12th week of 2021 patent applcation highlights part 62 |
Patent application number | Title | Published |
20210090914 | METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | 2021-03-25 |
20210090915 | FLATTENING APPARATUS, ARTICLE MANUFACTURING METHOD, FLATTENING METHOD, AND IMPRINTING APPARATUS | 2021-03-25 |
20210090916 | DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | 2021-03-25 |
20210090917 | Multi-Wafer Volume Single Transfer Chamber Facet | 2021-03-25 |
20210090918 | SUBSTRATE CARRIER APPARATUS AND SUBSTRATE CARRYING METHOD | 2021-03-25 |
20210090919 | SUBSTRATE PROCESSING CONTROL METHOD, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM | 2021-03-25 |
20210090920 | CONTAMINANT DETECTION TOOLS AND RELATED METHODS | 2021-03-25 |
20210090921 | PROCESSING INFORMATION MANAGEMENT SYSTEM AND METHOD FOR MANAGING PROCESSING INFORMATION | 2021-03-25 |
20210090922 | SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090923 | EFEM AND EFEM SYSTEM | 2021-03-25 |
20210090924 | DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | 2021-03-25 |
20210090925 | DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | 2021-03-25 |
20210090926 | PROCESSING METHOD OF WORKPIECE | 2021-03-25 |
20210090927 | SUBSTRATE TREATING APPARATUS | 2021-03-25 |
20210090928 | SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | 2021-03-25 |
20210090929 | SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES | 2021-03-25 |
20210090930 | HOLDING DEVICE | 2021-03-25 |
20210090931 | SEMICONDUCTOR DEVICE PACKAGES AND METHOD FOR MANUFACTURING THE SAME | 2021-03-25 |
20210090932 | METHOD OF MANUFACTURING ELECTRONIC DEVICE | 2021-03-25 |
20210090933 | METHOD FOR MANUFACTURING AN ELECTROLUMINESCENT DEVICE | 2021-03-25 |
20210090934 | SUPPORT SUBSTRATE, METHOD FOR PEELING OFF SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090935 | APPARATUS FOR FABRICATING A SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE | 2021-03-25 |
20210090936 | CARRIER PLATE FOR USE IN PLASMA PROCESSING SYSTEMS | 2021-03-25 |
20210090937 | SYSTEM FOR DESIGNING THERMAL SENSOR ARRANGEMENT | 2021-03-25 |
20210090938 | INTERCONNECTS HAVING AIR GAP SPACERS | 2021-03-25 |
20210090939 | SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING THE SAME | 2021-03-25 |
20210090940 | ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS | 2021-03-25 |
20210090941 | APPARATUS WITH OVERLAPPING DEEP TRENCH AND SHALLOW TRENCH AND METHOD OF FABRICATING THE SAME WITH LOW DEFECT DENSITY | 2021-03-25 |
20210090942 | INTERCONNECT STRUCTURES INCLUDING SELF ALIGNED VIAS | 2021-03-25 |
20210090943 | Method of Forming Trenches with Different Depths | 2021-03-25 |
20210090944 | Semiconductor Structure with Staggered Selective Growth | 2021-03-25 |
20210090945 | SYSTEM AND METHOD FOR INTERCONNECTION | 2021-03-25 |
20210090946 | MULTIPLE LAYER COPPER SEEDING | 2021-03-25 |
20210090947 | SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 2021-03-25 |
20210090948 | Bottom-up Formation of Contact Plugs | 2021-03-25 |
20210090949 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2021-03-25 |
20210090950 | Self-Aligned Contacts for MOL | 2021-03-25 |
20210090951 | SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS | 2021-03-25 |
20210090952 | Fully Self-Aligned Via | 2021-03-25 |
20210090953 | Self-Aligned Trench MOSFET Contacts Having Widths Less Than Minimum Lithography Limits | 2021-03-25 |
20210090954 | METHOD OF PROCESSING WAFER, AND CHIP MEASURING APPARATUS | 2021-03-25 |
20210090955 | Method for preparing a heterostructure | 2021-03-25 |
20210090956 | NON-PLANAR I/O AND LOGIC SEMICONDUCTOR DEVICES HAVING DIFFERENT WORKFUNCTION ON COMMON SUBSTRATE | 2021-03-25 |
20210090957 | FINFET STRUCTURE HAVING DIFFERENT CHANNEL LENGTHS | 2021-03-25 |
20210090958 | Method of Manufacturing a Semiconductor Device | 2021-03-25 |
20210090959 | Air Spacer Formation for Semiconductor Devices | 2021-03-25 |
20210090960 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2021-03-25 |
20210090961 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090962 | RF CURRENT MEASUREMENT IN SEMICONDUCTOR PROCESSING TOOL | 2021-03-25 |
20210090963 | WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND ELECTRONIC DEVICE | 2021-03-25 |
20210090964 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF IMAGING DEVICE AND SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090965 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2021-03-25 |
20210090966 | SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-03-25 |
20210090967 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME | 2021-03-25 |
20210090968 | SEMICONDUCTOR APPARATUS SEMICONDUCTOR APPARATUS HAVING A SEMICONDUCTOR PACKAGE AND THERMALLY-CONDUCTIVE LAYER FOR DISSIPATING HEAT | 2021-03-25 |
20210090969 | SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS AND METHODS OF MANUFACTURING THE SAME | 2021-03-25 |
20210090970 | INTEGRATED DEVICE PACKAGE | 2021-03-25 |
20210090971 | HEAT SINK | 2021-03-25 |
20210090972 | SEMICONDUCTOR CHIP CONTACT STRUCTURE, DEVICE ASSEMBLY, AND METHOD OF FABRICATION | 2021-03-25 |
20210090973 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-03-25 |
20210090974 | POWER MODULE | 2021-03-25 |
20210090975 | CONNECTING CLIP DESIGN FOR PRESSURE SINTERING | 2021-03-25 |
20210090976 | SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090977 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090978 | SEMICONDUCTOR DEVICE | 2021-03-25 |
20210090979 | Semiconductor Package with Top or Bottom Side Cooling | 2021-03-25 |
20210090980 | SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF | 2021-03-25 |
20210090981 | SURFACE FINISH SURROUNDING A PAD | 2021-03-25 |
20210090982 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-03-25 |
20210090983 | 3D CHIP PACKAGE BASED ON THROUGH-SILICON-VIA INTERCONNECTION ELEVATOR | 2021-03-25 |
20210090984 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | 2021-03-25 |
20210090985 | WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER | 2021-03-25 |
20210090986 | FAN-OUT SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LINE STRUCTURE | 2021-03-25 |
20210090987 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2021-03-25 |
20210090988 | PATTERNED SHIELDING STRUCTURE | 2021-03-25 |
20210090989 | INTEGRATED CIRCUIT STRUCTURE OF CAPACITIVE DEVICE | 2021-03-25 |
20210090990 | CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE LAYERS TO INHIBIT SHORTING | 2021-03-25 |
20210090991 | INTEGRATED CIRCUIT STRUCTURES HAVING LINERLESS SELF-FORMING BARRIERS | 2021-03-25 |
20210090992 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TUBULAR BLOCKING DIELECTRIC SPACERS | 2021-03-25 |
20210090993 | PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-03-25 |
20210090994 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-03-25 |
20210090995 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-03-25 |
20210090996 | RESISTANCE TUNABLE FUSE STRUCTURE FORMED BY EMBEDDED THIN METAL LAYERS | 2021-03-25 |
20210090997 | SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULTING THEREFROM | 2021-03-25 |
20210090998 | APPARATUSES AND METHODS FOR SEMICONDUCTOR LAYOUTS | 2021-03-25 |
20210090999 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-03-25 |
20210091000 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-03-25 |
20210091001 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | 2021-03-25 |
20210091002 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | 2021-03-25 |
20210091003 | SEMICONDUCTOR MEMORY DEVICE | 2021-03-25 |
20210091004 | ELECTRONIC MODULE | 2021-03-25 |
20210091005 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-03-25 |
20210091006 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-03-25 |
20210091007 | Fabric With Embedded Electrical Components | 2021-03-25 |
20210091008 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-03-25 |
20210091009 | Integrated Assemblies Having Barrier Material Between Silicon-Containing Material and Another Material Reactive with Silicon | 2021-03-25 |
20210091010 | BEOL ALTERNATIVE METAL INTERCONNECTS: INTEGRATION AND PROCESS | 2021-03-25 |
20210091011 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | 2021-03-25 |
20210091012 | FLOATING DIE PACKAGE | 2021-03-25 |
20210091013 | Reduced pattern-induced wafer deformation | 2021-03-25 |