13th week of 2011 patent applcation highlights part 12 |
Patent application number | Title | Published |
20110074018 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In one embodiment, a method of manufacturing a semiconductor device is disclosed. The method includes forming a cured film of an insulation resin on a surface of a first semiconductor chip and flip-chip bonding a second semiconductor via a bump on the first semiconductor chip on which the cured film of the insulation resin is formed. The insulation resin can be cured at temperature range from (A−50)° C. to (A+50)° C., wherein “A” is a solidification point of the bump. | 2011-03-31 |
20110074019 | SEMICONDUCTOR DEVICE - To improve reliability of a semiconductor device in which wire bonding using a wire made of copper is performed. A semiconductor device is configured so that one of end parts (wide width part) of a copper wire is joined via a bump on a pad (electrode pad) formed over a main surface (first main surface) of a semiconductor chip of the semiconductor device. The bump is made of gold, which is a metal material having a hardness lower than that of copper, and the width of the bump is narrower than the width of the wide width part of the wire. | 2011-03-31 |
20110074020 | SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE - A method for mounting a semiconductor device by mounting a semiconductor chip on a board by flip chip bonding, comprising: contacting an Au bump of the semiconductor chip with a Sn—Bi solder; and heating the Sn—Bi solder at a temperature which is not lower than the melting point thereof and which is not higher than 180° C. for 30 minutes or more. | 2011-03-31 |
20110074021 | DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE - A device mounting board includes an insulating resin layer, a wiring layer provided on one of main surfaces of the insulating resin layer, and bump electrodes connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A semiconductor module is formed by having the bump electrodes connected to a semiconductor device. A recess is provided in the top face of each bump electrode. The recess communicates with an opening provided on a side surface of the bump electrode. | 2011-03-31 |
20110074022 | Semiconductor Device and Method of Forming Flipchip Interconnect Structure - A semiconductor device has a semiconductor die with a plurality of bumps or interconnect structures formed over an active surface of the die. The bumps can have a fusible portion and non-fusible portion, such as a conductive pillar and bump formed over the conductive pillar. A plurality of conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A masking layer is formed over an area of the substrate away from the interconnect sites. The bumps are bonded to the interconnect sites under pressure or reflow temperature so that the bumps cover a top surface and side surfaces of the interconnect sites. An encapsulant is deposited around the bumps between the die and substrate. The masking layer can form a dam to block the encapsulant from extending beyond the semiconductor die. Asperities can be formed over the interconnect sites or bumps. | 2011-03-31 |
20110074023 | Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate - Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed. | 2011-03-31 |
20110074024 | Semiconductor Device and Method of Forming Bump-on-Lead Interconnection - A semiconductor device has a semiconductor die with a plurality of composite bumps formed over a surface of the semiconductor die. The composite bumps have a fusible portion and non-fusible portion, such as a conductive pillar and bump formed over the conductive pillar. The composite bumps can also be tapered. Conductive traces are formed over a substrate with interconnect sites having edges parallel to the conductive trace from a plan view for increasing escape routing density. The interconnect site can have a width less than 1.2 times a width of the conductive trace. The composite bumps are wider than the interconnect sites. The fusible portion of the composite bumps is bonded to the interconnect sites so that the fusible portion covers a top surface and side surface of the interconnect sites. An encapsulant is deposited around the composite bumps between the semiconductor die and substrate. | 2011-03-31 |
20110074025 | SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND MOBILE DEVICE - An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern. | 2011-03-31 |
20110074026 | Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding - A semiconductor device has a semiconductor die with a plurality of bumps formed over an active surface of the semiconductor die. A plurality of first conductive traces with interconnect sites is formed over a substrate. The bumps are wider than the interconnect sites. A surface treatment is formed over the first conductive traces. A plurality of second conductive traces is formed adjacent to the first conductive traces. An oxide layer is formed over the second conductive traces. A masking layer is formed over an area of the substrate away from the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surface of the interconnect sites. The oxide layer maintains electrical isolation between the bump and second conductive trace. An encapsulant is deposited around the bumps between the semiconductor die and substrate. | 2011-03-31 |
20110074027 | FLIP CHIP INTERCONNECTION WITH DOUBLE POST - A microelectronic assembly includes a substrate having a first surface, a plurality of first conductive pads exposed thereon, and a plurality of first metal posts. Each metal post defines a base having an outer periphery and is connected to one of the conductive pads. Each metal post extends along a side wall from the base to ends remote from the conductive pad. The assembly further includes a dielectric material layer having a plurality of openings and extending along the first surface of the substrate. The first metal posts project through the openings such that the dielectric material layer contacts at least the outside peripheries thereof. Fusible metal masses contact the ends of some of first metal posts and extend along side walls towards the outer surface of the dielectric material layer. A microelectronic element is carried on the substrate and is electronically can be connected the conductive pads. | 2011-03-31 |
20110074028 | Semiconductor Device and Method of Dissipating Heat From Thin Package-on-Package Mounted to Substrate - A semiconductor device has a first substrate with a central region. A plurality of bumps is formed around a periphery of the central region of the first substrate. A first semiconductor die is mounted to the central region of the first substrate. A second semiconductor die is mounted to the first semiconductor die over the central region of the first substrate. A height of the first and second die is less than or equal to a height of the bumps. A second substrate has a thermal conduction channel. A surface of the second semiconductor die opposite the first die is mounted to the thermal conductive channel of the second substrate. A thermal interface layer is formed over the surface of the second die. The bumps are electrically connected to contact pads on the second substrate. A conductive plane is formed over a surface of the second substrate. | 2011-03-31 |
20110074029 | FLIP-CHIP PACKAGE COVERED WITH TAPE - A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion. | 2011-03-31 |
20110074030 | METHOD FOR PREVENTING Al-Cu BOTTOM DAMAGE USING TiN LINER - A semiconductor device and related method for fabricating the same include providing a stacked structure including an insulating base layer and lower and upper barrier layers with a conductive layer in between, etching the stacked structure to provide a plurality of conductive columns that each extend from the lower barrier layer, each of the conductive columns having an overlying upper barrier layer cap formed from the etched upper barrier layer, wherein the lower barrier layer is partially etched to provide a land region between each of the conductive lines, forming a liner layer over the etched stacked structure exposing the land region, and etching the liner layer and removing the exposed land region to form a plurality of conductive lines | 2011-03-31 |
20110074031 | BACK SIDE METALLIZATION WITH SUPERIOR ADHESION IN HIGH-PERFORMANCE SEMICONDUCTOR DEVICES - In sophisticated semiconductor devices, the metal-containing layer stack at the back side of the substrate may be provided so as to obtain superior adhesion to the semiconductor material in order to reduce the probability of creating leakage paths in a bump structure upon separating the substrate into individual semiconductor chips. For this purpose, in some illustrative embodiments, an adhesion layer including a metal and at least one non-metal species may be used, such as titanium oxide, in combination with further metal-containing materials, such as titanium, vanadium and gold. | 2011-03-31 |
20110074032 | Semiconductor device - A semiconductor device which is capable of preventing interface peeling and a crack from occurring in the vicinity of the edge part of a rewiring layer is provided. The semiconductor device includes a semiconductor substrate, an electrode pad formed on the semiconductor substrate, a first insulation film formed on the semiconductor substrate having a first aperture which exposes the electrode pad, a first conductor film formed on the electrode pad and the first insulation film, an external electrode electrically connected to the first conductor film, and a sealing resin which covers the first conductor film and the first insulation film. The first conductor film includes a plurality of copper layers which are stacked so that an outer edge portion of the first conductor film has a stepped portion. | 2011-03-31 |
20110074033 | Crack Stop Trenches - Structures and methods of forming crack stop trenches are disclosed. The method includes forming active regions disposed in cell regions of a substrate, the cell regions separated by dicing channels, and forming back end of line (BEOL) layers over the substrate, the BEOL layers being formed over the cell regions and the dicing channels. Crack stop trenches are then formed encircling the cell regions by etching a portion of the BEOL layers surrounding the cell regions. The wafer is diced along the dicing channels. | 2011-03-31 |
20110074034 | METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE - A semiconductor component and methods for manufacturing the semiconductor component that includes a double exposure of a layer of photoresist or the use of multiple layers of photoresist. A metallization structure is formed on a layer of electrically conductive material that is disposed on a substrate and a layer of photoresist is formed on the metallization structure. The layer of photoresist is exposed to light and developed to remove a portion of the photoresist layer, thereby forming an opening. Then, a larger portion of the photoresist layer is exposed to light and an electrically conductive interconnect is formed in the opening. The larger portion of the photoresist layer that was exposed to light is developed to expose edges of the electrically conductive interconnect and portions of the metallization structure. A protection layer is formed on the top and edges of the electrically conductive interconnect and on the exposed portions of the metallization structure. | 2011-03-31 |
20110074035 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor memory apparatus is provided to minimize failure of the semiconductor memory apparatus and to secure a processing margin. The method also provides for minimizing the deterioration of an operating speed and the operational stability, and minimizing the increase of resistance occurring as a result of a reduced processing margin when forming a gate pattern in a peripheral region of the semiconductor memory apparatus. The method includes forming a connection pad in a peripheral region while forming a buried word line in a cell region, and forming a gate pattern in the peripheral region while forming a bit line in the cell region. | 2011-03-31 |
20110074036 | VIA CONTACT STRUCTURES AND METHODS FOR INTEGRATED CIRCUITS - A method for fabricating an integrated circuit device includes providing a semiconductor substrate having a first region and a second region, e.g., peripheral region. The method forms a stop layer overlying the first and second regions and a low k dielectric layer (e.g., k<2.9) overlying the stop layer in the first and second regions. The method forms a cap layer overlying the low k dielectric layer. In an embodiment, the method initiates formation of a plurality of via structures within a first portion of the low k dielectric layer overlying the first region and simultaneously initiates formation of an isolated via structure for in the second region of the semiconductor substrate, using one or more etching processes. The method includes ceasing formation of the plurality of via structures within the first portion and ceasing formation of the isolated via structure in the second region when one or more portions of stop layer have been exposed. | 2011-03-31 |
20110074037 | SEMICONDUCTOR DEVICE - A device has a semiconductor chip, a wiring board, a support which supports the semiconductor chip on the wiring board and forms a gap between the semiconductor chip and the wiring board, and a sealing resin injected into the gap and covering the semiconductor chip. | 2011-03-31 |
20110074038 | METHODS FOR FORMING INTERCONNECT STRUCTURES THAT INCLUDE FORMING AIR GAPS BETWEEN CONDUCTIVE STRUCTURES - A method for forming a semiconductor structure includes forming a sacrificial layer over a substrate. A first dielectric layer is formed over the sacrificial layer. A plurality of conductive structures are formed within the sacrificial layer and the first dielectric layer. The sacrificial layer is treated through the first dielectric layer, at least partially removing the sacrificial layer and forming at least one air gap between two of the conductive structures. A surface of the first dielectric layer is treated, forming a second dielectric layer over the first dielectric layer, after the formation of the air gap. A third dielectric layer is formed over the second dielectric layer. At least one opening is formed within the third dielectric layer such that the second dielectric layer substantially protects the first dielectric layer from damage by the step of forming the opening. | 2011-03-31 |
20110074039 | RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE - A method for forming a semiconductor device is presented. A substrate prepared with a dielectric layer formed thereon is provided. A sacrificial and a hard mask layer are formed on the dielectric layer. The dielectric, sacrificial and hard mask layers are patterned to form an interconnect opening. The interconnect opening is filled with a conductive material to form an interconnect. The conductive material is processed to produce a top surface of the conductive material that is substantially planar with a top surface of the sacrificial layer. The sacrificial layer is removed. The sacrificial layer protects the dielectric layer during processing of the conductive material. | 2011-03-31 |
20110074040 | Semiconductor Device And Method For Making Same - One or more embodiments may relate to a method for making a semiconductor structure, the method including: forming an opening at least partially through a workpiece; and forming an enclosed cavity within the opening, the forming the cavity comprising forming a paste within the opening. | 2011-03-31 |
20110074041 | Circuit Board with Oval Micro Via - Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor structure. A first via is formed in the first interconnect layer and in electrical contact with the first conductor structure. The first via has a first oval footprint. | 2011-03-31 |
20110074042 | ELECTRONIC DEVICE - The electronic device includes the substrate, the electronic component mounted on a main surface of the substrate, a plurality of external terminals formed on a back surface of the substrate, and a plurality of interconnects formed on the back surface of the substrate, wherein the plurality of interconnects includes a first interconnect disposed so as to overlap with an outer edge of the electronic component in a plan view. A pitch between a first external terminal and a second external terminal, adjacent to each other in one direction with the first interconnect located therebetween, is wider than a pitch between a third external terminal and a fourth external terminal, adjacent to each other in the same direction without the first interconnect located therebetween. | 2011-03-31 |
20110074043 | METHOD OF FORMING VIAS IN SEMICONDUCTOR SUBSTRATES AND RESULTING STRUCTURES - Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from an active surface through a conductive element thereon and a portion of the substrate underlying the conductive element. The through via may then be completed by laser ablation or drilling from a back surface. In another embodiment, a partial via may be formed by laser ablation or drilling from the back surface of a substrate to a predetermined distance therein. The through via may be completed from the active surface by forming a partial via extending through the conductive element and the underlying substrate to intersect the laser-drilled partial via. In another embodiment, a partial via may first be formed by laser ablation or drilling from the back surface of the substrate followed by dry etching to complete the through via. | 2011-03-31 |
20110074044 | PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED CAP LAYER AND METHOD OF FABRICATION - An interconnect structure is provided that includes at least one patterned and cured low-k material located on a surface of a patterned graded cap layer. The at least one cured and patterned low-k material and the patterned graded cap layer each have conductively filled regions embedded therein. The patterned and cured low-k material is a cured product of a functionalized polymer, copolymer, or a blend including at least two of any combination of polymers and/or copolymers having one or more acid-sensitive imageable groups, and the graded cap layer includes a lower region that functions as a barrier region and an upper region that has antireflective properties of a permanent antireflective coating. | 2011-03-31 |
20110074045 | INTERPOSER, SEMICONDUCTOR CHIP MOUNTED SUB-BOARD, AND SEMICONDUCTOR PACKAGE - A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible. | 2011-03-31 |
20110074046 | PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A printed wiring board is configured to be connected to an organic substrate in a state where a semiconductor chip is mounted thereon. A plurality of first layers are formed of a material having the same coefficient of thermal expansion as the semiconductor chip. A plurality of second layers are formed of a material having the same coefficient of thermal expansion as the organic substrate. The first layers have different thicknesses from each other and the second layers have different thicknesses from each other. The first layers and the second layers form a lamination by being laminated alternately one on another. The thicknesses of the first layers decrease from a side where the semiconductor chip is mounted toward a side where the organic substrate is connected. The thicknesses of the second layers decrease from the side where the organic substrate is connected toward the side where the semiconductor chip is mounted. | 2011-03-31 |
20110074047 | Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die - A semiconductor device has a semiconductor die with a die pad layout. Signal pads in the die pad layout are located primarily near a perimeter of the semiconductor die, and power pads and ground pads are located primarily inboard from the signal pads. The signal pads are arranged in a peripheral row or in a peripheral array generally parallel to an edge of the semiconductor die. Bumps are formed over the signal pads, power pads, and ground pads. The bumps can have a fusible portion and non-fusible portion. Conductive traces with interconnect sites are formed over a substrate. The bumps are wider than the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surfaces of the interconnect sites. An encapsulant is deposited around the bumps between the semiconductor die and substrate. | 2011-03-31 |
20110074048 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device of the present invention includes: a base material ( | 2011-03-31 |
20110074049 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MASK AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device answerable to refinement of circuits by correctly connecting adjacent small patterns with each other with excellent reproducibility in connective exposure and a semiconductor device manufactured by this method are proposed. According to this method of manufacturing a semiconductor device, connective exposure is performed by dividing a pattern formed on a semiconductor substrate into a plurality of patterns and exposing the plurality of divided patterns in a connective manner, by forming marks for adjusting arrangement of the patterns to be connected with each other on the semiconductor substrate before exposing patterns of a semiconductor element and connectively exposing the patterns of the semiconductor element in coincidence with the marks for adjusting arrangement. | 2011-03-31 |
20110074050 | FILM FOR SEMICONDUCTOR DEVICE - The present invention provides a film for a semiconductor device, which is capable of preventing interface delamination between each of the films, a film lifting phenomenon, and transfer of the adhesive film onto the cover film even during transportation or after long-term storage in a low temperature condition. The film for a semiconductor device of the present invention is a film in which an adhesive film and a cover film are sequentially laminated on a dicing film, in which a peel force F | 2011-03-31 |
20110074051 | VENTILATION OF DRAINAGE SYSTEM FOR FRAME ENGINE EVAPORATIVE COOLER - An evaporative cooler for cooling air includes a cooling housing having an air inlet and an air outlet and an evaporation media, located within the cooling housing intermediate the air inlet and the air outlet for air flow there through and for receiving water to permit evaporation of at least some water. The evaporative cooler includes a drain pan located within the cooling housing and below the evaporation media to catch water which has not evaporated and falling from the evaporation media and a sump located within the cooling housing and below the drain pan for collecting water for use in supplying water to the evaporation media. The evaporative cooler includes a pipe connecting the drain pan to the sump for water movement from the drain pan to the sump and an air vent located within the cooling housing and connected to the pipe, the air vent being open to air within the cooling housing and above the drain pan to permit release of air from within the pipe. | 2011-03-31 |
20110074052 | Wind-water ultrasonic humidifier - A wind-water ultrasonic humidifier includes a housing, a hollow connecting portion, a water circulation system, and a power control box. The water circulation system includes an electric base, a rubber cork plugged into the top of the water circulation system and having a baffle inserted into a concave hole, a circular threaded pipe including a nebulizer and a water pump, two arc-shaped bridging support stands provided for connecting both sides of the electric base in an arc shape, a latch structure disposed at a lower end of the support stand, latches disposed on both sides of the electric base, and a water dripping device installed at an upper end of the bridging support stand. | 2011-03-31 |
20110074053 | HUMIDIFYING APPARATUS, LITHOGRAPHIC APPARATUS AND HUMIDIFYING METHOD - A humidifying apparatus is disclosed in which gas is provided to a first side of a membrane and liquid to a second side of the same membrane. The membrane is non-porous to the liquid but porous to vapour of the liquid and is liquidphilic to said liquid. | 2011-03-31 |
20110074054 | PROCESS FOR PRODUCING AN OPTICAL WAVEGUIDE AND STAMP FOR USE IN THE PRODUCTION PROCESS - In an optical waveguide, the present invention provides a process for producing an optical waveguide, and a stamp for use in the production process, in which the thickness of a lower cladding layer in the portion positioned in the lower side of a core layer is easily controlled even if any one or more materials of a substrate, a cladding material, and a stamp are material with low rigidity. The production process of the present invention comprises steps of forming a lower cladding layer which has a core groove and spacer grooves formed substantially in parallel with intervals in both sides of the core groove on a substrate by making use of soft lithography with a second stamp (i.e., a male stamp); then forming a core layer by injecting and filling a core material into the core groove, followed by curing the core material; further forming a upper cladding layer by injecting and filling a cladding material into the spacer grooves and applying the cladding material to the lower cladding layer so as to be embedded the core layer and followed by curing. A stamp used in the production process of the present invention comprises a convex portion or a concave portion corresponding to a core groove and convex portions or concave portions corresponding to spacer grooves formed substantially in parallel with intervals in both sides of the convex portion or the concave portion corresponding to the core groove. | 2011-03-31 |
20110074055 | DEVICE AND METHOD FOR FORMING LENS - In order to realize a device and a method each capable of forming a lens with high accuracy and low costs, a lens forming device of the present invention includes a metal mold, an insulating substrate, a stage, a power source, a switch, and a UV radiating device. Dielectric resin is supplied onto the insulating substrate and a transfer surface of the metal mold is pressed to the dielectric resin so as to transfer a lens shape to the dielectric resin. At that time, the power source applies a voltage on the metal mold to generate an electric field between the metal mold and the insulating substrate so that an electrostatic attraction causes the dielectric resin to be attracted toward the transfer surface of the metal mold while the top of the dielectric resin has a sharp cuspate shape. Consequently, bubbles are less likely to be invade between the transfer surface and the dielectric resin, allowing transferring a highly accurate lens shape to the dielectric resin. | 2011-03-31 |
20110074056 | METHOD FOR MANUFACTURING SPHERICAL FRESNEL LENS - Manufacturing spherical Fresnel lens includes providing a first optical element with a regular hexagonal first Fresnel micro-lens in the center of the first optical element and six regular hexagonal second Fresnel micro-lens arrayed around the first Fresnel micro-lens. One edge of the second Fresnel micro-lens is connected to one edge of the first Fresnel micro-lens. The first optical element is stressed to yield a spherical cap configuration of the first optical element, and a second optical element is provided matched to the first optical element, and including a plurality of Fresnel micro-lens. The second optical element is bent into a curve shaped configuration having a curvature as the bent first optical element, and a number of bent second optical elements are assembled around the bent first optical element in sequence to form a hemispherical-shaped configuration. | 2011-03-31 |
20110074057 | Methods and Systems for Thermoforming with Billets - Methods and systems for producing thermoformed articles from pre-cut thermoformable billets are provided. The system may include a heating apparatus for heating the billets, a billet thermoformer for thermoforming the billet into an article, a discharge system for evacuated the formed articles from the thermoformer, and an inspection system for inspecting each of the formed articles for the presence of a defect. Conveyors and billet carriers are provided for transporting the billets between the various components of the system, and loaders are provided for loading the billets onto the conveyor and/or billet carriers. | 2011-03-31 |
20110074058 | Device For And Method Of Determining Residence Time Distributions - A method of determining a residence time distribution comprises mixing a molding batch ( | 2011-03-31 |
20110074059 | POROUS CERAMIC PREPARATION METHOD - A porous ceramic member preparation method includes the step of mixing powdered silicon carbide and a resin at a predetermined ratio with a solvent to form a paste for enabling the resin to be covered on the surface of the powdered silicon carbide and the solvent to be fully vaporized, the step of processing the paste into a predetermined shape, the step of heating the shaped material at a low heating temperature to cure the resin, and the step of sintering the shaped material into a ceramic member having pores therein. | 2011-03-31 |
20110074060 | MOLDED MONOCOMPONENT MONOLAYER RESPIRATOR WITH BIMODAL MONOLAYER MONOCOMPONENT MEDIA - A molded respirator is made from a monocomponent monolayer nonwoven web containing a bimodal mass fraction/fiber size mixture of intermingled continuous monocomponent polymeric microfibers and larger size fibers of the same polymeric composition. The respirator is a cup-shaped porous monocomponent monolayer matrix whose matrix fibers are bonded to one another at least some points of fiber intersection. The matrix has a King Stiffness greater than 1 N. The respirator may be formed without requiring stiffening layers, bicomponent fibers, or other reinforcement in the filter media layer. | 2011-03-31 |
20110074061 | Process For Producing Molded Silicone Rubber Sponge - The present invention relates to a process for producing a molded silicone rubber sponge by filling a sponge-forming silicone rubber composition into a cavity of a mold, wherein after the aforementioned sponge-forming silicone rubber composition is cured, and before mold opening of the aforementioned mold, gas present in the aforementioned cavity is discharged. Thereby, a molded silicone rubber sponge without damage such as chips or the like can be effectively produced. | 2011-03-31 |
20110074062 | SYSTEM, METHOD AND APPARATUS FOR MANUFACTURING MAGNETIC RECORDING MEDIA - A system, method and apparatus for manufacturing high density magnetic media is disclosed. A flexible mold having a very low modulus of less than about | 2011-03-31 |
20110074063 | Surgical Instrument Having a Plastic Surface - A surgical instrument including a handle portion, a body portion, a movable handle, a tool assembly, a drive beam and a closure apparatus is disclosed. At least one of the closure apparatus and a contact surface of the tool assembly include a plastic surface. The body portion extends distally from the handle portion. The movable handle is located on the handle portion and is in mechanical cooperation with a drive member. The tool assembly includes an anvil, a cartridge assembly and a contact surface. The drive beam includes a proximal engagement portion and is configured to engage a portion of the drive member. The closure apparatus is configured to engage the contact surface of the tool assembly. At least a partial actuation of the movable handle moves the closure apparatus distally into engagement with the contact surface to approximate the anvil and the cartridge assembly. | 2011-03-31 |
20110074064 | IMPRINT APPARATUS AND PRODUCT MANUFACTURING METHOD - An imprint apparatus forms patterns in a plurality of shot regions on a substrate by repeating an imprint cycle in which a pattern is formed in one shot region on the substrate by curing a resin while an original and the resin are in contact with each other. The apparatus comprises a detector configured to detect a mark formed on the substrate, and a controller configured to execute overlay measurement, in which the controller causes the detector to detect the mark, and obtains an overlay error that is a shift between a pattern formed on a given layer on the substrate and a pattern newly formed on a layer on or above the given layer, between successive imprint cycles. | 2011-03-31 |
20110074065 | RIBBON LIQUEFIER FOR USE IN EXTRUSION-BASED DIGITAL MANUFACTURING SYSTEMS - A ribbon liquefier comprising an outer liquefier portion configured to receive thermal energy from a heat transfer component, and a channel at least partially defined by the outer liquefier portion, where the channel has dimensions that are configured to receive the ribbon filament, and where the ribbon liquefier is configured to melt the ribbon filament received in the channel to at least an extrudable state with the received thermal energy to provide a melt flow. The dimensions of the channel are further configured to conform the melt flow from an axially-asymmetric flow to a substantially axially-symmetric flow in an extrusion tip connected to the ribbon liquefier. | 2011-03-31 |
20110074066 | Methods of demolding building products from a mold - A demolding apparatus for removing molded building products from a mold has a conveyor assembly to advance the mold in a machine direction. A removal mechanism contacts a dislodged portion of the molded building product and applies a dislodging force to the dislodged portion of the molded building product. | 2011-03-31 |
20110074067 | Manufacture Of An Acoustic Silencer - A method for manufacturing a resonator is disclosed in which a sleeve insert is placed into a fixture within a blow molding apparatus. The sleeve insert has a wall with a first plurality of apertures in the wall at a first axial distance and a second plurality of apertures in the wall at a second axial distance. A parison is slid over the sleeve insert; the mold is clamped over the parison causing the parison to press into the sleeve insert at three locations: near the ends of the sleeve insert and at a location between the pluralities of apertures; and air is blown into the sleeve insert, via a blow pin, to expand the parison into the walls of the mold to form cavities proximate the first and second pluralities of aperatures. After cooling, the mold opens to release the newly formed resonator. | 2011-03-31 |
20110074068 | METHOD FOR SINTERING ANHYDROUS CALCIUM SULFATE AS BIOMEDICAL MATERIAL - A method for sintering anhydrous calcium sulfate material as biomedical material, includes the steps of: (a) preparing the anhydrous calcium sulfate material; (b) mixing the anhydrous calcium sulfate material with a sintering-support agent thoroughly to obtain a mixture waited for sintering; (c) die-pressing the mixture into a predetermined shape; and (d) executing a heat treatment onto the mixture to make the mixture be sintered to form the biomedical material having the predetermined shape. | 2011-03-31 |
20110074069 | THE METHOD OF MANUFACTURING BUILDING BRICK - Dry compound from clay, quartz sand, starch as binding addition agent is prepared, 20% of water solution of sodium hydroxide is added to it, the obtained mixture is formed and exposed to bake for 1.5 hour under 960-1050 deg. C., at that, the ratio of quartz sand and clay is 2.33:1, and the ratio of dry compound and solution of sodium hydroxide is 6.25:1. Thus, the method is simplified, the obtained bricks have low heat transfer and low gravity, but are solid, cold, heat and chemical-resistant. | 2011-03-31 |
20110074070 | OPERATION METHOD OF FLASH SMELTER AND RAW MATERIAL SUPPLY APPARATUS - An operation method of a flash smelter includes blowing a gas for dispersing raw material and contributing to a reaction, from a lance at an upper portion of a shaft so that the gas forms a spiral flow. A raw material supply apparatus includes a supply portion supplying raw material and a gas for dispersing the raw material and contributing to a reaction into a flash smelting furnace, wherein the supply portion has a lance provided at an upper portion of a shaft that blows the gas so that the gas forms a spiral flow. | 2011-03-31 |
20110074071 | COOLING PLATE ARRANGEMENT AND METHOD FOR INSTALLING COOLING PLATES IN A METALLURGICAL FURNANCE - The present invention proposes a gap-filler insert ( | 2011-03-31 |
20110074072 | Side well for metal melting furnace - An exemplary embodiment of the invention provides a side well for a metal melting furnace. The side well comprises an insulated body having a front wall adapted to form part of an insulated side wall of a metal melting furnace and a top, a cavity within the body including a single upright well having a cylindrical wall adjacent to a closed bottom of the cavity, an entrance to the cavity at the top of the insulated body, a metal inlet channel leading directly into the cavity from an inlet aperture in the front wall, and a metal outlet channel leading directly from the cavity to a metal outlet aperture in the front wall. The side well includes a rotatable impeller having a vertical rotatable shaft and at least one vaned section positioned at a lower end of the rotatable shaft; wherein the impeller extends into the cavity with the vaned section positioned in the well adjacent to the cylindrical wall. | 2011-03-31 |
20110074073 | METHOD OF PRODUCING CAST IRON - A method of producing a silicon-and-carbon-enriched cast iron melt. The method can include melting an initial cupola charge in a cupola, conducting the molten metal to a mixing vessel, increasing the silicon and carbon content of the molten metal by a substantially continuous addition of granular silicon carbide having a purity of greater than 94% and a size of less than ⅜″ to the mixing vessel while simultaneously agitating the molten metal to an extent sufficient to bring the silicon carbide into solution with the molten metal, and conducting the silicon-and-carbon-enriched molten metal away from the mixing vessel. | 2011-03-31 |
20110074074 | Compliant Banding System - The present invention discloses a compliant banding system for use in a marine environment comprising a flexible compliant member and an abaxial relatively rigid strap, both constructed to extend circumferentially around an underlying structure such as a strake or fairing collar. The strap maintains a fixed circumference while the compliant member flexes intermediate the strap and an underlying. | 2011-03-31 |
20110074075 | APPARATUS, SYSTEM, AND METHOD FOR A CUSHIONING ELEMENT - A cushioning element includes a two-sided membrane. The membrane may be of any size and shape appropriate to a desired application. Units extend from each side of the membrane with units on one side staggered or offset from those of the other. Depressing a unit on one side of the membrane causes displacement of at least part of the other side of the membrane into the space opposite to the depressed unit. Releasing the depressed unit allows the membrane to return to at least substantially its previous position. Membrane resiliency may be consistent throughout an embodiment or part(s) may be differently resilient. Units may be consistent in resiliency, size and/or shape on one or both sides of an embodiment, or may vary on one or both sides. Membrane and units may be integrally made in whole or in part within an embodiment. The cushioning element may have vibration dampening characteristics. | 2011-03-31 |
20110074076 | SPRING STEEL AND SPRING HAVING SUPERIOR CORROSION FATIGUE STRENGTH - A high-strength spring steel and a spring are provided that have superior corrosion fatigue strength. The spring steel comprises, in mass percent, 0.35-0.55% C, 1.60-3.00% Si, 0.20-1.50% Mn, 0.10-1.50% Cr, and at least one of 0.40-3.00% Ni, 0.05-0.50% Mo and 0.05-0.50% V, the balance being substantially Fe and incidental elements and impurities. | 2011-03-31 |
20110074077 | SPRING STEEL AND SPRING HAVING SUPERIOR CORROSION FATIGUE STRENGTH - The present application provides a high strength spring steel and a high strength spring that have superior corrosion fatigue strength. The spring steel comprises, in terms of percent by mass, 0.35-0.55% C, 1.60-3.00% Si, 0.20-1.50% Mn, 0.10-1.50% Cr and at least one element selected from 0.40-3.00% Ni, 0.05-0.50% Mo 0.05-0.50% V, the balance being at least substantially Fe and incidental elements and impurities. | 2011-03-31 |
20110074078 | SPRING STEEL AND SPRING HAVING SUPERIOR CORROSION FATIGUE STRENGTH - A spring steel and spring having superior corrosion fatigue strength and a strength on the order of HRC 53 to HRC 56 are disclosed. The spring steel comprises a tempered martensite and 2.1 to 2.4% Si in terms of percent by mass of the total mass of the spring steel. | 2011-03-31 |
20110074079 | COIL SPRING FOR AUTOMOBILE SUSPENSION AND METHOD OF MANUFACTURING THE SAME - A manufacturing method of a coil spring for an automobile suspension includes forming a material into a coil shape; performing a heat treatment step on the material; performing a warm shot peening step on the material, and performing a hot setting step on the material. By performing the warm shot peening step prior to the hot setting step, a stronger compressive residual stress is imparted in a direction along which a large tensile stress acts during actual use of the coil spring, thereby improving sag resistance and durability of the coil spring. A coil spring is also manufactured according to this method. | 2011-03-31 |
20110074080 | Carrier for Holding Microelectronic Devices - One embodiment is a carrier for holding devices that includes a tray having one or more sites in which a device may be held, and a frame resiliently coupled to the tray so the tray is movable with respect to the frame. | 2011-03-31 |
20110074081 | Sheet processing apparatus and image forming apparatus - A sheet processing apparatus includes: a staple tray on which sheets are stacked temporarily and stapled after being aligned together and from which the stapled sheets are discharged to a discharge tray; a discharger to discharge the sheets to the staple tray; a rear end reference against which rear ends of the sheets are abutted to be aligned together; a returner to return the sheets discharged by the discharger and to align the sheets together in a conveying direction based on the rear end reference fence; a lifter to lift and lower the returner with respect to a sheet; and a guide configured to guide the sheets toward the rear end reference fence when the sheets are returned and to be lifted and lowered in synchronization with the lifting and lowering by the lifter. | 2011-03-31 |
20110074082 | SHEET FEEDER, IMAGE FORMING APPARATUS HAVING THE SAME, AND METHOD FOR SHEET FEEDING - A sheet feeder includes a sheet feed tray on which a first sheet bundle is stacked at a first position where sheet feeding to a conveyance path can be performed, and a conveyance tray on which a second sheet bundle is stacked at a second position adjacent to the sheet feed tray, and which conveys the second sheet bundle to the sheet feed tray and stacks the second sheet bundle on the sheet feed tray after the first sheet bundle is fed, presses the stacked second sheet bundle to a side plate provided in a direction perpendicular to a conveyance direction of the conveyance tray, and aligns an end of the second sheet bundle. | 2011-03-31 |
20110074083 | SHEET POST-PROCESSING APPARATUS WITH PROTECTION COVER - A sheet post-processing apparatus of the invention includes a sheet guiding unit configured to have plural components including paper carrying components be attached thereto, a tray onto which a sheet of paper is discharged, and a protection cover attached to the sheet guiding unit at a portion in close proximity to the tray side. A protection cover has a cover main body, a screw attachment portion, a screw cover that covers the screw attached to the screw attachment portion, and a slit used for the tip end of the screw cover to be inserted into the cover main body to be fixed thereto. | 2011-03-31 |
20110074084 | PRINTER - A printer includes a printer body, a tray, and an actuating device. The printer body is capable of outputting file paper from a paper output opening. The tray is attached to the printer body configured for holding file paper. The actuating device is attached to the tray capable of moving the file paper in the tray to a predetermined position. | 2011-03-31 |
20110074085 | PAPER SHEET OBVERSE AND REVERSE SIDE ARRANGING DEVICE - A paper sheet obverse and reverse side arranging device according to the present invention, includes: a reversible conveying section which includes a rotor reversibly conveying paper sheets in two directions opposite to each other, and two inlet and outlet sections provided in front of the two directions, respectively; a sorting section which is provided in an upstream conveying path upstream from the reversible conveying section, and which sorts paper sheets to either one of the two inlet and outlet sections; two guiding sections which are provided in the two inlet and outlet sections, respectively, and which guide paper sheets conveyed from the reversible conveying section; two guide conveying sections which convey paper sheets guided from the reversible conveying section by the two guiding sections towards a downstream conveying path provided downstream; and a control section which controls the reversible conveying section and the sorting section. | 2011-03-31 |
20110074086 | DECOLORIZING DEVICE AND METHOD FOR CONTROLLING DECOLORIZING DEVICE - According to one embodiment, a decolorizing device includes a first stacker to stack sheets to be decolorized images on the sheets, a second stacker arranged adjacent to the first stacker, wherein the sheets stacked on the first stacker is kept waiting on the second stacker in order to be decolorized the images, a pressing unit to urge the sheets stacked on the second stacker downward and keep the sheets stacked on the second stacker flat, an image decolorizing unit to decolorize the images on the sheets, and a sheet feed unit positioned on an upper surface of the pressing unit to convey the sheets pressed on the pressing unit from the second stacker to the image decolorizing unit. | 2011-03-31 |
20110074087 | Sheet Feeding Device - A sheet feeding device, having a sheet feeding mechanism and an image processor is provided. The sheet feeding mechanism includes a base structure, a first roller, and a second roller. The first roller includes a first shaft and a first roller body fixed to the first shaft. The second roller includes a second shaft and a second roller body fixed to the second shaft. The first roller feeds a sheet into a sheet feeding path, and the second roller conveys the sheet in the sheet feeding path. The first roller and the second roller are connected with each other by a connector member, which rotatably supports the first shaft and the second shaft and maintains positional relation of the first shaft and the second shaft with respect to each other. | 2011-03-31 |
20110074088 | PAPER SHEET PICK UP DEVICE - According to one embodiment, a pick up device for paper sheets includes an input unit configured to support a plurality of paper sheets in a stacked manner, a supply mechanism configured to move the placed paper sheets in a stacking direction and supply each paper sheet to an pick up position, a pick up mechanism configured to pick up the paper sheet at the pick up position from the input unit one by one, and a control unit configured to determine a supply speed or a feed amount of the paper sheets by the supply mechanism in accordance with thickness information per unit time of the picked up paper sheets obtained from a thickness detector, and configured to determine whether the supply mechanism is to be operated or stopped based on density information of the paper sheets obtained from a paper sheet sensor. | 2011-03-31 |
20110074089 | MEDIA TRANSPORT - A media transport element comprises: a fixed roller, a first coupling connected an end of the fixed roller for receiving rotational motion therefrom, a second coupling connected to the first coupling for receiving rotational motion therefrom, and being rotatable about a pivot axis; and a pivoting roller mounted in registration with the fixed roller. The fixed roller and the pivoting roller define a media passage therebetween. The media transport element also comprises: a link coupled to the pivoting roller and mounted on a link shaft co-axial with the pivot axis. The fixed roller and the pivoting roller are both continuously driven even when media items pass through the media passage and move the pivoting roller away from the fixed roller. | 2011-03-31 |
20110074090 | RECORDING TARGET MEDIA CASSETTE, RECORDING TARGET MEDIUM FEEDING APPARATUS, AND RECORDING APPARATUS - A recording target medium feeding apparatus includes a body having a switching section and a feeding section that feeds a recording target medium. A recording target media cassette that receives the recording target media has an inner wall facing the leading edge of the recording target medium and switches between first and second states. In the first state, the inner wall has a predetermined angle with respect to a bottom surface of the recording target media cassette. In the second state, the inner wall has a steeper angle of inclination. In the first state, the inner wall separates the uppermost of the recording target media from a second recording target medium. In the second state, the inner wall contacts the leading edge of the recording target media loaded in the recording target media cassette and sets the leading edge of the recording target media at a uniform edge position. | 2011-03-31 |
20110074091 | PAPER SHEET CONVEYING DEVICE AND PAPER SHEET CONVEYING SYSTEM - A paper sheet conveying device is equipped with a conveying path ( | 2011-03-31 |
20110074092 | SHEET FEEDER AND IMAGE RECORDING APPARATUS - A sheet feeder, including: a holding portion for holding sheets; a sheet supply portion; an inclined member disposed downstream of the holding portion and having an inclined surface for guiding each sheet in a sheet feed direction along the inclined surface; a plurality of first separation protrusions provided on and integrally with the inclined member and arranged in the sheet feed direction, each first separation protrusion protruding from the inclined surface such that its distal end is located more downstream in the sheet feed direction than its proximal end; and a plurality of second separation protrusions formed of a metal, each second separation protrusion protruding from the inclined surface through a corresponding one of openings formed in the inclined member at a position in the sheet feed direction between corresponding adjacent two of the first separation protrusions, the second separation protrusions being arranged in the sheet feed direction. | 2011-03-31 |
20110074093 | SHEET FEEDER AND IMAGE RECORDING APPARATUS - A sheet feeder, including; a sheet holding portion; a sheet supply portion; an inclined member having an inclined surface and configured to guide each sheet in a sheet feed direction; and separation protrusions which are provided on the inclined member and each of which protrudes from the inclined surface such that a distal end thereof is located more downstream in the sheet feed direction than a proximal end thereof, wherein each separation protrusion has a contact surface and said each sheet comes into contact with one or more contact surfaces of the separation protrusions, and wherein each separation protrusion protrudes from the inclined surface such that the distal end of one of the separation protrusions is located more downstream in the sheet feed direction than the proximal end of another of the separation protrusions that is located immediately downstream of the one of the separation protrusions in the sheet feed direction. | 2011-03-31 |
20110074094 | SHEET FEEDER AND IMAGE RECORDING APPARATUS - A sheet feeder, including: a holding portion for holding sheets; a sheet supply portion; an inclined member having an inclined surface for guiding each sheet in a sheet feed direction along the inclined surface; a first separation protrusion provided integrally on the inclined member so as to protrude from the inclined surface such that its distal end is located more downstream in the sheet feed direction than its proximal end; a plurality of second separation protrusions formed of a metal and disposed more upstream in the sheet feed direction than the first separation protrusion, each second separation protrusion protruding from the inclined surface through a corresponding one of openings formed in the inclined member, the second separation protrusions being arranged in the sheet feed direction; and a fixing member by which the second separation protrusions are fixed to the inclined member on a surface thereof opposite to the inclined surface. | 2011-03-31 |
20110074095 | SHEET CONVEYING APPARATUS - A sheet conveying apparatus includes a first storing unit in which a sheet bundle is stacked, a second storing unit that is provided near the first storing unit and in which the sheet bundle is stacked, a transfer tray that is provided in the second storing unit and transfers the sheet bundle from the second storing unit to the first storing unit, and a stopper that regulates, when the transfer tray transfers the stacked sheet bundle from the second storing unit to the first storing unit and moves from the first storing unit to the second storing unit, movement of the sheet bundle on the transfer tray. | 2011-03-31 |
20110074096 | MEDIA HANDLING - A media handler comprises a pick unit arranged to receive a media cassette defining a stub; a detent mounted on the pick unit and resiliently biased to protrude into a path traversed by the stub until deflected by the stub; and a latch pivotably mounted to the pick unit. The latch defines: (i) a flag portion and (ii) a recess engagable by the stub as the cassette is fully inserted into the pick unit. The latch is moveable between (i) an open position in which the detent prevents the latch from moving and (ii) a closed position in which the detent has been deflected by the stub and the recess engages with the stub. Complete insertion of the cassette causes the stub to deflect the detent out of the path, thereby allowing the latch to pivot from the open to the closed position and the recess to engage with the stub to lock the cassette in position. | 2011-03-31 |
20110074097 | PAPER-OUT MECHANISM FOR PRINTING APPARATUS - A paper-out mechanism for a printing apparatus, includes a paper out wall and a paper out board. The paper out wall defines a paper out opening via which a printing apparatus discharges printed papers out. The paper out opening includes a first edge and a second edge facing to the first edge. The paper out board is slidably mounted on the paper out wall below the paper out opening. The paper out board is capable of receiving printed papers discharged from the paper out opening. The paper out board includes an adapter portion which includes a first side and a second side. A distance between the first side and second side is greater than a distance between the first edge and the second edge. The paper out board is slidable between a first position and a second position. In the first position, the first side of the adapter portion is in alignment with the first edge of the paper out opening. In the second position, the second side of the adapter portion is in alignment with the second edge of the paper out opening. | 2011-03-31 |
20110074098 | PAPER SHEETS STORAGE AND PAPER SHEETS HANDLING APPARATUS - The provides a two money kinds recycle box provided with a plurality of paper money accumulating portions and storing and feeding the paper money at one position, thereby simplifying a carrier path structure of a whole of a paper money inputting and outputting machine provided with the two money kinds recycle box, and corresponding to a lot of money kinds with a compact structure. The two money kinds recycle box is provided with an output and input port outputting and inputting the paper money with respect to an external portion, a plurality of paper money accumulating portions storing the paper money, a pickup roller provided at one position of each of the paper money accumulating portions and carrying out an accumulating motion of the paper sheets onto the paper money accumulating portions and a feeding motion of the paper sheets from the accumulating portions, and a two-way carrier path carrying the paper sheets in a two-way direction between the one output and input port and a plurality of pickup rollers. | 2011-03-31 |
20110074099 | DOCUMENT DESKEWING MODULE WITH A MOVING TRACK BOTTOM AND METHODS OF OPERATING A DOCUMENT DESKEWING MODULE - A document deskewing module is provided for a self-service bunch document depositing terminal. The document deskewing module comprises a set of sensors arranged to detect when a document transported in a first direction of document travel along a document transport path is deskewed, a first set of drive rollers in the form of hard drive rollers disposed along the document transport path, a first set of idler rollers moveable towards and away from the hard drive rollers, a second set of drive rollers in the form of soft drive rollers disposed along the document transport path, a second set of idler rollers moveable towards and away from the soft drive rollers, a track bottom disposed on one side of the document transport path and movable in the first direction of document travel, and a controller arranged to (i) control operation of the first and second sets of idler rollers in response to a number of signals from the set of sensors such that a deskewed document is moved in a second direction of document travel which is transverse to the first direction of document travel, and (ii) control operation of the movable track bottom such that a leading front corner of the deskewed document is moved in the first direction of document travel when the corner moves into contact with the track bottom as the document is moving in the second direction of document travel so as to reduce tendency of the corner of the document from curling and thereby to reduce tendency of the corner from bunching up and causing a document jam condition. | 2011-03-31 |
20110074100 | METHOD AND APPARATUS FOR USE IN A DOCUMENT JOGGER SYSTEM FOR AUTOMATICALLY DETECTING AND RESPONDING TO CONDITIONS OCCURRING IN THE DOCUMENT JOGGER SYSTEM - A method and apparatus for use in document jogger system are provided. The apparatus includes a document detector that detects the presence and absence of documents in the pocket of the document jogger system and that automatically activates and deactivates the document jogger system when documents are present and absent, respectively. Detecting the presence and absence of documents in the pocket and automatically activating and deactivating, respectively, the document jogger system based on the detected conditions, allows an increase in overall “wall-clock” throughput and a reduction in operator intervention to be realized. The increased throughput and the reduced operator intervention improve the overall quality of document processing and allow overall document processing costs to be reduced. The apparatus may also include one or more visual indicators and associated electrical circuitry for providing a visual indication of the status of the document jogger system. | 2011-03-31 |
20110074101 | SHEET STACKER - According to one embodiment, a sheet stacker includes a stacking table, a pair of side walls, and a sensor. The stacking table is configured to stack a sheet. The pair of side walls is configured to move symmetrically with respect to a center position to regulate both sides of the sheet in a width direction. The sensor is configured to detect a relative position of the center position against the stacking table. | 2011-03-31 |
20110074102 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - To prevent deviation in a processing position of a sheet bundle caused by buckling of the sheet bundle and handle a number of diversified kinds of sheets without increasing the size of apparatuses, a sheet processing apparatus and a image forming apparatus includes a pair of saddle entrance rollers which discharges a sheet; a stack tray which stacks the sheet discharged by the roller pair; a gripping member which grips the rear end portion of the sheet in the discharging direction which is stacked by the tray; a gripper which grips the front end portion of the sheet in the discharging direction which is stacked by the tray; and a stapler, etc., which processes a sheet bundle at a processing position, wherein the gripping member and the gripper grip the sheet bundle stacked by the tray and move the sheet bundle to the processing position in cooperation with each other. | 2011-03-31 |
20110074103 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - Provided is a sheet processing apparatus for processing sheets, including: a sheet process tray on which sheets to be processed are stacked; a sheet transport means for transporting processed sheets on the sheet process tray; a pressure member which is provided on an upstream side of the sheet transport means with respect to a sheet transport direction and which moves in the sheet transport direction while pressing the processed sheets, for transporting the processed sheets in cooperation with the sheet transport unit; and a controller for selectively operating the pressure member. | 2011-03-31 |
20110074104 | PAPER SORTING APPARATUS AND ELECTRONIC DEVICE WITH PAPER SORTING APPARATUS - A paper sorting apparatus for an electronic device includes a chassis with a control module disposed therein, a paper transporting module accommodated in the chassis, and a plurality of paper trays attached to the chassis. The paper transporting module has a first end, that is pivotable, and a second end, that is attached to the control module. The control module is capable of rotating the second end about the first end and coupling the second end with one of the paper trays. | 2011-03-31 |
20110074105 | Game Having Adversarial Figure Releasably Holding a Player Figure - A game includes an adversarial figure with at least two portions that cooperatively present a figure-holding chamber. A captured figure is removably positioned in the chamber and operable to enter and exit the chamber. The holding figure also has a latch assembly that holds the portions in a closed condition where figure ingress and egress is restricted. The latch assembly can be shifted to open the portions and permit figure ingress and egress to and from the chamber. The game has an objective of freeing the captured figure from within the chamber by having a player position a rescuing figure in a game area, and releasing the captured figure from control of the holding figure as a result of a releasing act of the rescuing figure. | 2011-03-31 |
20110074106 | MULTI-GAME TABLE ASSEMBLY - A game table assembly comprises a game table having a game-playing surface, two parallel and opposing ends extending parallel to a width axis, and two parallel and opposing longitudinal edges extending parallel to a longitudinal axis. The ends of the game table are shorter in length than the longitudinal edges. The game table assembly additionally includes two side support members positioned adjacent the longitudinal edges and a rotating mechanism defining a central width axis parallel to the shorter width ends. The rotating mechanism rotatably engages the game table with the side support members at opposing engagement positions along the longitudinal edges. The game table is configured to pivot about the rotating mechanism so that the game table is rotatable about the central width axis. Additionally, the game table is selectively lockable in at least one position. | 2011-03-31 |
20110074107 | Games and gaming devices utilizing game cards with bonus symbols - A game utilizes cards or similar game elements having at least primary indicia or symbols and in some instances at least a secondary or bonus indicia or symbol. The primary indicia may comprise card rank and suit indicia. The cards may include a secondary slot or bonus symbol. A deck of cards may comprise multiple cards having primary indicia with one or more or all of the cards including a secondary or bonus symbol. The primary indicia may be evaluated in the play of a primary game such as a poker game, while the secondary symbols may be used in a secondary slot game or may trigger one or more bonus events. In other embodiments, the game cards may include game symbol primary indicia, game suit secondary indicia and slot line tertiary indicia. A deck of slot cards may be formed from individual cards each bearing unique combinations of the indicia. In game play, slot cards may be dealt in a row and, after any discard and replacement, the resulting slot cards may be evaluated against a pay table which defines winning combinations of slot cards and associated awards. | 2011-03-31 |
20110074108 | CARD GAME WITH COMMON CARD REMOVAL - A method of managing a card game, a computer implementation thereof, and a card game kit, according to which a hand of cards is dealt to each of a plurality of players. Each hand includes one or more cards, and each card bears a designated value and suit. A plurality of common cards are dealt into a common card zone, and all players know the designated value and suit of each common card. The players then have the option of placing a wager or withdrawing from the game, after the hands and common cards have been dealt. For those players remaining in the game, at least one common card is removed from the common card zone and wagering or withdrawing continues until a winner is determined based at least in part on remaining cards in the common card zone. | 2011-03-31 |
20110074109 | Ring toss game and equipment therefor - A tossing game includes playing equipment. The playing equipment includes a first pair of propelling sticks and a tossable ring member. The first pair of propelling sticks include a proximal handle portion, a distal portion and a guard portion. The tossable ring member include a central aperture. The distal portion of the propelling sticks are sized and configured for being received within the central aperture of the ring member. | 2011-03-31 |
20110074110 | GRAVITY RESET TARGET - A gravity reset target system that includes a target plate assembly that is removably engaged with a base plate assembly. The base plate assembly includes at least two parallel guide plates having grooves cut therein and the target plate assembly includes a target plate secured to a carrier piece having at least one guide rod. The guide rod of the carrier piece is inserted into the grooves in the guide plates to removably engage the target plate assembly with the base plate assembly. The target plate begins in a vertical resting position, rocks backward to a generally horizontal position when struck with a projectile, and then automatically returns to its vertical resting position. | 2011-03-31 |
20110074111 | TARGET-BASED GAME & METHODS OF PLAYING THEREOF - Embodiments of a target-based game and methods of playing the target-based game are herein disclosed. In one embodiment, the target-based game includes a vertically-oriented target platform having a plurality of openings therein. Each opening may be approximately circular in configuration, may vary in size, and may have a backing, or “pocket” to catch one or more game pieces. In one embodiment, the target platform includes one or more suspension means about one or more edges or peripheries thereof for holding the target platform in a vertically-oriented position when attached to a plurality of supporting members. When assembled, the supporting members may form a frame to support the suspension means and/or the target platform. A plurality of game pieces may be used to play a variety of games using the target-based game. | 2011-03-31 |
20110074112 | Target positioning system - Target positioning system with a rectangular flat table top member having downwardly disposed side walls and three primary legs to support the table top member. Two primary legs are hingedly attached to the left and right rear corners of the table top member. One primary leg is hingedly attached under the center front portion of the table top member. Each leg has a telescoping secondary leg member that is capable of being affixed to the to the primary leg member to adjust the height of the primary leg member. The table top member left and right side walls include slots for receiving a strap. The strap can be adjusted in length to hold a standard archery target cube. The flat table top member includes upwardly facing flange located at the rear edge of the table top to prevent the target block from being thrust backward during target practice. | 2011-03-31 |
20110074113 | METHOD AND COMPOSITION FOR COATING OF HONEYCOMB SEALS - A method and composition are provided for coating honeycomb seals and, more specifically, to a method and slurry for applying an aluminide coating onto honeycomb seals. The method includes preparing a slurry of a powder containing a metallic aluminum alloy having a melting temperature higher than aluminum, an activator capable of forming a reactive halide vapor with the metallic aluminum, and a binder containing an organic polymer. The slurry is applied to surfaces of the honeycomb seal, which is then heated to remove or burn off the binder, vaporize and react the activator with the metallic aluminum to form the halide vapor, react the halide vapor at the substrate surfaces to deposit aluminum on the surfaces of the seal, and diffuse the deposited aluminum into the surfaces to form a diffusion aluminide coating. | 2011-03-31 |
20110074114 | GASKET, COVER WITH GASKET, AND PNEUMATIC CYLINDER WITH COVER AND GASKET - A gasket includes a damping buffer for a piston that can be charged with a pressure medium and that can be moved back and forth axially in a cylinder pipe and includes at least one static seal for sealing the cylinder pipe vis-à-vis a cover connected to the face of the cylinder pipe and a dynamic seal having at least one dynamically loaded sealing lip that, during the proper use of the gasket, can be laid against the surface to be sealed of a damping journal that is connected to and axially movable back and forth with the piston and that has at least one flow-guiding connection opening that connects the axial faces of the gasket. | 2011-03-31 |
20110074115 | Injection of sealant for pressure sealant type rotary seal - An insert for a pressure sealant type sealing system, an improved sealing system for sealing between an aperture of a machine housing and a rotating shaft of the machine protruding through the aperture, comprising the insert to provide a pair of outlets into the driveshaft arranged collinearly around the driveshaft, a method of injecting the sealant into the stuffing box in two positions on opposite sides of the drive shaft thereby balancing the pressure, and a method of retrofitting existing pressure sealant systems by retrofitting with the insert. | 2011-03-31 |
20110074116 | COLLAPSIBLE EXPANSION MECHANISM FOR EFFECTING A SEAL - An expansion mechanism of the type that may be used with a seal for sealing a connection about the upper end of a concrete structure, such as providing as seal across a manhole frame, optionally one or more spacer rings, and the upper end of a manhole chimney or riser, or which may be used with a seal for internally sealing a connection between a pair of pipes. The expansion mechanism includes a pair of ring portions and a pair of expansion mechanisms that include pivotal connections to the ring portions such that the assembly may be moved or folded between a folded configuration, in which the assembly has a reduced profile to allow the assembly to be moved into place at the sealing site, and a deployed configuration, in which the assembly has a cylindrical shape and is expandable to compress the seal against a cylindrical surface. | 2011-03-31 |
20110074117 | Cable Drop System - The present invention is directed toward a sealing assembly in a cable drop system. The sealing assembly includes a base mounted to a network cabinet and a cover hingedly connected to the base. The sealing assembly also includes a lower sleeve and an upper sleeve. The lower sleeve and the upper sleeve wrap around the cables passing through an opening in the cable drop system. The lower sleeve includes a top portion and a bottom portion. The bottom portion of the lower sleeve is connected to the base and the upper sleeve is positioned around the top portion of the lower sleeve to form the sealing assembly. | 2011-03-31 |