14th week of 2014 patent applcation highlights part 14 |
Patent application number | Title | Published |
20140091443 | SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATED ASSEMBLY AND MANUFACTURING PROCESS - A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package. | 2014-04-03 |
20140091444 | SEMICONDUCTOR UNIT AND METHOD FOR MANUFACTURING THE SAME - A semiconductor unit includes a base, an insulating substrate bonded to the base, a conductive plate made of a metal of poor solderability, a semiconductor device mounted to the insulating substrate through the conductive plate, and a metal plate interposed between the conductive plate and the semiconductor device and made of a metal of good solderability as compared to the metal used for the conductive plate. The base, the insulating substrate, the conductive plate and the metal plate are brazed together, and the semiconductor device is soldered to the metal plate. | 2014-04-03 |
20140091445 | BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER - An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower heat spreader surface, an upper heat spreader surface parallel to the lower heat spreader surface, and at least one heat spreader side, the heat spreader disposed on the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the heat spreader side and lower heat spreader surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface. | 2014-04-03 |
20140091446 | SEMICONDUCTOR DEVICE EMPLOYING ALUMINUM ALLOY LEAD-FRAME WITH ANODIZED ALUMINUM - A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame is suitable for mass production; furthermore, since its weight is much lower than copper or iron-nickel material, aluminum alloy lead frame is very convenient for the production of semiconductor devices. | 2014-04-03 |
20140091447 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF - A semiconductor device according to an embodiment includes: a first unit device configured to include a semiconductor chip, a backside electrode that is in contact with a backside of the semiconductor chip, and a bonding wire in which one end is connected to the backside electrode; a second unit device configured to have a function different from that of the first unit device; a resin layer configured to fix the first and second unit devices to each other; and a first wiring that is formed on the resin layer on a surface side of the semiconductor chip and connected to the other end of the bonding wire. | 2014-04-03 |
20140091448 | Semiconductor Package with Corner Pins - There are provided semiconductor packages having corner pins and methods for their fabrication. Such a semiconductor package includes a leadframe and a die paddle, the leadframe having first and second edge sides meeting to form a first corner. The semiconductor package also includes edge pins arrayed substantially parallel to the first edge side and edge pins arrayed substantially parallel to the second edge side. In addition, the semiconductor package includes a first corner pin situated at the first corner, the first corner pin being electrically isolated from the die paddle. | 2014-04-03 |
20140091449 | Power Quad Flat No-Lead (PQFN) Semiconductor Package with Leadframe Islands for Multi-Phase Power Inverter - According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a leadframe, a V-phase output node situated on a second leadframe island of said leadframe, and a W-phase output node situated on a W-phase die pad of said leadframe. The first leadframe island can be on a first leadframe strip of the leadframe, where the first leadframe strip is connected to a U-phase die pad of the leadframe. The second leadframe island can be on a second leadframe strip of the leadframe, where the second leadframe strip is connected to a V-phase die pad of the leadframe. A first W-phase power switch is situated on the W-phase die pad. Furthermore, at least one wirebond is connected to the W-phase die pad and to a source of a second W-phase power switch. The W-phase die pad can be a W-phase output terminal of the PQFN package. | 2014-04-03 |
20140091450 | Semiconductor Housing for Smart Cards - A semiconductor housing includes a front side with a semiconductor chip and a first metallization on a substrate, and a rear side with a second metallization. The rear side is situated opposite the front side of the semiconductor housing. The semiconductor housing further includes a first compensation layer applied on the front side of the semiconductor housing. | 2014-04-03 |
20140091451 | SEMICONDUCTOR DEVICE COMPRISING A CRACK STOP STRUCTURE - A semiconductor device may include at least one pad adjacent a top surface of the device, and a metal crack stop structure below the at least one pad. The metal crack structure may have an inner envelope and an outer envelope, and may be configured to be vertically aligned with the at least one pad so that an edge of the at least one pad is between the inner and outer envelopes. | 2014-04-03 |
20140091452 | SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF - A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant. | 2014-04-03 |
20140091453 | COOLING DEVICE AND SEMICONDUCTOR DEVICE - A cooling device includes a base and a plurality of radiator fins. The base includes an exterior, an interior, an inlet, and an outlet. A heat generation element is connected to the exterior of the base. The radiator fins are located near the heat generation element in the interior of the base. The radiator fins are arranged from the inlet to the outlet. Each radiator fin has a sidewise cross-section with a dimension in a flow direction of the cooling medium and a dimension in a lateral direction orthogonal to the flow direction of the cooling medium. The dimension in the flow direction is longer than the dimension in the lateral direction. The radiator fins are separated from one another by a predetermined distance in the lateral direction. | 2014-04-03 |
20140091454 | Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package - A semiconductor device includes a semiconductor die. An encapsulant is formed around the semiconductor die. A build-up interconnect structure is formed over a first surface of the semiconductor die and encapsulant. A first supporting layer is formed over a second surface of the semiconductor die as a supporting substrate or silicon wafer disposed opposite the build-up interconnect structure. A second supporting layer is formed over the first supporting layer an includes a fiber enhanced polymer composite material comprising a footprint including an area greater than or equal to an area of a footprint of the semiconductor die. The semiconductor die comprises a thickness less than 450 micrometers (μm). The thickness of the semiconductor die is at least 1 μm less than a difference between a total thickness of the semiconductor device and a thickness of the build-up interconnect structure and the second supporting layer. | 2014-04-03 |
20140091455 | Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging - A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die. | 2014-04-03 |
20140091456 | USING COLLAPSE LIMITER STRUCTURES BETWEEN ELEMENTS TO REDUCE SOLDER BUMP BRIDGING - Provided are an electronic assembly and method for forming the same, comprising a first element having a first surface and a second element having a second surface. | 2014-04-03 |
20140091457 | CONTROLLED SOLDER HEIGHT PACKAGES AND ASSEMBLY PROCESSES - An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed. | 2014-04-03 |
20140091458 | ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING - Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon. | 2014-04-03 |
20140091459 | Chip-size, double side connection package and method for manufacturing the same - A low resistance metal is charged into holes formed in a semiconductor substrate to thereby form through electrodes. Post electrodes of a wiring-added post electrode component connected together by a support portion thereof are simultaneously fixed to and electrically connected to connection regions formed on an LSI chip. On the front face side, after resin sealing, the support portion is separated so as to expose front face wiring traces. On the back face side, the semiconductor substrate is grounded so as to expose tip ends of the through electrodes. The front face wiring traces exposed to the front face side and the tip ends of the through electrodes exposed to the back face side are used as wiring for external connection. | 2014-04-03 |
20140091460 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip. The molding material may be on outer side surfaces of the homogeneous integral underfill material above the upper surface of the first chip, wherein, in view of a first cross sectional profile, the molding material is separated from sidewalls of the second chip by the homogeneous integral underfill material such that the molding material does not contact sidewalls of the second chip. | 2014-04-03 |
20140091461 | DIE CAP FOR USE WITH FLIP CHIP PACKAGE - A die cap for use with flip chip packages, flip chip packages using a die cap, and a method for manufacturing flip chip packages with a die cap are provided in the invention. A die cap encases the die of flip chip packages about its top and sides for constraining the thermal deformation of the die during temperature change. The CTE (coefficient of thermal expansion) mismatch between the die and substrate of flip chip packages is the root cause for warpage and reliability issues. The current inventive concept is to reduce the CTE mismatch by using a die cap to constrain the thermal deformation of the die. When a die cap with high CTE and high modulus is used, the die with the die cap has a relatively high overall CTE, reducing the CTE mismatch. As a result, the warpage and reliability of flip chip packages are improved. | 2014-04-03 |
20140091462 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods. | 2014-04-03 |
20140091463 | SEMICONDUCTOR PACKAGE APPARATUS - According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls. | 2014-04-03 |
20140091464 | SEMICONDUCTOR DEVICE - The semiconductor device of the present invention includes a semiconductor substrate provided with semiconductor elements, a lower layer wiring pattern which includes first wiring and second wiring, the first wiring and the second wiring disposed separately so as to be flush with each other, and the first wiring and the second wiring being fixed at a mutually different potential, an uppermost interlayer film disposed on the lower layer wiring pattern, a titanium nitride layer disposed on the uppermost interlayer film so as to cover the first wiring and the second wiring, and the titanium nitride having the thickness of 800 Å or more, and a pad metal disposed on the titanium nitride layer. | 2014-04-03 |
20140091465 | LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING - A method of assembling semiconductor devices includes dispensing a metal paste including metal particles in a solvent onto a bonding area of a plurality of metal terminals of a leadframe. The dispensing provides a varying thickness over the bonding area. The solvent is evaporated to form a sloped metal coating including a first sloped top face and a second sloped top face. The first sloped top face is closer to the die pad compared to the second sloped top face, the second sloped top face increases in coating thickness with decreasing distance to the die pad, and the first sloped top face decreases in coating thickness with decreasing distance to the die pad. A bottom side of semiconductor die including a plurality of top side bond pads is attached to the die pad. Bond wires are connected between the bond pads and the second sloped top faces. | 2014-04-03 |
20140091466 | PITCH QUARTERING TO CREATE PITCH HALVED TRENCHES AND PITCH HALVED AIR GAPS - A silicon structure is fabricated determining a pattern for wire trenches and air gaps. The wire trenches are created, and certain trenches are used as air gaps. The remaining wire trenches are used for metallization of inter connecting wires. | 2014-04-03 |
20140091467 | FORMING BARRIER WALLS, CAPPING, OR ALLOYS /COMPOUNDS WITHIN METAL LINES - Described herein are techniques structures related to forming barrier walls, capping, or alloys/compounds such as treating copper so that an alloy or compound is formed, to reduce electromigration (EM) and strengthen metal reliability which degrades as the length of the lines increases in integrated circuits. | 2014-04-03 |
20140091468 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film including the upper surface of a wiring serving as a lower layer wiring, an insulating film formed of a silicon carbonitride film having excellent barrier properties to copper is formed; on the insulating film, an insulating film formed of a silicon carbide film having excellent adhesiveness to a low dielectric constant material film is formed; on the insulating film, an insulating film formed of a low dielectric constant material as an interlayer insulating film is formed; and thereafter a wiring as an upper layer wiring is formed. | 2014-04-03 |
20140091469 | METHODS OF PROVIDING DIELECTRIC TO CONDUCTOR ADHESION IN PACKAGE STRUCTURES - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a CVD dielectric material on a package dielectric material, and then forming a conductive material on the CVD dielectric material. | 2014-04-03 |
20140091470 | DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY - Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating. | 2014-04-03 |
20140091471 | Apparatus and Method for a Component Package - A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure. | 2014-04-03 |
20140091472 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor element includes a plurality of electrodes on a main surface, a sealing resin covering at least a part of a side surface of the semiconductor element, and a first insulating layer formed on the main surface of the semiconductor element, a part of the side surface of the semiconductor element, and the sealing resin. The first insulating layer has first openings formed therein to allow the plural electrodes on the main surface to be exposed through the first openings, and a fillet provided on a part of the side surface. The semiconductor element further includes a wiring layer formed in the first openings in such a manner as to be electrically connected to the plural electrodes, and also formed on the first insulating layer, and a second insulating layer having second openings formed on the first insulating layer and the wiring layer. | 2014-04-03 |
20140091473 | NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH - A semiconductor package and a method of forming a semiconductor package with one or more dies over an interposer die are provided. By forming a first redistribution structure over the interposer die with TSVs, the die(s) bonded to the interposer die can have edge(s) beyond the boundary of the interposer die. In addition, a second redistribution structure may be formed on the opposite surface of the interposer die from the redistribution structure. The second redistribution structure enables reconfiguration and fan-out of bonding structures for external connectors of the interposer die. | 2014-04-03 |
20140091474 | LOCALIZED HIGH DENSITY SUBSTRATE ROUTING - Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough. | 2014-04-03 |
20140091475 | METHOD AND APPARATUS TO IMPROVE RELIABILITY OF VIAS - A semiconductor device comprising a first insulating layer, a first metal conductor layer formed over the first insulating layer, a second insulating layer comprising a low-k insulating material formed over the first metal conductor, a second metal conductor layer formed over the second insulating layer, vias formed in the second insulating layer connecting the first metal conductor layer to the second metal conductor layer, and a plurality of metal lines. One of the metal lines is expanded around one of the vias compared to metal lines around other ones of the vias so that predetermined areas around each of the vias meets a minimum metal density. | 2014-04-03 |
20140091476 | DIRECTED SELF ASSEMBLY OF BLOCK COPOLYMERS TO FORM VIAS ALIGNED WITH INTERCONNECTS - A method of an aspect includes forming an interconnect line etch opening in a hardmask layer. The hardmask layer is over a dielectric layer that has an interconnect line disposed therein. The interconnect line etch opening is formed aligned over the interconnect line. A block copolymer is introduced into the interconnect line etch opening. The block copolymer is assembled to form a plurality of assembled structures that are spaced along a length of the interconnect line etch opening. An assembled structure is directly aligned over the interconnect line that is disposed within the dielectric layer. | 2014-04-03 |
20140091477 | SYSTEM AND METHOD FOR CHEMICAL-MECHANICAL PLANARIZATION OF A METAL LAYER - A method for forming a field-effect transistor with a raised drain structure is disclosed. The method includes depositing a low-k inter-metal layer over a semiconductor substrate, depositing a porogen-containing low-k layer over the low-k inter-metal layer, and etching a space for the via through the low-k inter-metal layer and the porogen-containing low-k layer. The method further includes depositing a metal layer, a portion of the metal layer filling the space for the via, another portion of the metal layer being over the porogen-containing low-layer, removing the portion of the metal layer over the porogen-containing layer by a CMP process, and curing the porogen-containing low-k layer to form a cured low-k layer. | 2014-04-03 |
20140091478 | SEMICONDUCTOR DEVICE - To provide a semiconductor device having a high efficiency of arranging a TSV, there is provided a semiconductor device which is stacked with a semiconductor chip, and in which the semiconductor chips contiguous each other are electrically connected by plural TSVs, the semiconductor chip includes a core circuit and plural IO circuits arranged at a surrounding thereof, the TSV is arranged in the core circuit, and a pitch of arranging the TSVs is an integer-told of a ceil pitch of a library configuring the core circuit. | 2014-04-03 |
20140091479 | SEMICONDUCTOR DEVICE WITH STACKED SEMICONDUCTOR CHIPS - A semiconductor chip | 2014-04-03 |
20140091480 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 2014-04-03 |
20140091481 | SEMICONDUCTOR PACKAGE - The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A first conductive trace disposed on the substrate. A semiconductor die is disposed over the first conductive trace. A solder resist layer that extends across an edge of the semiconductor die is also included. Finally, an underfill material is provided that fills a gap between the substrate and the semiconductor die. | 2014-04-03 |
20140091482 | Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP - A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface. | 2014-04-03 |
20140091483 | METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A method of manufacturing a semiconductor apparatus includes: a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus. | 2014-04-03 |
20140091484 | BUBBLE GENERATOR FOR VALVE OR FAUCET - A bubble generator includes a housing engaged in a receptacle, and a casing engaged into the housing and having an outer peripheral fence and a bottom plate, and having a bulge extended upwardly from the bottom plate for forming an inner peripheral channel between the bulge and the peripheral fence, and having a passage formed in the peripheral fence and communicating with the inner peripheral channel of the casing for allowing a fluid to flow into the inner peripheral channel of the casing and to flow out through the passage of the casing and to flow into the compartment of the housing, and the casing includes a number of projections extended from the bulge for agitating the fluid and for generating air bubbles in the fluid. | 2014-04-03 |
20140091485 | NOZZLE DESIGN FOR HIGH TEMPERATURE ATTEMPERATORS - An improved spray nozzle assembly for use in a steam desuperheating device that is adapted to spray cooling water into a flow of superheated steam. The nozzle assembly is of simple construction with relatively few components, and thus requires a minimal amount of maintenance. In addition, the nozzle assembly is specifically configured to, among other things, prevent thermal shock to prescribed internal structural components thereof, to prevent “sticking” of a valve element thereof, and to create a substantially uniformly distributed spray of cooling water for spraying into a flow of superheated steam in order to reduce the temperature of the steam. | 2014-04-03 |
20140091486 | NOZZLE DESIGN FOR HIGH TEMPERATURE ATTEMPERATORS - An improved spray nozzle assembly for use in a steam desuperheating device that is adapted to spray cooling water into a flow of superheated steam. The nozzle assembly is of simple construction with relatively few components, and thus requires a minimal amount of maintenance. In addition, the nozzle assembly is specifically configured to, among other things, prevent thermal shock to prescribed internal structural components thereof, to prevent “sticking” of a valve element thereof, and to create a substantially uniformly distributed spray of cooling water for spraying into a flow of superheated steam in order to reduce the temperature of the steam. | 2014-04-03 |
20140091487 | Dispensing System - A dispensing system for dispensing a material is disclosed that includes a housing for receipt of a dispenser holding a material. A fan is disposed within the housing. Upon activation, the fan draws air into the housing and diffuses the material charged air from the housing with a substantially 360 degree dispersal pattern. | 2014-04-03 |
20140091488 | MICROSTRUCTURE FORMING MOLD AND OPTICAL ELEMENT MANUFACTURING METHOD - This microstructure forming mold forms a concavoconvex reflection preventing part on a concave lens surface of a lens main body including the concave lens surface with curvature. The reflection preventing part is formed using a surface processing device including: a molding surface part that transfers the reflection preventing part; a base body part that supports the molding surface part in a bendable manner; and a cavity portion, an annular cavity portion, and a liquid supply unit that deform the base body part to bend the molding surface part. | 2014-04-03 |
20140091489 | Blowing agent introduction in polymer foam processing - Systems and methods of processing polymer foam materials are provided. The methods involve introducing blowing agent downstream of an extruder. For example, the blowing agent may be introduced into a static mixing device positioned between the extruder and a mold. The methods may be used in connection with injection molding systems to produce high quality injection molded polymer foam articles. | 2014-04-03 |
20140091490 | PROCESS FOR MANUFACTURING ARTICLES COMPRISING POLYLACTIC ACID POLYMERS HAVING IMPROVED HEAT RESISTANCE - A process for thermoforming a discrete section of an amorphous pliable thermoplastic sheet in a temperature-controlled thermoforming mold to provide a discrete thermoformed section having one or more discrete shaped articles formed therein and to heat the shaped articles to a temperature below the T | 2014-04-03 |
20140091491 | OSTEOCHONDRAL IMPLANTS, ARTHROPLASTY METHODS, DEVICES, AND SYSTEMS - Implants for resurfacing or repairing one or more articular cartilage bearing surfaces of a biological organism include an engineered tissue and a biocompatible porous substrate secured to the engineered tissue for attaching the implant to a native bone of the biological organism. The engineered tissue includes a scaffold containing a biocompatible material, and a plurality of living chondrocytes supported by the scaffold. Methods for culturing chondrocytes for incorporation into a biocompatible implant are provided. A bioreactor for producing functional cartilaginous tissue from a cell-seeded scaffold and a system for producing functional cartilaginous tissue are also provided. | 2014-04-03 |
20140091492 | LAMINATED SYNTHETIC RESIN BOTTLE, INJECTION MOLDING DEVICE, AND PROCESS FOR MOLDING A LAMINATED PREFORM - A problem to be solved by this invention is to control the above-described problem of delamination in the laminated and biaxially drawn, blow molded bottle. A major means of this invention to solve this problem is a biaxially drawn, blow molded bottle characterized in that vertical connecting zones having no intermediate layer and having substrate layers welded directly with each other are formed in parallel in a circumferential direction and in a plural number along an axial direction of the bottle and are disposed on both right and left sides of each intermediate layer segment to be formed in this height range, and that horizontal connecting zones having no intermediate layer and having substrate layers welded directly with each other are also formed in parallel in an axial direction and in a plural number along a circumferential direction of the bottle and are disposed on both upper and lower sides of each intermediate layer segment to be formed, thus allowing the intermediate layer to be segmentalized in the circumferential and axial directions by both the vertical and horizontal connecting zones. | 2014-04-03 |
20140091493 | ACTUATOR FOR SPRAY CONTAINER AND METHOD REGARDING SAME - Actuator apparatus for spray containers and methods of manufacturing actuator apparatus for spray containers. The actuator apparatus includes a cover having a restraint structure, e.g., locatable below an aperture portion of a push button of a base, to restrict the push button from depression by a user when the actuator apparatus is in a locked position. | 2014-04-03 |
20140091494 | TWO-PIECE VIAL TRANSFER NEEDLE ASSEMBLY - The present disclosure relates to a vial transfer needle assembly including a first molding member and a second molding member. The first molding member includes a hub portion that has a proximal piercing tip and a distal portion. The hub portion defines a lumen that passes therethrough. The second molding member includes a central housing, a proximal skirt, and a distal skirt. The second molding portion is molded at least partially about the first molding portion to form a monolithic structure. The piercing tip is positioned to extend into a first cavity that is defined by the proximal skirt. The distal portion of the first molding member is positioned to extend through a second cavity that is defined by the skirt. The distal skirt is dimensioned to receive a medical device. | 2014-04-03 |
20140091495 | JOINING COMPONENT AND METHOD FOR PRODUCTION OF A JOINING COMPONENT - A method for production of a joining component, the method comprising the steps of providing a metal section which is inductively heatable and defines an axial through aperture; and coating the metal element with a thermoplastic material by a single-component injection-moulding of a base body of the joining component around the metal section so that the base body includes: a holding section formed as a cylindrical shaft and a flange, the flange including a first and second sides, and an inner side of the metal section is joined to the flange and an exposed outer side of the metal section faces away from the flange; and a the second side of the flange is axially recessed within the aperture; and a joining surface is comprised of the outer side of the metal section and a portion of the second side of the flange radially outward of the metal section. | 2014-04-03 |
20140091496 | VACUUM INFUSION ADHESIVE AND METHODS RELATED THERETO - An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive. | 2014-04-03 |
20140091497 | PROCESS FOR CURING A POROUS MUFFLER PREFORM - A process for curing a porous muffler preform defined by a plurality of glass fibers and a heat-curing thermoset or thermoplastic materials applied to the plurality of glass fibers is disclosed herein. The process includes the step of enclosing the muffler preform in a chamber. The process also includes the step of surrounding the muffler preform with steam. The process also includes the step of causing steam to enter the muffler preform from multiple directions. | 2014-04-03 |
20140091498 | ARTICLES COMPRISING RUBBER, THERMOPLASTIC POLYURETHANE AND ENGINEERING POLYMER - Item comprising thermoplastic polyurethane, which has, respectively, direct-contact adhesive bonding not only to rubber but also to engineering plastic. | 2014-04-03 |
20140091499 | APPARATUS AND METHOD OF SHAPING PLASTICS MATERIAL PRE-FORMS WITH SEPARATE FLOW PATHS FOR BLOWING AIR AND CONTROL AIR - An apparatus for shaping plastics material pre-forms into plastics material containers has a movable carrier on which are arranged a plurality of shaping stations for shaping the plastics material pre-forms into the plastics material containers. Each shaping station has a stressing device which acts upon the plastics material pre-forms for the expansion thereof with a gaseous medium, and a pressure preparation device which prepares the gaseous medium. The pressure preparation device is arranged in a stationary manner and supplies the shaping stations with the gaseous medium for the expansion of the plastics material pre-forms by way of at least one connection line. A distribution device is provided which distributes the gaseous medium from the pressure preparation device shaping stations. A control air line supplies the valve device with a control gas, and a blowing air line supplies the shaping stations with the gaseous medium, are separate from each other at least downstream of the distribution device in a flow direction of the gaseous medium. | 2014-04-03 |
20140091500 | BOTTLE WITH EXTENDED NECK FINISH AND METHOD OF MAKING SAME - A blow molded synthetic resin bottle has a body and an elongated neck with the body providing a shoulder extending about the base of the neck. The neck has a first collar extending thereabout spaced adjacent the shoulder and at least one additional collar extending thereabout adjacent the upper end of the neck. The resin in the neck is substantially unoriented. To produce the bottle, a synthetic resin preform is injection molded with a generally tubular body and the elongated neck. This preform is placed in a blow mold cavity having a body receiving portion and a neck receiving portion that has a recess extending thereabout seating the first collar therein. The additional collar is disposed outwardly of the mold cavity and is disposed on the upper surface of the mold. | 2014-04-03 |
20140091501 | METHOD OF MANUFACTURING HEXAGONAL FERRITE MAGNETIC PARTICLES - The method of manufacturing hexagonal ferrite magnetic particles, which includes providing hexagonal ferrite magnetic particles by conducting calcination of particles comprising an alkaline earth metal salt and an iron salt to cause ferritization; and further includes causing a glass component to adhere to the particles and then conducting the calcination of the particles to form a calcined product in which hexagonal ferrite is detected as a principal component in X-ray diffraction analysis; and removing the glass component from a surface of the calcined product that has been formed. | 2014-04-03 |
20140091502 | DEVICES AND METHODS FOR ENHANCING BURDEN UNIFORMITY IN A COMBINATION REFORMING/REDUCING SHAFT FURNACE - The present invention provides a combination reforming/reducing shaft furnace for the production of direct reduced iron that utilizes one or more burden uniformity enhancers, such as one or more rotating/reciprocating mixing shafts, one or more stationary flow aids, one or more wall structures/variations, one or more agitators, or the like for ensuring that reforming and reducing in the shaft furnace take place evenly across the width of and throughout the depth of the burden in the shaft furnace. | 2014-04-03 |
20140091503 | METHOD FOR RECOVERING VALUABLE METALS FROM SLAG AND APPARATUS FOR MANUFACTURING MULTIFUNCTIONAL AGGREGATE - An apparatus for recovering valuable metals and manufacturing multifunctional aggregate from slag. The apparatus includes a slag reforming processing pot | 2014-04-03 |
20140091504 | GAS SPRING ASSEMBLY AND METHOD - A gas spring assembly includes an unreinforced flexible wall formed from a polymeric material and an external reinforcing structure extending lengthwise along and around the periphery of the unreinforced flexible wall. The external reinforcing structure is capable of extending and collapsing together with corresponding extension and compression of the flexible wall. The gas spring assembly also includes opposing end members. The external reinforcing structure can be formed from a plurality of interconnecting wall segments that at least partially define a plurality of openings extending through the external reinforcing structure. A suspension system is also included. | 2014-04-03 |
20140091505 | END MEMBERS, GAS SPRING ASSEMBLIES AND SUSPENSION SYSTEMS - An end member for a gas spring assembly can include a first end, a second end opposite the first end and a plurality of reflector surfaces formed along the first end. A first reflector surface can extend from the first end toward the second end. A second reflector surface can extend from adjacent the first reflector surface toward the second end. One or more of the plurality of reflector surfaces can include a plurality of facets or reflector zones. A gas spring assembly including at least one of such end members and a suspension system including one or more of such gas spring assemblies are also disclosed. | 2014-04-03 |
20140091506 | ELASTOMERIC THERMAL BARRIER AS WELL AS GAS SPRING ASSEMBLY AND SUSPENSION SYSTEM INCLUDING SAME - An elastomeric article and elastomeric thermal barrier system includes an elastomeric article that is at least partially formed from an elastomeric material susceptible to thermal degradation upon exposure to an external thermal energy source. An elastomeric thermal barrier extends around and along at least a portion of the elastomeric article. The elastomeric thermal barrier is spaced apart from the elastomeric article to form a thermal break. The elastomeric thermal barrier is at least partially formed from an elastomeric material having a thermal property that is different from the thermal property of the elastomeric article and is operative to provide at least one of reduced absorption, reduced conductivity, increased reflectance and reduced emissivity to reduce thermal energy transfer into the elastomeric article from the external thermal energy source. A gas spring and thermal barrier system and/or assembly and a suspension system are also included. | 2014-04-03 |
20140091507 | BUSHINGS FOR VEHICLE SUSPENSION - Described the embodiments generally relate to bushings for vehicle suspensions. In particular, described embodiments relate to bushings for applications that can involve extreme articulation of the vehicle suspension, or for applications involving the transport of heavy payloads, off-road sporting vehicles and vehicles with modified suspensions. Described embodiments relate to one-piece bushings, as well as two-piece bushings. | 2014-04-03 |
20140091508 | INTEGRATED FOLDING CUTLERY RETAINING AND CUTTING BOARD APPARATUS - A kitchen apparatus including a combined utensil retainer member and drying rack member, encapsulated within a rotatably attached cutting board mechanism. The cutting board mechanism includes a containment apparatus on the underside such that food, liquids, debris and the like are deflected from entering the internal portion of the cutlery holding area. The overall apparatus combines an upper and lower portion, both of which utilize numerous embodiments interchangeably in order to retain utensils and provide cutlery ability. | 2014-04-03 |
20140091509 | Methods for Forming 3DIC Package - A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening. | 2014-04-03 |
20140091510 | FASTENING HARDWARE HOLDER WITH INSTALLATION INDICATOR - An apparatus for holding fastening hardware in place on a workpiece having an arrangement of through-holes. The apparatus includes a body having a first surface and a second surface on opposite sides of the body. The first surface has at least one projection extending from the first surface and a recess configured to hold the fastening hardware, with the recess being open to the first surface. A brace extends from the second surface of the body and is configured to hold the first surface in an installation position relative to the workpiece. The at least one projection is inserted in a first hole of the arrangement of through-holes when the first surface is in the installation position. The fastening hardware is held by the recess in a position to receive a complementary fastener through a second hole of the arrangement of through-holes when the first surface is in the installation position. | 2014-04-03 |
20140091511 | Apparatus for Manipulating Substrates - The invention refines the standard cutting tool concept used in substrate manipulation systems, such as CNC applications. Aspects of the invention provide a novel substrate manipulation attachment that provides superior functionality and lower operating costs by utilizing standard utility knife blades and other off-the-shelf components. | 2014-04-03 |
20140091512 | SPACER FOR THERMAL PLATE IN SEMICONDUCTOR PROCESSING - A spacer for a thermal plate in semiconductor processing includes a base substrate having a top surface defined thereon, a wafer having a bottom surface covering a portion of the base substrate, and a plurality of air passages formed in between the bottom surface of the wafer and the base substrate. The air passages connect the bottom surface of the wafer to an ambience. | 2014-04-03 |
20140091513 | Image Forming Apparatus - An image forming apparatus has a main body having a sheet feed path and an opening. A sheet placing part defined in the main body. The sheet inserted through the opening is placed on the sheet placing part. A supply roller arranged to face the placing part and feeds the sheet placed on the sheet placing part in a sheet feed direction toward the sheet feed path, a frame arranged to face the sheet placing part and configured to support the supply roller, the frame having a protruded part protruded on an opening side with respect to the supply roller. An image forming unit is provided inside the main body. An inclined surface is formed on a side of the protruded part facing the sheet placing part, and the protruded part has an inclined surface facing the sheet placing part and inclined such that a distance between the inclined surface and the sheet placing part becomes gradually smaller toward the supply roller. | 2014-04-03 |
20140091514 | SHEET DISCHARGE DEVICE, METHOD FOR DETECTING SHEET-LOADING, COMPUTER READABLE MEDIUM STORING SHEET LOADING-DETECTION PROGRAM, AND IMAGE FORMING APPARATUS INCLUDING SHEET DISCHARGE DEVICE - There is provided a sheet discharge unit which includes a tray which a first area and a second area, a discharge mechanism, a pendulum mechanism, a signal transmission mechanism which transmits a first signal and a second signal, a memory, and a controller. The controller judges whether or not a time interval of two sheets discharged consecutively exceeds the first time interval, and judges that the sheets loaded onto the tray up to a height not lower than the reference position, when the time interval of the two sheets exceeds the first time interval, and when the signal transmission mechanism continues to transmit the second signal exceeding the first time interval. | 2014-04-03 |
20140091515 | DUAL FLIP OVER ROLL INVERTER - Provided herein is sheet inverter apparatus which includes a diverter gate which diverts the sheet to one of at least two paths, a first paper path, and a second paper path. The first and second path each include a rotatable nip assembly, the rotatable nip assembly including a nip drive roll and a nip idler roll positioned so as to define a nip therebetween, the nip serving as a rotatable axis around which the nip drive roll and the nip idler roll rotate to invert the sheet. | 2014-04-03 |
20140091516 | MULTI-FEED DETECTION APPARATUS, SHEET CONVEYANCE APPARATUS, AND SHEET PROCESSING APPARATUS - A multi-feed detection apparatus may include an ultrasonic transmission unit, arranged on one side of a conveyance path configured to convey a sheet-like member, for transmitting an ultrasonic wave toward the conveyance path, an ultrasonic reception unit, arranged on the other side of the conveyance path, for receiving the ultrasonic wave from the ultrasonic transmission unit, and a multi-feed determination unit for determining, based on the reception result of the ultrasonic wave received by the ultrasonic reception unit, whether multi-feed of sheet-like members has occurred. The ultrasonic transmission surface of the ultrasonic transmission unit is inclined with respect to the conveyance path, and the ultrasonic reception surface of the ultrasonic reception unit is arranged to be almost parallel to the conveyance path. | 2014-04-03 |
20140091517 | TRANSPORT APPARATUS AND RECORDING APPARATUS PROVIDED WITH THE SAME - A transport apparatus includes: a guide surface which extends in a transport direction for transporting a medium and which is configured to guide the medium to be transported; a first roller which is a driving roller for transporting the medium; a second roller which is a driven roller arranged to face the first roller; and a roller support member which rotatably supports the second roller and which is configured to be pivotable about a support shaft perpendicular to an axis of a rotational shaft of the second roller between a first position and a second position. | 2014-04-03 |
20140091518 | SHEET CONVEYING DEVICE, SHEET DISCHARGING DEVICE, AND IMAGE FORMING APPARATUS - A sheet conveying device includes a first rotating member, a second rotating member, and a biasing unit that biases the second rotating member toward the first rotating member. The first and second rotating members pinch a sheet therebetween and convey the sheet in a sheet conveying direction. The second rotating member includes a small-diameter portion that faces a conveying portion of the first rotating member, and a large-diameter portion at a position axially displaced from the conveying portion. The second rotating member can change its orientation to an orientation where a rotating shaft of the second rotating member is tilted relative to a rotating shaft of the first rotating member as viewed in the sheet conveying direction, thereby moving a position of an end portion of the second rotating member on a side of the large-diameter portion away from the rotating shaft of the first rotating member. | 2014-04-03 |
20140091519 | CABINET CONSTRUCTION FOR AN AMUSEMENT GAME DEVICE - An amusement game having a cabinet wherein the cabinet is assembled by attaching cabinet pieces together using knock-down fasteners. | 2014-04-03 |
20140091520 | Bonus Win System For Skill Games With PrizeDispenser - A game apparatus is provided comprising a cabinet defining a playing area including a plurality of shelves mounted therein where each of the shelves has disposed thereon a plurality of game pieces. A receiving mechanism is attached to the cabinet for accepting a playing piece. A playing area with one or more holes that allow game pieces to fall through the playing area into a mechanism that counts the game pieces until the count is equal to a predetermined number and reward the player a prize or additional playing pieces depending on the operators adjustments. | 2014-04-03 |
20140091521 | CARD RECOGNITION SYSTEM, CARD HANDLING DEVICE, AND METHOD FOR TUNING A CARD HANDLING DEVICE - A card recognition system comprises an imaging device configured to capture a raw image of at least a portion of a card, and a processor operably coupled with the imaging device. The processor is configured to perform an image processing analysis of the raw image to identify measurements of at least one of a rank area around a rank of the card, and a suit area around a suit of the card, and automatically generate a calibration file based, at least in part, on the image processing analysis. A card handling device comprises a card infeed, a card output, and a card recognition system. A method for tuning a card handling device comprises capturing a plurality of images from a deck of cards, storing the images in memory, analyzing the plurality of images for card identification information, and generating a calibration file including parameters associated with the card identification information. | 2014-04-03 |
20140091522 | METHODS FOR AUTOMATICALLY GENERATING A CARD DECK LIBRARY AND MASTER IMAGES FOR A DECK OF CARDS, AND A RELATED CARD PROCESSING APPARATUS - A method of automatically generating a calibration file for a card handling device comprises automatically generating a calibration file stored in memory of a main control system for a card handling device. Automatically generating the calibration file comprises identifying at least one parameter associated with a rank area around a rank of the at least a portion of the card, identifying at least one parameter associated with a suit area around a suit of the at least a portion of the card, and storing the at least one parameter associated with the rank area and the at least one parameter associated with the suit area in the calibration file. Additionally, a method of automatically generating deck libraries for one or more decks of cards comprises automatically generate a plurality of master images for the cards of the first deck type using the parameters from the calibration file. | 2014-04-03 |
20140091523 | Device to Secure the Mouth of a Playing Card Shoe - The present disclosure is directed to a security apparatus for use on a playing card shoe to prevent the removal of playing cards from the splaying card shoe. Playing card shoes generally have an elongated body including a card cradle for supporting a plurality of playing cards. The card cradle has an outlet opening adjacent to a front end of the elongated body, through which playing cards can be removed from the playing card shoe, A cradle cover is removably attached to the elongated, body, covering the card cradle and playing cards therein. A faceplate is removably attach to the outer front, end of the elongated body, and defines a mouth through which playing cards can be drawn from the outlet opening. The security apparatus prevents the removal a playing cards from the shoe, where the security apparatus is removably attached to the playing card shoe to block and/or cover the outlet opening. | 2014-04-03 |
20140091524 | SPATIAL LOGIC GAME - A game for a plurality of players is disclosed herein. The game may include a plurality of pieces for each player. The game may also include a polyhedron having a plurality of faces, wherein each face has a plurality of spaces for holding pieces. The game may further include a random number generator for indicating the number of spaces to move at least one of the pieces at each player's turn. | 2014-04-03 |
20140091525 | Bean Bag Toss Device with Raised Exterior Lip and Elevated Central Section - A bean bag toss device is provided that includes a rounded platform forming a bowl-like configuration and an elevated central section having an open upper. The rounded platform retains a bean bag that is thrown at the device to prevent the bean bag from sliding therefrom and onto the ground. The elevated central section requires a user to toss a bean bag directly into its open upper to score a “bulls-eye”. In one embodiment, a bulls-eye is noted by music from a speaker attached to the platform, whereby the central section includes a motion sensor to register a bulls-eye, which initiates the sound. The device further includes a pair of folding legs that elevate the platform along one end thereof to slope the device towards a user during use. When not in use, multiple platforms can be stacked on top of another in a nesting configuration to conserve storage space. | 2014-04-03 |
20140091526 | PORTABLE BEAN BAG TOSS GAME - A portable bean bag toss game having first and second target boards, a plurality of bean bags, a first set of target board legs and a second set of target board legs. Each of the target boards includes a planar top surface and a bottom face and a target hole. The first and second target boards are adapted to be clasped together with the bottom faces back-to-back and carried as a unit with the plurality of bean bags removably stored in pockets within the back-to-back bottom faces and the first and second sets of legs removably stored within mating recesses of the back-to-back bottom faces. | 2014-04-03 |
20140091527 | Corner-Mounted Target - A target for receiving projectiles is configured for mounting in a corner of a room. The target includes a front target wall including a pair of spaced apart edges having a target area located between the edges and at least one side area extending from the front wall adapted for engagement with one of the walls defining the corner | 2014-04-03 |
20140091528 | SEALED ASSEMBLIES AND METHODS OF UNSEALING SAME - A sealed assembly includes a first component having a first flange, and a second component having a second flange matable with the first flange. The sealed assembly also includes a sealant disposed between and along the first flange and the second flange such that the first component is sealingly mated to the second component. The sealed assembly further includes a wire disposed within the sealant, wherein the wire is configured for unsealing the second component from the first component. A method of unsealing the sealed assembly is also disclosed. | 2014-04-03 |
20140091529 | CLAMSHELL SEAL - A seal for a duct having an upstream portion and a downstream portion, the duct upstream portion and the duct downstream portion separated by a first gap, includes a first portion having a length greater than a width of the first gap between the first portion and the second portion, the first portion having a first thickness, a first upstream end and a first downstream end; a second portion having a length greater than a width of the gap between the first portion and the second portion, the second portion having a second thickness, a second upstream end and a second downstream end; and an attachment between the first portion and the second portion such that the first portion and the second portion move relative to each other, wherein the first portion is inside the duct and the second portion is outside of the duct. | 2014-04-03 |
20140091530 | MECHANICAL SEAL - An inside-type mechanical seal is mounted between a rotating shaft and a housing, and adapted for preventing leakage of a sealed fluid from an outer circumference of a sliding surface in the direction of an inner circumference thereof, wherein provided are a rotary-side sealing ring mounted on a rotating shaft side, a stationary-side sealing ring mounted on a seal case side, an annular packing for pushing the stationary-side sealing ring toward the rotary-side sealing ring, a holding part on the outer circumferential side being fitted in the seal case, and a seal lip part on the inner circumferential side being in close contact with the stationary-side sealing ring, and wherein provided to the seal case is a ring-shaped projection abutting against a back surface of the packing during assembly of the mechanical seal, and adapted for pushing the packing toward the stationary-side sealing ring. | 2014-04-03 |
20140091531 | SPLINE SEAL WITH COOLING PATHWAYS - The present application provide a seal for use between components engine facing a high pressure cooling air flow and a hot gas path in a gas turbine. The seal may include a first shim, a second shim with an air exit hole, one or more middle layers positioned between the first shim and the second shim, and one or more cooling pathways extending through the middle layers for the high pressure cooling air flow to pass therethrough and exit via the air exit hole into the hot gas path. | 2014-04-03 |
20140091532 | Plug-In Piece - A plug-in piece for sealing connection of two mutually assigned cylindrical surfaces includes an essentially tubular support body which on its ends exhibits annularly encircling sealing elements with a spherically curved sealing surface with a fluting formed therein. | 2014-04-03 |
20140091533 | Plug-In Piece - A plug-in piece | 2014-04-03 |
20140091534 | ASSEMBLY HAVING GASKET RESISTANT TO SIDE LOADING BY PRESSURIZED FLUID - An assembly that includes first and second housing members, a gasket and a plurality of bolts that exert a clamp force to clamp the gasket between the first and second housing members. The gasket includes a plurality of tab members that engage the interior of one or both of the first and second housing members. The gasket tabs can resist a force exerted by a pressurized fluid within one or both of the first and second housing members. A gasket that is resistant to side loading due to a pressurized fluid is also provided. | 2014-04-03 |
20140091535 | PISTON RING COATED CARBON SEAL - A seal assembly for separating a relatively high pressure area from a relatively low pressure area includes a first seal carrier having a circumferential body that has a land thereon and a seal. The seal has a circumferential body located within the first seal carrier, the seal having a first surface for sealing against the first land and a second surface and wherein one of the first surface or the first land has an unmachined wear coating that resists fretting and vibration. | 2014-04-03 |
20140091536 | TOUCH PANEL SEALING APPARATUS - A sealing apparatus of a touch panel provided in a portable terminal including a body and the touch panel, wherein the sealing apparatus is attached and coupled to a coupling area between the body and the touch panel to seal the coupling area while the touch panel is suspended over the body by a resilient member. | 2014-04-03 |
20140091537 | CHUCK TABLE - A chuck table holds a workpiece having a warp. The chuck table includes a suction holding member having a suction holding surface for holding the workpiece under suction, and an annular seal member provided around the outer circumference of the suction holding member for supporting a peripheral portion of the workpiece. The annular seal member is formed from an elastic member. The upper surface of the annular seal member is set higher in level than the suction holding surface according to the warp of the workpiece. In holding the workpiece on the chuck table under suction, vacuum leaking from the gap between the workpiece and the suction holding surface due to the warp of the workpiece is applied to the space defined by the workpiece and the annular seal member, thereby elastically deforming the annular seal member to flatten the upper surface of the workpiece. | 2014-04-03 |
20140091538 | SUSPENSION FOR VEHICLE - A upper arm | 2014-04-03 |
20140091539 | ELECTRIC SUSPENSION DEVICE AND MOTORCYCLE - An electric suspension device includes a cylinder, a sub-tank, a first oil passage and a second oil passage, a damping force adjusting valve, and a damping force adjusting motor. The cylinder is rotatable about a mounting axis. The first oil passage connects a first inner oil chamber and an outer oil chamber. The second oil passage connects the first inner oil chamber of the cylinder and an oil chamber of the sub-tank. The first and second oil passages are disposed outside an inner tube and an outer tube, and share a portion with each other. The first and second oil passages are entirely disposed on the same side with respect to a reference plane. | 2014-04-03 |
20140091540 | Wheelbarrow Lateral Support - Embodiments of the present disclosure are directed to a wheelbarrow having a wheelbarrow lateral support. The wheelbarrow lateral support includes a first arm, a second arm, and a horizontal support area configured to connect the first arm and the second arm. The wheelbarrow lateral support further includes a first extension of subjection connected to the first arm. | 2014-04-03 |
20140091541 | ROLL CONTAINER - A roll container is suitable for transporting post, namely letters. The novel roll container which includes two opposing parallel side wall frames, wherein the front ends of the side wall frames define the width of the front opening of the roll container. The roll container also includes a door, and a hinge which connects the door to one of said side wall frames. The door includes a lower portion and an upper portion which is arranged slidably to tracks provided to the lower portion. The roll container further includes a device configured to lock the upper portion of the door to the front end of the side wall frames at different heights. | 2014-04-03 |
20140091542 | RIDE STEER ADJUSTMENT DEVICE AND METHOD OF ADJUSTING RIDE STEER - A ride steer adjustment device for a vehicle includes an insert sleeve that has an opening configured so that the insert sleeve has an interference fit with a tie rod ball stud when the tie rod ball stud extends through the opening. The insert sleeve has external threads and is configured to be threaded to the knuckle steer arm at the external threads. A distance between the knuckle steer arm and the tie rod is adjustable by turning the insert sleeve relative to the knuckle steer arm at the external threads. Adjusting the distance between the knuckle steer arm and the tie rod changes the angle of the tie rod and thereby the ride steer. | 2014-04-03 |