can be used to produce electromagnetic shields whose impedance is controlled. | 2015-03-19 |
20150077962 | SOLDER ATTACH APPARATUS AND METHOD - An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures. | 2015-03-19 |
20150077963 | PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH METAL POST - A printed wiring board includes a wiring board, and multiple posts formed on the wiring board and positioned to mount a second printed wiring board onto the wiring board. Each of the metal posts has a first surface connected to the wiring board, a second surface formed to connect the second printed wiring board, and a side surface between the first surface and the second surface, and the side surface of each of the metal posts forms a curved surface. | 2015-03-19 |
20150077964 | ELECTRIC PROPULSION SYSTEM OF ELECTRIC VEHICLE - An electric propulsion system of an electric vehicle according to one exemplary embodiment of the present disclosure includes a housing having an inside partitioned into a plurality of spaces, power conversion devices disposed in the partitioned spaces of the housing, respectively, a connection bar formed on one surface of the housing to electrically interconnect the power conversion devices and a battery, and adapters configured to connect the connection bar to the power conversion devices, wherein each of the adaptors comprises an inner side and an outer side, wherein the inner side of the adaptor is provided with conductor members formed to be electrically connected to electrodes of the power conversion devices when the electrodes are inserted therein, wherein the outer side of the adaptor is provided with shielding members covering the conductor members for shielding noise generated from the power conversion devices. | 2015-03-19 |
20150077965 | STROBE DEVICE AND IMAGE-CAPTURING DEVICE PROVIDED WITH STROBE DEVICE - A strobe device according to the present invention includes: a strobe main body; a light-emitting unit rotatably connected to the strobe main body; a variable mechanism capable of changing an angle of the light-emitting unit; a drive unit for driving the variable mechanism; and a control unit for controlling the drive unit, wherein the control unit has a mode of changing an illumination direction angle of the light-emitting unit regularly or irregularly before shooting. This makes it possible, when a subject to be photographed is a human or an animal, to draw the subject's attention, and photograph the subject in a proper state. | 2015-03-19 |
20150077966 | LIGHT-SCATTERING BODY, LIGHT-SCATTERING BODY FILM, LIGHT-SCATTERING BODY SUBSTRATE, LIGHT-SCATTERING BODY DEVICE, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND ILLUMINATION DEVICE - A light-scattering body includes at least light-transmitting resin, and first particles and second particles which are dispersed in the light-transmitting resin. An average grain size Da of the first particles is greater than an average grain size Db of the second particles. A refractive index na of the first particles is less than a refractive index nb of the second particles. The average grain size Db of the second particles is within a range of 150 nm≦Db≦300 nm. | 2015-03-19 |
20150077967 | SMART PORTABLE LIGHTING DEVICE - A smart portable lighting device including: at least one or a plurality artificial light sources having a high light output, the artificial light source or each of the artificial light sources being provided with an voltage-to-current electricity converter, which is capable of modulating the output of the light sources according to a given set value; a self-contained power source having a rechargeable battery for supplying electricity to the artificial light source(s) via the voltage-to-current electricity converters, characterized in that the device includes an electronic management casing, which includes a digital processing unit with attached circuits to which the converter(s) of the light source(s) and the self-contained power source are connected, the electronic management casing being configured so as to establish the main lighting phase by programming the desired lighting duration determining a constant light output, or by programming a constant light output determining the available lighting duration. | 2015-03-19 |