15th week of 2020 patent applcation highlights part 43 |
Patent application number | Title | Published |
20200111711 | Semiconductor Device Convex Source/Drain Region | 2020-04-09 |
20200111712 | Semiconductor Device Convex Source/Drain Region | 2020-04-09 |
20200111713 | FINFET HAVING INSULATING LAYERS BETWEEN GATE AND SOURCE/DRAIN CONTACTS | 2020-04-09 |
20200111714 | FABRICATION OF SILICON GERMANIUM CHANNEL AND SILICON/SILICON GERMANIUM DUAL CHANNEL FIELD-EFFECT TRANSISTORS | 2020-04-09 |
20200111715 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE | 2020-04-09 |
20200111716 | WIRING BOARD | 2020-04-09 |
20200111717 | Package With Embedded Electronic Component Being Encapsulated in a Pressureless Way | 2020-04-09 |
20200111718 | RELATING TO PASSIVATION LAYERS | 2020-04-09 |
20200111719 | SYSTEMS AND METHODS TO ENHANCE PASSIVATION INTEGRITY | 2020-04-09 |
20200111720 | DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION | 2020-04-09 |
20200111721 | POWER MODULE | 2020-04-09 |
20200111722 | METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE | 2020-04-09 |
20200111723 | HEAT SINK HOLD DOWN SYSTEM FOR DIRECT ATTACHMENT TO PRINTED CIRCUIT BOARD | 2020-04-09 |
20200111724 | WIRING BOARD | 2020-04-09 |
20200111725 | STACKED HEAT EXCHANGER AND METHOD FOR PRODUCING STACKED HEAT EXCHANGER | 2020-04-09 |
20200111726 | BOTTOM UP ELECTROPLATING WITH RELEASE LAYER | 2020-04-09 |
20200111727 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111728 | SEMICONDUCTOR PACKAGE STRUCTURE AND ASSEMBLY STRUCTURE | 2020-04-09 |
20200111729 | Integrated Circuit Package and Method | 2020-04-09 |
20200111730 | SEMICONDUCTOR PACKAGE | 2020-04-09 |
20200111731 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111732 | ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE | 2020-04-09 |
20200111733 | CHIP PART AND MANUFACTURING METHOD THEREOF | 2020-04-09 |
20200111734 | LOGIC DRIVE BASED ON MULTICHIP PACKAGE USING INTERCONNECTION BRIDGE | 2020-04-09 |
20200111735 | Metal-Oxide-Metal Capacitor with Embedded Routing | 2020-04-09 |
20200111736 | SKIP VIA FOR METAL INTERCONNECTS | 2020-04-09 |
20200111737 | CHIP PACKAGE | 2020-04-09 |
20200111738 | SEMICONDUCTOR PACKAGE, PACKAGE-ON-PACKAGE DEVICE, AND METHOD OF FABRICATING THE SAME | 2020-04-09 |
20200111739 | METHOD FOR FORMING SEMICONDUCTOR CONTACT STRUCTURE | 2020-04-09 |
20200111740 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2020-04-09 |
20200111741 | VERTICAL ELECTRICAL FUSE | 2020-04-09 |
20200111742 | SEMICONDUCTOR PACKAGE | 2020-04-09 |
20200111743 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2020-04-09 |
20200111744 | Interconnect Structure and Method of Forming Same | 2020-04-09 |
20200111745 | HIGH DENSITY INTERCONNECT DEVICE AND METHOD | 2020-04-09 |
20200111746 | Semiconductor Device | 2020-04-09 |
20200111747 | SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING REDISTRIBUTION STRUCTURE | 2020-04-09 |
20200111748 | Component Carrier With Face-Up and Face-Down Embedded Components | 2020-04-09 |
20200111749 | Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming | 2020-04-09 |
20200111750 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111751 | Eliminate Sawing-Induced Peeling Through Forming Trenches | 2020-04-09 |
20200111752 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-04-09 |
20200111753 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111754 | Barrier for Power Metallization in Semiconductor Devices | 2020-04-09 |
20200111755 | Forming Large Chips Through Stitching | 2020-04-09 |
20200111756 | Integrated Tunable Filter Architecture | 2020-04-09 |
20200111757 | Semiconductor Package | 2020-04-09 |
20200111758 | SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT | 2020-04-09 |
20200111759 | Semiconductor Device, Semiconductor Component and Method of Fabricating a Semiconductor Device | 2020-04-09 |
20200111760 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-04-09 |
20200111761 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2020-04-09 |
20200111762 | DISPLAY PANEL, METHOD FOR MANUFACTURING THE DISPLAY PANEL, AND DISPLAY DEVICE | 2020-04-09 |
20200111763 | SEMICONDUCTOR PACKAGE | 2020-04-09 |
20200111764 | SEMICONDUCTOR MODULE INCLUDING MEMORY STACK HAVING TSVS | 2020-04-09 |
20200111765 | ELECTRONIC ASSEMBLY AND METHOD OF FORMING SAME | 2020-04-09 |
20200111766 | LIGHT EMITTING DEVICE | 2020-04-09 |
20200111767 | LIGHT-EMITTING DEVICE | 2020-04-09 |
20200111768 | Multichannel Monostatic Rangefinder | 2020-04-09 |
20200111769 | OPTICAL DEVICE | 2020-04-09 |
20200111770 | LIGHT EMITTING DEVICE | 2020-04-09 |
20200111771 | SPLICED DISPLAY | 2020-04-09 |
20200111772 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111773 | INTEGRATED CIRCUIT (IC) PACKAGE WITH HETROGENOUS IC CHIP INTERPOSER | 2020-04-09 |
20200111774 | PASSIVE ELEMENT, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2020-04-09 |
20200111775 | Strapping Structure of Memory Circuit | 2020-04-09 |
20200111776 | DIODE WITH CURRENT SENSOR | 2020-04-09 |
20200111777 | METHOD OF FORMING A TVS SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111778 | GATE-LIFTED NMOS ESD PROTECTION DEVICE | 2020-04-09 |
20200111779 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111780 | BI-DIRECTIONAL TRANSISTOR DEVICES | 2020-04-09 |
20200111781 | SEMICONDUCTOR DEVICES INCLUDING A NARROW ACTIVE PATTERN | 2020-04-09 |
20200111782 | Semiconductor Devices having Fin Field Effect Transistor (FinFET) Structures and Manufacturing and Design Methods Thereof | 2020-04-09 |
20200111783 | FINFET ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2020-04-09 |
20200111784 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-04-09 |
20200111785 | SEMICONDUCTOR DEVICE AND THE METHOD OF MANUFACTURING THE SAME | 2020-04-09 |
20200111786 | SELF RESTORING LOGIC STRCTURES | 2020-04-09 |
20200111787 | ASYMMETRIC THRESHOLD VOLTAGE VTFET WITH INTRINSIC DUAL CHANNEL EPITAXY | 2020-04-09 |
20200111788 | ASYMMETRIC THRESHOLD VOLTAGE VTFET WITH INTRINSIC DUAL CHANNEL EPITAXY | 2020-04-09 |
20200111789 | FINFET AND FABRICATION METHOD THEREOF | 2020-04-09 |
20200111790 | SEMICONDUCTOR DEVICE OR MEMORY DEVICE | 2020-04-09 |
20200111791 | METHOD OF FORMING LAYOUT OF SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111792 | NAND String Utilizing Floating Body Memory Cell | 2020-04-09 |
20200111793 | SEMICONDUCTOR MEMORY DEVICES | 2020-04-09 |
20200111794 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111795 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2020-04-09 |
20200111796 | Methods of Forming Integrated Assemblies | 2020-04-09 |
20200111797 | Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars | 2020-04-09 |
20200111798 | INTEGRATED CIRCUIT STRUCTURE WITH COMPLEMENTARY FIELD EFFECT TRANSISTOR AND BURIED METAL INTERCONNECT AND METHOD | 2020-04-09 |
20200111799 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111800 | METHODS OF FORMING A DEVICE, AND RELATED DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | 2020-04-09 |
20200111801 | INTEGRATED CIRCUIT WITH DECOUPLING CAPACITOR IN A STRUCTURE OF THE TRIPLE WELL TYPE | 2020-04-09 |
20200111802 | METHOD OF PREVENTING CHARGE LOSS FROM A FLOATING GATE | 2020-04-09 |
20200111803 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES | 2020-04-09 |
20200111804 | SEMICONDUCTOR DEVICE | 2020-04-09 |
20200111805 | Method of ONO Stack Formation | 2020-04-09 |
20200111806 | METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICE HAVING CHANNEL STRUCTURES WITH NATIVE OXIDE LAYER | 2020-04-09 |
20200111807 | INTER-DECK PLUG IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | 2020-04-09 |
20200111808 | METHODS FOR REDUCING DEFECTS IN SEMICONDUCTOR PLUG IN THREE-DIMENSIONAL MEMORY DEVICE | 2020-04-09 |
20200111809 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE INCLUDING SLIT WITH LATERAL SURFACES HAVING PERIODICITY | 2020-04-09 |
20200111810 | SEMICONDUCTOR MEMORY | 2020-04-09 |