13th week of 2021 patent applcation highlights part 56 |
Patent application number | Title | Published |
20210098402 | INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES | 2021-04-01 |
20210098403 | SEMICONDUCTOR DEVICE | 2021-04-01 |
20210098404 | PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS | 2021-04-01 |
20210098405 | BUMP STRUCTURE TO PREVENT METAL REDEPOSIT AND TO PREVENT BOND PAD CONSUMPTION AND CORROSION | 2021-04-01 |
20210098406 | MICROELECTRONIC DEVICE WITH PILLARS HAVING FLARED ENDS | 2021-04-01 |
20210098407 | VIAS IN COMPOSITE IC CHIP STRUCTURES | 2021-04-01 |
20210098408 | Interconnect Chips | 2021-04-01 |
20210098409 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098410 | Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and Method of Forming a Metal Interconnect | 2021-04-01 |
20210098411 | MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME | 2021-04-01 |
20210098412 | DIRECT GANG BONDING METHODS AND STRUCTURES | 2021-04-01 |
20210098413 | PRINTED CIRCUIT BOARD STRUCTURE HAVING PADS AND CONDUCTIVE WIRE | 2021-04-01 |
20210098414 | METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS | 2021-04-01 |
20210098415 | BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | 2021-04-01 |
20210098416 | THERMOCOMPRESSION BONDING OF ELECTRONIC COMPONENTS | 2021-04-01 |
20210098417 | METHOD OF FABRCATING PACKAGE STRUCTURE | 2021-04-01 |
20210098418 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | 2021-04-01 |
20210098419 | FABRICATING ACTIVE-BRIDGE-COUPLED GPU CHIPLETS | 2021-04-01 |
20210098420 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-04-01 |
20210098421 | PACKAGE COMPONENT, ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098422 | COMPOSITE IC CHIPS INCLUDING A CHIPLET EMBEDDED WITHIN METALLIZATION LAYERS OF A HOST IC CHIP | 2021-04-01 |
20210098423 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2021-04-01 |
20210098424 | SEMICONDUCTOR DEVICE HAVING CHIP-TO-CHIP BONDING STRUCTURE | 2021-04-01 |
20210098425 | SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS | 2021-04-01 |
20210098426 | PACKAGING STRUCTURE, AND FORMING METHOD AND PACKAGING METHOD THEREOF | 2021-04-01 |
20210098427 | CHIP PACKAGE WITH REDISTRIBUTION LAYERS | 2021-04-01 |
20210098428 | SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE | 2021-04-01 |
20210098429 | LED PACKAGING UNIT, LED LAMP COMPRISING SAME, AND METHOD OF THE MANUFACTURE SAME | 2021-04-01 |
20210098430 | VERTICAL ALIGNMENT METHOD OF VERTICAL TYPE MICRO LED AND LED ASSEMBLY MANUFACTURING METHOD USING THE SAME | 2021-04-01 |
20210098431 | LED ASSEMBLY HAVING VERTICALLY ALIGNED VERTICAL TYPE MICRO LED | 2021-04-01 |
20210098432 | OPTOELECTRONIC DEVICE COMPRISING A PHOSPHOR PLATE AND METHOD OF MANUFACTURING THE OPTOELECTRONIC DEVICE | 2021-04-01 |
20210098433 | MULTI-COB-LED LIGHTING MODULE | 2021-04-01 |
20210098434 | Package Structure and Method of Forming the Same | 2021-04-01 |
20210098435 | Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices | 2021-04-01 |
20210098436 | VIA-IN-VIA STRUCTURE FOR HIGH DENSITY PACKAGE INTEGRATED INDUCTOR | 2021-04-01 |
20210098437 | INTEGRATED CIRCUIT MODULE WITH INTEGRATED DISCRETE DEVICES | 2021-04-01 |
20210098438 | MICRO LIGHT EMITTING DIODE DISPLAY SUBSTRATE, DEVICE AND FABRICATION METHOD THEREOF | 2021-04-01 |
20210098439 | SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR WAFER | 2021-04-01 |
20210098440 | PACKAGED DEVICE WITH A CHIPLET COMPRISING MEMORY RESOURCES | 2021-04-01 |
20210098441 | SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS | 2021-04-01 |
20210098442 | SEMICONDUCTOR DEVICE | 2021-04-01 |
20210098443 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD | 2021-04-01 |
20210098444 | ISOLATION TRENCHES FOR ESD CIRCUITS | 2021-04-01 |
20210098445 | EMBEDDED N-CHANNEL METAL OXIDE SEMICONDUCTOR (NMOS) TRIGGERED SILICON CONTROLLED RECTIFICATION DEVICE | 2021-04-01 |
20210098446 | ELECTRO-STATIC DISCHARGE CIRCUIT, ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS | 2021-04-01 |
20210098447 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-04-01 |
20210098448 | INTELLIGENT POWER MODULE CONTAINING IGBT AND SUPER-JUNCTION MOSFET | 2021-04-01 |
20210098449 | DIODE CHIP | 2021-04-01 |
20210098450 | VERTICAL STRUCTURE FOR SEMICONDUCTOR DEVICE | 2021-04-01 |
20210098451 | Novel Liner Structures | 2021-04-01 |
20210098452 | Semiconductor Devices having Fin Field Effect Transistor (FinFET) Structures and Manufacturing and Design Methods Thereof | 2021-04-01 |
20210098453 | DOUBLE RULE INTEGRATED CIRCUIT LAYOUTS FOR A DUAL TRANSMISSION GATE | 2021-04-01 |
20210098454 | Crown Bulk for FinFET Device | 2021-04-01 |
20210098455 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 2021-04-01 |
20210098456 | Input/Output Semiconductor Devices | 2021-04-01 |
20210098457 | MULTI-THRESHOLD GATE STRUCTURE WITH DOPED GATE DIELECTRIC LAYER | 2021-04-01 |
20210098458 | DEPOSITION METHOD, SEMICONDUCTOR DEVICE AND METHOD OF FAVRICATING THE SAME | 2021-04-01 |
20210098459 | Hybrid Scheme for Improved Performance for P-type and N-type FinFETs | 2021-04-01 |
20210098460 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-04-01 |
20210098461 | SEMICONDUCTOR DEVICE | 2021-04-01 |
20210098462 | SEMICONDUCTOR DEVICE WITH NANOWIRE CONTACT AND METHOD FOR FABRICATING THE SAME | 2021-04-01 |
20210098463 | Integrated Assemblies, and Methods of Forming Integrated Assemblies | 2021-04-01 |
20210098464 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-04-01 |
20210098465 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-04-01 |
20210098466 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FIN IN MEMORY CELL AND METHOD FOR FORMING THE SAME | 2021-04-01 |
20210098467 | 4CPP SRAM CELL AND ARRAY | 2021-04-01 |
20210098468 | Source/Drain Contact Having a Protruding Segment | 2021-04-01 |
20210098469 | Fin-Based Well Straps For Improving Memory Macro Performance | 2021-04-01 |
20210098470 | Non-Interleaving N-Well and P-Well Pickup Region Design for IC Devices | 2021-04-01 |
20210098471 | Metal Gate Contacts and Methods of Forming the Same | 2021-04-01 |
20210098472 | VERTICAL SEMICONDUCTOR DEVICES | 2021-04-01 |
20210098473 | Memory Device with Improved Margin and Performance and Methods of Formation Thereof | 2021-04-01 |
20210098474 | Well Strap Structures and Methods of Forming the Same | 2021-04-01 |
20210098475 | INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME | 2021-04-01 |
20210098476 | SEMICONDUCTOR MEMORY DEVICE | 2021-04-01 |
20210098477 | INPUT AND DIGITAL OUTPUT MECHANISMS FOR ANALOG NEURAL MEMORY IN A DEEP LEARNING ARTIFICIAL NEURAL NETWORK | 2021-04-01 |
20210098478 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE | 2021-04-01 |
20210098479 | VERTICAL NON-VOLATILE MEMORY DEVICE | 2021-04-01 |
20210098480 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | 2021-04-01 |
20210098481 | MEMORY DEVICE AND FORMING METHOD THEREOF | 2021-04-01 |
20210098482 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098483 | SEMICONDUCTOR DEVICES | 2021-04-01 |
20210098484 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | 2021-04-01 |
20210098485 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE | 2021-04-01 |
20210098486 | Integrated Assemblies Comprising Conductive Levels Having Two Different Metal-Containing Structures Laterally Adjacent One Another, and Methods of Forming Integrated Assemblies | 2021-04-01 |
20210098487 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098488 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | 2021-04-01 |
20210098489 | THREE-DIMENSIONAL MEMORY DEVICE HAVING EPITAXIALLY-GROWN SEMICONDUCTOR CHANNEL AND METHOD FOR FORMING THE SAME | 2021-04-01 |
20210098490 | 3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES | 2021-04-01 |
20210098491 | Three-Dimensional Memory Devices and Methods for Forming the Same | 2021-04-01 |
20210098492 | SEMICONDUCTOR MEMORY DEVICE | 2021-04-01 |
20210098493 | DIELECTRIC EXTENSIONS IN STACKED MEMORY ARRAYS | 2021-04-01 |
20210098494 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098495 | ELECTRODE STRUCTURE AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE | 2021-04-01 |
20210098496 | ARRAY SUBSTRATE AND DISPLAY PANEL | 2021-04-01 |
20210098497 | ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF | 2021-04-01 |
20210098498 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098499 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-04-01 |
20210098500 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-04-01 |
20210098501 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY DEVICE | 2021-04-01 |